GB2186124A - Contact pin - Google Patents
Contact pin Download PDFInfo
- Publication number
- GB2186124A GB2186124A GB08602310A GB8602310A GB2186124A GB 2186124 A GB2186124 A GB 2186124A GB 08602310 A GB08602310 A GB 08602310A GB 8602310 A GB8602310 A GB 8602310A GB 2186124 A GB2186124 A GB 2186124A
- Authority
- GB
- United Kingdom
- Prior art keywords
- spill
- hole
- plated
- contact
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Description
1
GB2186124A 1
SPECIFICATION Contact spill
5 The present invention relates to a contact spill for use in the manufacture of a backplane in a telecommunications environment, for example.
Hitherto 0.1 inch backplanes have used existing DIN 41612 spills, in the production of 10 such backplanes, and employ preformed solder rings which are inserted over the pin and rest on the backplane and then heated until the ring melts thereby making an electrical connection.
15 The use of such rings make the cost of backplane manufacture expensive.
Accordingly an aim of the present invention is to provide a spill which enables good electrical contact to be made with the plated-20 through hole during manufacture of the backplanes, which is less expensive than previous used spills and solder preforms.
According to the present invention there is provided a contact spill, for use in the manu-25 facture of a backplane provided with a plated-through hole for the reception of the spill, wherein the portion of the spill arranged to co-operate with the plated-through hole is formed in a manner which allows the spill to 30 experience an interference-fit with the hole, and is further prepared with a coating to permit the spill to be subjected to reflow solder process and thereby make a good electrical contact with the plated-through hole. 35 According to a further aspect of the invention a portion of the spill is formed into an H cross-section and the central limb of the H cross-section is provided with a slot arranged to inwardly collapse as the pin is fitted into 40 the plated-through hole.
According to yet a further aspect of the present invention, the flanges of the H cross-section are inwardly bent to allow the pin to be accommodated in the hole easily. 45 According to another aspect of the present invention, the flanges of the cross-section are ouwardly bent to allow the pin to be accommodated in the hole easily.
An embodiment of the present invention will 50 now be described with reference to the following drawing in which:
Figure 1 shows a view of a spill,
Figure 2 shows a spill fitted into a connector moulding and a plated-through hole of a 55 backplane,
Figure 3 shows an enlarged cross-section when viewed in the direction of arrows A-A in Fig. 1, and Figure 4 shows an alternative form of the 60 cross-section shown in Fig. 3.
In Figs. 1 to 4, like parts have been given the same identification letter. The spill is made from a phospor bronze drawn pin of square section.
65 Referring to Figs. 1 to 4 the portion of the spill B which is to be accommodated in a plated-through hole is flattened in the area of
C, and flanges D and E are formed on the edges of the web formed by flattening area C.
70 A longitudinal slot F is cut into the central web portion of area C.
Sections G and H of the spill B are gold plated to a thickness of 2.5 micrometres, and section I is coated with tin lead in readiness 75 for use in solder reflow process.
Fig. 2 shows a backplane J having several plated-through holes and a connector moulding K having holes in alignment with the plated-through holes. A spill B is shown in position 80 in one of the holes. As the spill B is inserted into a plated-through hole, the flanges D, E suffer compressive forces and the longitudinal hole F begins to collapse inwardly. The result is that the spill B is easily forced into the 85 plated-through hole, and experiences an interference-fit therewith.
The backplane is then subjected to a solder reflow process causing the coating of tin-lead on the spill and the plated-through hole coat-90 ing to melt and mix thereby giving a good solder joint at least in the areas L, Fig. 3, Fig. 4.
Fig. 4 shows an alternative form of cross-section to that shown in Fig. 3. The flanges D 95 and E are bent outwardly. As the spill B is inserted into a plated-through hole, the flanges
D,E suffer compressive forces and the longitudinal hole F begins to collapse inwardly. The result is that the spill B is easily forced into
100 the plated-through hole, and experiences an interference-fit therewith.
As a result a good electrical connection with the backplane J is achieved together with reliably anchoring the spill B in the plated-
105 through hole, at a manufacturing cost which is less than the solder ring method discussed above.
Claims (8)
110 1. A contact spill, for use in the manufacture of a backplane provided with a plated-through hole for the reception of the spill, wherein a portion of the spill, arranged to cooperate with the plated-through hole, is
115 formed in a manner which allows the spill to experience an interference-fit with the hole, and is further prepared with a coating to permit the spill to be subjected to a reflow solder process and thereby make a good electri-
120 cal contact with the plated-through hole.
2. A contact spill as claimed in claim 1, wherein the portion of the spill is formed into an H cross-section, and a central limb of the H cross-section is provided with a slot ar-
125 ranged to inwardly collapse as the spill is fitted into the plated-through hole.
3. A contact spill as claimed in claim 2, wherein flanges of the H cross-section are inwardly bent to allow the spill to be accommo-
130 dated in the plated-through hole easily.
2
GB2 186124A
2
4. A contact spill as claimed in claim 2, wherein flanges of the H cross-section are outwardly bent to allow the spill to be accommodated in the plated-through hole easily.
5 5. A contact spill substantially as hereinbefore described.
6. A contact spill substantially as hereinbe-. fore described with reference to Fig. 1 of the accompanying drawings.
10
7. A contact spill substantially as hereinbefore described with reference to Fig. 2 of the accompanying drawings.
8. A contact spill substantially as hereinbefore described with reference to Figs. 3 or 4 15 of the accompanying drawings.
Printed for Her Majesty's Stationery Office by Burgess & Son (Abingdon) Ltd, Dd 8991685, 1987.
Published at The Patent Office, 25 Southampton Buildings,
London, WC2A 1 AY, from which copies may be obtained.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08602310A GB2186124A (en) | 1986-01-30 | 1986-01-30 | Contact pin |
| EP87100541A EP0234235A1 (en) | 1986-01-30 | 1987-01-16 | Contact spill |
| IE11587A IE870115L (en) | 1986-01-30 | 1987-01-20 | Contact spill |
| DK43887A DK43887A (en) | 1986-01-30 | 1987-01-27 | CONTACT PLOEK |
| PT8421087A PT84210A (en) | 1986-01-30 | 1987-01-28 | CONTACT FOR PRINTED CIRCUIT |
| FI870392A FI870392A (en) | 1986-01-30 | 1987-01-29 | Contact element. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08602310A GB2186124A (en) | 1986-01-30 | 1986-01-30 | Contact pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8602310D0 GB8602310D0 (en) | 1986-03-05 |
| GB2186124A true GB2186124A (en) | 1987-08-05 |
Family
ID=10592241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08602310A Withdrawn GB2186124A (en) | 1986-01-30 | 1986-01-30 | Contact pin |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0234235A1 (en) |
| DK (1) | DK43887A (en) |
| FI (1) | FI870392A (en) |
| GB (1) | GB2186124A (en) |
| IE (1) | IE870115L (en) |
| PT (1) | PT84210A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0255093A2 (en) * | 1986-07-28 | 1988-02-03 | GTE Products Corporation | Electrical connector with compliant section |
| GB2195836B (en) * | 1986-07-11 | 1991-01-02 | Neumayer Karl | Contact pin |
| GB2245770B (en) * | 1990-06-01 | 1994-09-21 | Oxley Dev Co Ltd | Compliant pins |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3909310A1 (en) * | 1989-03-21 | 1990-09-27 | Unimet Gmbh | Contact pin |
| DE9004090U1 (en) * | 1990-04-09 | 1990-06-13 | ELCO Elektronik GmbH, 5240 Betzdorf | Press-in contact |
| DE19810897C1 (en) * | 1998-03-13 | 1999-08-19 | Weidmueller Interface | Contact pin for solder-free mounting in metallised circuit board holes |
| DE19831672B4 (en) * | 1998-07-15 | 2005-05-12 | Ludger Sorig | press-fit |
| JP2005235410A (en) * | 2004-02-17 | 2005-09-02 | Yazaki Corp | Terminal for connecting substrate |
| JP4709502B2 (en) | 2004-05-14 | 2011-06-22 | タイコエレクトロニクスジャパン合同会社 | Board mounted electrical connector |
| DE102010024526A1 (en) | 2010-06-21 | 2011-12-22 | Schroeder + Bauer Gmbh + Co. Kg | Press-in contact for pressing into hole of printed circuit board to connect electrical components with board, has insertion portion comprising middle portion with embossed zone that completely extends around slot |
| EP3091616A1 (en) | 2015-05-06 | 2016-11-09 | PPM-Pforzheimer Präzisions Mechanik GmbH + Co. KG | Solder-free circuit board plug contact |
| DE102015014553A1 (en) | 2015-11-11 | 2017-05-11 | Andreas Veigel | Electrical contact element for insertion into a metallic bore |
| US10729016B1 (en) | 2019-03-13 | 2020-07-28 | International Business Machines Corporation | Shape-memory alloy connector for plated through-hole |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1142160A (en) * | 1966-03-17 | 1969-02-05 | Howell Samuel Hughes | Connections to printed circuit boards |
| US3915546A (en) * | 1971-06-15 | 1975-10-28 | Amp Inc | Selectively applied flowable solder apparatus, product and method of fabrication |
| US4087906A (en) * | 1974-07-11 | 1978-05-09 | Amp Incorporated | Method of selectively applying solder onto conductors |
| EP0105044A1 (en) * | 1982-08-31 | 1984-04-04 | Burndy Electra N.V. | Electric contact pin for use in printed circuit boards |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL149675B (en) * | 1972-05-10 | 1976-05-17 | Berg Electronics B V | CHAIN PLATE PIN. |
| US4017142A (en) * | 1975-03-14 | 1977-04-12 | E. I. Du Pont De Nemours And Company | Self-staking circuit board pin contact |
| ATE17415T1 (en) * | 1982-03-04 | 1986-01-15 | Du Pont | PRESS-FIT ELECTRICAL CONNECTIONS. |
-
1986
- 1986-01-30 GB GB08602310A patent/GB2186124A/en not_active Withdrawn
-
1987
- 1987-01-16 EP EP87100541A patent/EP0234235A1/en not_active Withdrawn
- 1987-01-20 IE IE11587A patent/IE870115L/en unknown
- 1987-01-27 DK DK43887A patent/DK43887A/en not_active Application Discontinuation
- 1987-01-28 PT PT8421087A patent/PT84210A/en unknown
- 1987-01-29 FI FI870392A patent/FI870392A/en not_active Application Discontinuation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1142160A (en) * | 1966-03-17 | 1969-02-05 | Howell Samuel Hughes | Connections to printed circuit boards |
| US3915546A (en) * | 1971-06-15 | 1975-10-28 | Amp Inc | Selectively applied flowable solder apparatus, product and method of fabrication |
| US4087906A (en) * | 1974-07-11 | 1978-05-09 | Amp Incorporated | Method of selectively applying solder onto conductors |
| EP0105044A1 (en) * | 1982-08-31 | 1984-04-04 | Burndy Electra N.V. | Electric contact pin for use in printed circuit boards |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2195836B (en) * | 1986-07-11 | 1991-01-02 | Neumayer Karl | Contact pin |
| EP0255093A2 (en) * | 1986-07-28 | 1988-02-03 | GTE Products Corporation | Electrical connector with compliant section |
| EP0255093A3 (en) * | 1986-07-28 | 1989-05-31 | Gte Products Corporation | Electrical connector with compliant section |
| GB2245770B (en) * | 1990-06-01 | 1994-09-21 | Oxley Dev Co Ltd | Compliant pins |
Also Published As
| Publication number | Publication date |
|---|---|
| FI870392A0 (en) | 1987-01-29 |
| FI870392A (en) | 1987-07-31 |
| PT84210A (en) | 1987-02-01 |
| DK43887A (en) | 1987-07-31 |
| IE870115L (en) | 1987-07-30 |
| EP0234235A1 (en) | 1987-09-02 |
| DK43887D0 (en) | 1987-01-27 |
| GB8602310D0 (en) | 1986-03-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |