EP0405757A3 - High efficiency light-emitting diode - Google Patents

High efficiency light-emitting diode Download PDF

Info

Publication number
EP0405757A3
EP0405757A3 EP19900305903 EP90305903A EP0405757A3 EP 0405757 A3 EP0405757 A3 EP 0405757A3 EP 19900305903 EP19900305903 EP 19900305903 EP 90305903 A EP90305903 A EP 90305903A EP 0405757 A3 EP0405757 A3 EP 0405757A3
Authority
EP
European Patent Office
Prior art keywords
emitting diode
high efficiency
efficiency light
light
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19900305903
Other versions
EP0405757A2 (en
Inventor
Roland H. Haitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP0405757A2 publication Critical patent/EP0405757A2/en
Publication of EP0405757A3 publication Critical patent/EP0405757A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
EP19900305903 1989-06-27 1990-05-31 High efficiency light-emitting diode Withdrawn EP0405757A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37227589A 1989-06-27 1989-06-27
US372275 1989-06-27

Publications (2)

Publication Number Publication Date
EP0405757A2 EP0405757A2 (en) 1991-01-02
EP0405757A3 true EP0405757A3 (en) 1991-01-30

Family

ID=23467457

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900305903 Withdrawn EP0405757A3 (en) 1989-06-27 1990-05-31 High efficiency light-emitting diode

Country Status (2)

Country Link
EP (1) EP0405757A3 (en)
JP (1) JPH0335568A (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
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EP0542656A1 (en) * 1991-10-31 1993-05-19 International Business Machines Corporation Pattern propagation by blanket illumination of patterned thermal conductors and patterned thermal insulator on a thermal conductor
US5349211A (en) * 1992-03-26 1994-09-20 Nec Corporation Semiconductor infrared emitting device with oblique side surface with respect to the cleavage
US6177761B1 (en) * 1996-07-17 2001-01-23 Teledyne Lighting And Display Products, Inc. LED with light extractor
US6229160B1 (en) * 1997-06-03 2001-05-08 Lumileds Lighting, U.S., Llc Light extraction from a semiconductor light-emitting device via chip shaping
US6784463B2 (en) 1997-06-03 2004-08-31 Lumileds Lighting U.S., Llc III-Phospide and III-Arsenide flip chip light-emitting devices
DE19727233A1 (en) 1997-06-26 1999-01-07 Siemens Ag Radiation-emitting optoelectronic component
GB2381380B (en) * 1997-11-19 2003-06-18 Unisplay Sa LED lamp
DE19943406C2 (en) 1999-09-10 2001-07-19 Osram Opto Semiconductors Gmbh Light emitting diode with surface structuring
DE19947030A1 (en) * 1999-09-30 2001-04-19 Osram Opto Semiconductors Gmbh Surface-structured light emission diode with improved current coupling
AU2001239182A1 (en) 2000-02-15 2001-08-27 Osram Opto Semiconductors Gmbh Semiconductor component which emits radiation, and method for producing the same
DE10006738C2 (en) * 2000-02-15 2002-01-17 Osram Opto Semiconductors Gmbh Light-emitting component with improved light decoupling and method for its production
DE10019665A1 (en) * 2000-04-19 2001-10-31 Osram Opto Semiconductors Gmbh Luminescent diode chip and method for its production
DE10032838B4 (en) 2000-07-06 2015-08-20 Osram Opto Semiconductors Gmbh Radiation emitting semiconductor chip and method for its production
JP3882539B2 (en) 2000-07-18 2007-02-21 ソニー株式会社 Semiconductor light emitting device, method for manufacturing the same, and image display device
JP4595198B2 (en) 2000-12-15 2010-12-08 ソニー株式会社 Semiconductor light emitting device and method for manufacturing semiconductor light emitting device
JP4649745B2 (en) 2001-02-01 2011-03-16 ソニー株式会社 Light-emitting element transfer method
JP5283293B2 (en) 2001-02-21 2013-09-04 ソニー株式会社 Semiconductor light emitting device
JP3690340B2 (en) 2001-03-06 2005-08-31 ソニー株式会社 Semiconductor light emitting device and manufacturing method thereof
JP2002261327A (en) 2001-03-06 2002-09-13 Sony Corp Semiconductor light-emitting element and manufacturing method therefor
JP4876319B2 (en) * 2001-03-09 2012-02-15 ソニー株式会社 Display device and manufacturing method thereof
DE10111501B4 (en) 2001-03-09 2019-03-21 Osram Opto Semiconductors Gmbh Radiation-emitting semiconductor component and method for its production
US6987613B2 (en) * 2001-03-30 2006-01-17 Lumileds Lighting U.S., Llc Forming an optical element on the surface of a light emitting device for improved light extraction
DE10139723A1 (en) 2001-08-13 2003-03-13 Osram Opto Semiconductors Gmbh Radiation-emitting chip and radiation-emitting component
DE10139798B9 (en) * 2001-08-14 2006-12-28 Osram Opto Semiconductors Gmbh Radiation-emitting component with geometrically optimized coupling-out structure
JP3715627B2 (en) * 2002-01-29 2005-11-09 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
JP3776824B2 (en) 2002-04-05 2006-05-17 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
JP2004056088A (en) * 2002-05-31 2004-02-19 Toyoda Gosei Co Ltd Iii nitride compound semiconductor light-emitting element
JP3874701B2 (en) 2002-06-26 2007-01-31 株式会社東芝 Semiconductor light emitting device and semiconductor light emitting device
JP2004288799A (en) 2003-03-20 2004-10-14 Sony Corp Semiconductor light-emitting element, integrated semiconductor light-emitting device, image display device, lighting apparatus, and manufacturing methods of all
DE10313606A1 (en) * 2003-03-26 2004-10-14 Osram Opto Semiconductors Gmbh Micro-structuring a semiconductor chip used in optics and optoelectronics comprises using a mechanical process
JP2006525682A (en) 2003-04-30 2006-11-09 クリー　インコーポレイテッド High power solid state light emitting device package
JP4238666B2 (en) * 2003-07-17 2009-03-18 豊田合成株式会社 Method for manufacturing light emitting device
WO2005048363A2 (en) * 2003-11-12 2005-05-26 Cree, Inc. Methods of processing semiconductor wafer backsides having light emitting devices (leds) thereon and leds so formed
JP4320676B2 (en) * 2004-03-31 2009-08-26 日亜化学工業株式会社 Nitride semiconductor light emitting device
US7534633B2 (en) * 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
JP2006066518A (en) 2004-08-25 2006-03-09 Sharp Corp Semiconductor light-emitting element and method of manufacturing the same
JP4244953B2 (en) * 2005-04-26 2009-03-25 住友電気工業株式会社 Light emitting device and manufacturing method thereof
US8154079B2 (en) 2006-12-07 2012-04-10 Kabushiki Kaisha Toshiba Semiconductor device and fabrication method of the semiconductor device
CN101800274B (en) * 2009-02-11 2011-11-09 晶发光电股份有限公司 Method for manufacturing semiconductor element with concave-convex base plate
JP5596375B2 (en) * 2010-03-08 2014-09-24 スタンレー電気株式会社 Semiconductor light emitting device manufacturing method and semiconductor light emitting device
CN104241262B (en) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 Light emitting device and display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE752273A (en) * 1969-06-23 1970-12-01 Western Electric Co ROUGH SURFACE LIGHT DIODES
DE2421590A1 (en) * 1974-05-03 1975-11-13 Siemens Ag Optical semiconductor radiation source - has hilly geometric shaped outer surface with PN junction in or near hill
DE2626564A1 (en) * 1975-06-17 1976-12-30 Matsushita Electric Ind Co Ltd GALLIUM PHOSPHIDE ELECTROLUMINESCENT SYSTEM AND METHOD FOR MANUFACTURING THE SAME
DE2751272A1 (en) * 1976-11-16 1978-05-18 Mitsubishi Electric Corp Mesa semiconductor device with insulating surface film - has at least one pn-junction provided at chip surface and support element on one main surface

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840872A (en) * 1981-09-03 1983-03-09 Nec Corp Semiconductor light-emitting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE752273A (en) * 1969-06-23 1970-12-01 Western Electric Co ROUGH SURFACE LIGHT DIODES
DE2421590A1 (en) * 1974-05-03 1975-11-13 Siemens Ag Optical semiconductor radiation source - has hilly geometric shaped outer surface with PN junction in or near hill
DE2626564A1 (en) * 1975-06-17 1976-12-30 Matsushita Electric Ind Co Ltd GALLIUM PHOSPHIDE ELECTROLUMINESCENT SYSTEM AND METHOD FOR MANUFACTURING THE SAME
DE2751272A1 (en) * 1976-11-16 1978-05-18 Mitsubishi Electric Corp Mesa semiconductor device with insulating surface film - has at least one pn-junction provided at chip surface and support element on one main surface

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 7, no. 123 (E-178)(1268) 27 May 1983, & JP-A-58 040872 (NIPPON DENKI K.K.) 09 March 1983, *

Also Published As

Publication number Publication date
JPH0335568A (en) 1991-02-15
EP0405757A2 (en) 1991-01-02

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