GB2138775B - Transferring e.g. semi-conductor wafers between carriers - Google Patents

Transferring e.g. semi-conductor wafers between carriers

Info

Publication number
GB2138775B
GB2138775B GB08333210A GB8333210A GB2138775B GB 2138775 B GB2138775 B GB 2138775B GB 08333210 A GB08333210 A GB 08333210A GB 8333210 A GB8333210 A GB 8333210A GB 2138775 B GB2138775 B GB 2138775B
Authority
GB
United Kingdom
Prior art keywords
carriers
transferring
semi
conductor wafers
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08333210A
Other versions
GB8333210D0 (en
GB2138775A (en
Inventor
Raymond D Worden
Lorenzo D Geren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ruska Instrument Corp
Original Assignee
Ruska Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruska Instrument Corp filed Critical Ruska Instrument Corp
Publication of GB8333210D0 publication Critical patent/GB8333210D0/en
Publication of GB2138775A publication Critical patent/GB2138775A/en
Application granted granted Critical
Publication of GB2138775B publication Critical patent/GB2138775B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB08333210A 1983-04-25 1983-12-13 Transferring e.g. semi-conductor wafers between carriers Expired GB2138775B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48793283A 1983-04-25 1983-04-25

Publications (3)

Publication Number Publication Date
GB8333210D0 GB8333210D0 (en) 1984-01-18
GB2138775A GB2138775A (en) 1984-10-31
GB2138775B true GB2138775B (en) 1987-02-04

Family

ID=23937711

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08333210A Expired GB2138775B (en) 1983-04-25 1983-12-13 Transferring e.g. semi-conductor wafers between carriers

Country Status (1)

Country Link
GB (1) GB2138775B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568234A (en) * 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
US4611966A (en) * 1984-05-30 1986-09-16 Johnson Lester R Apparatus for transferring semiconductor wafers
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
JPS636857A (en) * 1986-06-26 1988-01-12 Fujitsu Ltd Wafer transfer device
US5246528A (en) * 1991-05-31 1993-09-21 Shin-Etsu Handotai Co., Ltd. Automatic wafer etching method and apparatus
US5810549A (en) * 1996-04-17 1998-09-22 Applied Materials, Inc. Independent linear dual-blade robot and method for transferring wafers
US6890796B1 (en) 1997-07-16 2005-05-10 Oki Electric Industry Co., Ltd. Method of manufacturing a semiconductor package having semiconductor decice mounted thereon and elongate opening through which electodes and patterns are connected
JPH1140694A (en) 1997-07-16 1999-02-12 Oki Electric Ind Co Ltd Semiconductor package, and semiconductor device and their manufacture

Also Published As

Publication number Publication date
GB8333210D0 (en) 1984-01-18
GB2138775A (en) 1984-10-31

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee