DE3436001A1 - Electrostatic glass-soldering of semiconductor components - Google Patents

Electrostatic glass-soldering of semiconductor components

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Publication number
DE3436001A1
DE3436001A1 DE19843436001 DE3436001A DE3436001A1 DE 3436001 A1 DE3436001 A1 DE 3436001A1 DE 19843436001 DE19843436001 DE 19843436001 DE 3436001 A DE3436001 A DE 3436001A DE 3436001 A1 DE3436001 A1 DE 3436001A1
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Prior art keywords
glass
soldering
temperature
component
carrier
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DE19843436001
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German (de)
Inventor
Manfred 8000 München Wintzer
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Siemens AG
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Siemens AG
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Priority to DE19843436001 priority Critical patent/DE3436001A1/en
Publication of DE3436001A1 publication Critical patent/DE3436001A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

Assembly of certain semiconductor components onto a suitable carrier plate, for example glass. The carrier disc is provided with a thin glass layer onto which the component is laid with its connection side. The parts to be connected are heated, between two mutually electrically insulated metal discs, to a temperature not exceeding the glass-soldering temperature. In the process, a direct voltage is applied to the two mutually insulated metal discs in such a way, that the anode is located on the component side and the cathode is located at the glazed carrier disc.

Description

Elektrostatisches Glaslöten von Haibleiterbauteilen.Electrostatic glass soldering of semiconductor components.

Die Erfindung betrifft ein Glaslötverfahren zum Verbinden von Bauelementen mit einer Trägerscheibe.The invention relates to a glass soldering method for connecting components with a carrier disk.

In Planartechnik auf Halbleiterwafern (zum Beispiel Silizium) hergestellte Bauteile (Dioden, Drucksensoren, Fotoelementarray usw.) werden vor der Montage in Gehäuse oder auf Schaltungen auf einer Trägerscheibe gleichen oder thermisch angepaßten Materials zum Zwecke der Stabilitätsverbesserung befestigt. Diese Verbindungstechnologie ist mit der Wahl der Trägerscheibe verknüpft und beides für die späteren Eigenschaften der Bauteile von entscheidender Bedeutung.Manufactured using planar technology on semiconductor wafers (e.g. silicon) Components (diodes, pressure sensors, photo element arrays, etc.) are in Housing or circuits on a carrier disk the same or thermally adapted Material attached for the purpose of stability improvement. This connection technology is linked to the choice of the carrier disk and both for the later properties the components are of crucial importance.

In den US-PS 3 918 019 sowie 3 397 278 wird ein Verfahren beschrieben, das eine starre Verbindung bei mindestens 2500C unter Anwendung einer Gleichspannung von 500 V auf Glasscheiben ermöglicht. Die Nachteile dieses sogenannten "Anodischen Verbindens liegen in der Tatsache, daß als Trägermaterial kein gleichartiges Halbleitermaterial und kein Quarzglas als Träger verwendet werden kann, sondern vorwiegend nur alkalihaltige Silikatglasscheiben und daß außerdem die miteinander zu verbindenden Oberflächen optisch plan poliert sein müssen.US Pat. No. 3,918,019 and US Pat. No. 3,397,278 describe a process a rigid connection at at least 2500C using a DC voltage of 500 V on glass panes. The disadvantages of this so-called "anodic The connection lies in the fact that no semiconductor material of the same type is used as the carrier material and no quartz glass can be used as a carrier, but predominantly only alkaline glass Silicate glass panes and that also the surfaces to be connected to one another must be optically polished flat.

Weitere bekannte Verbindungsverfahren stellen das Löten mit Metallen oder Gläsern dar, sowie das Legieren von Metallen (Gold oder Aluminium) über eutektische Verbindungen zwischen den zu verbindenden Oberflächen. Diese Nur-Temperatur-Verfahren nehmen die Diffusion störender oder vergiftender Materialien in das Halbleiterbauteil in Kauf.Other known connection methods are soldering with metals or glasses, as well as the alloying of metals (gold or aluminum) via eutectic Connections between the surfaces to be connected. This temperature-only method take the diffusion more disruptive or poisoning materials in the semiconductor component in purchase.

Der Erfindung liegt die Aufgabe zugrunde, die erwähnten Nachteile zu beseitigen. Die Lösung nach dem Kennzeichen des Anspruchs 1 ermöglicht die Verwendung aller gewünschten Materialien als Träger, indem auf deren Oberflächen eine dünne Schicht eines alkalihaltigen Glases aufgebracht wird. Dies kann wie bei der bekannten Glaslöttechnik im Siebdruckverfahren geschehen (übliche Schichtdicken 20 bis 100 um) oder aber durch Aufdampfen oder Aufstäuben (Sputtern) entsprechend beständiger alkalihaltiger Gläser. Dieses bevorzugte Verfahren ermöglicht die Aufbringung sehr gleichmäßiger Schichten in einem größeren Schichtdickenbereich frei von organischen Bindemitteln.The invention is based on the mentioned disadvantages to eliminate. The solution according to the characterizing part of claim 1 enables the use all desired materials as a carrier by placing a thin Layer of an alkaline glass is applied. This can be done as with the known Glass soldering is done in the screen printing process (usual layer thicknesses 20 to 100 um) or by vapor deposition or dusting (sputtering) correspondingly more resistant alkaline glasses. This preferred method is very easy to apply more uniform layers in a larger layer thickness range free of organic Binders.

So kann es sinnvoll sein, bei vorhandenen polierten Verbindungsoberflächen Schichten von wenigen um zu wählen (zum Beispiel 4 ... 10 um). Diese sehr dünnen Schichtdicken vermeiden besonders bei der Wahl thermisch falsch angepaßter Verbindungspartner die Ausbildung thermischer Spannungen. So wird erfindungsgemäß die Möglichkeit geschaffen, eine Verbindung zwischen zum Beispiel Siliziumwafern untereinander oder aber mit Quarzglasscheiben zu schaffen. Aber auch die dickeren Schichten des Siebdruckverfahrens können erfindungsgemäß zum Verbinden weniger ebener Oberflächenstrukturen genutzt werden, ohne aber die Nachteile des Temperaturglaslötens zu besitzen.So it can be useful with existing polished connection surfaces Layers of a few to choose from (for example 4 ... 10 µm). These very thin Avoid layer thicknesses, especially when choosing connection partners that are thermally incorrectly adapted the formation of thermal stresses. Thus, according to the invention, the possibility is created a connection between, for example, silicon wafers with one another or with To create quartz glass panes. But also the thicker layers of the screen printing process can be used according to the invention to connect less planar surface structures without having the disadvantages of temperature glass soldering.

Wenn nach der Lösung der Erfindung die Trägerscheibe des gewünschten Werkstoffs mit der dünnen Glasschicht auf der zu verbindenden Oberfläche versehen ist, wird die Waferscheibe mit den Halbleiterbauteilen mit ihrer Verbindungsseite auf die mehr oder weniger dünne Glasschicht der Trägerscheibe aufgelegt und sandwichartig zwischen zwei gegeneinander isolierte Metallscheiben gelegt. Beide Metallplatten, von denen die oben aufliegende gleichzeitig als Beschwerung dient, werden an eine Gleichspannungsquelle derart angeschlossen, daß die Bauelementen-Scheibe mit der Anode in Berührung ist, die glasbeschichtete Trägerscheibe mit der Katode. Dieser "Sandwichaufbau" wird nun in einem Ofen (sinnvollerweise in einem Vakuumofen) auf Temperaturen zwischen 2000 und max. 5000C aufgeheizt und bei Erreichen der jeweils gewünschten Temperatur die Gleichspannung für die Dauer weniger Minuten (zum Beispiel 4 ... 20 Min) eingeschaltet. Nach Ablauf dieser Zeit wird der Ofen ausgeschaltet. Die Spannung wird spätestens nach der Abkühlung und vor der Entnahme der nun fest miteinander verbundenen Bauteile-Trägerscheibe ebenfalls abgeschaltet.If, according to the solution of the invention, the carrier disk of the desired Material provided with the thin glass layer on the surface to be connected is, the wafer with the semiconductor components with its connection side placed on the more or less thin glass layer of the carrier disk and sandwiched placed between two mutually insulated metal disks. Both metal plates, of which the one on top also serves as a weight, are attached to a DC voltage source connected in such a way that the components disk is in contact with the anode, the glass-coated carrier disk with the cathode. This "sandwich structure" is now in an oven (meaningfully in a vacuum oven) heated to temperatures between 2000 and max. 5000C and when the respective desired temperature, the DC voltage for a period of a few minutes (for example 4 ... 20 min) switched on. After this time has elapsed, the furnace is switched off. The tension is fixed at the latest after the cooling and before the removal of the now Interconnected components carrier disk also switched off.

Weitere Einzelheiten der Erfindung sind Gegenstand der Unteransprüche.Further details of the invention are the subject of the subclaims.

Folgende Vorteile sind mit der Erfindung gegenüber den oben beschriebenen, bekannten Verfahren zu erreichen: 1. Es können nicht nur optisch plane Oberflächen (zum Beispiel die Oberflächenseite planar hergestellter Bauelemente) verbunden werden. Die unebene Strukturoberfläche wird durch die Glasschicht der Trägerscheibe ausgeglichen. Die angelegte Gleichspannung zieht die beweglichen Kationen (vorwiegend Natrium) aus der Glasschicht ab, wodurch eine Verarmung an Ladungsträgern in der Grenzschicht und damit ein elektrostatisches Potential mit hohen Anziehungskräften entsteht. Diese Kräfte sorgen für eine lötähnliche Verbindung mit dem viskosen, aber noch nicht flüssigen Glas, also bei einer wesentlich niedrigeren Temperatur als der sonst üblichen Löttemperatur.The following advantages are achieved with the invention over those described above, known methods to achieve: 1. It can not only optically plane surfaces (for example the surface side of components manufactured in a planar manner). The uneven structure surface is evened out by the glass layer on the carrier plate. The applied DC voltage pulls the mobile cations (mainly sodium) from the glass layer, causing a depletion of charge carriers in the boundary layer and thus an electrostatic potential with high attractive forces is created. These forces create a solder-like connection with the viscous, but still non-liquid glass, i.e. at a significantly lower temperature than usual usual soldering temperature.

2. Flüssiges Glas mit seinen beweglichen Natriumionen ist für Halbleiterbauteile sehr gefährlich. Bei einem "normalen Glaslötprozeß zerstören die diffundierfreudigen Natriumionen den Halbleiter. Das elektrostatische Glas- löten" verhindert jedoch die Natriumionendiffusion in Richtung Halbleiter aufgrund des angelegten Potentiales. Die Natriumionen werden vom Halbleiterbauteil weg zur Katode transportiert. Eine Zerstörung des Halbleiters durch Natriumionen wird vermieden.2. Liquid glass with its mobile sodium ions is used for semiconductor components very dangerous. In a "normal glass soldering process, the diffusing ones destroy Sodium ions the semiconductor. The electrostatic glass soldering "prevented however the sodium ion diffusion towards semiconductors due to the applied Potential. The sodium ions are transported away from the semiconductor component to the cathode. Destruction of the semiconductor by sodium ions is avoided.

3. Die Dicke der Glasschicht wird beim "elektrostatischen Glaslöten" stark reduziert, weil die Potentialkräfte die beiden zu verbindenden Scheiben zusammenpressen und das überschüssige Glas weggedrückt wird. Das ist besonders wichtig im Hinblick auf die thermischen Ausdehnungsspannungen bei nicht völligem Übereinstimmen des Ausdehnungsverhaltens von Glas und Halbleiter-bzw. Trägerscheibe.3. The thickness of the glass layer is determined by "electrostatic glass soldering" greatly reduced because the potential forces press the two disks to be connected together and the excess glass is pushed away. This is especially important in view on the thermal expansion stresses if the Expansion behavior of glass and semiconductors or. Carrier disk.

4. Das thermische Ausdehnungsverhalten des Glases wird durch die Reduzierung des Natriumanteiles durch das angelegte Spannungspotential verändert. Es tritt eine Erniedrigung des Koeffizienten ein, was sich ebenfalls in einer Verringerung vorhandener thermischer Spannung äußert.4. The thermal expansion behavior of the glass is due to the reduction the sodium content is changed by the applied voltage potential. There occurs a Decrease in the coefficient, which also results in a decrease in existing thermal stress.

5. Quarzglasscheiben und Halbleitermaterialscheiben niedriger Wärmeausdehnung können mit Glasloten nicht gelötet werden, da es für diese Ausdehnungsbereiche keine angepaßten Glaslote oder Gläser gibt. Von einem auf dem Markt erhältlichen Aufdampfglas können durch Verdampfen und Kondensation im Hochvakuum dünne Glasfilme auch auf Quarzglas- und Halbleiterscheiben er--zeugt und diese auf diese Weise für das elektrostatische Glaslöten verwendbar gemacht werden. Zwischen Träger- und Bauelementescheibe aus gleichem Werkstoff kann ohne diese Glastrennschicht kein elektrostatisches Potential erzeugt werden. Auf diese Weise sind bereits ab einer aufgedampften Glasschicht von 4 um mit einer Gleichspannung von 40 V bei max. 4000C feste Verbindungen zu erzielen. Für optisch nicht plane Oberflächen werden, je nach Oberflächengüte, dickere Aufdampfschichten benötigt.5. Quartz glass disks and semiconductor material disks with low thermal expansion cannot be soldered with glass solders as there are no adapted glass solders or glasses. From a vapor-deposition glass available on the market can also produce thin glass films through evaporation and condensation in a high vacuum Quartz glass and semiconductor wafers are produced in this way for the electrostatic Glass soldering can be made usable. Between the carrier and component washer The same material cannot have an electrostatic potential without this glass separating layer be generated. In this way, a vapor-deposited glass layer is already available of 4 µm with a direct voltage of 40 V at max. 4000C achieve. For visually not flat surfaces are, depending on the surface quality, thicker vapor deposition layers are required.

7 Patentansprüche7 claims

Claims (7)

Patentansprüche 1. Glaslötverfahren zum Verbinden von Bauelementen mit einer Trägerscheibe, d a d u r c h g e k e n n -z e i c h n e t , daß die Trägerscheibe mit einer dünnen Glasschicht versehen wird auf die das Bauelement mit seiner Verbindungsseite aufgelegt und zwischen zwei gegeneinander elektrisch isolierten Metallscheiben auf eine Temperatur bis höchstens der Glaslöttemperatur erhitzt wird, während an den beiden gegeneinander isolierten Metallscheiben eine Gleichspannung so anliegt, daß sich die Anode an der Bauelementseite und die Katode an der glasierten Trägerscheibe befindet.Claims 1. Glass soldering process for connecting components with a carrier disk, which means that the carrier disk is provided with a thin glass layer on which the component with its connection side placed and between two mutually electrically isolated metal disks a temperature up to a maximum of the glass soldering temperature is heated, while at the two mutually insulated metal disks a DC voltage is applied so that the anode on the component side and the cathode on the glazed carrier plate is located. 2. Lötverfahren nach Anspruch 1, d a d u r c h g e -k e n n z e i c h n e t , daß die Glasschicht aus einem niedrig schmelzenden Lotglas besteht und in bekannter Weise (zum Beispiel Siebdruck) in einer Dicke von zum Beispiel 20 ... 100 um aufgebracht wird.2. Soldering method according to claim 1, d a d u r c h g e -k e n n z e i c h n e t that the glass layer consists of a low-melting solder glass and in a known manner (for example screen printing) in a thickness of, for example, 20 ... 100 µm is applied. 3. Verfahren nach Anspruch 1, d a d u r c h g e k e n n -z e i c h n e t , daß die Glasschicht aus einem im Vakuum aufdampfbaren oder aufstäubbaren alkalihaltigen Glas besteht und in der Dicke von zum Beispiel 4 ... 100 um aufgebracht wird.3. The method of claim 1, d a d u r c h g e k e n n -z e i c h n e t that the glass layer consists of a vacuum vapor-depositable or sputterable Alkali-containing glass and applied in a thickness of, for example, 4 ... 100 µm will. 4. Verfahren nach Anspruch 1, d a d u r c h g e k e n n -z e i c h n e t , daß die erforderliche Temperatur nur bei besonders unebener Oberflächenstruktur bis an den Glaserweichungspunkt herankommt, ansonsten Temperaturen von zum Beispiel 200 ... 400°C ausreichen.4. The method according to claim 1, d a d u r c h g e k e n n -z e i c h n e t that the required temperature is only available for a particularly uneven surface structure up to the glass softening point, otherwise temperatures of, for example 200 ... 400 ° C are sufficient. 5. Verfahren nach Anspruch 1, d a d u r c h g e k e n n -z e i c h n e t , daß die erforderliche Gleichspannung je nach Glasdicke und Temperatur zwischen 30 und max.5. The method according to claim 1, d a d u r c h g e k e n n -z e i c h n e t that the required DC voltage depending on the glass thickness and temperature between 30 and max. 400 V liegt.400 V is. 6. Verfahren nach Anspruch 1, d a d u r c h g e -k e n n z e i c h n e t , daß als Trägerscheibe eine Halbleiterscheibe aus dem gleichen Material wie das des Bauelementes dient.6. The method of claim 1, d a d u r c h g e -k e n n z e i c h n e t that a semiconductor wafer made of the same material as the carrier wafer that serves the component. 7. Verfahren nach Anspruch 1, d a d u r c h g e -k e n n z e i c h n e t , daß als Trägerscheibe eine hochschmelzende, dem Halbleiterbauteil ausdehnungsmäßig angepaßte Glasscheibe oder Quarzglasscheibe dient.7. The method according to claim 1, d a d u r c h g e -k e n n z e i c h n e t that the carrier disk is a high-melting point, the semiconductor component in terms of expansion adapted glass pane or quartz glass pane is used.
DE19843436001 1984-10-01 1984-10-01 Electrostatic glass-soldering of semiconductor components Withdrawn DE3436001A1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4108304A1 (en) * 1991-03-14 1992-09-24 Fraunhofer Ges Forschung Fusing silicon water to glass backing plate - using high voltage and applied heat to secure silicon waters and ultra-thin membranes to glass backing plate
EP0539741A1 (en) * 1991-09-30 1993-05-05 Canon Kabushiki Kaisha Anodic bonding process with light irradiation
DE4136075A1 (en) * 1991-10-30 1993-05-06 Siemens Ag, 8000 Muenchen, De Anodic bonding of insulating and conductive discs to sandwich - involves using two hot plates for heating and applying pressure to minimise distortion and allow more than two discs to be bonded
DE4243612A1 (en) * 1991-12-25 1993-07-01 Rohm Co Ltd Anodic bonding of two substrates - comprises forming electroconductive film on one substrate and glass film on other substrate, joining and applying voltage
DE4219132A1 (en) * 1992-06-11 1993-12-16 Suess Kg Karl Bonded silicon@ wafer-glass or silicon@-silicon@ joint prodn. - comprises using laser light radiation to initially fix materials at spot(s) and/or lines and conventional high temp. bonding for pressure and acceleration sensors or micro-system elements

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DE1696110B1 (en) * 1968-01-23 1971-07-01 Jenaer Glaswerk Schott & Gen PROCESS FOR THE PRODUCTION OF GLASSY COATINGS ON SUBSTATE MATERIALS BY VACUUM EVAPORATION USING ELECTRON BEAMS
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* Cited by examiner, † Cited by third party
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DE4108304A1 (en) * 1991-03-14 1992-09-24 Fraunhofer Ges Forschung Fusing silicon water to glass backing plate - using high voltage and applied heat to secure silicon waters and ultra-thin membranes to glass backing plate
EP0539741A1 (en) * 1991-09-30 1993-05-05 Canon Kabushiki Kaisha Anodic bonding process with light irradiation
US5820648A (en) * 1991-09-30 1998-10-13 Canon Kabushiki Kaisha Anodic bonding process
DE4136075A1 (en) * 1991-10-30 1993-05-06 Siemens Ag, 8000 Muenchen, De Anodic bonding of insulating and conductive discs to sandwich - involves using two hot plates for heating and applying pressure to minimise distortion and allow more than two discs to be bonded
DE4136075C3 (en) * 1991-10-30 1999-05-20 Siemens Ag Method for connecting a disk-shaped insulating body to a disk-shaped, conductive body
DE4243612A1 (en) * 1991-12-25 1993-07-01 Rohm Co Ltd Anodic bonding of two substrates - comprises forming electroconductive film on one substrate and glass film on other substrate, joining and applying voltage
DE4219132A1 (en) * 1992-06-11 1993-12-16 Suess Kg Karl Bonded silicon@ wafer-glass or silicon@-silicon@ joint prodn. - comprises using laser light radiation to initially fix materials at spot(s) and/or lines and conventional high temp. bonding for pressure and acceleration sensors or micro-system elements

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