DE602005011778D1 - It metallschicht und halbleiterelement - Google Patents

It metallschicht und halbleiterelement

Info

Publication number
DE602005011778D1
DE602005011778D1 DE602005011778T DE602005011778T DE602005011778D1 DE 602005011778 D1 DE602005011778 D1 DE 602005011778D1 DE 602005011778 T DE602005011778 T DE 602005011778T DE 602005011778 T DE602005011778 T DE 602005011778T DE 602005011778 D1 DE602005011778 D1 DE 602005011778D1
Authority
DE
Germany
Prior art keywords
metal layer
provides
laminate film
heat resistance
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005011778T
Other languages
English (en)
Inventor
Takuo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of DE602005011778D1 publication Critical patent/DE602005011778D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
DE602005011778T 2004-05-20 2005-04-25 It metallschicht und halbleiterelement Expired - Fee Related DE602005011778D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004150222 2004-05-20
PCT/JP2005/007766 WO2005113645A1 (ja) 2004-05-20 2005-04-25 ポリイミド樹脂、積層フィルム、金属層付き積層フィルム、および半導体装置

Publications (1)

Publication Number Publication Date
DE602005011778D1 true DE602005011778D1 (de) 2009-01-29

Family

ID=35428386

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005011778T Expired - Fee Related DE602005011778D1 (de) 2004-05-20 2005-04-25 It metallschicht und halbleiterelement

Country Status (9)

Country Link
US (1) US20070260035A1 (de)
EP (1) EP1739114B1 (de)
JP (1) JPWO2005113645A1 (de)
KR (1) KR20070013303A (de)
CN (1) CN1954015A (de)
AT (1) ATE417881T1 (de)
DE (1) DE602005011778D1 (de)
TW (1) TW200615302A (de)
WO (1) WO2005113645A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080214777A1 (en) * 2005-08-02 2008-09-04 Srs Technologies Heteropolymeric Polyimide Polymer Compositions
WO2007149604A1 (en) * 2006-02-13 2007-12-27 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Novel aromatic/aliphatic diamine derivatives for advanced compositions and polymers
KR101385856B1 (ko) 2006-05-24 2014-04-17 닛산 가가쿠 고교 가부시키 가이샤 게이트 절연막용 도포액, 게이트 절연막 및 유기 트랜지스터
CN101374386B (zh) * 2007-08-24 2011-03-23 富葵精密组件(深圳)有限公司 印刷电路板的制作方法
JP5351470B2 (ja) * 2008-09-09 2013-11-27 日立電線株式会社 絶縁電線
JP5584134B2 (ja) * 2008-11-10 2014-09-03 味の素株式会社 シロキサン含有ポリイミド樹脂
JP5583551B2 (ja) 2009-11-04 2014-09-03 三星電子株式会社 有機シリケ−ト化合物を含む組成物およびフィルム
JP5419226B2 (ja) * 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP6422657B2 (ja) * 2014-02-18 2018-11-14 東京応化工業株式会社 ポリイミド樹脂の製造方法、ポリイミド膜の製造方法、ポリアミック酸溶液の製造方法、ポリイミド膜、及びポリアミック酸溶液
CN106029744B (zh) * 2014-02-26 2018-08-28 东丽株式会社 聚酰亚胺树脂、使用其的树脂组合物及层叠膜
CN106255714A (zh) * 2014-04-18 2016-12-21 长濑化成株式会社 抗蚀剂树脂及其制造方法
SG10202000399YA (en) * 2014-08-08 2020-03-30 Toray Industries Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
JP5918822B2 (ja) * 2014-09-18 2016-05-18 株式会社カネカ 寸法安定性を向上させたフレキシブル金属張積層板の製造方法ならびにそれにより得られるフレキシブル金属張積層板
CN105622938B (zh) * 2016-04-06 2018-10-30 京东方科技集团股份有限公司 聚酰亚胺、其组合物及制备方法、配向膜、显示装置
TWI788288B (zh) * 2016-05-06 2023-01-01 日商三菱瓦斯化學股份有限公司 聚醯亞胺樹脂
KR102310660B1 (ko) * 2017-04-28 2021-10-07 미쓰이 가가쿠 가부시키가이샤 기판 적층체 및 기판 적층체의 제조 방법
JP7292651B2 (ja) * 2018-04-17 2023-06-19 エルジー・ケム・リミテッド 光拡散性バリアフィルム
US11898009B2 (en) * 2018-04-20 2024-02-13 Ube Corporation Polyimide, laminate, and electronic device including same
JP6996643B2 (ja) * 2019-09-06 2022-01-17 昭和電工マテリアルズ株式会社 ポリアミドイミド樹脂、樹脂組成物、及び半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094919A (en) * 1988-06-30 1992-03-10 Nippon Steel Chemical Co., Ltd. Polyimide copolymers and process for preparing the same
US4948400A (en) * 1988-06-30 1990-08-14 Nippon Steel Chemical Co., Ltd. Separation membranes and process for preparing the same
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
US5156710A (en) * 1991-05-06 1992-10-20 International Business Machines Corporation Method of laminating polyimide to thin sheet metal
JPH0539363A (ja) * 1991-08-05 1993-02-19 Nippon Steel Corp ポリイミド樹脂成形物とその製造方法
JP2992462B2 (ja) * 1995-08-31 1999-12-20 株式会社巴川製紙所 電子部品用接着テープ及び液状接着剤
JP2949568B2 (ja) * 1995-08-31 1999-09-13 株式会社巴川製紙所 新規なポリイミド及びその製造方法
JP4045621B2 (ja) * 1997-10-15 2008-02-13 Ｊｓｒ株式会社 フッ素含有ポリイミド樹脂を含む電気絶縁材料およびそれを用いた電子部品
JP4042201B2 (ja) * 1998-04-15 2008-02-06 Ｊｓｒ株式会社 電子部品およびその製造方法
JP2004250577A (ja) * 2003-02-20 2004-09-09 Sumitomo Bakelite Co Ltd フィルム状接着剤、フィルム状接着剤付リードフレーム及び半導体装置

Also Published As

Publication number Publication date
EP1739114A1 (de) 2007-01-03
WO2005113645A1 (ja) 2005-12-01
KR20070013303A (ko) 2007-01-30
EP1739114B1 (de) 2008-12-17
TW200615302A (en) 2006-05-16
US20070260035A1 (en) 2007-11-08
ATE417881T1 (de) 2009-01-15
JPWO2005113645A1 (ja) 2008-03-27
EP1739114A4 (de) 2007-03-07
CN1954015A (zh) 2007-04-25

Similar Documents

Publication Publication Date Title
DE602005011778D1 (de) It metallschicht und halbleiterelement
CN104379339B (zh) 层压板和包括使用其制备的基板的器件
TWI718484B (zh) 顯示裝置之製造方法
WO2006077964A1 (ja) ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体
WO2006077964A3 (ja) ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体
EP1266926A4 (de) Polyimid-Klebstoffharz und Laminat-Klebemittel
JP5298760B2 (ja) 絶縁体フィルム、樹脂組成物、および表示装置
WO2008142887A1 (ja) 半導体モジュール及びインバータ装置
ATE475971T1 (de) Organische halbleiterschicht-formulierungen mit polyacenen und organischen binderpolymeren
WO2003038526A1 (fr) Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
TW200701432A (en) Electron device, operational device and display device
DE60136145D1 (de) Polyesterfilm für einen hitzebeständigen kondensator, metallisierter polyesterfilm und hitzebständiger kondensator
EP1508584A4 (de) Klebharz und damit hergestellte filmklebstoffe
WO2015038412A3 (en) Amine treated maleic anhydride polymers with pendent silyl group, compositions and applications thereof
WO2009037834A1 (ja) 半導体装置用プライマー樹脂及び半導体装置
TWI732439B (zh) 聚醯亞胺系樹脂膜、用於顯示器元件的基板以及光學元件
WO2002026888A3 (en) Low temperature bonding adhesive composition
ATE510688T1 (de) Wärmeschrumpfbare geschichtete folie und damit hergestellte verpackung
CN107722267B (zh) 聚酰亚胺前体及由所述聚酰亚胺前体生成的聚酰亚胺
TW200520598A (en) Thick film compositions for use in electroluminescent applications
JP7414011B2 (ja) ポリイミド系樹脂フィルム、およびこれを利用したディスプレイ装置用基板ならびに光学装置
JP3707879B2 (ja) ポリイミド樹脂組成物およびフィルム接着剤とその製造方法
JP2021195542A (ja) ポリイミド系共重合体およびそれを含む電子部品と電界効果トランジスタ
ATE329960T1 (de) Wärmeleitende härtbare flüssige polymerzusammensetzung und mit dieser zusammensetzung hergestellter halbleiter
JP2003105306A5 (de)

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee