EP1027730A1 - Semiconductor processing apparatus having linear conveyor system - Google Patents

Semiconductor processing apparatus having linear conveyor system

Info

Publication number
EP1027730A1
EP1027730A1 EP98903371A EP98903371A EP1027730A1 EP 1027730 A1 EP1027730 A1 EP 1027730A1 EP 98903371 A EP98903371 A EP 98903371A EP 98903371 A EP98903371 A EP 98903371A EP 1027730 A1 EP1027730 A1 EP 1027730A1
Authority
EP
European Patent Office
Prior art keywords
wafer
transfer
semiconductor
transport
guide rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98903371A
Other languages
German (de)
French (fr)
Inventor
Kyle Hanson
Mark Dix
Daniel J. Woodruff
Wayne J. Schmidt
Kevin W. Coyle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/990,107 external-priority patent/US6672820B1/en
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of EP1027730A1 publication Critical patent/EP1027730A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Definitions

  • interconnect metallization which electrically connects the various devices on the integrated circuit to one another.
  • aluminum has been used for such interconnects, however, it is now recognized that copper metallization may be preferable.
  • the industry has sought to overcome the problem of forming patterned layers of copper by using a damascene electroplating process where holes, more commonly called vias, trenches and other recesses are used in which the pattern of copper is desired.
  • the wafer is first provided with a metallic seed layer which is used to conduct electrical current during a subsequent metal electroplating step.
  • the seed layer is a very thin layer of metal which can be applied using one or more of several processes. For example, the seed layer of metal can be laid down using physical vapor deposition or chemical vapor deposition processes to produce a layer on the order of 1000 angstroms thick.
  • the seed layer can advantageously be formed of copper, gold, nickel, palladium, and most or all other metals.
  • the seed layer is formed over a surface which is convoluted by the presence of the vias, trenches, or other device features which are recessed. This convoluted nature of the exposed surface provides increased difficulties in forming the seed layer in a uniform manner. Nonuniformities in the seed layer can result in variations in the electrical current passing from the exposed surface of the wafer during the subsequent electroplating process. This in turn can lead to nonuniformities in the copper layer which is subsequently electroplated onto the seed layer. Such nonuniformities can cause deformities and failures in the resulting semiconductor device being formed.
  • the copper layer that is electroplated onto the seed layer is in the form of a blanket layer.
  • the blanket layer is plated to an extent which forms an overlying layer, with the goal of completely providing a copper layer that fills the trenches and vias and extends a certain amount above these features.
  • Such a blanket layer will typically be formed in thicknesses on the order of 10,000-15,000 angstroms (1-1.5 microns).
  • the damascene processes also involve the removal of excess metal material present outside of the vias, trenches or other recesses.
  • the metal is removed to provide a resulting patterned metal layer in the semiconductor integrated circuit being formed.
  • the excess plated material can be removed, for example, using chemical mechanical planarization.
  • Chemical mechanical planarization is a processing step which uses the combined action of a chemical removal agent and an abrasive which grind and polish the exposed metal surface to remove undesired parts of the metal layer applied in the electroplating step.
  • a transport system for manipulating a semiconductor wafer in a processing tool is
  • the system includes a transport unit guide disposed within the processing tool for
  • the transport unit guide comprises a frame, a lateral guide rail mounted on the
  • the wafer transfer unit includes a tram translatably attached to the
  • An electromagnet is mounted on the tram in cooperative relation with the magnetic
  • Actuators are used for
  • a controller for determining the position of the transfer unit and the transfer arm assembly.
  • communication link is a fiber optic link.
  • Fig. 1 is an isometric view of the semiconductor wafer processing tool in accordance
  • Fig. 2 is a cross-sectional view taken along line 2-2 of the semiconductor wafer
  • Figs. 3-8 are a diagrammatic representation of a wafer cassette turnstile and elevator of
  • present invention operating to exchange wafer cassettes between a hold position and an
  • Fig. 9 is an isometric view of a preferred wafer cassette tray engageable with the
  • FIGS. 10-15 illustrate one manner in which the processing tool may be modularized to
  • Figs. 16-19 illustrate a wafer conveying system in accordance with one embodiment of
  • Figs. 20-25 illustrate a further wafer conveying system in accordance with a further
  • Fig. 26 is a functional block diagram of an embodiment of a control system of the
  • Fig. 27 is a functional block diagram of a master/slave control configuration of an
  • Fig. 28 is a functional block diagram of an interface module control subsystem
  • Fig. 29 is a functional block diagram of a wafer conveyor control subsystem coupled
  • Fig. 30 is a functional block diagram of a wafer processing module control subsystem
  • Fig. 31 is a functional block diagram of a slave processor of the interface module
  • control subsystem coupled with components of a wafer interface module of the processing
  • Fig. 32 is a functional block diagram of a slave processor of the wafer conveyor
  • control subsystem coupled with components of a wafer conveyor of the processing tool.
  • Fig. 33 is a cross-sectional view of a processing station for use in electroplating a
  • the processing tool 10 may comprise an interface section 12 and
  • semiconductor wafers may be loaded into the processing tool 10 or
  • the wafer cassettes 16 are
  • first port 32 preferably loaded or unloaded through at least one port such as first port 32 within a front
  • An additional second port 33 may be
  • port 33 may be utilized as an output.
  • Respective powered doors 35, 36 may be utilized to cover access ports 32, 33 thereby
  • Each door 35, 36 may be
  • the upper portions and lower portion move upward and downward
  • Wafer cassettes 16 are typically utilized to transport a plurality of semiconductor
  • the wafer cassettes 16 are preferably oriented to provide the semiconductor wafers
  • the front outwardly facing surface of the processing tool 10 may advantageously join
  • wafer cassettes 16 may be introduced into processing tool 10 or removed
  • the interface section 12 joins a processing section 14 of the processing tool 10.
  • processing section 14 may include a plurality of semiconductor wafer processing modules for
  • processing tool 10 shown in Fig. 1 includes a plating module 20 defining a first lateral surface
  • the processing section 14 of the tool 10 may advantageously
  • modules of the processing tool 10 may be different or of similar nature.
  • the processing tool 10 is
  • the processing modules of the process tool 10 are preferably modular,
  • Additional wafer processing modules may be
  • the processing tool 10 of the present invention preferably includes a rear closure
  • processing section 14 The interface section 12, lateral sides of the processing section 14,
  • closure surface 18, and air supply 26 preferably provide an enclosed work space 11 within the
  • the air supply 26 may comprise a duct coupled with a filtered air source
  • supply 26 may include a plurality of vents intermediate the processing modules 19 for
  • exhaust ducts 58, 59 may be provided adjacent the frame 65 of a
  • wafer transport unit guide 66 to remove the circulated clean air and the contaminants therein.
  • Exhaust ducts 58, 59 may be coupled with the each of the processing modules 19 for drawing
  • clean air is supplied to the workspace 11 of the
  • the air may be drawn adjacent the wafer transport units
  • Each processing module 19 within the processing tool 10 may be directly coupled
  • a user interface 30 may be provided at the outwardly facing front surface of the
  • the user interface 30 may advantageously be a touch
  • An additional user interface 30 may be any user interface
  • processing tool 10 operation can be effected from alternate locations about the
  • a portable user interface 30 may be provided to permit an
  • the user interface 30 may be utilized to teach specified functions and
  • Each module 20, 22, 24 within the processing tool 10 preferably includes a window 34
  • each processing module 20, 22 may be advantageously provided within a top surface of each processing module 20, 22,
  • Processing module electronics are preferably located adjacent the vents 37 allowing circulating air to dissipate heat generated by such electronics.
  • FIG. 2 is shown in detail in detail in Fig. 2.
  • the interface section 12 includes two interface modules 38, 39 for manipulating wafer
  • the interface modules 38, 39 receive wafer
  • cassettes 16 through the access ports 32, 33 and may store the wafer cassettes 16 for
  • Each interface module 38, 39 may comprise a wafer cassette turnstile 40, 41 and a
  • the wafer cassette elevator 42, 43 The wafer cassette turnstiles 40, 41 generally transpose the
  • wafer cassettes 16 from a stable vertical orientation to a horizontal orientation where access to
  • Each wafer cassette elevator 42, 43 has a respective
  • the second wafer interface module 39 may function as an
  • Wafer transport units 62, 64 within the processing tool 10 may access wafer cassettes 16 held by either wafer interface module 38, 39. Such an arrangement
  • a semiconductor wafer conveyor 60 is shown intermediate processing modules 20, 22,
  • the wafer conveyor 60 includes wafer transport
  • Wafer conveyor 60 advantageously includes a transport unit guide 66, such as an
  • a wafer transport unit 62 on a first path 68 may pass a wafer
  • transport unit 64 positioned on a second path 70 during movement of the transport units 62, 64
  • the processing tool 10 may include additional wafer transport units
  • the second arm extension 88 may support a semiconductor wafer W
  • the appropriate wafer transport unit 62, 64 may approach a wafer
  • the first extension 87 and second extension 88 may rotate to approach the wafer
  • the second extension 88 is positioned above the wafer support 401 and
  • the vacuum is removed from vacuum support 89, and finger assemblies within the processing
  • Second extension 88 may be
  • a wafer transport unit 62, 64 may retrieve the wafer and either
  • cassette 16 for storage or removal from the processing tool 10.
  • Each of the wafer transport units 62, 64 may access a wafer cassette 16 adjacent the
  • wafer transport unit 62 is shown withdrawing a
  • the second extension 88 and vacuum support 89 connected therewith may be
  • a vacuum may be applied via vacuum support 89 once support 89
  • first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may be raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may
  • transport unit 62, 64 may thereafter deliver the semiconductor wafer W to a wafer processing
  • wafer transport unit 62 may travel along path 68 to a position adjacent an
  • processing support 401 for processing of the semiconductor wafer INTERFACE MODULE
  • wafer interface module 38 is also applicable
  • the first wafer interface module 38 and the second wafer interface module are preferably identical.
  • both modules can function as both input and
  • wafer cassettes 16 holding unprocessed semiconductors wafers may
  • Processed semiconductor wafers may be delivered to a wafer cassette 16 for processing.
  • Processed semiconductor wafers may be delivered to a wafer cassette 16
  • wafer transport units 62, 64 for temporary
  • the wafer interface modules 38, 39 may be directly accessed by each of the wafer
  • each wafer transport unit 62, 64 facilitates the transport of semiconductor wafers W
  • Each wafer interface module 38, 39 preferably includes a wafer cassette turnstile 40
  • the access ports 32, 33 are adjacent the respective wafer cassette turnstiles 40, 41. Wafer cassettes 16 may be brought into the
  • Wafer cassettes 16 are preferably placed in a vertical position onto cassette trays 50
  • Each wafer cassette turnstile 40, 41 preferably includes two saddles 45, 46 each
  • cassettes 16 to be placed into the processing tool 10 or removed therefrom during a single
  • Each saddle 45, 46 includes two forks engageable with the cassette tray 50. Saddles
  • wafers therein are preferably vertically oriented for passage through the access ports 32, 33
  • the wafer cassette 16 held by wafer cassette turnstile 40 in Fig. 3, also referred to as
  • wafer cassette 15 is in a hold position (also referred to herein as a load position).
  • a hold position also referred to herein as a load position.
  • semiconductor wafers within a wafer cassette 16 in the hold position may be stored for
  • the semiconductor wafers within a wafer cassette 16 in the hold position may be stored for subsequent removal from the processing tool 10 through an
  • wafer cassette 17 is in an extraction or exchange position.
  • wafers may either be removed from or placed into a wafer cassette 16 positioned in the
  • the wafer cassette turnstile 41 and wafer cassette elevator 42 may exchange wafer
  • Such an exchange may transfer a wafer cassette 15 having unprocessed
  • saddle 46 is positioned below a powered shaft 44 of wafer cassette elevator 42.
  • Shaft 44 is coupled with a powered wafer cassette support 47 for holding a wafer cassette 16.
  • a motor within shaft 44 rotates wafer cassette support 47 about an
  • turnstile 40 are subsequently tilted into a horizontal orientation as shown in Fig. 6.
  • wafer cassette turnstile 40 rotates 180 degrees to transpose wafer cassettes 15, 17.
  • Wafer cassette 17 having processed semiconductor wafers therein is now accessible via
  • Figure 10 illustrates one manner in which the apparatus 10 may be modularized.
  • the apparatus 10 is comprised of an input/output assembly 800, left and right
  • left and right processing modules 805 and 810 may be
  • the wafer conveying system 60 of one apparatus 10 is programmed to cooperate with the
  • wafer conveying system 60 of one or more prior or subsequent conveying systems 60 of one or more prior or subsequent conveying systems 60.
  • Figure 11 illustrates one manner of arranging processing heads within the apparatus
  • the left hand processing module 805 is comprised of three processing heads that are dedicated to rinsing and drying each wafer after electrochemical
  • the left hand processing module 805 constitutes a
  • Wafer alignment may be based upon sensing of registration
  • Figures 12 and 13 illustrate embodiments of the left and right hand processing
  • Figure 14 is a perspective view of the input module 800 with its panels removed as
  • Figure 15 provides a similar view of the input
  • wafer alignment station 850 and a wafer alignment controller 860 are provided in the input
  • a robot controller 865 used to control the wafer conveying system 60 is also connected to the wafer conveying system 60.
  • the input module 800 is provided with one or more wafer mapping sensors 870 that sense the wafers present in
  • the system control computer 875 is
  • the processing tool 10 includes a semiconductor wafer conveyor 60 for transporting
  • semiconductor wafers throughout the processing tool 10.
  • semiconductor wafers are semiconductor wafers throughout the processing tool 10.
  • semiconductor wafers are semiconductor wafers throughout the processing tool 10.
  • semiconductor wafers are semiconductor wafers throughout the processing tool 10.
  • conveyor 60 may access each wafer cassette interface module 38, 39 and each wafer
  • FIG. 16 One embodiment of the wafer conveyor system 60 is depicted in Fig. 16. The wafer
  • conveyor 60 generally includes a wafer transport unit guide 66 which preferably comprises an
  • transport unit guide 66 may be
  • the length of wafer conveyor 60 may be varied and is configured to permit access of
  • Wafer transport unit guide 66 defines the paths of movement 68, 70 of wafer transport
  • Each semiconductor wafer includes guide rails 63, 64 mounted on opposite sides thereof.
  • Each semiconductor wafer includes guide rails 63, 64 mounted on opposite sides thereof.
  • transport unit 62, 64 preferably engages a respective guide rail 63, 64.
  • Each guide rail can mount one or more transport units 62, 64.
  • Extensions 69, 75 may be fixed to opposing sides
  • guide 66 for providing stability of the transport units 62, 64 thereagainst and to protect
  • Each wafer transport unit 62, 64 includes a roller 77 configured to ride
  • wafer conveyor 60 may be formed in alternate
  • Ducts 58, 59 are preferably in fluid
  • Each wafer transport unit 62, 64 is powered along the respective path 68, 70 by a
  • drive operators 71, 74 are mounted to respective sides of
  • transport unit guide 66 to provide controllable axial movement of wafer transport units 62, 64
  • the drive operators 71, 74 may be linear magnetic motors for providing precise
  • electromagnet 79 mounted on the wafer transport units 62, 64 to propel the units along the
  • Cable guards 72, 73 may be connected to respective wafer transport units 62, 64 and
  • Cable guards 72, 73 may be used to protect communication and power cables therein.
  • a first wafer transport unit 62 is coupled with a first side of the
  • Each wafer transport unit 62, 64 includes a linear bearing 76 for
  • a horizontal roller 77 for engaging a extension 69 formed upon the spine of
  • Fig. 17 additionally shows an electromagnet 79 of the first wafer transport unit 62
  • electromagnet 79 provide axial movement and directional control of the wafer transport units
  • each wafer transport unit 62, 64 includes a movable carriage or tram 84
  • a wafer transfer arm assembly 86 coupled to a respective side of the transport unit guide 66, a wafer transfer arm assembly 86
  • transfer arm elevator 90 for adjusting the elevation of the transfer arm assembly 86 relative to
  • a cover 85 surrounds the portion of tram 84 facing away from
  • Tram 84 includes linear bearings 76 for engagement with
  • Linear bearings 76 maintain the tram 84 in a fixed relation with the transport unit guide 66 and permit axial movement of
  • a roller 77 engages a respective extension 69 for preventing rotation
  • tram 84 about guide rail 63, 64 and providing stability of wafer transport unit 62.
  • electromagnet 79 is also shown connected with the tram 84 in such a position to magnetically
  • a wafer transfer arm assembly 86 extends above the top of tram 84. The wafer
  • transfer arm assembly 86 may include a first arm extension 87 coupled at a first end thereof
  • a second arm extension 88 may be advantageously coupled with a second
  • the first arm extension 87 may rotate 360 degrees about shaft
  • second arm extension 88 may rotate 360 degrees about axis 82 passing through a shaft
  • Second extension 88 preferably includes a wafer support 89 at a distal end thereof for
  • the transfer arm assembly 86 preferably includes a chamber coupled with the wafer support
  • the cover 85 has been removed from the wafer transport unit shown in Fig. 19 to reveal a wafer transfer arm elevator 90 coupled with tram 84 and transfer arm assembly 86.
  • Transfer arm elevator 90 adjusts the vertical position of the transfer arm assembly 86 relative
  • unit guide 66 is precisely controlled using a positional indicating array, such as a CCD array
  • each semiconductor wafer holder 91 of Fig. 19. In one embodiment of the processing tool 10, each semiconductor wafer holder
  • the light emitter 81 may present a continuous beam
  • the transfer arm assembly 86 includes an CCD array 91 positioned to receive the laser
  • a position indicating array 91 on shaft 83 detects the
  • the positional accuracy of the wafer transport unit position indicator is preferably in die range
  • a second embodiment of a wafer transport unit 562b is shown in Figs. 20-25 and is
  • Tram 584 includes linear bearings 576 for engagement with respective
  • the electromagnet 579 magnetically interacts with the guide 66 to drive
  • a wafer transfer arm assembly 586 extends above the top of tram 584. The wafer
  • transfer arm assembly 586 includes a first arm extension 587 coupled at a first end thereof
  • a second arm extension 588 having a wafer support 589 for supporting the
  • semiconductor wafer W may be advantageously coupled with a second end of the first
  • the first arm extension 587 may rotate 360 degrees about shaft 583 and
  • second arm extension 588 may rotate 360 degrees about axis 582 passing through a shaft
  • extension 588 about axis 582 permits the semiconductor wafer transport units 562a, 562b to
  • cover 585 has been removed from the wafer transport unit 562b
  • Transfer arm elevator 590 adjusts the vertical position of the transfer arm assembly 586
  • commumcation path such as a fiber optic filament, replaces wires 72, 73 to the wafer transport units through a digital-to-analog converter board 540 on each of the wafer transport
  • TPOW absolute encoder
  • TPOW absolute encoder
  • Wrist absolute encoder located in the shaft 583.
  • TPOWISA 597 is provided at the base of the shaft 583. Lift absolute encoder 596 is located
  • absolute encoder 541 are located on the base plate 203 of the base of tram 584, the latter
  • conveyor 560 includes a wafer transport unit guide 566 which comprises an elongated spine or
  • Wafer transport unit guide 566 defines d e paths of movement
  • a spine of transport unit guide 566 includes upper guide rails 563a, 564a and lower guide rails 563b, 564b mounted on opposite sides
  • Each semiconductor wafer transport unit 544a, 544b preferably engages each of the
  • upper and lower guide rails can mount one or more transport units 544a, 544b.
  • Each wafer transport unit 544a, 544b is also powered along the respective patii 568,
  • the drive operators 571, 574 may be linear magnetic motors for providing
  • transport units 544a, 544b to propel the units along the transport unit guide 566.
  • Fiber optic cable guards 572, 573 provide commumcation with the respective wafer
  • 573 may comprise a plurality of interconnected segments to permit a full range of motion of
  • wafer transport units 544a, 544b along transport unit guide 566.
  • wafer transport units 544a, 544b are coupled along each side of
  • Each wafer transport unit 544a, 544b includes an upper linear bearing
  • wafer transport units 544a, 544b includes a lower linear bearing 576b engaging the lower
  • linear guide rails 563b, 564b providing stability and more equal distribution of the weight
  • the lower elbow housing 210 is mounted to a base plate 211, as seen in Figs. 21, 23
  • mounting screws 212 are embossed pivots 216 on the base plate 211 that engage a
  • pivots 216 are preferably sized, relative the lateral groove 218 to provide a clearance between
  • housing 210 and die attached transfer arm assembly 586, can be adjusted and fixed to provide
  • 576b is obtained by use of a compliant fastening technique.
  • a float pin 221 is positioned
  • d e control system 100 generally
  • At least one grand master controller 101 for controlling and/or monitoring the overall
  • the control system 100 is preferably arranged in a hierarchial configuration.
  • grand master controller 101 includes a processor electrically coupled with a plurality of
  • control subsystems as shown in Fig. 26.
  • the control subsystems preferably control and
  • control subsystems are
  • control subsystems 110 The control subsystems 110,
  • 113 - 119 preferably provide process and status information to respective grand master controllers 101, 102.
  • the grand master control 101 is coupled with an interface module
  • control 110 which may control each of the semiconductor wafer interface modules 38, 39.
  • grand master control 101 is coupled wim a conveyor control 113 for controlling
  • control system 100 of the processing tool 10 according to d e present disclosure may
  • control 119 Four control subsystems may be preferably coupled with each
  • the grand master controllers 101, 102 are preferably
  • Each grand master controller 101, 102 receives and transmits data to the respective
  • a bidirectional memory mapped device is provided intermediate the grand master controller
  • memory mapped devices 160 each modular subsystem connected thereto.
  • memory mapped devices 160 each modular subsystem connected thereto.
  • 161, 162 are provided intermediate the grand master controller 101 and master controllers
  • processing module control 114 controls the processing module control 114.
  • Each memory mapped device 150, 160 - 162 within the control system 100 is
  • grand master controller 101 may write data to a memory location corresponding to master controller 130 and master controller 130 may simultaneously read the data.
  • grand master controller 101 may read data from mapped memory device being
  • Memory mapped device 150 is preferably provided
  • a user interface 30 is preferably coupled with each of the grand master controllers
  • the user interface 30 may be advantageously mounted on die exterior of the
  • processing tool 10 or at a remote location to provide an operator with processing and status
  • the user interface 30 receives and processing directives for the processing tool 10 via user interface 30.
  • the user interface 30 receives and processing directives for the processing tool 10 via user interface 30.
  • general purpose computer preferably includes a 486 100 MHz processor, but other processors
  • Each modular control subsystem including interface module control 110, wafer
  • conveyor control 113 and each processing module control 114 - 119 is preferably configured
  • the modular control subsystems 110, 113 - 119 are preferably
  • the grand master controller 101 controls the processing modules 20, 22, 24.
  • corresponding master controllers 130, 131, 132 coupled therewith are preferably embodied on
  • Each grand master controller 101, 102 preferably includes a 68EC000
  • control system 100 preferably includes a 80251 processor provided by Intel.
  • Each master controller 130, 131, 132 is coupled with its respective slave controllers
  • Each data link 126, 127, 129 is connected to a data link 126, 127, 129 as shown in Fig. 27 - Fig. 30.
  • Each data link 126, 127, 129 is also connected to a data link 126, 127, 129.
  • optical data medium such as Optilink provided by Hewlett Packard.
  • data links 126, 127, 129 may comprise alternate data transfer media.
  • Each master and related slave configuration preferably corresponds
  • one master may control or monitor a plurality of modules.
  • the master/slave may control or monitor a plurality of modules.
  • the grand master controller 101 is connected via memory mapped device 160 to a
  • the master controller 130 within the corresponding interface module control 110.
  • the master controller 130 is coupled witii a plurality of slave controllers 140, 141, 142. Sixteen slave controllers 140, 141, 142. Sixteen slave controllers 140, 141, 142.
  • controllers may be preferably coupled with a single master controller 130 - 132 and each slave
  • controller may be configured to control and monitor a single motor or process component, or
  • the control system 100 of the processing tool 10 preferably utilizes flash memory.
  • controller 130 - 132 and slave controller 140 - 147 within the control system 100 may be
  • the grand master controller 101, 102 may poll the corresponding
  • each master controller 130 - 132 may operate each master controller 130 - 132.
  • each master controller 130 - 132 may operate each master controller 130 - 132.
  • 130 - 132 may initiate downloading of d e appropriate program from the grand master
  • controller 101, 102 to die respective slave controller 140 - 147 via the master controller 130 -
  • Each slave controller may be configured to control and monitor a single motor or a
  • each slave controller 140 - 147 may be configured to monitor
  • slave controller 145 shown in Fig. 36 may be configured to control and/or monitor
  • Each slave controller includes a slave processor which is coupled with a plurality of port interfaces.
  • Each port interface may be utilized for control and/or monitoring of servo
  • a port may be coupled wim a servo
  • controller card 176 which is configured to operate a wafer transfer unit 62a, 62b.
  • processor 171 may operate the wafer transfer unit 62a, 62b via the port and servo controller
  • the slave processor 171 may operate servo motors within the wafer
  • slave controllers 140, 141 may operate different components
  • interface module 38 within a single processing tool device, such as interface module 38. More specifically, the
  • Slave controller 140 may operate turnstile motor 185 and monitor the position of the
  • Slave controller 140 is preferably coupled
  • die turnstile motor 185 and turnstile encoder 190 via a servo control card (shown in Fig.
  • Slave controller 141 may operate and monitor saddle 45 of the turnstile 40 by controlling
  • a port of a slave processor may be coupled with an interface controller card 180 for
  • a flow sensor 657 may provide flow information of the delivery of processing
  • the interface controller 180 is configured to
  • controller 180 may operate a process component, such as a flow controller 658, responsive to
  • One slave controller 140 - 147 may contain one or more servo controller and one or
  • a servo controller and interface controller may each contain an onboard
  • the on board processor which may also control a respective servo motor or
  • the slave processor responsive to the data.
  • the slave processor responsive to the data.
  • the conveyor control subsystem 113 for controlling and monitoring the operation of
  • a slave controller 143 of conveyor control 113 is
  • slave controller 143 may operate transfer arm assembly 86
  • slave controller 144 may be configured to operate wafer transport unit 62b
  • slave controller 143 The interfacing of slave controller 143 and light detector 91, drive actuator 71, linear encoder 196 and wafer transport unit 62a is shown in detail in Fig. 36.
  • slave controller 143 is preferably coupled witii a servo controller 176.
  • 171 may control the linear position of wafer transport unit 62a by operating drive actuator 71
  • Light detector 91 may provide linear position information of the
  • a linear encoder 196 may also be
  • the conveyor slave processor 171 may also control and monitor the operation of the conveyor slave processor 171
  • conveyor processor 171 may be coupled witii a transfer arm motor 194 within shaft 83 for
  • rotation encoder 197 may be provided within the shaft 83 of each wafer transport unit 62a for
  • Slave controller 143 may be advantageously coupled with transfer arm elevation motor
  • An incremental transfer arm elevation encoder 198 may be provided witiiin the transfer arm
  • elevator assembly 90 for monitoring the elevation of die transfer arm assembly 86.
  • conveyor slave controller 143 may be coupled with an air supply control
  • valve actuator (not shown) via an interface controller for controlling a vacuum within wafer
  • Absolute encoders 199 may be provided within the wafer conveyor 60, interface
  • absolute encoder 199 may detect a condition
  • encoder 591 located in die elevator 590 encoder 592 located in the
  • head rail encoder 599 and track CDD array absolute encoder 541 provide inputs for the
  • the control system 100 preferably includes a processing module control subsystem 114
  • control system 100 may also include additional components
  • processing module control subsystem 119 for controlling and/or monitoring additional wafer
  • Respective processing module controls 114, 115, 116 may control and monitor the
  • processing module controls 114, 115, 116 may advantageously control and/or monitor the processing of the semiconductor
  • a single slave controller 147 may operate a plurality of wafer
  • slave controller 148 may be utilized to operate and monitor all process components 184 ⁇ i.e.,
  • a single slave controller 145 may operate and monitor a
  • wafer holder 410 and process components 184.
  • a single slave controller 145 - 148 may be configured to operate and
  • slave controller 145 to both a wafer holder 401 and process components are shown in the
  • controller 180 may be coupled with respective ports connected to slave processor 172 of slave
  • Slave processor 172 may operate and monitor a plurality of wafer holder
  • slave processor 172 may operate lift
  • encoder 455 may be provided witiiin a wafer holder 401 to provide rotational information of
  • lift arm 407 to the respective slave processor 172 or a processor within servo controller 177.
  • Slave processor 172 may also control a rotate motor 428 within wafer holder 401 for rotating
  • a processing head 406 about shafts 429, 430 between a process position and a semiconductor
  • Incremental rotate encoder 435 may provide rotational information regarding the processing head 406 to d e corresponding slave processor 172.
  • Spin motor 480 may also be controlled by a processor within servo controller 177 or
  • slave processor 172 for rotating the wafer holder 478 during processing of a semiconductor
  • An incremental spin encoder 498 is preferably provided to monitor the
  • Plating module control 114 advantageously operates the fingertips 414 of die wafer
  • 172 may operate a valve via pneumatic valve actuator 201 for supplying air to pneumatic
  • controller 145 within the plating module control 114 may thereafter operate the valve actuator
  • Slave processor 172 may also control the application of electrical current through the
  • the processing module controls 114, 115, 116 preferably operate and monitor the
  • slave processor 172 monitors and/or controls process components 184
  • the processing fluid passes through the filter, into supply manifold 652 and is delivered via bowl supply lines to a plurality of processing plating bowls wherein
  • Each bowl supply line preferably includes a flow
  • processor 172 may operate an actuator of flow controller 658 within each bowl supply line to
  • Slave processor 172 may also monitor and
  • the pressure regulator 656 may provide pressure information to the
  • processing module control subsystems 115, 116 may be configured to
  • Each interface module control subsystem 110 preferably controls and monitors the
  • interface module control 110 controls operation of wafer interface modules 38, 39. More specifically, interface module control 110
  • Slave processor 170 within slave controller 140 of interface module control 110 may
  • slave modules 38, 39 operate and monitor the function of me interface modules 38, 39.
  • slave modules 38, 39 operate and monitor the function of me interface modules 38, 39.
  • slave modules 38, 39 operate and monitor the function of me interface modules 38, 39.
  • processor 170 may operate doors 35, 36 for providing access into the processing tool 10 via
  • slave processor 170 is
  • controller 175 may operate the components of interface module 38.
  • slave 175 may operate the components of interface module 38.
  • slave 175 may operate the components of interface module 38.
  • slave 175 may operate the components of interface module 38.
  • slave 175 may operate the components of interface module 38.
  • slave 175 may operate the components of interface module 38.
  • slave 175 may operate the components of interface module 38.
  • processor 170 may control turnstile motor 185 for operating rotate functions of turnstile 40
  • turnstile encoder 190 momtors the position of turnstile 40 and provides position data to slave
  • servo controller 175 may include a processor for reading
  • turnstile encoder 190 information from turnstile encoder 190 and controlling turnstile motor 185 in response thereto.
  • Servo controller 175 may alert slave processor 170 once turnstile 40 has reaches a desired
  • Each wafer cassette turnstile 40 includes a motor for controlling the positioning of
  • the slave processor 170 may control the position of saddles
  • each wafer cassette turnstile 40 for providing position
  • Either slave processor 170 or servo controller 175 may be configured to control die
  • the slave processor 170 may be coupled
  • Incremental lift encoder 192 and incremental rotation encoder 193 may supply elevation and rotation information of the elevator
  • Absolute encoders 199 may be utilized to notify slave processor of extreme conditions
  • Elevator lift motor 187 may be
  • a wafer cassette tray 50 for holding a wafer cassette 16 is shown in detail in Fig. 9.
  • Each cassette tray 50 may include a base 51 and an upright portion 54 preferably
  • Two lateral supports 52 may be formed on opposing sides of the
  • cassettes 16 thereon in a fixed position during die movement, rotation and exchange of wafer
  • Each lateral support 52 contains a groove 53 preferably extending the length
  • the wafer cassette trays 50 are preferably utilized during the handling of wafer
  • ELECTROPLATING STATION Fig. 33 shows principal components of a second semiconductor processing station 900 is specifically adapted and constructed to serve as an electroplating station.
  • the two principal parts of processing station 900 are the wafer rotor assembly, shown generally at 906, .and the electroplating bowl assembly 303.
  • Fig. 33 shows an electroplating bowl assembly 303.
  • the process bowl assembly consists of a process bowl or plating vessel 316 having an outer bowl side wall 317, bowl bottom 319, and bowl rim assembly 917.
  • the process bowl is preferably circular in horizontal cross-section and generally cylindrical in shape although other shapes may be possible.
  • the bowl assembly 303 includes a cup assembly 320 which is disposed within a process bowl vessel 317.
  • Cup assembly 320 includes a fluid cup portion 321 holding the chemistry for the electroplating process.
  • the cup assembly also has a depending skirt 371 which extends below the cup bottom 323 and may have flutes open therethrough for fluid communication and release of any gas that might collect as the chamber below fills with liquid.
  • the cup is preferably made from polypropylene or other suitable material.
  • a lower opening in the bottom wall of the cup assembly 320 is connected to a polypropylene riser tube 330 which is adjustable in height relative thereto by a threaded connection.
  • a first end of the riser tube 330 is secured to the rear portion of an anode shield 393 which supports anode 334.
  • a fluid inlet line 325 is disposed within the riser tube 330. Both the riser tube 330 and the fluid inlet line are secured with the processing bowl assembly 303 by a fitting 362.
  • the fitting 362 can accommodate height adjustment of both the riser tube and line 325. As such, the connection between the fitting 362 and the riser tube 330 facilitates vertical adjustment of the anode position.
  • the inlet line 325 is preferably made from a conductive material, such as titanium, and is used to conduct electrical current to the anode 324, as well as supply fluid to the cup.
  • Process fluid is provided to the cup through fluid inlet line 325 and proceeds therefrom through fluid inlet openings 324.
  • Plating fluid then fills the chamber 904 through opening 324 as supplied by a plating fluid pump (not shown) or other suitable supply.
  • the upper edge of the cup side wall 322 forms a weir which limits the level of electroplating solution within the cup. This level is chosen so that only the bottom surface of wafer W is contacted by the electroplating solution. Excess solution pours over this top edge surface into an overflow chamber 345.
  • the level of fluid in the chamber 345 is preferably maintained within a desired range for stability of operation by monitoring the fluid level with appropriate sensors and actuators. This can be done using several different outflow configurations. A preferred configuration is to sense a high level condition using an appropriate sensor and then drain fluid through a drain line as controlled by a control valve. It is also possible to use a standpipe arrangement (not illustrated), and such is used as a final overflow protection device in the preferred plating station. More complex level controls are also possible.
  • the outflow liquid from chamber 345 is preferably returned to a suitable reservoir.
  • the liquid can then be treated with additional plating chemicals or other constituents of the plating or other process liquid and used again.
  • the anode 334 is a consumable anode used in connection with the plating of copper or other metals onto semiconductor materials.
  • the specific anode will vary depending upon the metal being plated and other specifics of the plating liquid being used.
  • a number of different consumable anodes which are commercially available may be used as anode 334.
  • Fig. 33 also shows a diffusion plate 375 provided above the anode 334 for providing a more even distribution of the fluid plating bath across the Wafer W. Fluid passages are provided over all or a portion of the diffusion plate 375 to allow fluid communication therethrough.
  • the height of the diffusion plate is adjustable using diffuser height adjustment mechanisms 386.
  • the anode shield 393 is secured to the underside of the consumable anode 334 using anode shield fasteners 394 to prevent direct impingement by the plating solution as the solution passes into the processing chamber 904.
  • the anode shield 393 and anode shield fasteners 394 are preferably made from a dielectric material, such as polyvinylidene fluoride or polypropylene.
  • the anode shield is advantageously about 2-5 millimeters thick, more preferably about 3 millimeters thick.
  • the anode shield serves to electrically isolate and physically protect the back side of the anode. It also reduces the consumption of organic plating liquid additives. Although the exact mechanism may not be known at this time, the anode shield is believed to prevent disruption of certain materials which develop over time on the back side of the anode. If the anode is left unshielded, the organic chemical plating additives are consumed at a significantly greater rate. With the shield in place, these additives are not consumed as quickly.
  • the wafer rotor assembly 906 holds a wafer W for rotation within the processing chamber 904.
  • the wafer rotor assembly 906 includes a rotor assembly 984 having a
  • Fingers 979 are preferably adapted to conduct current between the wafer and a plating
  • electrical power supply and may be constructed in accordance with various configurations
  • the various components used to spin the rotor assembly 984 are disposed in a fixed
  • the fixed housing is connected to a horizontally extending arm 909 that, in

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Abstract

A transport system for manipulating a semiconductor wafer in a processing tool (10) is set forth. The system includes a transport unit guide (66) disposed within the processing tool (10) for supporting a wafer transfer unit (61) as the unit moves between a first position and a second position. The transport unit guide (66) comprises a frame (65), a lateral guide rail (63) mounted on the frame (65), and a series of magnetic segments (71, 74) arranged upon the transport unit guide (66) proximate the lateral guide rail (63). The wafer transfer unit (62) includes a tram (84) translatably attached to the lateral guide rail (63) and a wafer transfer arm assembly (86) for manipulating the semiconductor wafer. An electromagnet is mounted on the tram (84) in cooperative relation with the magnetic segments (71, 74) for moving the transfer unit (62) along the guide rail (63). Actuators are used for controlling the position of the transfer unit (62) and transfer arm assembly (86), and sensors (91) are used for determining the position of the transfer unit (62) and transfer arm assembly (86). A controller (101) is disposed remote of the wafer transfert unit (62) and directs the movement of the transfer unit (62) and transfer arm assembly (86) in response to the sensors (91) using the actuators. A communication link is established between the actuators, sensors and controller (101). Preferably, the communication link is a fiber optic link.

Description

TITLE OF THE INVENTION
SEMICONDUCTOR PROCESSING APPARATUS HAVING LINEAR CONVEYOR SYSTEM
CROSS-REFERENCE TO RELATED APPLICATIONS
The present application is a continuation- in-part of U.S.S.N. (Corporate
Docket No. P96-0018) and of U.S.S.N. (Corporate Docket No. P96-0011) which are hereby incorporated by reference.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR
DEVELOPMENT
Not Applicable
BACKGROUND OF THE INVENTION
In the production of semiconductor integrated circuits and other semiconductor articles from semiconductor wafers, it is often necessary to provide multiple metal layers on the wafer to serve as interconnect metallization which electrically connects the various devices on the integrated circuit to one another. Traditionally, aluminum has been used for such interconnects, however, it is now recognized that copper metallization may be preferable.
The application of copper onto semiconductor wafers has, in particular, proven to be a great technical challenge. At this time copper metallization has not achieved commercial reality due to practical problems of forming copper layers on semiconductor devices in a reliable and cost efficient manner. This is caused, in part, by the relative difficulty in performing reactive ion etching or other selective removal of copper at reasonable production temperatures. The selective removal of copper is desirable to form patterned layers and provide electrically conductive interconnects between adjacent layers of the wafer or other wafer.
Because reactive ion etching cannot be efficiently used, the industry has sought to overcome the problem of forming patterned layers of copper by using a damascene electroplating process where holes, more commonly called vias, trenches and other recesses are used in which the pattern of copper is desired. In the damascene process, the wafer is first provided with a metallic seed layer which is used to conduct electrical current during a subsequent metal electroplating step. The seed layer is a very thin layer of metal which can be applied using one or more of several processes. For example, the seed layer of metal can be laid down using physical vapor deposition or chemical vapor deposition processes to produce a layer on the order of 1000 angstroms thick. The seed layer can advantageously be formed of copper, gold, nickel, palladium, and most or all other metals. The seed layer is formed over a surface which is convoluted by the presence of the vias, trenches, or other device features which are recessed. This convoluted nature of the exposed surface provides increased difficulties in forming the seed layer in a uniform manner. Nonuniformities in the seed layer can result in variations in the electrical current passing from the exposed surface of the wafer during the subsequent electroplating process. This in turn can lead to nonuniformities in the copper layer which is subsequently electroplated onto the seed layer. Such nonuniformities can cause deformities and failures in the resulting semiconductor device being formed.
In damascene processes, the copper layer that is electroplated onto the seed layer is in the form of a blanket layer. The blanket layer is plated to an extent which forms an overlying layer, with the goal of completely providing a copper layer that fills the trenches and vias and extends a certain amount above these features. Such a blanket layer will typically be formed in thicknesses on the order of 10,000-15,000 angstroms (1-1.5 microns).
The damascene processes also involve the removal of excess metal material present outside of the vias, trenches or other recesses. The metal is removed to provide a resulting patterned metal layer in the semiconductor integrated circuit being formed. The excess plated material can be removed, for example, using chemical mechanical planarization. Chemical mechanical planarization is a processing step which uses the combined action of a chemical removal agent and an abrasive which grind and polish the exposed metal surface to remove undesired parts of the metal layer applied in the electroplating step.
Automation of the copper electroplating process has been elusive, and there is a need in the art for improved semiconductor plating systems which can produce copper layers upon semiconductor articles which are uniform and can be produced in an efficient and cost-effective manner. More particularly, there is a substantial need to provide a copper plating system that is effectively and reliably automated.
BRIEF SUMMARY OF THE INVENTION
A transport system for manipulating a semiconductor wafer in a processing tool is
set forth. The system includes a transport unit guide disposed within the processing tool for
supporting a wafer transfer unit as the unit moves between a first position and a second
position. The transport unit guide comprises a frame, a lateral guide rail mounted on the
frame, and a series of magnetic segments arranged upon the transport unit guide proximate
the lateral guide rail. The wafer transfer unit includes a tram translatably attached to the
lateral guide rail and a wafer transfer arm assembly for manipulating the semiconductor
wafer. An electromagnet is mounted on the tram in cooperative relation with the magnetic
segments for moving the transfer unit along the guide rail. Actuators are used for
controlling the position of the transfer unit and transfer arm assembly, and sensors are used
for determining the position of the transfer unit and the transfer arm assembly. A controller
is disposed remote of the wafer transfer unit and directs the movement of the transfer unit
and transfer arm assembly in response to the sensors using the actuators. A communication
link is established between the actuators, sensors and controller. Preferably, the
communication link is a fiber optic link.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
Fig. 1 is an isometric view of the semiconductor wafer processing tool in accordance
with the present invention.
Fig. 2 is a cross-sectional view taken along line 2-2 of the semiconductor wafer
processing tool shown in Fig. 1.
Figs. 3-8 are a diagrammatic representation of a wafer cassette turnstile and elevator of
a preferred interface module of the semiconductor wafer processing tool according to the
present invention operating to exchange wafer cassettes between a hold position and an
extraction position.
Fig. 9 is an isometric view of a preferred wafer cassette tray engageable with the
turnstile of an interface module of the semiconductor wafer processing tool.
Figs. 10-15 illustrate one manner in which the processing tool may be modularized to
facilitate end-to-end connection of sequential processing units.
Figs. 16-19 illustrate a wafer conveying system in accordance with one embodiment of
the present invention.
Figs. 20-25 illustrate a further wafer conveying system in accordance with a further
embodiment of the present invention.
Fig. 26 is a functional block diagram of an embodiment of a control system of the
semiconductor wafer processing tool.
Fig. 27 is a functional block diagram of a master/slave control configuration of an
interface module control subsystem for controlling a wafer cassette interface module. Fig. 28 is a functional block diagram of an interface module control subsystem
coupled with components of a wafer cassette interface module of the processing tool.
Fig. 29 is a functional block diagram of a wafer conveyor control subsystem coupled
with components of a wafer conveyor of the processing tool.
Fig. 30 is a functional block diagram of a wafer processing module control subsystem
coupled with components of a wafer processing module of the processing tool.
Fig. 31 is a functional block diagram of a slave processor of the interface module
control subsystem coupled with components of a wafer interface module of the processing
tool.
Fig. 32 is a functional block diagram of a slave processor of the wafer conveyor
control subsystem coupled with components of a wafer conveyor of the processing tool.
Fig. 33 is a cross-sectional view of a processing station for use in electroplating a
downward facing surface of a semiconductor wafer.
DETAILED DESCRIPTION OF THE INVENTION
Referring to Fig. 1, a present preferred embodiment of the semiconductor wafer
processing tool 10 is shown. The processing tool 10 may comprise an interface section 12 and
processing section 14. Semiconductor wafer cassettes 16 containing a plurality of
semiconductor wafers, generally designated W, may be loaded into the processing tool 10 or
unloaded therefrom via the interface section 12. In particular, the wafer cassettes 16 are
preferably loaded or unloaded through at least one port such as first port 32 within a front
outwardly facing wall of the processing tool 10. An additional second port 33 may be
provided within the interface section 12 of the processing tool 10 to improve access and port
32 may be utilized as an input and port 33 may be utilized as an output.
Respective powered doors 35, 36 may be utilized to cover access ports 32, 33 thereby
isolating the interior of the processing tool 10 from the clean room. Each door 35, 36 may
comprise two portions. The upper portions and lower portion move upward and downward,
respectively, into the front surface of the processing tool 10 to open ports 32, 33 and permit
access therein.
Wafer cassettes 16 are typically utilized to transport a plurality of semiconductor
wafers. The wafer cassettes 16 are preferably oriented to provide the semiconductor wafers
therein in an upright or vertical position for stability during transportation of the
semiconductor wafers into or out of the processing tool 10.
The front outwardly facing surface of the processing tool 10 may advantageously join
a clean room to minimize the number of harmful contaminants which may be introduced into
the processing tool 10 during insertion and removal of wafer cassettes 16. In addition, a plurality of wafer cassettes 16 may be introduced into processing tool 10 or removed
therefrom at one time to minimize the opening of ports 32, 33 and exposure of the processing
tool 10 to the clean room environment.
The interface section 12 joins a processing section 14 of the processing tool 10. The
processing section 14 may include a plurality of semiconductor wafer processing modules for
performing various semiconductor process steps. In particular, the embodiment of the
processing tool 10 shown in Fig. 1 includes a plating module 20 defining a first lateral surface
of the processing section 14. The processing section 14 of the tool 10 may advantageously
include additional modules, such as pre- wet module 22 and resist strip module 24, opposite the
plating module 20.
Alternatively, other modules for performing additional processing functions may also
be provided within the processing tool 10. The specific processing performed by processing
modules of the processing tool 10 may be different or of similar nature. Various liquid and
gaseous processing steps can be used in various sequences. The processing tool 10 is
particularly advantageous in allowing a series of complex processes to be run serially in
different processing modules set up for different processing solutions. All the processing can
be advantageously accomplished without human handling and in a highly controlled working
space 11, thus reducing human operator handling time and the chance of contaminating the
semiconductor wafers.
The processing modules of the process tool 10 are preferably modular,
interchangeable, stand-alone units. The processing functions performed by the processing tool
10 may be changed after installation of the processing tool 10 increasing flexibility and allowing for changes in processing methods. Additional wafer processing modules may be
added to the processing tool 10 or replace existing processing modules 19.
The processing tool 10 of the present invention preferably includes a rear closure
surface 18 joined with the lateral sides of the processing tool 10. As shown in Fig. 1, an air
supply 26 may be advantageously provided intermediate opposing processing modules of the
processing section 14. The interface section 12, lateral sides of the processing section 14,
closure surface 18, and air supply 26 preferably provide an enclosed work space 11 within the
processing tool 10. The air supply 26 may comprise a duct coupled with a filtered air source
(not shown) for providing clean air into the processing tool 10. More specifically, the air
supply 26 may include a plurality of vents intermediate the processing modules 19 for
introducing clean air into work space 11.
Referring to Fig. 16, exhaust ducts 58, 59 may be provided adjacent the frame 65 of a
wafer transport unit guide 66 to remove the circulated clean air and the contaminants therein.
Exhaust ducts 58, 59 may be coupled with the each of the processing modules 19 for drawing
supplied clean air therethrough. In particular, clean air is supplied to the workspace 11 of the
processing tool 10 via air supply 26. The air may be drawn adjacent the wafer transport units
62, 64 and into the processing modules 19 via a plurality of vents 57 formed within a shelf or
process deck thereof by an exhaust fan (not shown) coupled with the output of exhaust ducts
58, 59. Each processing module 19 within the processing tool 10 may be directly coupled
with ducts 58, 59. The air may be drawn out of the ducts 58, 59 of the processing tool 10
through the rear closant surface 18 or through a bottom of surface of the processing tool 10.
Providing an enclosed work space and controlling the environment within the work space greatly reduces the presence of contaminants in the processing tool 10.
Each of the processing modules may be advantageously accessed through exterior
panels of the respective modules forming the lateral side of the processing tool 10. The lateral
sides of the processing tool 10 may be adjacent a gray room environment. Gray rooms have
fewer precautions against contamination compared with the clean rooms. Utilizing this
configuration reduces plant costs while allowing access to the processing components and
electronics of each wafer module of the processing tool 10 which require routine maintenance.
A user interface 30 may be provided at the outwardly facing front surface of the
processing tool as shown in Fig. 1. The user interface 30 may advantageously be a touch
screen cathode ray tube control display allowing finger contact to the display screen to effect
various control functions within the processing tool 10. An additional user interface 30 may
also be provided at the rear of the processing tool 10 or within individual processing modules
so that processing tool 10 operation can be effected from alternate locations about the
processing tool 10. Further, a portable user interface 30 may be provided to permit an
operator to move about the processing tool 10 and view the operation of the processing
components therein. The user interface 30 may be utilized to teach specified functions and
operations to the processing modules 19 and semiconductor wafer transport units 62, 64.
Each module 20, 22, 24 within the processing tool 10 preferably includes a window 34
allowing visual inspection of processing tool 10 operation from the gray room. Further, vents
37 may be advantageously provided within a top surface of each processing module 20, 22,
24. Processing module electronics are preferably located adjacent the vents 37 allowing circulating air to dissipate heat generated by such electronics.
The work space 11 within the interface section 12 and processing section 14 of an
embodiment of the processing tool 10 is shown in detail in Fig. 2.
The interface section 12 includes two interface modules 38, 39 for manipulating wafer
cassettes 16 within the processing tool 10. The interface modules 38, 39 receive wafer
cassettes 16 through the access ports 32, 33 and may store the wafer cassettes 16 for
subsequent processing of the semiconductor wafers therein. In addition, the interface modules
38, 39 store the wafer cassettes for removal from the processing tool 10 upon completion of
the processing of the semiconductor wafers within the respective wafer cassette 16.
Each interface module 38, 39 may comprise a wafer cassette turnstile 40, 41 and a
wafer cassette elevator 42, 43. The wafer cassette turnstiles 40, 41 generally transpose the
wafer cassettes 16 from a stable vertical orientation to a horizontal orientation where access to
the semiconductor wafers is improved. Each wafer cassette elevator 42, 43 has a respective
wafer cassette support 47, 48 for holding wafer cassettes 16. Each wafer cassette elevator 42,
43 is utilized to position a wafer cassette 16 resting thereon in either a transfer position and
extraction position. The operation of the wafer interface modules 38, 39 is described in detail
below.
In a preferred embodiment of the present invention, the first wafer interface module 38
may function as an input wafer cassette interface for receiving unprocessed semiconductor
wafers into the processing tool 10. The second wafer interface module 39 may function as an
output wafer cassette interface for holding processed semiconductor wafers for removal from
the processing tool 10. Wafer transport units 62, 64 within the processing tool 10 may access wafer cassettes 16 held by either wafer interface module 38, 39. Such an arrangement
facilitates transferring of semiconductor wafers throughout the processing tool 10.
A semiconductor wafer conveyor 60 is shown intermediate processing modules 20, 22,
24 and interface modules 38, 39 in Fig. 2. The wafer conveyor 60 includes wafer transport
units 62, 64 for transferring individual semiconductor wafers W between each of the wafer
interface modules 38, 39 and the wafer processing modules 19.
Wafer conveyor 60 advantageously includes a transport unit guide 66, such as an
elongated rail, which defines a plurality of paths 68, 70 for the wafer transport units 62, 64
within the processing tool 10. A wafer transport unit 62 on a first path 68 may pass a wafer
transport unit 64 positioned on a second path 70 during movement of the transport units 62, 64
along transport guide 66. The processing tool 10 may include additional wafer transport units
to facilitate the transfer of semiconductor wafers W between the wafer processing modules 20,
22, 24 and wafer interface modules 38, 39.
More specifically, the second arm extension 88 may support a semiconductor wafer W
via vacuum support 89. The appropriate wafer transport unit 62, 64 may approach a wafer
support 401 by moving along transport unit guide 66. After reaching a proper location along
guide 66, the first extension 87 and second extension 88 may rotate to approach the wafer
support 401. The second extension 88 is positioned above the wafer support 401 and
subsequently lowered toward engagement finger assemblies 409 on the wafer support 401.
The vacuum is removed from vacuum support 89, and finger assemblies within the processing
modules grasp the semiconductor wafer W positioned therein. Second extension 88 may be
lowered and removed from beneath the semiconductor wafer held by the wafer engagement fingers.
Following completion of processing of the semiconductor wafer within the appropriate
processing module 20, 22, 24, a wafer transport unit 62, 64 may retrieve the wafer and either
deliver the wafer to another processing module 20, 22, 24 or return the wafer to a wafer
cassette 16 for storage or removal from the processing tool 10.
Each of the wafer transport units 62, 64 may access a wafer cassette 16 adjacent the
conveyor 60 for retrieving a semiconductor wafer from the wafer cassette 16 or depositing a
semiconductor wafer therein. In particular, wafer transport unit 62 is shown withdrawing a
semiconductor wafer W from wafer cassette 16 upon elevator 42 in Fig. 2. More
specifically, the second extension 88 and vacuum support 89 connected therewith may be
inserted into a wafer cassette 16 positioned in the extraction position. Second extension 88
and vacuum support 89 enter below the lower surface of the bottom semiconductor wafer W
held by wafer cassette 16. A vacuum may be applied via vacuum support 89 once support 89
is positioned below the center of the semiconductor wafer W being removed. The second
extension 88, vacuum support 89 and semiconductor wafer W attached thereto may be slightly
raised via transfer arm elevator 90. Finally, first extension 87 and second extension 88 may
be rotated to remove the semiconductor wafer W from the wafer cassette 16. The wafer
transport unit 62, 64 may thereafter deliver the semiconductor wafer W to a wafer processing
module 19 for processing.
Thereafter, wafer transport unit 62 may travel along path 68 to a position adjacent an
appropriate processing module 20, 22, 24 for depositing the semiconductor wafer upon wafer
processing support 401 for processing of the semiconductor wafer. INTERFACE MODULE
Referring to Fig. 3 - Fig. 8, the operation of the interface module 38 is shown in
detail. The following discussion is limited to wafer interface module 38 but is also applicable
to wafer interface module 39 inasmuch as each interface module 38, 39 may operate in
substantially the same manner.
Preferably, the first wafer interface module 38 and the second wafer interface module
39 may function as a respective semiconductor wafer cassette 16 input module and output
module of the processing tool 10. Alternately, both modules can function as both input and
output. More specifically, wafer cassettes 16 holding unprocessed semiconductors wafers may
be brought into the processing tool 10 via port 32 and temporarily stored within the first wafer
interface module 38 until the semiconductor wafers are to be removed from the wafer cassette
16 for processing. Processed semiconductor wafers may be delivered to a wafer cassette 16
within the second wafer interface module 39 via wafer transport units 62, 64 for temporary
storage and/or removal from the processing tool 10.
The wafer interface modules 38, 39 may be directly accessed by each of the wafer
transport units 62, 64 within the processing tool 10 for transferring semiconductor wafers
therebetween. Providing a plurality of wafer cassette interface modules 38, 39 accessible by
each wafer transport unit 62, 64 facilitates the transport of semiconductor wafers W
throughout the processing tool 10 according to the present invention.
Each wafer interface module 38, 39 preferably includes a wafer cassette turnstile 40
and a wafer cassette elevator 42 adjacent thereto. The access ports 32, 33 are adjacent the respective wafer cassette turnstiles 40, 41. Wafer cassettes 16 may be brought into the
processing tool 10 or removed therefrom via ports 32, 33.
Wafer cassettes 16 are preferably placed in a vertical position onto cassette trays 50
prior to delivery into the processing tool 10. Cassette trays 50 are shown in detail in Fig. 9.
The vertical position of wafer cassettes 16 and the semiconductor wafers therein provides a
secure orientation to maintain the semiconductor wafers within the wafer cassette 16 for
transportation.
Each wafer cassette turnstile 40, 41 preferably includes two saddles 45, 46 each
configured to hold a wafer cassette 16. Providing two saddles 45, 46 enables two wafer
cassettes 16 to be placed into the processing tool 10 or removed therefrom during a single
opening of a respective access door 35, 36 thereby minimizing exposure of the workspace 11
within the processing tool 10 to the clean room environment.
Each saddle 45, 46 includes two forks engageable with the cassette tray 50. Saddles
45, 46 are powered by motors within the wafer cassette turnstile shaft 49 to position the wafer
cassette 16 in a horizontal or vertical orientation. The wafer cassettes 16 and semiconductor
wafers therein are preferably vertically oriented for passage through the access ports 32, 33
and horizontally oriented in a transfer or extraction position to provide access of the wafers
therein to the wafer transport units 62, 64.
The wafer cassette 16 held by wafer cassette turnstile 40 in Fig. 3, also referred to as
wafer cassette 15, is in a hold position (also referred to herein as a load position). The
semiconductor wafers within a wafer cassette 16 in the hold position may be stored for
subsequent processing. Alternatively, the semiconductor wafers within a wafer cassette 16 in the hold position may be stored for subsequent removal from the processing tool 10 through an
access port 32, 33.
Referring to Fig. 3, the wafer cassette 16 supported by the wafer cassette elevator 42,
also referred to as wafer cassette 17, is in an extraction or exchange position. Semiconductor
wafers may either be removed from or placed into a wafer cassette 16 positioned in the
extraction position via a wafer transport unit 62, 64.
The wafer cassette turnstile 41 and wafer cassette elevator 42 may exchange wafer
cassettes 15, 17 to transfer a wafer cassette 17 having processed semiconductor wafers therein
from the extraction position to the hold position for removal from the processing tool 10.
Additionally, such an exchange may transfer a wafer cassette 15 having unprocessed
semiconductor wafers therein from the hold position to the extraction position providing wafer
transport units 62, 64 with access to the semiconductor wafer therein.
The exchange of wafer cassettes 15, 17 is described with reference to Fig. 4 - Fig. 8.
Specifically, saddle 46 is positioned below a powered shaft 44 of wafer cassette elevator 42.
Shaft 44 is coupled with a powered wafer cassette support 47 for holding a wafer cassette 16.
Shaft 44 and wafer cassette support 47 attached thereto are lowered as shown in Fig. 4 and
shaft 44 passes between the forks of saddle 46.
Referring to Fig. 5, a motor within shaft 44 rotates wafer cassette support 47 about an
axis through shaft 44 providing the wafer cassette 17 thereon in an opposing relation to the
wafer cassette 15 held by wafer cassette turnstile 40. Both saddles 45, 46 of wafer cassette
turnstile 40 are subsequently tilted into a horizontal orientation as shown in Fig. 6. The shaft
44 of wafer cassette elevator 42 is next lowered and wafer cassette 17 is brought into engagement with saddle 46 as depicted in Fig. 7. The shaft 44 and wafer cassette support 47
are lowered an additional amount to clear rotation of wafer cassettes 16. Referring to Fig. 8,
wafer cassette turnstile 40 rotates 180 degrees to transpose wafer cassettes 15, 17.
Wafer cassette 17 having processed semiconductor wafers therein is now accessible via
port 32 for removal from the processing tool 10. Wafer cassette 15 having unprocessed
semiconductors therein is now positioned for engagement with wafer cassette support 47. The
transfer process steps shown in Fig. 3 - Fig. 8 may be reversed to elevate the wafer cassette
15 into the extraction position providing access of the semiconductor wafers to wafer transport
units 62, 64.
Figure 10 illustrates one manner in which the apparatus 10 may be modularized. As
illustrated, the apparatus 10 is comprised of an input/output assembly 800, left and right
processing modules 805, 810, wafer conveyor system 60, top exhaust assembly 820, and
end panel 825. As illustrated, left and right processing modules 805 and 810 may be
secured to one another about the wafer conveying system 60 to form a processing chamber
having an inlet and 830 and an outlet 835. A plurality of these processing modules may thus
be secured in an end-to-end configuration to thereby provide an extended processing
chamber capable of performing a substantially larger number of processes on each wafer
or, in the alternative, process a larger number of wafers concurrently. In such instances,
the wafer conveying system 60 of one apparatus 10 is programmed to cooperate with the
wafer conveying system 60 of one or more prior or subsequent conveying systems 60.
Figure 11 illustrates one manner of arranging processing heads within the apparatus
10. In this embodiment, the left hand processing module 805 is comprised of three processing heads that are dedicated to rinsing and drying each wafer after electrochemical
deposition and two processing heads for performing wetting of the wafers prior to
electrochemical deposition. Generically, the left hand processing module 805 constitutes a
support module having processing heads used in pre-processing and post-processing of the
wafers with respect to electrochemical copper deposition. The right-hand module 810
generically constitutes a plating module and includes five reactor heads dedicated to
electrochemical copper deposition. In the embodiment of Figure 11 , a wafer alignment
station 850 is provided to ensure thickness proper orientation of each wafer as it is
processed in the apparatus. Wafer alignment may be based upon sensing of registration
marks or the like on each wafer.
Figures 12 and 13 illustrate embodiments of the left and right hand processing
modules 805 and 810, respectively. In these figures, the exterior portions of the respective
housing have been removed thereby exposing various system components. Preferably,
electronic components such as power supplies, controllers, etc. , are disposed in the upper
portion of each of the processing modules 805 and 810, while moving components and the
like are disposed in a lower portion of each of the processing modules.
Figure 14 is a perspective view of the input module 800 with its panels removed as
viewed from the interior of apparatus 10. Figure 15 provides a similar view of the input
module 800 with respect to the exterior of apparatus 10. In the illustrated embodiment, the
wafer alignment station 850 and a wafer alignment controller 860 are provided in the input
module 800. A robot controller 865 used to control the wafer conveying system 60 is also
disposed therein. To keep track of the wafers as they are processed, the input module 800 is provided with one or more wafer mapping sensors 870 that sense the wafers present in
each cassette. Other components in the input module 800 include the system control
computer 875 and a four-axis controller 880. The system control computer 875 is
generally responsible for coordinating all operations of the apparatus 10.
SEMICONDUCTOR WAFER CONVEYOR
The processing tool 10 includes a semiconductor wafer conveyor 60 for transporting
semiconductor wafers throughout the processing tool 10. Preferably, semiconductor wafer
conveyor 60 may access each wafer cassette interface module 38, 39 and each wafer
processing module 19 within processing tool 10 for transferring semiconductor wafers
therebetween. This includes processing modules from either side.
One embodiment of the wafer conveyor system 60 is depicted in Fig. 16. The wafer
conveyor 60 generally includes a wafer transport unit guide 66 which preferably comprises an
elongated spine or rail mounted to frame 65. Alternatively, transport unit guide 66 may be
formed as a track or any other configuration for guiding the wafer transport units 62, 64
thereon. The length of wafer conveyor 60 may be varied and is configured to permit access of
the wafer transport units 62, 64 to each interface module 38, 39 and processing modules 20,
22, 24.
Wafer transport unit guide 66 defines the paths of movement 68, 70 of wafer transport
units 62, 64 coupled therewith. Referring to Fig. 16, a spine of transport unit guide 66
includes guide rails 63, 64 mounted on opposite sides thereof. Each semiconductor wafer
transport unit 62, 64 preferably engages a respective guide rail 63, 64. Each guide rail can mount one or more transport units 62, 64. Extensions 69, 75 may be fixed to opposing sides
of guide 66 for providing stability of the transport units 62, 64 thereagainst and to protect
guide 66 from wear. Each wafer transport unit 62, 64 includes a roller 77 configured to ride
along a respective extension 69, 75 of guide 66.
It is to be understood that wafer conveyor 60 may be formed in alternate
configurations dependent upon the arrangement of interface modules 38, 39 and processing
modules 20, 22, 24 within the processing tool 10. Ducts 58, 59 are preferably in fluid
commumcation with extensions from each wafer processing module 19 and an exhaust fan for
removing circulated air from the workspace 11 of the processing tool 10.
Each wafer transport unit 62, 64 is powered along the respective path 68, 70 by a
suitable driver. More specifically, drive operators 71, 74 are mounted to respective sides of
transport unit guide 66 to provide controllable axial movement of wafer transport units 62, 64
along the transport unit guide 66.
The drive operators 71, 74 may be linear magnetic motors for providing precise
positioning of wafer transport units 62, 64 along guide 66. In particular, drive operators 71,
74 are preferably linear brushless direct current motors. Such preferred driver operators 71,
74 utilize a series of angled magnetic segments which magnetically interact with a respective
electromagnet 79 mounted on the wafer transport units 62, 64 to propel the units along the
transport unit guide 66.
Cable guards 72, 73 may be connected to respective wafer transport units 62, 64 and
frame 65 for protecting communication and power cables therein. Cable guards 72, 73 may
comprise a plurality of interconnected segments to permit a full range of motion of wafer transport units 62, 64 along transport unit guide 66.
As shown in Fig. 17, a first wafer transport unit 62 is coupled with a first side of the
spine of guide 66. Each wafer transport unit 62, 64 includes a linear bearing 76 for
engagement with linear guide rails 63, 64. Further, the wafer transport units 62, 64 each
preferably include a horizontal roller 77 for engaging a extension 69 formed upon the spine of
the guide 66 and providing stability.
Fig. 17 additionally shows an electromagnet 79 of the first wafer transport unit 62
mounted in a position to magnetically interact with drive actuator 71. Drive actuator 71 and
electromagnet 79 provide axial movement and directional control of the wafer transport units
62, 64 along the transport unit guide 66.
SEMICONDUCTOR WAFER TRANSPORT UNITS
Preferred embodiments of the semiconductor wafer transport units 62, 64 of the wafer
conveyor 60 are described with reference to Fig. 18 and Fig. 19.
In general, each wafer transport unit 62, 64 includes a movable carriage or tram 84
coupled to a respective side of the transport unit guide 66, a wafer transfer arm assembly 86
movably connected to the tram 84 for supporting a semiconductor wafer W, and a wafer
transfer arm elevator 90 for adjusting the elevation of the transfer arm assembly 86 relative to
tram 84.
Referring to Fig. 18, a cover 85 surrounds the portion of tram 84 facing away from
the transport unit guide 66. Tram 84 includes linear bearings 76 for engagement with
respective guide rails 63, 64 mounted to transport unit guide 66. Linear bearings 76 maintain the tram 84 in a fixed relation with the transport unit guide 66 and permit axial movement of
the tram 84 therealong. A roller 77 engages a respective extension 69 for preventing rotation
of tram 84 about guide rail 63, 64 and providing stability of wafer transport unit 62. The
electromagnet 79 is also shown connected with the tram 84 in such a position to magnetically
interact with a respective transport unit 62, 64 drive actuator 71, 74.
A wafer transfer arm assembly 86 extends above the top of tram 84. The wafer
transfer arm assembly 86 may include a first arm extension 87 coupled at a first end thereof
with a shaft 83. A second arm extension 88 may be advantageously coupled with a second
end of the first extension 87. The first arm extension 87 may rotate 360 degrees about shaft
83 and second arm extension 88 may rotate 360 degrees about axis 82 passing through a shaft
connecting first and second arm extensions 87, 88.
Second extension 88 preferably includes a wafer support 89 at a distal end thereof for
supporting a semiconductor wafer W during the transporting thereof along wafer conveyor 60.
The transfer arm assembly 86 preferably includes a chamber coupled with the wafer support
89 for applying a vacuum thereto and holding a semiconductor wafer W thereon.
Providing adjustable elevation of transfer arm assembly 86, rotation of first arm
extension 87 about the axis of shaft 83, and rotation of second extension 88 about axis 82
allows the transfer arm 86 to access each semiconductor wafer holder 810 of all processing
modules 19 and each of the wafer cassettes 16 held by interface modules 38, 39 within the
processing tool 10. Such access permits the semiconductor wafer transport units 62, 64 to
transfer semiconductor wafers therebetween.
The cover 85 has been removed from the wafer transport unit shown in Fig. 19 to reveal a wafer transfer arm elevator 90 coupled with tram 84 and transfer arm assembly 86.
Transfer arm elevator 90 adjusts the vertical position of the transfer arm assembly 86 relative
to the tram 84 during the steps of transferring a semiconductor wafer between the wafer
support 89 and one of a wafer holder 810 and the wafer cassette 16.
The path position of the tram 84 of each wafer transport unit 62, 64 along the transport
unit guide 66 is precisely controlled using a positional indicating array, such as a CCD array
91 of Fig. 19. In one embodiment of the processing tool 10, each semiconductor wafer holder
810 within a processing module 19 has a corresponding light or other beam emitter 81
mounted on a surface of the processing module 19 as shown in Fig. 2 for directing a beam of
light toward the transport unit guide 66. The light emitter 81 may present a continuous beam
or alternatively may be configured to generate die beam as a wafer transport unit 62, 64
approaches the respective wafer holder 810.
The transfer arm assembly 86 includes an CCD array 91 positioned to receive the laser
beam generated by light emitter 81. A position indicating array 91 on shaft 83 detects the
presence of the light beam to determine the location of tram 84 along transport unit guide 66.
The positional accuracy of the wafer transport unit position indicator is preferably in die range
less than 0.003 inch (approximately less than 0.1 millimeter).
A second embodiment of a wafer transport unit 562b is shown in Figs. 20-25 and is
similarly provided with a movable carriage or tram 584 coupled to a respective side of the
transport unit guide 66, a wafer transfer arm assembly 586 movably connected to the tram 584
for supporting a semiconductor wafer W, and a wafer transfer arm elevator 590 for adjusting
the elevation of the transfer arm assembly 586 relative to tram 584. A cover 585 surrounds a portion of tram 584. Tram 584 includes linear bearings 576 for engagement with respective
guide rails 63, 64 mounted to transport unit guide 66. Linear bearings 576 maintain the tram
584 in a fixed relation with me transport unit guide 66 and permit axial movement of the tram
584 therealong. The electromagnet 579 magnetically interacts with the guide 66 to drive
actuator 71, 74.
A wafer transfer arm assembly 586 extends above the top of tram 584. The wafer
transfer arm assembly 586 includes a first arm extension 587 coupled at a first end thereof
with a shaft 583. A second arm extension 588, having a wafer support 589 for supporting the
semiconductor wafer W, may be advantageously coupled with a second end of the first
extension 587. The first arm extension 587 may rotate 360 degrees about shaft 583 and
second arm extension 588 may rotate 360 degrees about axis 582 passing through a shaft
connecting first and second arm extensions 587, 588.
As with the first embodiment, providing adjustable elevation of transfer arm assembly
586, rotation of first arm extension 587 about the axis of shaft 583, and rotation of second
extension 588 about axis 582 permits the semiconductor wafer transport units 562a, 562b to
transfer semiconductor wafers therebetween.
As shown in Fig. 21, cover 585 has been removed from the wafer transport unit 562b,
revealing a wafer transfer arm elevator 590 coupled with tram 584 and transfer arm assembly
586. Transfer arm elevator 590 adjusts the vertical position of the transfer arm assembly 586
relative to the tram 584 during a transfer of a semiconductor wafer.
In the second embodiment of the wafer transport units 562a, 562b, a fiber optic
commumcation path, such as a fiber optic filament, replaces wires 72, 73 to the wafer transport units through a digital-to-analog converter board 540 on each of the wafer transport
units 562a, 562b. The use of fiber optics as opposed to wire harnesses lowers the inertial
mass of the transport units 562a, 562b and improves reliability. Preferably, such
communications take place between the transfer unit and the system controller 875.
The path and operational position of me tram 584 of each wafer transport unit 562a,
562b along the transport unit guide 66 is precisely controlled using a combination of encoders
to provide position information on the position of the tram 584, transfer arm assembly 586 and
second extension 588 in three-axis space. An absolute encoder, the position of which is
shown at 591, is located in the elevator 590. An absolute encoder, TPOW, is shown at 592,
located in the base motor 593 of the shaft 583. An absolute encoder, TPOW, is shown at 594,
located in the shaft 583. Wrist absolute encoder, the position of which is shown at 595, is
located at the distal end of transfer arm assembly 586. An elbow absolute encoder,
TPOWISA, 597 is provided at the base of the shaft 583. Lift absolute encoder 596 is located
along the base motor 593. A linear encoder 598, head rail encoder 599 and track CDD array
absolute encoder 541 are located on the base plate 203 of the base of tram 584, the latter
located for sensing the beam emitter 81 mounted on a surface of the processing module 19 as
shown in Fig. 2 and discussed above. The foregoing allows precise and reliable positional
accuracy.
Mounting of the wafer transport units is shown in Figure 22. As illustrated, a wafer
conveyor 560 includes a wafer transport unit guide 566 which comprises an elongated spine or
rail mounted to frame 565. Wafer transport unit guide 566 defines d e paths of movement
568, 570 of wafer transport units 544a, 544b. A spine of transport unit guide 566 includes upper guide rails 563a, 564a and lower guide rails 563b, 564b mounted on opposite sides
thereof. Each semiconductor wafer transport unit 544a, 544b preferably engages each of the
respective upper guide rails 563a, 564b and lower guide rails 563b, 564b. Each of the pair of
upper and lower guide rails can mount one or more transport units 544a, 544b.
Each wafer transport unit 544a, 544b is also powered along the respective patii 568,
570 by drive operators 571, 574 mounted to respective sides of transport unit guide 66 to
provide controllable axial movement of wafer transport units 544a, 544b along the transport
unit guide 566. The drive operators 571, 574 may be linear magnetic motors for providing
precise positioning of wafer transport units 544a, 544b along guide 566, and are again
preferably linear brushless direct current motors utilizing a series of angled magnetic segments
which magnetically interact with a respective electromagnet 579 mounted on each of the wafer
transport units 544a, 544b to propel the units along the transport unit guide 566.
Fiber optic cable guards 572, 573 provide commumcation with the respective wafer
transport units 544a, 544b and protect fiber optic cables located therein. Cable guards 572,
573 may comprise a plurality of interconnected segments to permit a full range of motion of
wafer transport units 544a, 544b along transport unit guide 566.
As shown in Fig. 22, wafer transport units 544a, 544b are coupled along each side of
the spine of guide 566. Each wafer transport unit 544a, 544b includes an upper linear bearing
576a for engagement with upper linear guide rails 563a, 564a, respectively. Further, each
wafer transport units 544a, 544b includes a lower linear bearing 576b engaging the lower
linear guide rails 563b, 564b, providing stability and more equal distribution of the weight
loads upon the rails. With reference to Figs. 22-24, the upper and lower linear bearing 576a, 576b also
provides a means by which the vertical axis of the wafer transfer arm assembly 586 extending
above the top of tram 584 may be adjusted. It is important that the transfer arm assembly 586
rotate in a plane as close as possible to the absolute horizontal plane during the transfer of
wafers within the processing tool 10. To this end, d e lower elbow housing 210 of the transfer
arm assembly, shown in Fig. 25, mounted to the base plate 203 of the transport unit 544a is
provided wi a tilt adjustment.
The lower elbow housing 210 is mounted to a base plate 211, as seen in Figs. 21, 23
and 24 through upper mounting screws 212 and lower mounting screws 214. The base plate
211 is in turn fastened to the elevator motor 590 to raise or lower the transfer arm assembly
586, better seen in Fig. 25. As seen in Fig. 26, positioned laterally between the upper
mounting screws 212 are embossed pivots 216 on the base plate 211 that engage a
corresponding, yet slightly smaller, lateral groove 218 on the lower elbow housing 210. The
pivots 216 are preferably sized, relative the lateral groove 218 to provide a clearance between
the base plate 211 and d e lower elbow housing 210 so that about 0.95 degrees of tilt is
available between the two. In combination wim one or more leveling screws 220 and the
upper and lower mounting screws 212, 214, the angular orientation of me lower elbow
housing 210, and die attached transfer arm assembly 586, can be adjusted and fixed to provide
rotation of the transfer arm assembly 586 as close as possible within the absolute horizontal
plane during the transfer of wafers within the processing tool 10.
Also, compliant attachment of the lower linear bearing guides 576b is important to
smooth operation of the wafer transport unit 544a, 544b along the guide 566. Providing such compliant attachment, preferably allowing 0.100 inch of float, at die lower gearing guides
576b is obtained by use of a compliant fastening technique. A float pin 221 is positioned
about mounting screw 222, with an O-ring 223, preferably VITON, positioned about the float
pin. When installed within shouldered counterbore 224 of the base plate 203 into tapped hole
227 of lower bearing guide 576b, as shown in Fig. 28, the screw 222 bears against a flange 225 of the float pin 221, which in turn bears against the O-ring 223. The O-ring 223 then
bears against the shoulder 226 of e counterbore. However, even when the screw 222 is
tightened, relative motion is allowed between me lower bearing guide 576b and the base plate
203 to facilitate smooth motion over the entire guide 566.
CONTROL SYSTEM
Referring to Fig. 26, mere is shown one embodiment of me control system 100 of the
semiconductor wafer processing tool 10. As illustrated, d e control system 100 generally
includes at least one grand master controller 101 for controlling and/or monitoring the overall
function of the processing tool 10.
The control system 100 is preferably arranged in a hierarchial configuration. The
grand master controller 101 includes a processor electrically coupled with a plurality of
subsystem control units as shown in Fig. 26. The control subsystems preferably control and
monitor the operation of components of the corresponding apparatus (i.e. , wafer conveyor 60,
processing modules 20, 22, 24, interface modules 38, 39, etc.). The control subsystems are
preferably configured to receive instructional commands or operation instructions such as
software code from a respective grand master control 101, 102. The control subsystems 110,
113 - 119 preferably provide process and status information to respective grand master controllers 101, 102.
More specifically, the grand master control 101 is coupled with an interface module
control 110 which may control each of the semiconductor wafer interface modules 38, 39.
Further, grand master control 101 is coupled wim a conveyor control 113 for controlling
operations of the wafer conveyor 60 and a plurality of processing module controls 114, 115
corresponding to semiconductor wafer processing modules 20, 22 within the processing tool
10. The control system 100 of the processing tool 10 according to d e present disclosure may
include additional grand master controllers 102 as shown in Fig. 26 for monitoring or
operating additional subsystems, such as additional wafer processing modules via additional
processing module control 119. Four control subsystems may be preferably coupled with each
grand master controller 101, 102. The grand master controllers 101, 102 are preferably
coupled together and each may transfer process data to the other.
Each grand master controller 101, 102 receives and transmits data to the respective
modular control subsystems 110 - 119. In a preferred embodiment of me control system 100,
a bidirectional memory mapped device is provided intermediate the grand master controller
and each modular subsystem connected thereto. In particular, memory mapped devices 160,
161, 162 are provided intermediate the grand master controller 101 and master controllers
130, 131, 132 within respective interface module control 110, wafer conveyor control 113 and
processing module control 114.
Each memory mapped device 150, 160 - 162 within the control system 100 is
preferably a dual port RAM provided by Cypress for a synchronously storing data. In
particular, grand master controller 101 may write data to a memory location corresponding to master controller 130 and master controller 130 may simultaneously read the data.
Alternatively, grand master controller 101 may read data from mapped memory device being
written by the master controller 130. Utilizing memory mapped devices 160 - 161 provides
data transfer at processor speeds. Memory mapped device 150 is preferably provided
intermediate user interface 30 and the grand master controllers 101, 102 for transferring data
therebetween.
A user interface 30 is preferably coupled with each of the grand master controllers
101, 102. The user interface 30 may be advantageously mounted on die exterior of the
processing tool 10 or at a remote location to provide an operator with processing and status
information of the processing tool 10. Additionally, an operator may input control sequences
and processing directives for the processing tool 10 via user interface 30. The user interface
30 is preferably supported by a general purpose computer within the processing tool 10. The
general purpose computer preferably includes a 486 100 MHz processor, but other processors
may be utilized.
Each modular control subsystem, including interface module control 110, wafer
conveyor control 113 and each processing module control 114 - 119, is preferably configured
in a master/slave arrangement. The modular control subsystems 110, 113 - 119 are preferably
housed within die respective module such as wafer interface module 38, 39, wafer conveyor
60, or each of the processing modules 20, 22, 24. The grand master controller 101 and
corresponding master controllers 130, 131, 132 coupled therewith are preferably embodied on
a printed circuit board or ISA board mounted within the general purpose computer supporting
user interface 30. Each grand master controller 101, 102 preferably includes a 68EC000
processor provided by Motorola and each master controller 130 and slave controller within
control system 100 preferably includes a 80251 processor provided by Intel.
Each master controller 130, 131, 132 is coupled with its respective slave controllers
via a data link 126, 127, 129 as shown in Fig. 27 - Fig. 30. Each data link 126, 127, 129
preferably comprises an optical data medium such as Optilink provided by Hewlett Packard.
However, data links 126, 127, 129 may comprise alternate data transfer media.
Referring to Fig. 27, the master/slave control subsystem for me interface module
control 110 is illustrated. Each master and related slave configuration preferably corresponds
to a single module (i.e., interface, conveyor, processing) wifhin the processing tool 10.
However, one master may control or monitor a plurality of modules. The master/slave
configuration depicted in Fig. 27 and corresponding to the interface module control 110 may
additionally apply to die otiier modular control subsystems 113, 114, 115.
The grand master controller 101 is connected via memory mapped device 160 to a
master controller 130 within the corresponding interface module control 110. The master controller 130 is coupled witii a plurality of slave controllers 140, 141, 142. Sixteen slave
controllers may be preferably coupled with a single master controller 130 - 132 and each slave
controller may be configured to control and monitor a single motor or process component, or
a plurality of motors and process components.
The control system 100 of the processing tool 10 preferably utilizes flash memory.
More specifically, the operation instructions or program code for operating each master
controller 130 - 132 and slave controller 140 - 147 within the control system 100 may be
advantageously stored within the memory of the corresponding grand master controller 101,
102. Upon powering up, the grand master controller 101, 102 may poll the corresponding
master controllers 130 -132 and download the appropriate operation instruction program to
operate each master controller 130 - 132. Similarly, each master controller 130 - 132 may
poll respective slave controllers 140 - 147 for identification. Thereafter, the master controller
130 - 132 may initiate downloading of d e appropriate program from the grand master
controller 101, 102 to die respective slave controller 140 - 147 via the master controller 130 -
132.
Each slave controller may be configured to control and monitor a single motor or a
plurality of motors within a corresponding processing module 19, interface module 38, 39 and
wafer conveyor 60. In addition, each slave controller 140 - 147 may be configured to monitor
and control process components 184 within a respective module 19. Any one slave controller,
such as slave controller 145 shown in Fig. 36, may be configured to control and/or monitor
servo motors and process components 184.
Each slave controller includes a slave processor which is coupled with a plurality of port interfaces. Each port interface may be utilized for control and/or monitoring of servo
motors and process components 184. For example, a port may be coupled wim a servo
controller card 176 which is configured to operate a wafer transfer unit 62a, 62b. The slave
processor 171 may operate the wafer transfer unit 62a, 62b via the port and servo controller
176. More specifically, the slave processor 171 may operate servo motors within the wafer
transfer unit 62a, 62b and monitor the state of the motor through the servo controller 176.
Alternatively, different slave controllers 140, 141 may operate different components
within a single processing tool device, such as interface module 38. More specifically, the
interface module control 110 and components of the interface module 38 are depicted in Fig.
32. Slave controller 140 may operate turnstile motor 185 and monitor the position of the
turnstile 40 via incremental turnstile encoder 190. Slave controller 140 is preferably coupled
with die turnstile motor 185 and turnstile encoder 190 via a servo control card (shown in Fig.
35). Slave controller 141 may operate and monitor saddle 45 of the turnstile 40 by controlling
saddle motor 186 and monitoring saddle encoder 191 via a servo control card.
A port of a slave processor may be coupled with an interface controller card 180 for
controlling and monitoring process components within a respective processing module 19.
For example, a flow sensor 657 may provide flow information of the delivery of processing
fluid to a processing bowl within the module. The interface controller 180 is configured to
translate the data provided by the flow sensors 657 or otiier process components into a form
which may be analyzed by the corresponding slave processor 172. Further, the interface
controller 180 may operate a process component, such as a flow controller 658, responsive to
commands from the corresponding slave processor 172. One slave controller 140 - 147 may contain one or more servo controller and one or
more interface controller coupled with respective ports of the slave processor 170 - 172 for
permitting control and monitor capabilities of various component motors and processing
components from a single slave controller.
Alternatively, a servo controller and interface controller may each contain an onboard
processor for improvmg the speed of processing and operation. Data provided by an encoder
or process component to the servo controller or interface controller may be immediately
processed by the on board processor which may also control a respective servo motor or
processing component responsive to the data. In such a configuration, the slave processor
may transfer the data from the interface processor or servo controller processor to the
respective master controller and grand master controller.
CONVEYOR CONTROL SUBSYSTEM
The conveyor control subsystem 113 for controlling and monitoring the operation of
the wafer conveyor 60 and die wafer transport units 62a, 62b or 562a, 562b or 544a, 544b
therein is shown in Fig. 29. In general, a slave controller 143 of conveyor control 113 is
coupled wim drive actuator 71 for controllably moving and monitoring a wafer transport unit
62a along the guide 66. Further, slave controller 143 may operate transfer arm assembly 86
of the wafer transport unit 62a or 562a or 544a and the transferring of semiconductor wafers
thereby. Similarly, slave controller 144 may be configured to operate wafer transport unit 62b
or 562b or 544b and drive actuator 74.
The interfacing of slave controller 143 and light detector 91, drive actuator 71, linear encoder 196 and wafer transport unit 62a is shown in detail in Fig. 36. The slave processor
171 of slave controller 143 is preferably coupled witii a servo controller 176. Slave processor
171 may control the linear position of wafer transport unit 62a by operating drive actuator 71
via servo controller 176. Light detector 91 may provide linear position information of the
wafer transport unit 62a along guide 66. Additionally, a linear encoder 196 may also be
utilized for precisely monitoring the position of wafer transport unit 62 along guide 66.
The conveyor slave processor 171 may also control and monitor the operation of the
transfer arm assembly 86 of the corresponding wafer transport unit 62a. Specifically, the
conveyor processor 171 may be coupled witii a transfer arm motor 194 within shaft 83 for
controUably rotating the first and second arm extensions 87, 88. An incremental transfer arm
rotation encoder 197 may be provided within the shaft 83 of each wafer transport unit 62a for
monitoring the rotation of transfer arm assembly 86 and providing rotation data thereof to
servo controller 176 and slave processor 171.
Slave controller 143 may be advantageously coupled with transfer arm elevation motor
195 within elevator 90 for controlling the elevational position of die transfer arm assembly 86.
An incremental transfer arm elevation encoder 198 may be provided witiiin the transfer arm
elevator assembly 90 for monitoring the elevation of die transfer arm assembly 86.
In addition, conveyor slave controller 143 may be coupled with an air supply control
valve actuator (not shown) via an interface controller for controlling a vacuum within wafer
support 89 for selectively supporting a semiconductor wafer thereon.
Absolute encoders 199 may be provided within the wafer conveyor 60, interface
modules 38, 39 and processing modules 19 to detect extreme conditions of operation and protect servo motors therein. For example, absolute encoder 199 may detect a condition
where the transfer arm assembly 86 has reached a maximum height and absolute encoder 199
may turn off elevator 90 to protect transfer arm elevator motor 195.
A similar approach may be used for the fiber optic signal communication system of the
second and third embodiments of d e wafer transfer units 562a, 562b and 544a, 544b,
respectively. Particular, encoder 591 located in die elevator 590, encoder 592 located in the
base motor 593 of the shaft 583, encoder 594 located in the shaft 583, wrist absolute encoder
595 located at the distal end of transfer arm assembly 586 and elbow absolute encoder 597
located at the base of the shaft 583 provide me rotational input of rotational encoder 193 of
Fig. 35. Likewise, lift absolute encoder 596 located along the base motor 593, linear encoder
598, head rail encoder 599 and track CDD array absolute encoder 541 provide inputs for the
lift encoder 192 and absolute encoder 199 of Fig. 35, respectively.
PROCESSING MODULE CONTROL
The control system 100 preferably includes a processing module control subsystem 114
- 116 corresponding to each wafer processing module 20, 22, 24 within the processing tool 10
according to the present disclosure. The control system 100 may also include additional
processing module control subsystem 119 for controlling and/or monitoring additional wafer
processing modules 19.
Respective processing module controls 114, 115, 116 may control and monitor the
transferring of semiconductor wafers W between a corresponding wafer holder 810 and wafer
transport unit 62a, 62b or 562a, 562b or 544a, 544b. Further, processing module controls 114, 115, 116 may advantageously control and/or monitor the processing of the semiconductor
wafers W within each processing module 20, 22, 24.
Referring to Fig. 30, a single slave controller 147 may operate a plurality of wafer
holders 401c-401e within a processing module 20. Alternatively, a single slave controller
145, 146 may operate and monitor a single respective wafer holder 401a, 401b. An additional
slave controller 148 may be utilized to operate and monitor all process components 184 {i.e.,
flow sensors, valve actuators, heaters, temperature sensors) within a single processing module
19. Further, as shown in Fig. 37, a single slave controller 145 may operate and monitor a
wafer holder 410 and process components 184.
In addition, a single slave controller 145 - 148 may be configured to operate and
monitor one or more wafer holder 401 and processing components 184. The interfacing of a
slave controller 145 to both a wafer holder 401 and process components are shown in the
control system embodiment in Fig. 37. In particular, a servo controller 177 and interface
controller 180 may be coupled with respective ports connected to slave processor 172 of slave
controller 145. Slave processor 172 may operate and monitor a plurality of wafer holder
components via servo controller 177. In particular, slave processor 172 may operate lift
motor 427 for raising operator arm 407 about lift drive shaft 456. An incremental lift motion
encoder 455 may be provided witiiin a wafer holder 401 to provide rotational information of
lift arm 407 to the respective slave processor 172 or a processor within servo controller 177.
Slave processor 172 may also control a rotate motor 428 within wafer holder 401 for rotating
a processing head 406 about shafts 429, 430 between a process position and a semiconductor
wafer transfer position. Incremental rotate encoder 435 may provide rotational information regarding the processing head 406 to d e corresponding slave processor 172.
Spin motor 480 may also be controlled by a processor within servo controller 177 or
slave processor 172 for rotating the wafer holder 478 during processing of a semiconductor
wafer W held thereby. An incremental spin encoder 498 is preferably provided to monitor the
rate of revolutions of the wafer holder 478 and supply the rate information to the slave
processor 172.
Plating module control 114 advantageously operates the fingertips 414 of die wafer
holder 478 for grasping or releasing a semiconductor wafer. In particular, slave processor
172 may operate a valve via pneumatic valve actuator 201 for supplying air to pneumatic
piston 502 for actuating fingertips 414 for grasping a semiconductor wafer. The slave
controller 145 within the plating module control 114 may thereafter operate the valve actuator
201 to remove me air supply thereby disengaging the fingertips 414 from the semiconductor
wafer. Slave processor 172 may also control the application of electrical current through the
fmger assembly 824 during the processing of a semiconductor wafer by operating relay 202.
The processing module controls 114, 115, 116 preferably operate and monitor the
processing of semiconductor wafers within the corresponding wafer processing modules 20,
22, 24 via instrumentation or process components 184.
Referring to Fig. 33, the control operation for the plating processing module 20 is
described. Generally, slave processor 172 monitors and/or controls process components 184
via interface controller 180. Slave processor 172 within the plating module control 114
operates pump 605 to draw processing solution from the process fluid reservoir 604 to the
pump discharge filter 607. The processing fluid passes through the filter, into supply manifold 652 and is delivered via bowl supply lines to a plurality of processing plating bowls wherein
the semiconductor wafers are processed. Each bowl supply line preferably includes a flow
sensor 657 coupled with the plating processing module control 114 for providing flow
information of the processing fluid thereto. Responsive to the flow information, the slave
processor 172 may operate an actuator of flow controller 658 within each bowl supply line to
control die flow of processing fluid therethrough. Slave processor 172 may also monitor and
control a back pressure regulator 656 for maintaining a predetermined pressure level within
the supply manifold 652. The pressure regulator 656 may provide pressure information to the
slave processor 172 within the plating processing control module 114.
Similarly, processing module control subsystems 115, 116 may be configured to
control the processing of semiconductor wafers within the corresponding prewet module 22
and resist module 24.
INTERFACE MODULE CONTROL
Each interface module control subsystem 110 preferably controls and monitors the
operation of wafer interface modules 38, 39. More specifically, interface module control 110
controls and monitors the operation of die wafer cassette turnstiles 40, 41 and elevators 42, 43
of respective semiconductor wafer interface modules 38, 39 to exchange wafer cassettes 16.
Slave processor 170 within slave controller 140 of interface module control 110 may
operate and monitor the function of me interface modules 38, 39. In particular, slave
processor 170 may operate doors 35, 36 for providing access into the processing tool 10 via
ports 32, 33. Alternatively, master control 100 may operate doors 35, 36. Referring to Fig. 31, an embodiment of the interface module control portion for
controlling wafer interface module 38 is discussed. In particular, the slave processor 170 is
coupled with servo controller 175. Either slave processor 170 or a processor on board servo
controller 175 may operate the components of interface module 38. In particular, slave
processor 170 may control turnstile motor 185 for operating rotate functions of turnstile 40
moving wafer cassettes 16 between a load position and a transfer position. Incremental
turnstile encoder 190 momtors the position of turnstile 40 and provides position data to slave
processor 170. Alternatively, servo controller 175 may include a processor for reading
information from turnstile encoder 190 and controlling turnstile motor 185 in response thereto.
Servo controller 175 may alert slave processor 170 once turnstile 40 has reaches a desired
position.
Each wafer cassette turnstile 40 includes a motor for controlling the positioning of
saddles 45, 46 connected thereto. The slave processor 170 may control the position of saddles
45, 46 through operation of the appropriate saddle motor 186 to orient wafer cassettes 16
attached ti ereto in one of a vertical and horizontal orientation. Incremental saddle encoders
191 are preferably provided within each wafer cassette turnstile 40 for providing position
information of the saddles 45, 46 to the respective slave processor 170.
Either slave processor 170 or servo controller 175 may be configured to control die
operation of die wafer cassette elevator 42 for transferring a wafer cassette 16 between either
the exchange position and die extraction position. The slave processor 170 may be coupled
with an elevator lift motor 187 and elevator rotation motor 188 for controlling the elevation
and rotation of elevator 42 and elevator support 47. Incremental lift encoder 192 and incremental rotation encoder 193 may supply elevation and rotation information of the elevator
42 and support 47 to slave processor 170.
Absolute encoders 199 may be utilized to notify slave processor of extreme conditions
such as when elevator support 47 reaches a maximum height. Elevator lift motor 187 may be
shut down in response to the presence of an extreme condition by absolute encoder 199.
WAFER CASSETTE TRAY
A wafer cassette tray 50 for holding a wafer cassette 16 is shown in detail in Fig. 9.
Each cassette tray 50 may include a base 51 and an upright portion 54 preferably
perpendicular to the base 51. Two lateral supports 52 may be formed on opposing sides of the
base 51 and extend upward dierefrom. Lateral supports 52 assist with maintaining wafer
cassettes 16 thereon in a fixed position during die movement, rotation and exchange of wafer
cassettes 16. Each lateral support 52 contains a groove 53 preferably extending the length
thereof configured to engage with the forks of saddles 45, 46.
The wafer cassette trays 50 are preferably utilized during the handling of wafer
cassettes 16 within the wafer cassette interface modules 38, 39 where the wafer cassettes 16
are transferred from a load position to an extraction position providing access of the
semiconductor wafers W to wafer transport units 62, 64 within the conveyor 60.
ELECTROPLATING STATION Fig. 33 shows principal components of a second semiconductor processing station 900 is specifically adapted and constructed to serve as an electroplating station. The two principal parts of processing station 900 are the wafer rotor assembly, shown generally at 906, .and the electroplating bowl assembly 303.
ELECTROPLATING BOWL ASSEMBLY 303
Fig. 33 shows an electroplating bowl assembly 303. The process bowl assembly consists of a process bowl or plating vessel 316 having an outer bowl side wall 317, bowl bottom 319, and bowl rim assembly 917. The process bowl is preferably circular in horizontal cross-section and generally cylindrical in shape although other shapes may be possible.
The bowl assembly 303 includes a cup assembly 320 which is disposed within a process bowl vessel 317. Cup assembly 320 includes a fluid cup portion 321 holding the chemistry for the electroplating process. The cup assembly also has a depending skirt 371 which extends below the cup bottom 323 and may have flutes open therethrough for fluid communication and release of any gas that might collect as the chamber below fills with liquid. The cup is preferably made from polypropylene or other suitable material.
A lower opening in the bottom wall of the cup assembly 320 is connected to a polypropylene riser tube 330 which is adjustable in height relative thereto by a threaded connection. A first end of the riser tube 330 is secured to the rear portion of an anode shield 393 which supports anode 334. A fluid inlet line 325 is disposed within the riser tube 330. Both the riser tube 330 and the fluid inlet line are secured with the processing bowl assembly 303 by a fitting 362. The fitting 362 can accommodate height adjustment of both the riser tube and line 325. As such, the connection between the fitting 362 and the riser tube 330 facilitates vertical adjustment of the anode position. The inlet line 325 is preferably made from a conductive material, such as titanium, and is used to conduct electrical current to the anode 324, as well as supply fluid to the cup.
Process fluid is provided to the cup through fluid inlet line 325 and proceeds therefrom through fluid inlet openings 324. Plating fluid then fills the chamber 904 through opening 324 as supplied by a plating fluid pump (not shown) or other suitable supply.
The upper edge of the cup side wall 322 forms a weir which limits the level of electroplating solution within the cup. This level is chosen so that only the bottom surface of wafer W is contacted by the electroplating solution. Excess solution pours over this top edge surface into an overflow chamber 345. The level of fluid in the chamber 345 is preferably maintained within a desired range for stability of operation by monitoring the fluid level with appropriate sensors and actuators. This can be done using several different outflow configurations. A preferred configuration is to sense a high level condition using an appropriate sensor and then drain fluid through a drain line as controlled by a control valve. It is also possible to use a standpipe arrangement (not illustrated), and such is used as a final overflow protection device in the preferred plating station. More complex level controls are also possible.
The outflow liquid from chamber 345 is preferably returned to a suitable reservoir. The liquid can then be treated with additional plating chemicals or other constituents of the plating or other process liquid and used again.
In the preferred uses according to this invention, the anode 334 is a consumable anode used in connection with the plating of copper or other metals onto semiconductor materials. The specific anode will vary depending upon the metal being plated and other specifics of the plating liquid being used. A number of different consumable anodes which are commercially available may be used as anode 334.
Fig. 33 also shows a diffusion plate 375 provided above the anode 334 for providing a more even distribution of the fluid plating bath across the Wafer W. Fluid passages are provided over all or a portion of the diffusion plate 375 to allow fluid communication therethrough. The height of the diffusion plate is adjustable using diffuser height adjustment mechanisms 386.
The anode shield 393 is secured to the underside of the consumable anode 334 using anode shield fasteners 394 to prevent direct impingement by the plating solution as the solution passes into the processing chamber 904. The anode shield 393 and anode shield fasteners 394 are preferably made from a dielectric material, such as polyvinylidene fluoride or polypropylene. The anode shield is advantageously about 2-5 millimeters thick, more preferably about 3 millimeters thick.
The anode shield serves to electrically isolate and physically protect the back side of the anode. It also reduces the consumption of organic plating liquid additives. Although the exact mechanism may not be known at this time, the anode shield is believed to prevent disruption of certain materials which develop over time on the back side of the anode. If the anode is left unshielded, the organic chemical plating additives are consumed at a significantly greater rate. With the shield in place, these additives are not consumed as quickly.
WAFER ROTOR ASSEMBLY
The wafer rotor assembly 906 holds a wafer W for rotation within the processing chamber 904. The wafer rotor assembly 906 includes a rotor assembly 984 having a
plurality of wafer-engaging fingers 979 that hold the wafer against features of the rotor.
Fingers 979 are preferably adapted to conduct current between the wafer and a plating
electrical power supply and may be constructed in accordance with various configurations
to act as current thieves.
The various components used to spin the rotor assembly 984 are disposed in a fixed
housing 970. The fixed housing is connected to a horizontally extending arm 909 that, in
turn, is connected to a vertically extending arm. Together, the arms 908 and 909 allow the
assembly 906 to be lifted and rotated from engagement with the bowl assembly to thereby
present the wafer to the wafer conveying assembly 60for transfer to a subsequent
processing station.
Numerous modifications may be made to the foregoing system without departing
from the basic teachings thereof. Although the present invention has been described in
substantial detail with reference to one or more specific embodiments, those of skill in the
art will recognize that changes may be made thereto without departing from the scope and
spirit of the invention as set forth in the appended claims.

Claims

CLAIMSWhat is Claimed is:
1. A transport system for manipulating a semiconductor wafer within a processing
section of a processing apparatus, the transport system comprising:
a transport unit guide disposed within the processing apparatus for supporting a
wafer transfer unit as it moves between a first position and a second position,
the transport unit guide comprising a frame, a lateral guide rail mounted on
the frame and a series of magnetic segments arranged upon the transport unit
guide proximate the lateral guide rail;
the wafer transfer unit comprising a tram translatably attached to the lateral guide
rail, a wafer transfer arm assembly for manipulating the semiconductor
wafer, an electromagnet mounted on the tram in cooperative relation with the
magnetic segments for moving the transfer unit along the guide rail,
actuators responsive to control signals for controlling the position of the
transfer unit and transfer arm assembly, sensors for monitoring the position
of the transfer unit and the transfer arm assembly;
a controller disposed remote of the transfer unit, the controller being responsive to
signals received from the sensors and providing the control signals to the
actuators for directing the movement of the transfer unit and transfer arm
assembly; and a communication link between the wafer transfer unit and the controller for
facilitating control of the operation of the wafer transfer unit.
2. A transport system as claimed in claim 1 wherein the communication link between
the wafer transfer unit and the controller is an optical communication link.
3. A transport system as claimed in claim 2 wherein the optical communications link
comprises one or more fiber-optic lines extending between the wafer transfer unit
and the controller.
4. A transport system as claimed in claim 1 and further comprising:
a further lateral guide rail mounted on the frame and disposed parallel with and
vertically below the lateral guide rail;
the tram being translatably attached to the further lateral guide rail.
5. A transport system as claimed in claim 1 and further comprising an angular
adjustment mechanism for adjusting the angular orientation of the wafer transfer
arm assembly with respect to the tram.
6. A transport system as claimed in claim 4 and further comprising an angular
adjustment mechanism for adjusting d e angular orientation of the wafer transfer
arm assembly with respect to the tram.
7. A transport system as claimed in claim 4 wherein the tram is attached to the lateral
guide rail and the further lateral guide rail with respective compliant mounting
assemblies.
8. A semiconductor wafer processing apparatus, comprising:
a wafer conveyor system including
a central support extending along a linear transfer path,
a first wafer transport unit disposed on a first side of the central support and
mounted thereto for translational movement along the linear transfer
path,
a second wafer transport unit disposed on a second side of the central
support and mounted thereto for translational movement parallel to
the first transport unit along the linear transfer path;
a plurality of wafer processing modules adjacent opposing sides of said wafer
conveyor system; and
said first and second wafer transport units adapted to respectively support an
individual semiconductor wafer and to access each of said wafer processing
modules for transferring semiconductor wafers therebetween.
9. The semiconductor wafer processing apparatus of claim 8 wherein said first and
second wafer transport units are removed along the transfer path using respective
linear magnetic motors.
10. The semiconductor wafer processing apparatus of claim 8 herein each said at least
one wafer transport unit includes:
a tram;
a wafer transfer arm connected to said tram for 2 degree movement in a generally
horizontal plane, the wafer transfer arm having a vacuum support mounted at
a distal end thereof for holding a semiconductor wafer;
a transfer arm elevator for adjusting the vertical position of said wafer transfer arm
with respect to said tram.
11. The semiconductor wafer processing apparatus of claim 8 wherein each of said first
and second wafer transport units includes a position sensor for determining the
position of the respective wafer transport unit relative to said wafer processing
modules.
12. The semiconductor wafer processing apparatus of claim 8 and further comprising:
at least one wafer interface module adjacent said wafer conveyor for supporting a
wafer cassette having a plurality of semiconductor wafers therein; said wafer interface configured to present said wafer cassette in an extraction
position to permit at least one of said first and second wafer transport units
to access the semiconductor wafers in total wafer cassettes for.
13. The semiconductor wafer processing apparatus of claim 12 are wherein each said at
least one wafer interface includes:
a wafer cassette turnstile for moving a wafer cassette between a load position and a
transfer position;
a wafer cassette elevator adjacent said wafer cassette turnstile and configured to
transfer wafer cassettes therebetween and provide the wafer cassette in the
extraction position.
14. The semiconductor wafer processing apparatus of claim 12 wherein said
semiconductor wafer processing apparatus further comprises a cassette loading door
adjacent said at least one wafer interface module and being configured to permit
wafer cassettes to pass therethrough.
15. The semiconductor wafer processing apparatus of claim 8 further comprising:
a first wafer interface module for receiving wafer cassettes containing unprocessed
semiconductor wafers, the first wafer interface module presenting the
unprocessed semiconductor wafers to the wafer transfer assembly in a
generally horizontal extraction position; a second wafer interface module for receiving processed semiconductor wafers into
a wafer cassettes from below wafer transfer assembly, the second wafer
interface module accepting the processed semiconductor wafers from the
wafer transfer assembly in a generally horizontal insertion position.
16. The semiconductor wafer processing apparatus of claim 8 wherein the central
support comprises:
a frame;
a first set of magnetic segments in fixed relationship with respect to the frame along
a first side thereof along the length of the linear path;
a second set of magnetic segments in fixed relationship with respect to the frame
along a second side thereof along the length of the linear path;
first and second lateral guide rails mounted on opposite sides of the frame and
supporting the first and second wafer transfer units respectively.
17. The semiconductor wafer processing apparatus of claim 16 wherein each of the first
and second wafer transfer units comprises:
a tram translatably attached to the respective lateral guide rail;
an electromagnet mounted on the tram in cooperative relation with the respective
magnetic segments for moving the wafer transfer unit along the respective
guide rail; a plurality of actuators responsive to control signals for controlling the position of
the wafer transfer unit and transfer arm assembly;
a plurality of the sensors for monitoring the position of the transfer unit and the
transfer arm assembly.
18. The semiconductor wafer processing apparatus of claim 8 and further comprising
an air supply intermediate opposing ones of said wafer processing modules for
supplying air to said semiconductor wafer processing apparatus.
19. The semiconductor wafer processing apparatus of claim 8 wherein said wafer
conveyor system includes at least one exhaust duct adjacent thereto for removing
air.
20. The semiconductor wafer processing apparatus of claim 8 wherein said wafer
processing modules are interchangeable.
21. A semiconductor wafer processing apparatus, comprising:
a plurality of wafer processing modules for processing a semiconductor wafer, each
of said wafer processing modules being interchangeable; a wafer conveyor adjacent said wafer processing modules and having at least one
wafer transport unit adapted for controlled movement along a generally
linear transfer path;
said at least one wafer transport unit configured to support a semiconductor wafer
and access each of said wafer processing modules for transferring
semiconductor wafers therebetween.
22. The semiconductor wafer processing apparatus of claim 21 wherein said wafer
conveyor moves said at least one wafer transport unit along the linear transfer path using a linear magnetic motor.
23. A method of handling semiconductor wafers within a semiconductor wafer
processing apparatus having a plurality of wafer processing modules and a wafer
conveyor adjacent thereto, comprising the steps of:
a. receiving at least one wafer cassette having a plurality of semiconductor
wafers therein;
b. moving a first wafer transport unit along the wafer conveyor to transport a
first individual wafer between one of the at least one wafer cassettes and a
first one of the wafer processing modules;
c. moving a second wafer transport unit along the wafer conveyor to transport a
second individual wafer between one of the at least one wafer cassettes and a
second one of the wafer processing modules; wherein said moving of the first wafer transport unit and said moving of the second
wafer transport unit overlap in time.
24. The method of claim 23 and further comprising a step after step a of translating the
at least one wafer cassette from a vertical orientation to a horizontal orientation so
as to present semiconductor wafers contained therein in a generally horizontal
orientation.
25. The method of claim 23 and further comprising the steps of:
storing wafer cassettes having unprocessed semiconductor wafers in the to and and
in and and and and than in an and than than inward in a first interface
module; and
storing wafer cassettes having processed semiconductor wafers in a second interface
module.
26. A transport system for manipulating a semiconductor wafer within a processing
section of a semiconductor processing apparatus, the transport system comprising:
a transport unit guide disposed within the processing apparatus for supporting a
wafer transfer unit as it moves between a first position and a second position,
the transport unit guide comprising a frame, a lateral guide rail mounted on
the frame and a series of magnetic segments arranged upon the transport unit
guide proximate the lateral guide rail;
the wafer transfer unit comprising a tram translatably attached to the lateral guide
rail, a wafer transfer arm assembly for manipulating the semiconductor
wafer, an electromagnet mounted on the tram in cooperative relation with the
magnetic segments for moving the transfer unit along the guide rail; and
an angular adjustment mechanism for adjusting the angular orientation of the wafer
transfer arm assembly with respect to the tram.
27. A transport system as claimed in claim 26 and further comprising:
a plurality of actuators responsive to control signals for controlling the position of
the transfer unit and transfer arm assembly;
a plurality of sensors for monitoring the position of the transfer unit and the transfer
arm assembly.
28. A transport system as claimed in claim 27 and further comprising: a controller disposed remote of the transfer unit, the controller being responsive to
signals received from the sensors and providing the control signals to the
actuators for directing the movement of the transfer unit and transfer arm
assembly; and
a communication link between the wafer transfer unit and the controller for
facilitating control of the operation of the wafer transfer unit.
29. A transport system as claimed in claim 28 wherein the communication link between
the wafer transfer unit and the controller is an optical communication link.
30. A transport system as claimed in claim 29 wherein the optical communications link
comprises one or more fiber-optic lines extending between the wafer transfer unit
and the controller.
31. A transport system as claimed in claim 26 for and further comprising:
a further lateral guide rail mounted on the frame and disposed parallel with and
vertically below the lateral guide rail;
the tram being translatably attached to the further lateral guide rail.
32. A transport system as claimed in claim 31 wherein the tram is attached to the lateral
guide rail and the further lateral guide rail with respective compliant mounting
assemblies.
EP98903371A 1997-09-30 1998-01-06 Semiconductor processing apparatus having linear conveyor system Withdrawn EP1027730A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US990107 1992-12-14
US94052497A 1997-09-30 1997-09-30
US940524 1997-09-30
US08/990,107 US6672820B1 (en) 1996-07-15 1997-12-15 Semiconductor processing apparatus having linear conveyer system
PCT/US1998/000132 WO1999017356A1 (en) 1997-09-30 1998-01-06 Semiconductor processing apparatus having linear conveyor system

Publications (1)

Publication Number Publication Date
EP1027730A1 true EP1027730A1 (en) 2000-08-16

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JP (1) JP2001518710A (en)
CN (1) CN1129175C (en)
AU (1) AU6016498A (en)
WO (1) WO1999017356A1 (en)

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JP2001518710A (en) 2001-10-16
CN1129175C (en) 2003-11-26
AU6016498A (en) 1999-04-23
WO1999017356A1 (en) 1999-04-08
CN1272960A (en) 2000-11-08

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