EP1078301A1 - Dispositif de retenue de plaque pour photomasque - Google Patents

Dispositif de retenue de plaque pour photomasque

Info

Publication number
EP1078301A1
EP1078301A1 EP99917782A EP99917782A EP1078301A1 EP 1078301 A1 EP1078301 A1 EP 1078301A1 EP 99917782 A EP99917782 A EP 99917782A EP 99917782 A EP99917782 A EP 99917782A EP 1078301 A1 EP1078301 A1 EP 1078301A1
Authority
EP
European Patent Office
Prior art keywords
photoblank
holding device
tip
grounding
spring leaf
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99917782A
Other languages
German (de)
English (en)
Inventor
Gernot GÖDL
Andreas Oelmann
Gerd Unger
Wolfgang BESENBÖCK
Alois Reiter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1078301A1 publication Critical patent/EP1078301A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/40—Electrostatic discharge [ESD] related features, e.g. antistatic coatings or a conductive metal layer around the periphery of the mask substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography

Definitions

  • the invention relates to a holding device for photoblanks and a method for grounding a photoblank used in such a device.
  • photoblanks are used as the starting material in the production of photomasks for photolithographic processes. These photoblanks are polished quartz plates that are coated with a chrome layer and a layer of photoresist arranged above them. The photoblank is irradiated with an electron beam in an electron beam recorder, the desired mask pattern being transferred to the photoblank. During this irradiation, the photoblank must be grounded, since otherwise static charges can form in the area of its surface, which undesirably influence the electron beam during pattern drawing.
  • the invention has for its object to provide a holding device for photoblanks with which a high yield of flawless masks is made possible. Furthermore, the invention aims to provide a method, the use of which increases the yield of defect-free masks during manufacture.
  • the ground contact is formed by pressing the tip into a surface layer area of the photoblank with little damage, avoiding any "scratching" on the surface.
  • the earthing element according to the invention provides a defined and reliable electrical contact formation and thus a consistently good earthing.
  • the grounding element is designed as a spring leaf which can be fixed at one end to the holding body and provided with the contacting spring at its other end.
  • the spring leaf has a bend in the tension-free state, on which the spring leaf deviates from a straight line in its longitudinal extent at an angle. With a suitable choice of the angle oc, the dimensioning of the spring leaf and a suitable choice of material, the spring characteristic of the spring leaf can be set as desired.
  • a position actuator member is expediently attached to the spring leaf, which forms an adjustable stop on the holding device.
  • the stroke of the contact tip over the photoblank can be specified in a defined manner and it is also possible to control the lowering of the tip by actuating the position member.
  • the contacting tip is preferably formed from a hard material with good electrical conductivity, in particular a hard metal. This ensures a high degree of wear-free and dimensional stability of the tip as well as a low electrical resistance of the tip.
  • the contacting tip is designed as a polygonal tip in which at least one edge is a cutting edge.
  • at least one edge is a cutting edge.
  • the photoblank is first fixed in its end position on the holding device and the contacting tip of the grounding element is subsequently brought down essentially in the normal direction to the plane of the contact surface.
  • Figure 1 is a cross-sectional view of a cassette with an inserted photo blank and attached earthing spring with spring leaf and contacting tip.
  • Fig. 2 is a top view of the arrangement shown in Fig. 1;
  • FIG. 3a shows a sectional illustration of the spring leaf from FIG. 1;
  • FIG. 3b shows the spring leaf shown in FIG. 3a in a top view
  • Fig. 4a the grounding spring from FIG. 1 in the area of the contact tip in a top view
  • Fig. 4b is a side view of the tip portion of the grounding spring shown in Fig. 4a.
  • a cassette for holding a photobank in a mask artist has a holding plate 1 with a central recess 2.
  • the surface of the central recess 2 forms a support surface 3 for a photoblank 4.
  • the photoblank 4 consists of a polished quartz plate 5, on the surface of which there is an approximately 100 nm thick metal layer, for example a chromium layer 6 and an approximately 400 nm thick photoresist layer 7 arranged above it are upset.
  • the arrow X indicates the direction in which an electron beam for mask drawing is directed onto the photo blank 4.
  • the photoblank 4 is fixed in terms of position by means of a holding-down device 8 fastened to the holding plate 1 by pressing it onto the bearing surface 3.
  • the hold-down 8 has a dome-shaped fixing element 9 at its end remote from the holding plate, which can consist, for example, of sapphire and forms an essentially punctiform contact area with the surface of the photoblank 4.
  • hold-down devices 8 of this type can be provided on the holding plate 1.
  • a grounding spring 10 is provided for electrically contacting the chrome layer 6 of the photoblank 4 with the holding plate 1.
  • the grounding spring 10 consists essentially of a spring leaf 12, which is mechanically fixed via two screw connections 11 and with good electrical contact on the metal holding plate 1.
  • the spring leaf 12 extends essentially parallel to the surface 13 of the holding plate 1 and projects at its free end 14 beyond the central recess 2 of the holding plate 1.
  • a contacting tip 15 is attached to the free end 14, which, for example, is conical or as shown in FIG. 1 as Polygonal tip can be formed and is in good electrical contact with the chrome layer 6. Consequently, the chromium layer 6 is connected to the ground potential of the holding plate 1 via the earth spring 10.
  • the spring leaf 12 In the vicinity of a step formation 16 to the central recess 2, the spring leaf 12 is also provided with a threaded bore 17, into which a Teflon-coated adjusting screw 18 is screwed.
  • the adjusting screw 18 stands on its thread-side end on the surface 13 of the holding plate 1, so that the height of the contacting tip 15 above the surface of the quartz plate 5 can be adjusted very precisely via the rotational position of the adjusting screw 18.
  • Fig. 2 shows the holding device shown in Fig. 1 in
  • the photo blank 4 is inserted into the recess 2 of the holding plate 1.
  • both the hold-down 8 and the earthing spring 10 have been removed from the holding plate 1 so that the recess 2 is freely accessible.
  • the photoblank 4 is then grounded by attaching the grounding spring 10.
  • the spring leaf 12 is firmly screwed to the holding plate 1 or to a spacing base 20 provided on the holding plate 1 via the two screw connections 11. Care is taken to ensure that the contacting tip 15 does not yet come into contact with the surface of the photoblank 4 at this time. This can ensure, for example, Continuously, that the set screw 18 was screwed into the threaded bore 17 sufficiently far to secure the distance.
  • Another possibility is to take advantage of the elasticity of the spring leaf 12 and the contacting tip 15 during assembly by a suitable one
  • the contact tip 15 is lowered onto the surface of the photoblank 4 in a controlled manner. In the former case, this is done by unscrewing the set screw 18 from the threaded bore 17 by a defined amount. The contacting tip 15 lowers on the surface of the photoblank 4 and penetrates into the two upper ones
  • the press-in pressure is determined by the elasticity of the shape of the spring leaf 12, which depends on the material, the dimensions and an optional shape (see FIG. 3a) of the spring leaf 12 and can be predetermined by varying these parameters. It has been shown that permanent and reproducible electrical contacting of the chromium layer 6 can be achieved even at relatively low contact pressures. This is important because, especially with thin photoblanks, the application of pressure can cause the photoblank to bend undesirably. It is therefore provided that the contact pressure, depending on the thickness or deflection strength of the photoblank used, is always set so low that deflection of the photoblank is reliably avoided.
  • the second possibility (lowering of the contacting tip 15 by means of an aid) offers the advantage that the set screw 18 does not have to be turned for this process.
  • An exact pre-positioning of the set screw 18 therefore allows a desired end position stroke of the contacting tip 15 to be maintained very accurately. It is essential that in both approaches a lateral relative movement between the photo blank 4 and the contacting tip 15 is effectively prevented when the tip is applied.
  • FIG. 3a shows a possible shape of a suitable spring leaf 12 in the tension-free state.
  • a bend 19 is formed between the drill holes 21 provided for the screw connections 11 and the threaded bore 17, on which the spring leaf 12 is bent by an angle ⁇ of, for example, 5 ° with respect to its straight course.
  • the spring leaf 12 can consist of a CuSn alloy (bronze), for example a CuSn ⁇ alloy with 6% Sn content or a CuBe alloy.
  • the free end 14 of the spring leaf 12 is shown enlarged.
  • the spring leaf 12 has at its free end 14 a bore 22 into which the pin-shaped contact tip 15 is pressed.
  • the contact tip 15 can be secured in the area of the bore 22 with a conductive adhesive.
  • a low-resistance electrical connection between the spring leaf 12 and the contacting tip 15 is achieved by the press fit and the optionally additionally provided conductive adhesive.
  • the contacting tip 15 is formed in its front area as a triangular tip, the three edges being arranged at an angle of 120 ° to one another.
  • the tip 15 is provided with a sharp-edged and burr-free fine grinding.
  • a cutting surface 23 formed between two cutting edges is inclined at an angle ⁇ of approximately 30 ° with respect to the central axis of the contacting tip 15.
  • the contacting tip 15 is preferably made of a hard metal of the GTD type, which is high hardness and good has electrical conductivity and also none
  • Beam geometry contains disruptive magnetic components.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electron Beam Exposure (AREA)

Abstract

Dispositif de retenue de plaque pour photomasque, qui comporte un corps (1) de retenue doté d'une surface de support (3) de la plaque (4) pour photomasque, ainsi qu'un élément de mise à la terre (10) pouvant être connecté électriquement à une couche électriquement conductrice (6) de la plaque pour photomasque. L'élément de mise à la terre comporte une pointe de contact (15) pouvant être manipulée de telle sorte qu'elle peut être abaissée sur la plaque (4) pour photomasque, pratiquement sans mouvement latéral relatif par rapport à ladite plaque qui est installée dans le dispositif de retenue.
EP99917782A 1998-03-13 1999-03-11 Dispositif de retenue de plaque pour photomasque Withdrawn EP1078301A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19811081A DE19811081C1 (de) 1998-03-13 1998-03-13 Haltevorrichtung für Photoblanks
DE19811081 1998-03-13
PCT/DE1999/000675 WO1999047977A1 (fr) 1998-03-13 1999-03-11 Dispositif de retenue de plaque pour photomasque

Publications (1)

Publication Number Publication Date
EP1078301A1 true EP1078301A1 (fr) 2001-02-28

Family

ID=7860879

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99917782A Withdrawn EP1078301A1 (fr) 1998-03-13 1999-03-11 Dispositif de retenue de plaque pour photomasque

Country Status (7)

Country Link
US (1) US6972832B1 (fr)
EP (1) EP1078301A1 (fr)
JP (1) JP2002507768A (fr)
KR (1) KR20010041845A (fr)
CN (1) CN1187655C (fr)
DE (1) DE19811081C1 (fr)
WO (1) WO1999047977A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9514663B2 (en) 2012-07-30 2016-12-06 Ultravision Technologies, Llc Method of uniformly illuminating a billboard

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10336125B2 (en) * 2013-11-05 2019-07-02 Illinois Tool Works Inc. Composite laminate assembly used to form plural individual cards and method of manufacturing the same
CN108073035A (zh) * 2016-11-08 2018-05-25 中芯国际集成电路制造(上海)有限公司 一种光刻掩膜版和光刻掩膜版缺陷的修复方法

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JPS59114818A (ja) * 1982-12-21 1984-07-03 Toshiba Corp 電子ビ−ムパタ−ン描画方法
JPH07114182B2 (ja) * 1987-03-10 1995-12-06 富士通株式会社 荷電粒子線露光における乾板の製造方法
JPH0668240B2 (ja) 1988-01-21 1994-08-31 佐藤工業株式会社 コンクリート打設装置
JPH01187926A (ja) * 1988-01-22 1989-07-27 Nec Corp マスク及びレチクルの製造方法
JPH01217349A (ja) * 1988-02-25 1989-08-30 Dainippon Printing Co Ltd ブランク板、ブランク板を用いたフォトマスクおよびそれらの製造方法
JPH0230047A (ja) * 1988-07-18 1990-01-31 Nec Corp 電子ビーム露光装置用試料ホルダー
JPH02125416A (ja) * 1988-11-02 1990-05-14 Nec Corp 電子ビーム露光装置
JPH02125607A (ja) * 1988-11-04 1990-05-14 Nec Corp 電子ビーム描画装置用試料ホルダー
JPH03263814A (ja) * 1990-03-14 1991-11-25 Matsushita Electron Corp 試料導通をとる方法
JPH04353848A (ja) * 1991-05-31 1992-12-08 Fujitsu Ltd マスクの製造方法
US5843623A (en) * 1996-09-10 1998-12-01 International Business Machines Corporation Low profile substrate ground probe

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9514663B2 (en) 2012-07-30 2016-12-06 Ultravision Technologies, Llc Method of uniformly illuminating a billboard
US9524661B2 (en) 2012-07-30 2016-12-20 Ultravision Technologies, Llc Outdoor billboard with lighting assemblies
US9542870B2 (en) 2012-07-30 2017-01-10 Ultravision Technologies, Llc Billboard and lighting assembly with heat sink and three-part lens
US9659511B2 (en) 2012-07-30 2017-05-23 Ultravision Technologies, Llc LED light assembly having three-part optical elements
US9685102B1 (en) 2012-07-30 2017-06-20 Ultravision Technologies, Llc LED lighting assembly with uniform output independent of number of number of active LEDs, and method
US9734738B2 (en) 2012-07-30 2017-08-15 Ultravision Technologies, Llc Apparatus with lighting units
US9732932B2 (en) 2012-07-30 2017-08-15 Ultravision Technologies, Llc Lighting assembly with multiple lighting units
US9734737B2 (en) 2012-07-30 2017-08-15 Ultravision Technologies, Llc Outdoor billboard with lighting assemblies
US9812043B2 (en) 2012-07-30 2017-11-07 Ultravision Technologies, Llc Light assembly for providing substantially uniform illumination
US9947248B2 (en) 2012-07-30 2018-04-17 Ultravision Technologies, Llc Lighting assembly with multiple lighting units
US10223946B2 (en) 2012-07-30 2019-03-05 Ultravision Technologies, Llc Lighting device with transparent substrate, heat sink and LED array for uniform illumination regardless of number of functional LEDs
US10339841B2 (en) 2012-07-30 2019-07-02 Ultravision Technologies, Llc Lighting assembly with multiple lighting units
US10410551B2 (en) 2012-07-30 2019-09-10 Ultravision Technologies, Llc Lighting assembly with LEDs and four-part optical elements
US10891881B2 (en) 2012-07-30 2021-01-12 Ultravision Technologies, Llc Lighting assembly with LEDs and optical elements

Also Published As

Publication number Publication date
JP2002507768A (ja) 2002-03-12
WO1999047977A1 (fr) 1999-09-23
CN1300384A (zh) 2001-06-20
CN1187655C (zh) 2005-02-02
KR20010041845A (ko) 2001-05-25
US6972832B1 (en) 2005-12-06
DE19811081C1 (de) 1999-10-28

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