CN219107751U - Circuit board assembly, tool and electronic equipment - Google Patents

Circuit board assembly, tool and electronic equipment Download PDF

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Publication number
CN219107751U
CN219107751U CN202222494979.5U CN202222494979U CN219107751U CN 219107751 U CN219107751 U CN 219107751U CN 202222494979 U CN202222494979 U CN 202222494979U CN 219107751 U CN219107751 U CN 219107751U
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China
Prior art keywords
circuit board
assembly
support
pressing
board assembly
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CN202222494979.5U
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Chinese (zh)
Inventor
郭健强
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Honor Device Co Ltd
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Honor Device Co Ltd
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Priority to CN202321198598.0U priority Critical patent/CN220711699U/en
Priority to CN202222494979.5U priority patent/CN219107751U/en
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Abstract

The embodiment of the application provides a circuit board assembly, frock and electronic equipment, circuit board assembly include first circuit board, supporting component and first electronic component, and first electronic component includes two at least first devices that switch on with first circuit board, along the thickness direction of first circuit board, and each first device is folded in proper order and is located the homonymy of first circuit board. The support assembly comprises a plurality of support pieces, at least two support pieces form a first support unit, and the support pieces in the first support unit are arranged corresponding to the first devices. The supporting pieces corresponding to different first devices are staggered in the plate surface direction of the first circuit board, an avoidance area is formed towards the first devices of the first circuit board in at least two first devices, and part of the supporting pieces penetrate through the avoidance area and are connected between the first circuit board and the corresponding first devices in a conducting mode. The circuit board assembly reduces impedance discontinuity when signals are transmitted in the circuit board assembly for multiple times, and reduces machining times of the circuit board assembly.

Description

Circuit board assembly, tool and electronic equipment
Technical Field
The application relates to the technical field of electronic equipment, in particular to a circuit board assembly, a tool and electronic equipment.
Background
Electronic devices such as mobile phones, smart watches, and notebook computers are becoming one of the necessities of modern life.
Taking a mobile phone as an example, as the functions to be realized by the electronic device are more and more, electronic elements in the electronic device are more and more, so that the occupied space of a circuit board carrying the electronic elements in the electronic device is larger and more. At present, in the related art, a stacking manner of at least two circuit boards is adopted, more electronic components are intensively arranged, and a circuit board assembly is formed, so that the occupied space of the circuit board assembly in the electronic equipment is reduced.
However, when a plurality of circuit boards are included in the circuit board assembly, the signal needs to pass through a plurality of transmission cycles when transmitted in the circuit board assembly, which causes discontinuous impedance of the signal on the transmission path, thereby causing signal loss.
Disclosure of Invention
The application provides a circuit board assembly, frock and electronic equipment, impedance discontinuity when not only having reduced the signal in circuit board assembly multiple transmission has reduced the processing number of times of circuit board assembly moreover.
The first aspect of the embodiment of the application provides a circuit board assembly, which comprises a first circuit board, a supporting assembly and a first electronic assembly, wherein the first electronic assembly comprises at least two first devices communicated with the first circuit board, and all the first devices are sequentially overlapped on the same side of the first circuit board along the thickness direction of the first circuit board;
The support assembly comprises a plurality of support pieces, wherein at least two support pieces form a first support unit, and the support pieces in the first support unit are correspondingly arranged with the first devices; the supporting pieces corresponding to different first devices are staggered with each other in the plate surface direction of the first circuit board, and an avoidance area is formed towards the first device of the first circuit board in at least two first devices; a portion of the support member passes through the relief area and is conductively connected between the first circuit board and the corresponding first device.
According to the embodiment of the application, through the arrangement of the first circuit board, the supporting component and the first electronic component in the circuit board assembly, as each first device in the first electronic component is sequentially overlapped on the same side of the first circuit board along the thickness direction of the first circuit board, the circuit board assembly with the first electronic component and the first circuit board in the stacked structure is convenient, and the structural size of the circuit board assembly can be reduced when the electronic components on the circuit board assembly are increased compared with the non-stacked arrangement of each circuit board in the existing electronic equipment.
On the basis, the first supporting units are arranged through the supporting pieces in the supporting assembly, and as the supporting pieces in the first supporting units correspond to the first devices, the supporting pieces corresponding to different first devices are staggered with each other in the board surface direction of the first circuit board, so that the corresponding first devices are conducted and connected with the first circuit board through the supporting pieces; and because the first device facing the first circuit board in at least two first devices forms an avoidance area, the supporting piece passes through the avoidance area and is connected between the first circuit board and the corresponding first device in a conducting way, the supporting piece in the first supporting unit can pass through the corresponding avoidance area to directly conduct and connect the first circuit board with the corresponding first device, and therefore, when signals are transmitted between the first circuit board and the corresponding first device, the turnover of the first electronic element facing one side of the first circuit board in the first electronic component and the supporting piece corresponding to the first electronic element is not needed, and therefore, the phenomenon of discontinuous impedance of the signals in the transmission process is reduced, and the loss of the signals in the transmission process is reduced. Because the supporting piece is arranged corresponding to the first devices, after the electronic components are welded on the first devices, the supporting piece can be connected to the first circuit board through one-time welding, so that the processing times (namely the welding times) of the circuit board assembly are reduced, the damage risk to the electronic components on the circuit board assembly due to excessive welding times is reduced, and meanwhile, the processing technology of the circuit board assembly is simplified.
In an alternative embodiment, the support has a first end portion that is conductive and connected to the first circuit board and a second end portion that is conductive and connected to the corresponding first device to enable a direct conductive connection of the first circuit board to the first device.
In an alternative embodiment, the support is a frame-shaped circuit board, so that the occupation space on the first circuit board can be reduced while the first circuit board is connected with the first device in a direct conduction mode.
In an alternative embodiment, the first supporting unit includes an outer supporting member and an inner supporting member, and the inner supporting member is located in a hollow space surrounded by the outer supporting member, so as to form the first supporting unit, and the structural size of the circuit board assembly can be further reduced while the corresponding first device is directly connected with the first circuit board in a conductive manner.
In an alternative embodiment, the height of the supporting piece corresponding to the avoidance area in the first supporting unit is greater than the height of the supporting piece on the side of the avoidance area, so that the supporting piece corresponding to the avoidance area can pass through the avoidance area, and the mutual interference of electronic elements on the opposite surface of the adjacent first device can be reduced while the corresponding first device and the first circuit board are directly conducted.
In an alternative embodiment, the relief area is located in the middle of the first device, the height of the medial support being greater than the height of the lateral support. Therefore, the phenomenon of discontinuous impedance of the signal in the transmission process is reduced, loss of the signal in the transmission process is reduced, and meanwhile, each supporting piece in the first supporting unit is exposed out of the surface of the circuit board assembly, so that mutual interference of electronic elements on the opposite surfaces of adjacent first devices is reduced.
In an alternative embodiment, in the thickness direction of the first circuit board, an overlapping area is formed between two adjacent first devices, and the overlapping area is enclosed on the periphery of the avoidance area, so that after the support piece is arranged in the avoidance area in a penetrating manner, the support piece can be connected with the corresponding first devices in a conducting manner with the first circuit board.
In an alternative embodiment, the avoidance area is an avoidance hole, and the shape of the avoidance hole is matched with the shape of the outer edge of the penetrating supporting member, so that the influence of the opening of the avoidance area on the surface of the first device or the arrangement of the electronic element can be reduced while the supporting member in the first supporting unit penetrates through the avoidance area.
In an alternative embodiment, the first circuit board has at least one conductive hole, and the end of the support member in the first support unit is located in the conductive hole and is in communication with the first circuit board. The end part of the support piece is arranged in the conductive hole, so that the diversity of connection of the support piece and the first circuit board can be enhanced on the basis that the connection of the first device and the first circuit board is not affected, and the position of the support piece on the first circuit board can be positioned through the conductive hole.
In an alternative embodiment, the first device is a circuit board interconnected with the first circuit board, so that when the circuit board in the first electronic assembly is conducted with the first circuit board, signal transmission between the first circuit board and the circuit board interconnected in the first electronic assembly is realized, more electronic components can be arranged in a concentrated manner, and the density of the electronic components on the circuit board assembly is enhanced.
In an alternative embodiment, the first device includes a second circuit board and a third circuit board, the second circuit board being located between the first circuit board and the third circuit board;
the first supporting unit comprises a first supporting piece and a second supporting piece nested in the first supporting piece, and the first supporting piece is connected to the first circuit board and the second circuit board in a conducting manner;
the second supporting piece passes through the avoidance area on the second circuit board and is connected between the first circuit board and the third circuit board in a conducting way.
Therefore, the second circuit board is connected with the first circuit board in a conducting manner through the first supporting piece, the interconnection of the second circuit board and the first circuit board is realized, the third circuit board is connected with the first circuit board in a direct conducting manner through the second supporting piece, the interconnection of the third circuit board and the first circuit board is realized, the phenomenon that impedance discontinuity occurs in the signal transmission process between the first circuit board and the third circuit board is reduced, and further the loss of the signal in the transmission process is reduced.
In an alternative embodiment, the height of the second supporting member is greater than the sum of the height of the first supporting member and the thickness of the second circuit board, so that the second supporting member can pass through the avoidance area on the second circuit board, and the second circuit board and the first circuit board can be interconnected, and meanwhile, the arrangement of electronic components on the opposite sides of the second circuit board and the third circuit board can be facilitated, and the density of the electronic components on the circuit board assembly is enhanced.
In an alternative embodiment, the first circuit board is an application processor board, and the first device is a radio frequency board, so as to realize signal transmission between the application processor board and the radio frequency board, and further reduce loss of signals in the transmission process.
In an alternative embodiment, the circuit board assembly further includes a second electronic component, the second electronic component being located on a side of the first circuit board opposite the first electronic component, the second electronic component including at least one second device, each second device being in one-to-one correspondence with and electrically conductive to at least a portion of the first devices in the first electronic component.
Through the arrangement of the second electronic components, each second device in the second electronic components corresponds to and is conducted with at least part of the first devices in the first electronic components one by one, so that the interconnection density between the second devices and the first devices and between the second devices and the first circuit board can be further enhanced while signal transmission between the second devices and the first circuit board is met.
In an alternative embodiment, the at least one support forms a second support unit, which is located laterally of the first support unit, the support in the second support unit being arranged in correspondence with the second component and being connected in conduction between the second component and the corresponding first component.
Through the setting of second supporting element like this, because the second supporting element is located first supporting element side, and the support piece in the second supporting element corresponds the setting with the second device, and connect in conduction between second device and corresponding first device, so that on the basis that does not influence first device and first circuit board interconnection, can utilize the edge position of first device, directly switch on first device and second device through the support piece in the second supporting element, with the discontinuous phenomenon of impedance that appears in the transmission process between first electronic component and second device of signal, and then reduce the loss of signal in the transmission process.
In an alternative embodiment, the supporting element in the second supporting unit is located at the side of the first circuit board, or an opening is formed in the first circuit board, and the supporting element in the second supporting unit is arranged in the opening in a penetrating manner, so that the flexibility of setting the supporting element in the second supporting unit can be enhanced while the corresponding second device is directly conducted with the first device to be conducted through the supporting element in the second supporting unit.
In an alternative embodiment, the circuit board assembly further comprises a fixing member located at an intersection of the first circuit board and the support member in the second support unit, so as to fix the support member in the second support unit by the fixing member.
In an alternative embodiment, the second device is a circuit board, so that signals can be transmitted between the first circuit board and the circuit board interconnected in the first electronic component while the circuit board in the first electronic component is conducted with the first circuit board, and more electronic components can be intensively arranged, so that the density of the electronic components on the circuit board component is enhanced.
The second aspect of the embodiment of the application provides a tool, which is applied to the circuit board assembly of any one of the above, and comprises a shell and a pressing assembly, wherein the shell comprises a shell body and a cover plate, the cover plate is covered on the shell body and forms a cavity with the shell body, and the circuit board assembly is positioned in the cavity; the pressing component is positioned in the cavity and is pressed on each first device of the first electronic component in the circuit board component.
According to the embodiment of the application, the pressing assembly is arranged in the tool, so that the pressing assembly presses each first device simultaneously, the risk of warping after welding the first devices with the supporting piece is reduced or even avoided, the connection quality of the first devices and the supporting piece is enhanced, and the pressing process of the tool to the circuit board assembly is simplified.
In an alternative embodiment, the pressing component is pressed on each first device at a position opposite to the supporting piece in the circuit board component, so that the risk of tilting of the first device is reduced or even avoided, a certain pressure is ensured on the bonding pad of the pressed supporting piece, and the connection quality of the first device and the supporting piece is enhanced.
In an alternative embodiment, the pressing assembly includes a pressing block and a plurality of pressing parts, the pressing block is located at one side of the first electronic component, which faces away from the first circuit board, the cover plate is configured to be pressed on the pressing block, and the plurality of pressing parts are arranged at intervals at one side of the pressing block, which faces towards the first electronic component, and are pressed at opposite positions of the first devices and the supporting piece.
Through the setting of a plurality of clamping portions in the clamping assembly like this, owing to the apron is configured to press and establishes on the briquetting, a plurality of clamping portions set up in the one side interval of briquetting towards first electronic component, under the effect of apron like this, the briquetting can compress tightly the clamping portion on corresponding first device and the support piece that this first device corresponds to reduce and avoid the risk that the perk takes place for first device even, ensure to have certain pressure on first device and the support piece that the pressure established, thereby obtain better connection effect between first device and support piece.
In an alternative embodiment, the height of the pressing part located in the middle of the pressing block is smaller than the height of the pressing part located in the end of the pressing block, so that the pressing assembly can be pressed on each first device through a plurality of pressing parts under the action of the self-gravity of the cover plate and the pressing assembly.
In an alternative embodiment, the pressing portion at the end of the pressing block has an extension portion extending toward the middle of the pressing block to be pressed against the first device at a side toward the first circuit board at a position opposite to the support.
Therefore, when the widths of two adjacent first devices are the same, the extension parts of the pressing parts can be pressed on the first devices facing one side of the first circuit board, so that the pressing effect of the pressing assembly on each first device is realized.
In an alternative embodiment, the cover plate comprises a cover plate body and at least one pressing piece, wherein the pressing piece is positioned on one side of the cover plate body facing the pressing block and is pressed on the pressing block.
The pressing part is pressed on the pressing block through the pressing piece, and then the pressing part is pressed on each first device through the pressing block.
In an alternative embodiment, the compression portion is a compression post, or,
the compressing part is a magnetic part, the compressing part is a magnetic part which is magnetically repulsive to the magnetic part, and the compressing part is arranged opposite to at least part of the compressing part.
Therefore, when the pressing part is a pressing column, the pressing part can press on each first device and the corresponding supporting piece by means of gravity. When the compressing part is a magnetic part, under the repulsive force of the compressing part, compared with the compressing part which only depends on the self gravity of the compressing component, the compressing part can apply larger pressure on the first device and the supporting part which are pressed, so that the connection quality of the first device and the supporting part is enhanced.
In an alternative embodiment, the housing body includes a bottom shell disposed opposite to the cover plate, and the bottom shell is a magnetic plate magnetically attracted to the magnetic portion. Under the suction effect of the bottom shell, the pressure applied by the pressing part on the pressed first device and the supporting piece can be further increased, so that the connection quality of the first device and the supporting piece is further enhanced.
In an alternative embodiment, the tool further comprises an elastic component, wherein the elastic component is located at the connection part of the pressing block and the pressing part, so that the pressure on the first device and the supporting piece is increased through the elasticity generated by the elastic component, and the pressing part can apply pressure in a more flexible and various mode.
In an alternative embodiment, the elastic component comprises a guide piece, a limiting piece and an elastic piece, wherein a chute is formed on one side of the pressing block facing the pressing part, and the limiting piece is positioned in the chute;
One end of the guide piece is connected with the pressing part, and the other end of the guide piece penetrates through the limiting piece and is positioned in the chute; the elastic piece is sleeved on the guide piece and is abutted between the pressing block and the pressing part.
When the pressing component is pressed on each first device through the pressing part, the pressing block moves towards one side of the first device under the pressing of the cover plate, so that the elastic piece is compressed, the guide piece moves towards one side of the cover plate along the sliding groove, the pressing piece presses the first device under the action of the rebound force of the elastic piece, and the pressing force of the pressing part on the pressed first device and the supporting piece is increased.
In an alternative embodiment, the shell body further comprises a side plate, and the side plate is arranged on the bottom shell in a surrounding manner so as to form the shell body with the bottom shell; the cover plate cover is arranged on the side plate and is detachably connected with the side plate, so that the cover plate can be opened, and the circuit board assembly is convenient to set.
In an alternative embodiment, the tool further comprises a positioning assembly, the positioning assembly is located in the cavity, the positioning assembly comprises at least one of a first positioning part and a second positioning part, the first positioning part is located at the side of the circuit board assembly, or the first positioning part is arranged in the circuit board assembly and the pressing assembly in a penetrating manner; the second positioning part is positioned at one side of the first positioning part, which is away from the circuit board assembly, so as to connect the cover plate and the bottom shell of the shell body.
Therefore, the first positioning part can be used for positioning the position of the circuit board assembly in the tool and the position between the first device and the first circuit board in the circuit board assembly, so that the connection quality of the first device and the first circuit board is ensured. Through the setting of second location portion, can fix a position the apron for the position of drain pan to guarantee the effect is established to the lid of apron on the casing body and to compressing tightly the effect is established to the pressure of subassembly.
A third aspect of the embodiments provides an electronic device comprising a housing assembly and a circuit board assembly of any of the above, the circuit board assembly being located within the housing assembly.
According to the embodiment of the application, through the arrangement of the circuit board assembly in the electronic equipment, the electronic equipment is controlled through the circuit board assembly, and meanwhile, due to the fact that any circuit board assembly is adopted in the circuit board assembly, not only can the loss of signals in the transmission process be reduced by reducing the discontinuous impedance phenomenon of the signals in the transmission process, but also the processing times of the circuit board assembly can be reduced.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
Fig. 2 is a split schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a circuit board assembly according to the related art;
FIG. 4 is a schematic diagram of still another circuit board assembly provided in the related art;
FIG. 5 is a schematic diagram of signal transmission in a circuit board provided in the related art;
FIG. 6 is a schematic diagram of still another circuit board assembly provided in the related art;
fig. 7 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure;
fig. 8 is a top view of a first supporting unit provided in an embodiment of the present application on a first circuit board;
fig. 9 is a schematic structural view of an outer support member in the first support unit according to the embodiment of the present application;
fig. 10 is a schematic structural view of an inner side support member in a first support unit according to an embodiment of the present disclosure;
FIG. 11 is a top view of an inner first device in a first electronic assembly provided in an embodiment of the present application;
FIG. 12 is a top view of an outer first device in a first electronic assembly provided in an embodiment of the present application;
fig. 13 is a schematic structural diagram of another circuit board assembly according to an embodiment of the present disclosure;
fig. 14 is a schematic structural view of still another circuit board assembly according to an embodiment of the present disclosure;
FIG. 15 is an enlarged schematic view of portion A of FIG. 14;
FIG. 16 is an enlarged schematic view of portion B of FIG. 14;
FIG. 17 is a schematic view of the assembly of the solder bumps and support member of FIG. 14 within a first circuit board;
fig. 18 is a schematic structural view of still another circuit board assembly according to an embodiment of the present disclosure;
fig. 19 is a schematic structural view of still another circuit board assembly according to an embodiment of the present disclosure;
fig. 20 is an assembly schematic diagram of a tooling provided in an embodiment of the present application on the circuit board assembly in fig. 7;
FIG. 21 is a schematic view of an assembly of the compression assembly of FIG. 20 on the circuit board assembly of FIG. 7;
FIG. 22 is a schematic view of an assembly of the compression assembly of FIG. 20 on the circuit board assembly of FIG. 13;
FIG. 23 is a schematic view of the assembly of the hold down assembly on the circuit board assembly of FIG. 19;
FIG. 24 is a schematic view of an alternative assembly of the compression assembly of FIG. 20 onto the circuit board assembly of FIG. 7;
FIG. 25 is a schematic view of the spring assembly of FIG. 24 in an initial configuration;
fig. 26 is a schematic view of the spring assembly of fig. 24 in a compressed state.
Reference numerals illustrate:
100-an electronic device; 1-a display screen; a 2-housing assembly; 21-a middle frame; 211-frame; 212-middle plate; 22-a rear cover; 3-a printed circuit board; 4-cell;
A 5-circuit board assembly; 51-a first circuit board; 511-conductive holes; 5111-a hole is punched; 5112-a conductive member; 513-a first cloth section; 52-a first support unit; 521-supports; 522-pads; 523-a first support; 524-a second support; 525-frame plate; 5251-upper frame plate; 5252-lower frame plate;
53-a first device; 53 a-a first electrical connection; 53 b-a second cloth area; 531-a second circuit board; 5311 an avoidance region; 5312-a lower layer second circuit board; 5313 an upper layer second circuit board; 532—a third circuit board; 533—a wiring board; 5331-a via; 5332 a transmission line; 534-an electronic component; 54-a second device; 541-a fourth circuit board; 542-a fifth circuit board;
55-a second support unit; 551-third support; 552-fourth support; 56-fixing piece; 57-welding blocks; 58-solder balls;
200-tooling; 210-a housing; 2110-a housing body; 2111—bottom case; 2112-side panels; 2113-supporting portion; 2120-cover plate; 2121-cover plate body; 2122-a compression member; 2130-cavity;
220-a hold-down assembly; 221-briquetting; 2211-chute; 222-a pressing part; 2221-extension;
230-an elastic component; 231-guides; 232-an elastic member; 233-a limiting piece;
240-a first positioning portion; 250-second positioning portion.
Detailed Description
The terminology used in the description section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.
The impedance matching (impedance matching) is a part of microwave electronics and is mainly used on a transmission line, so that the aim that all high-frequency microwave signals can be transmitted to a load point is fulfilled, and the signals are hardly reflected back to a source point, thereby playing roles of ensuring normal operation of electronic equipment, improving energy benefit, avoiding signal distortion, enhancing signal to noise ratio and the like. In general, impedance matching is two, one is by varying the impedance, typically for lumped parameter circuits, and the other is by adjusting the wavelength of the transmission line, typically for transmission lines.
Impedance: refers to the input impedance at the beginning of the transmission line.
Instantaneous impedance: refers to the timely impedance encountered by the signal at any time.
Characteristic impedance: if the transmission line has a constant instantaneous impedance, this is referred to as the characteristic impedance of the transmission line. The characteristic impedance describes the instantaneous impedance that a signal experiences as it propagates along a transmission line, which is a major factor affecting the integrity of the signal in the transmission line circuit. The characteristic impedance is generally referred to as the transmission line impedance unless otherwise specified. Factors influencing the characteristic impedance are: dielectric constant, dielectric thickness, line width, copper foil thickness.
Embodiments of the present application provide an electronic device, which may include, but is not limited to, an electronic device such as a mobile phone, a tablet computer (i.e., pad), a Virtual Reality (VR) device, a notebook computer, a personal computer (personal computer, PC), an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a handheld computer, a smart wearable device, a Point of Sales (POS), and the like.
The structure of the electronic device 100 according to the embodiment of the present application will be further described below by taking a mobile phone as an example.
Fig. 1 is a schematic perspective view of an electronic device; fig. 2 is an exploded view of an electronic device. Referring to fig. 1 and 2, an electronic device 100 provided in an embodiment of the present application may include a housing assembly 2, where the housing assembly 2 includes a middle frame 21 and a rear cover 22, and the rear cover 22 is connected to one side of the middle frame 21, and forms the housing assembly 2 of the electronic device 100 with the middle frame 21, to provide a structural frame for the electronic device 100.
Referring to fig. 2 in combination with fig. 1, in some embodiments, the middle frame 21 may include a middle plate 212 and a side frame 211 connected to each other, where the side frame 211 is disposed around a peripheral edge of the middle plate 212 and forms the middle frame 21 together with the middle plate 212. The frame 211 is a square annular structure formed by connecting a plurality of side frames 211 end to end. The middle frame 21 may be a metal middle frame 21, or the middle frame 21 may be an integral or split type housing structure made of metal or plastic, etc.
Referring to fig. 1 and 2, in some embodiments, when the electronic device 100 has a display function, the electronic device 100 further includes a display screen 1, where the display screen 1 is mounted on a side of the frame 211 opposite to the rear cover 22, and encloses a housing space (not labeled in the drawings) together with the middle frame 21 and the rear cover 22, and the housing space may be provided with the printed circuit board 3 of the electronic device 100. In addition, the accommodating space may be further used for accommodating other components of the electronic device 100, such as the battery 4, the speaker, the microphone, the earphone, or the camera module. The side of the display screen 1 forms the front of the electronic device 100, and the side of the rear cover 22 forms the back of the electronic device 100.
With continued reference to fig. 2, the printed circuit board 3 may be understood as the main board in the handset and may be disposed on the side of the midplane 212 facing the back cover 22 along with the battery 4. The motherboard generally includes a circuit board (not shown) and electronic components (not shown) carried on the circuit board, which may include, but are not limited to, a system on a chip (SoC), an antenna module, a bluetooth module, a wireless communication module (such as a WIFI module), a positioning module, a Radio Frequency (RF) module, a radio frequency power amplifier (radio frequency poZer amplifier, RFPA), a storage module (such as a Double Data Rate (DDR) memory), a power management module, a charging module, and a screen display and operation module. The display screen 1 is electrically connected with a screen display and operation module on the printed circuit board 3, so that the display screen 1 can realize display or operation functions.
The SoC may include one or more processing units, for example: the SoC may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processingunit, GPU), an image signal processor (image signal processor, ISP), a controller, a video codec, a digital signal processor (digital signal processor, DSP), a baseband processor, and/or a neural-Network Processor (NPU), etc. Wherein the different processing units may be separate devices or may be integrated in one or more units.
The electronic device 100 may further include structural members such as a battery 4, a speaker, a microphone, a receiver, a camera module, a near field communication module (Near Field Communication, NFC), and a compass, where the battery 4, the speaker, the microphone, the receiver, or the camera module may be accommodated in the accommodating space. The arrangement position of the structural members such as the battery 4, the speaker, the microphone, the earpiece, or the camera module in the electronic device 100 such as the mobile phone may be referred to as description in the related art, and the structure of the electronic device 100 is not further limited in this embodiment. The structure of the speaker, microphone, earpiece or camera module is not shown.
Taking a mobile phone as an example, as the functions to be implemented by the electronic device 100 are more and more, the electronic components in the electronic device 100 are more and more, so that the occupied space of the printed circuit board 3 carrying the electronic components in the electronic device 100 is larger and larger, and the structural dimensions of the electronic device 100, such as the shell assembly 2, are also larger while the arrangement of other devices in the electronic device 100 is ensured, so that the weight of the electronic device 100 is larger, which is contrary to the development trend of thinning the electronic device 100. Therefore, it is necessary to optimize the structure of the circuit board to reduce the occupied space of the printed circuit board 3.
At present, a plurality of circuit boards are stacked to form the circuit board assembly 5, and more electronic components are arranged on each circuit board of the circuit board assembly 5 in a concentrated manner, compared with the printed circuit board 3, under the condition that the thickness of the electronic device 100 is not changed, the internal space of the electronic device 100 in the thickness direction (i.e. the Z direction in fig. 1) can be fully utilized, and the installation space occupied by the circuit board assembly 5 in the X-Y plane of the electronic device 100 is reduced, so that the structural size of the shell assembly 2 is increased due to the increase of the electronic components is avoided, and the design of the circuit board assembly 5 can conform to the development trend of lightening and thinning of the electronic device 100.
As shown in fig. 1, the X-direction may be regarded as a length direction of the electronic device 100, the Y-direction may be regarded as a width direction of the electronic device 100, and the X-Y plane may be understood as a plane formed by the length direction and the width direction of the electronic device 100, the plane being parallel to the display screen 1.
Fig. 3 is a schematic diagram of a related art circuit board assembly. Referring to fig. 3, a circuit board assembly 5a of a sandwich structure is formed in the related art in such a manner that circuit boards and frame plates 525 are alternately stacked in the thickness direction of the electronic device 100. For example, taking two circuit boards as an example, the first circuit board 51a, the frame board 525 and the second circuit board 531a may be stacked in sequence along the Z direction to form the circuit board assembly 5a, and the circuit board assembly 5a may replace the printed circuit board 3 as described above, and be used as a main board of the electronic device 100, so as to centrally set more electronic components 534a, so that two adjacent circuit boards are conducted through the frame board 525 (i.e., the frame board 525 is sandwiched between the two circuit boards). Because each circuit board in the circuit board assembly 5 is a double-sided welding plate (referred to as double-sided plate for short), when two circuit boards are stacked, a motherboard welded on four sides can be formed, so that the density and strength of the motherboard can be improved in a circuit board stacking manner, and meanwhile, the occupied space of the circuit board assembly 5 in the electronic device 100 can be reduced, so that the internal space (such as the accommodating space) of the electronic device 100 can be fully utilized.
Wherein the first circuit board 51a and the second circuit board 531a are soldered and conducted to opposite sides of the frame plate 525 via solder balls 58. The electronic component 534a is soldered on both opposite sides of the first circuit board 51a, and the electronic component 534a is soldered on a side of the second circuit board 531a facing away from the frame board 525.
Fig. 4 is a schematic structural view illustrating still another circuit board assembly provided in the related art.
Referring to fig. 4, the frame plate 525 may be regarded as a frame-shaped wiring board having pads 522a on both sides and metal vias (such as copper holes, not shown in the drawing) inside, through which the pads 522a on both sides are conducted for transmission of signals within the frame plate 525. The structure of the frame plate 525 may be described with reference to the related art, and will not be further described herein.
With continued reference to fig. 3 and 4, the electronic component 534a is provided on a side (i.e., an inner side) of the second circuit board 531a facing the frame plate 525, forming the circuit board assembly 5a shown in fig. 4. The second circuit board 531a of the circuit board assembly 5a is a Radio Frequency (RF) board, and the first circuit board 51a is an application processor (application processor, AP) board. The radio frequency board may include, but is not limited to, electronics 534a for carrying radio frequency chips, radio frequency power amplifiers, filters, diplexers, low noise amplifiers, radio frequency switches, antenna tuners, and the like. The application processor board may include, but is not limited to, electronics 534a for system-on-chip components, double data rate memory, power management modules, and the like.
As shown in fig. 4, the electronic component 534a is required to be soldered onto the second circuit board 531a by one reflow soldering to form the double-sided soldered second circuit board 531a. Then, the second circuit board 531a to be formed is soldered to the pad 522a on the frame plate 525 through the second reflow soldering to form a soldered assembly (not shown). Finally, the frame plate 525 in the soldering assembly is soldered to the first circuit board 51a through the third reflow soldering. Due to the high process temperature of reflow soldering, during the formation of the circuit board assembly 5a, the electronic component 534a inside the circuit board assembly 5a (such as the electronic component 534a on the inner side of the second circuit board 531 a) needs to undergo a high temperature environment of three reflow soldering, so that there is a risk of high temperature damage to the electronic component 534a inside the circuit board assembly 5 a.
In addition, after the impedance discontinuity and the frequency is slightly high, the interconnection line on the wiring board in the first circuit board 51a or the second circuit board 531a cannot be considered as a pure resistance any more and should be considered as a transmission line. Transmission line (or long line) theory is specifically referred to in microwave theory and is not further described herein. During the transmission of the signal, if the characteristic impedance of the transmission path changes (such as the impedance of the transmission line changes), the signal will reflect at the junction with discontinuous impedance, and the reflected light and heavy will depend on the impedance change.
It should be noted here that there is not necessarily a severe reflection of the different impedances, and in fact it is the smart design of the impedance in the impedance transforming coupling device that has completed transforming the transmission line impedance without causing significant reflection. It is of course noted that if the characteristic impedance is discontinuous, i.e. there is a break in the impedance curve. In this case, a relatively severe reflection occurs, and the reflection coefficient can be calculated from the impedance across the break point.
Fig. 5 illustrates a signal transmission diagram in a wiring board provided in the related art.
Referring to fig. 5, in order to achieve transmission between the transmission lines 5332 of different layers in the circuit board 533 of the first circuit board 51a and the second circuit board 531a, vias 5331 (i.e., board through holes) are provided on the circuit board 533 at different layers, so that the transmission lines 5332 of different layers are connected through the vias 5331 for signal transmission. Reference may be made specifically to the structure of the circuit board 533 and the description of signal transmission in the related art, which will not be further described herein. The via 5331 is one of important factors that cause the characteristic impedance of the signal to be discontinuous on the transmission path.
Fig. 6 is a schematic structural view of still another circuit board assembly in the related art.
Referring to fig. 6, when more frame plates 525 and radio frequency plates need to be raised in the circuit board assembly 5a, the circuit board assembly 5a includes a plurality of frame plates 525 and second circuit plates 531a (e.g., radio frequency plates) alternately stacked in the Z direction described above. The circuit board assembly 5a illustrated in fig. 6 includes two frame plates 525 and two second circuit boards 531a. For convenience of description, two second circuit boards 531a are defined as an upper layer second circuit board 5313 and a lower layer second circuit board 5312, and two frame boards 525 are defined as an upper layer frame board 5251 and a lower layer frame board 5252. The lower layer second circuit board 5312 is located between the upper layer second circuit board 5313 and the first circuit board 51 a. The upper frame plate 5251 is sandwiched between the upper second circuit board 5313 and the lower second circuit board 5312, and the lower frame plate 5252 is sandwiched between the lower second circuit board 5312 and the first circuit board 51 a.
Referring to fig. 6, the circuit board assembly may be soldered using the following process flow:
firstly, the upper layer second circuit board 5313 is welded with the upper layer frame board 5251 by reflow soldering after the electronic component 534a is welded on both sides by reflow soldering and the like; then, the lower second circuit board 5312 is soldered to the upper frame plate 5251 and the lower frame plate 5252 by reflow soldering or the like after the electronic components 534a are soldered to each other on both sides; finally, after the electronic component 534a is soldered on both sides of the first circuit board 51 by reflow soldering or the like, the first circuit board is soldered to the lower frame plate 5252 by reflow soldering again to form the circuit board assembly 5a.
In addition to the double-sided solder electronic components 534a on the first circuit board 51a, the upper layer second circuit board 5313, and the lower layer second circuit board 5312, four reflow soldering steps are required in forming the circuit board assembly 5 a: namely, the upper second circuit board 5313 is welded to the upper frame plate 5251, the lower second circuit board 5312 is welded to the lower frame plate 5252, and the first circuit board 51a is welded to the lower frame plate 5252.
When a signal is transmitted in the circuit board assembly 5a, the signal needs to pass through multiple transmission cycles, so that impedance of the signal on a transmission path is discontinuous, and signal loss is caused. For example, when the signal on the first circuit board 51a is transmitted to the upper layer second circuit board 5313, the signal needs to pass through the following paths:
the first circuit board 51 a-a solder joint (not labeled in the figure) between the first circuit board 51a and the lower frame plate 5252-a solder joint between the lower frame plate 5252 and the lower second circuit plate 5312-a solder joint between the lower second circuit plate 5312 and the upper frame plate 5251-a solder joint between the upper frame plate 5251 and the upper second circuit plate 5313-the upper second circuit plate 5313.
The presence of the vias 5331 on the first circuit board 51a and the second circuit board 531a and the metal vias on the frame plate 525 may cause the signal on the first circuit board 51a to be transmitted to the upper layer second circuit board 5313, which may cause impedance discontinuity during multiple transmissions, especially the situation that the impedance discontinuity at the vias 5331 and the metal vias is particularly prominent, thereby causing loss of the signal during transmission.
Therefore, the embodiment of the application provides the circuit board assembly, which not only reduces the impedance discontinuity when signals are transmitted in the circuit board assembly for multiple times, but also reduces the processing times of the circuit board assembly.
Fig. 7 illustrates a schematic structure of a circuit board assembly.
Referring to fig. 7, the circuit board assembly 5 may include a first circuit board 51 and a first electronic component, where the first electronic component includes at least two first devices 53 that are electrically connected to the first circuit board 51, and along the thickness direction of the first circuit board 51, each first device 53 is sequentially stacked on the same side of the first circuit board 51, so that the first electronic component 534 can form a stacked structure with the first circuit board 51, compared with the printed circuit board 3 in the existing electronic device 100, the circuit board assembly 5 can be provided with more electronic components 534 in a concentrated manner, so that the density of the circuit board assembly 5 is improved, and meanwhile, the transverse dimension of the circuit board assembly 5 can be reduced, so that the internal space of the electronic device 100 in the thickness direction can be fully utilized, and the installation space occupied by the circuit board assembly 5 in the X-Y plane of the electronic device 100 is reduced, so as to avoid the structural dimension of the housing assembly 2 from being enlarged due to the occupied space of the printed circuit board 3 in the electronic device 100, so that the design of the circuit board assembly 5 can meet the requirements of a light and thin electronic device 100 and a longer than the electronic device 100, and further requirements of the electronic device can be met, such as a battery device with a longer running requirement of 4.
The lateral dimensions may include dimensions in the longitudinal direction and the width direction of the electronic device. Taking the circuit board assembly 5 as an example, the lateral dimensions of the circuit board assembly 5 may include the length and width of the circuit board assembly 5. The length direction of the circuit board assembly 5 is the same as the length direction of the electronic device 100, and the width direction of the circuit board assembly 5 is the same as the width direction of the electronic device 100.
With continued reference to fig. 7, the circuit board assembly 5 further includes a support assembly including a plurality of support members 521, at least two support members 521 forming a first support unit 52, the support members 521 in the first support unit 52 being disposed corresponding to the first devices 53, the support members 521 corresponding to different first devices 53 being staggered from each other in a board surface direction of the first circuit board 51 so as to avoid interference between the support members 521 corresponding to different first devices 53, so that the strength of the circuit board assembly 5 can be enhanced due to the characteristic that the support members 521 are less deformable than the first circuit board 51 and the first devices 53 while the corresponding first devices 53 are conducted with the first circuit board 51 through the support members 521.
As shown in fig. 7, the first device 53 (inner first device) of the at least two first devices 53 facing the first circuit board 5 forms a relief region 5311. Wherein the relief areas 5311 are in one-to-one correspondence with the partial supports 521 in the first support unit 52. A portion of the supporting member 521 passes through the relief area 5311 and is conductively connected between the first circuit board 51 and the corresponding first device 53. Where the first device 53 has a plurality of relief areas 5311, the support 521 may pass through the respective corresponding relief areas 5311 to electrically connect the first circuit board 51 to the corresponding first device 53. Thus, when each first device 53 is stacked on the first circuit board 51, the portion of the supporting member 521 may pass through the avoiding area 5311 to directly connect the first circuit board 51 with the corresponding first device 53 in a conductive manner.
It should be noted that, the first device 53 located on the surface layer of the side of the first electronic component facing away from the first circuit board 51 may be understood as an outer first device (not labeled in the drawing), and the first device 53 located before the outer first device in the first electronic component may be understood as an inner first device (not labeled in the drawing).
At this time, when the signal is transmitted between the first circuit board 51 and the outer first device, the turnover of the inner first device and the supporting member 521 corresponding to the inner first device is not required, so that the signal transmission path is shortened, the phenomenon of discontinuous impedance of the signal in the transmission process is reduced, and the loss of the signal in the transmission process is further reduced.
It should be noted that, referring to fig. 7, since the supporting members 521 in the first supporting unit 52 are disposed corresponding to the first devices 53, each of the first devices 53 is corresponding to one supporting member 521, and the inner first device may be directly connected to the first circuit board 51 through its corresponding supporting member 521. In this way, each first device 53 can be ensured to be directly conducted with the first circuit board 51, the phenomenon of discontinuous impedance of signals in the transmission process is reduced, and the loss of the signals in the transmission process is reduced.
In addition, since each first device 53 corresponds to one supporting member 521, and each first device 53 is electrically connected to the first circuit board 51 through the corresponding supporting member 521, after each first device 53 is soldered to the corresponding supporting member 521 by reflow soldering, each first device 53 may be connected to the first circuit board 51 through one soldering, so that the number of times (such as soldering times) of processing the circuit board assembly 5 is reduced, the risk of damaging the electronic component 534 on the circuit board inside the supporting member 521 due to excessive soldering times can be reduced, and the processing process of the circuit board assembly 5 is simplified.
Taking the example that the first electronic component includes two first devices 53, compared with the circuit board assembly 5 in fig. 6, in addition to the soldering of the two first devices 53 and the electronic component 534 on the first circuit board 51, three reflow soldering processes are required in the process of forming the circuit board assembly 5: that is, the two first devices 53 are soldered (two times of soldering) to the supporting pieces 521 in the first supporting units 52 corresponding to themselves, respectively, and the two first devices 53 to which the supporting pieces 521 are soldered to the first circuit board 51 by the same time of reflow soldering. Therefore, the number of times of processing the circuit board assembly 5 can be reduced by the nested arrangement of the frame members of the frame 21 in the first supporting unit 52 and the opening of the avoiding area 5311 on the inner first device.
Referring to fig. 7, the support 521 has a first end portion that is conductive and connected to the first circuit board 51 and a second end portion that is conductive and connected to the corresponding first device 53 such that the support 521 is conductive and connected between the corresponding first device 53 and the first circuit board 51 to achieve a direct conductive connection of the first circuit board 51 and the first device 53.
With continued reference to fig. 7, the first device 53 may be a circuit board that is interconnected with the first circuit board 51. So that the electronic components 534 can be soldered on both sides of the first device 53 while the circuit board in the first electronic component is conducted with the first circuit board 51 to realize signal transmission between the first circuit board 51 and the circuit board interconnected in the first electronic component, so that the first device 53 can form a printed circuit board, and thus, more electronic components 534 can be collectively arranged, so that the circuit board assembly 5 is a multi-circuit board structure, and the density of the electronic components 534 on the circuit board assembly 5 can be enhanced while the electrical signal communication between the multi-circuit boards is realized, so that the interconnection density of the first circuit board 51 and other devices such as the first device 53 is higher, and the manufacturing cost of the circuit board assembly 5 and the electronic device 100 can be reduced without using a connector for connection.
By way of example, the first device 53 may include, but is not limited to, a radio frequency board (i.e., RF board) and the first circuit board 51 may include, but is not limited to, an application processor board (i.e., AP board). The electronic components 534 carried on the rf board and the application processor board may be referred to in the above description, and will not be further described herein. When the first device 53 is a circuit board, in some embodiments, the first device 53 may also be an application processor board, and the first circuit board 51 may also be a radio frequency board. In this way, by the nested arrangement of the supporting pieces 521, the board edge structure of the application processor board is fully utilized, so that at least two radio frequency boards and the application processor board are conducted and interconnected, the communication function of the electronic device 100 is ensured, and meanwhile, the phenomenon of discontinuous impedance of signals in the transmission process between the radio frequency boards and the processor board is reduced, the loss of the signals in the transmission process is further reduced, and the processing times of the circuit board assembly 5 are also reduced.
Alternatively, in some embodiments, the first device 53 may also be a single electronic component 534 (such as a radio frequency chip, a radio frequency power amplifier, etc.) in a radio frequency board. Alternatively, the first device 53 may be other electronic components 534 in the electronic device 100, such as a connector, a charging module, a WIFI module, or a compass. Here, the kinds of the first circuit board 51 and the first device 53 are not further limited.
Taking the first circuit board 51 as an application processor board and the first device 53 as a radio frequency board as an example, the structure of the circuit board assembly 5 will be further described.
Fig. 8 illustrates a top view of the first supporting unit on the first circuit board, fig. 9 illustrates a schematic structural view of the outer supporting member in the first supporting unit, and fig. 10 illustrates a schematic structural view of the inner supporting member in the first supporting unit.
Referring to fig. 8 to 10, the supporting member 521 is a circuit board having a frame shape (not shown) so as to reduce the occupied space on the first circuit board while directly connecting the first circuit board to the first device.
As shown in fig. 8 to 9, the opposite sides of the frame-shaped wiring board may be provided with a plurality of pads 522, and the inside of the frame-shaped wiring board may be provided with a plurality of metal vias (such as copper holes, not shown in the drawings), each of which may conduct one set of pads 522 on the opposite sides so that the first device 53 is soldered to the pads 522 on the support member 521, and after the first device 53 is soldered to the support member 521 and the support member 521 is soldered to the first circuit board 51, the conduction between the first device 53 and the first circuit board 51 can be achieved through the metal vias and the pads 522. The first device 53 may be described with reference to the structure of the frame plate 525 of the related art, which is not further described herein.
Alternatively, in some embodiments, the supporting member 521 may be a frame-shaped structure surrounded by a plurality of supporting protrusions independent from each other, and each supporting protrusion may be regarded as a small frame-shaped wiring board, so as to enable the first device 53 to be electrically connected and interconnected with the first circuit board 51.
The structure of the circuit board assembly 5 of the present application will be further described below by taking a frame circuit board as an example.
With continued reference to fig. 7 to 9, the first support unit 52 includes an outer support (not illustrated in the drawings) and an inner support (not illustrated in the drawings). As shown in fig. 8, the support 521 located at the outermost layer in the first support unit 52 may be understood as an outer support, whereas the remaining supports 521 within the first support unit 52 may be understood as inner supports.
The inner supporting member is located in a hollow space (not shown in the figure) surrounded by the outer supporting member, so that the inner supporting member is nested in the outer supporting member, so that the inner supporting member and the outer supporting member are staggered on the board surface of the first circuit board 51, and when the first supporting unit 52 is formed, compared with the circuit board assembly 5a shown in fig. 6, the transverse dimension of the first supporting unit 52 is still the structural dimension of the outer supporting member, and the longitudinal dimension of the first supporting unit 52 is the height of the highest supporting member 521 in the Z direction, but not the stacking height of each supporting member 521, therefore, by the nested arrangement of the supporting members 521, the board edge structure of the first circuit board 51 can be fully utilized to realize the conduction between the plurality of first devices 53 and the first circuit board 51, and the longitudinal dimension (such as the height in the Z direction) of the circuit board assembly 5 can be reduced while the transverse dimension of the first supporting unit 52 is not influenced, so that the structure of the circuit board assembly 5 is more compact, and the thickness of the electronic device 100 is reduced, and the electronic device 100 is light and thin.
The lateral dimension of the first support unit 52 is the same as the lateral dimension of the circuit board assembly 5, and may include the dimension (i.e., length) of the first support unit 52 in the X direction and the dimension (i.e., width) of the first support unit 52 in the Y direction.
The hollow space of the outer support member is matched with the structure of the inner support member, so that the inner support member is located in the hollow space of the outer support member, and the first support unit 52 in which the support members 521 are nested is formed.
To facilitate the arrangement of the electronic components 534 on the first circuit board 51, as shown in fig. 8, when the inner support is located in the hollow space of the outer support, there is a space between the inner support and the outer support. The region of the first circuit board 51 corresponding to the pitch may form a first cloth region 513 on the first circuit board 51 so that the electronic component 534 facing the first supporting unit 52 may be soldered into the first cloth region 513 when the electronic component 534 is double-sided-soldered by the first circuit board 51 to achieve soldering of the electronic component 534 on the first circuit board 51.
Fig. 11 illustrates a top view of an inner first device in the first electronic assembly. Referring to fig. 11 in combination with fig. 7, to facilitate conduction between the inner first device and the supporting member 521, the board edge of the inner first device is provided with a first electrical connection portion 53a, where the first electrical connection portion 53a is disposed opposite to the pad 522 on the supporting member 521, and the first electrical connection portion 53a may include, but is not limited to, a metal conductive portion such as a pad. The inner first device is electrically connected with the bonding pad 522 on the supporting member 521 through the first electrical connection portion 53a of the board edge, so as to realize physical and electrical communication between the inner first device and the supporting member 521, thereby realizing conduction and interconnection with the first circuit board 51 through the supporting member 521, and simultaneously, the connection between the inner first device and the supporting member 521 and the first circuit board 51 is simpler, and the structural stability is higher.
As shown in fig. 11, on a surface of the inner first device facing the supporting member 521, a region between the first electrical connection portion 53a and the avoiding region 5311 is a second cloth region 53b, so that the electronic component 534 can be arranged in the second cloth region 53b while the penetrating of the supporting member 521 and the welding of the inner first device and the supporting member 521 are not affected, so as to realize the arrangement and the welding of the electronic component 534 on the inner first device.
Fig. 12 is a top view illustrating an outer first device in the first electronic assembly. Referring to fig. 12, the first electric connection portion 53a and the second cloth region 53b are provided on the outer first device as well as the inner first device. The difference between the outer first device and the inner first device is that the avoiding area 5311 is not required to be provided on the outer first device, that is, the surface of the outer first device facing the supporting member 521 may be used as the second cloth area 53b except the position of the first electrical connection portion 53 a.
As shown in fig. 7 in combination with fig. 8, the lateral dimensions of the inner first device in the first electronic assembly may be greater than the lateral dimensions of the outer first device. The lateral dimensions of the first device 53 may be the same as the circuit board assembly 5, and each include a length in the length direction of the electronic apparatus 100 and a width in the width direction of the electronic apparatus 100 (i.e., the width of the first device 53). The lateral dimensions of the inner first device and the lateral dimensions of the outer first device satisfy the following relationship:
A n ＝A w +a formula (I)
Wherein A is n For the lateral dimension of the inner first device, A w A is the lateral dimension of the outside first device>0, and a may be greater than or equal to 0.05mm and less than or equal to 100mm, as examples. That is, the lateral dimensions (e.g., length and width) of the inner first device are the sum of the lateral dimensions of the outer first device and a.
By limiting the lateral dimensions of the inner first device and the outer first device, the edge area of the inner first device is located outside the projection of the outer first device on the inner first device, so that the inner first device can be conducted with the first circuit board 51 through the corresponding supporting piece 521, and meanwhile, the pressing of the inner first device by the tool 200 in the welding process can be facilitated, and the structure of the tool 200 is simplified.
Fig. 13 shows a schematic structural view of another circuit board assembly 5. Referring to fig. 13, in some embodiments, at least one lateral dimension of the medial first device may also be greater than or equal to the lateral dimension of the lateral first device. For example, the width of the outer first device may be equal to the width of the inner first device and the length of the outer first device may be greater than or equal to the length of the inner first device. In the welding process of the circuit board assembly 5, the pressing of the first device on the inner side can be realized by changing the structure of the tooling. The structure of the tooling in this scenario will be further described below in conjunction with a specific structure.
With continued reference to fig. 13, the supporting members 521 in the first supporting unit 52 have different heights, and the height of the supporting member 521 corresponding to the avoidance area 5311 in the first supporting unit 52 is greater than the height of the supporting member 521 located at the side of the avoidance area 5311, so that the supporting member 521 corresponding to the avoidance area 5311 can pass through the avoidance area 5311, and the corresponding first device 53 and the first circuit board 51 are directly conducted with each other, so that the impedance discontinuity phenomenon of signals in the transmission process is reduced, and further, the loss of the signals in the transmission process is reduced.
As shown in fig. 13, in some embodiments, the avoidance region 5311 may be located in the middle of the first device 53 (e.g., the medial first device). Wherein the height of the inner side support is greater than the height of the outer side support. Thus, the inner support member can pass through the avoiding area 5311 in the middle of the first device 53 to conduct the corresponding first device 53 and the first circuit board 51 directly, so that the phenomenon of discontinuous impedance of signals in the transmission process is reduced, the loss of the signals in the transmission process is reduced, and meanwhile, the mutual interference of the electronic components 534 on opposite surfaces of the adjacent first devices 53 can be reduced.
As shown in fig. 13, taking an example in which the first supporting unit 52 includes two supporting pieces 521, the height of the inner supporting piece and the height of the outer supporting piece satisfy the following relationship:
H n ＝H w +D n +h formula (II)
Wherein H is n Height of the inner support, H w Height of the outer support member, D n For the thickness of the inner first device,h>0, and by way of example, h may be greater than or equal to 0.05mm and less than or equal to 500mm.
Alternatively, in some embodiments, the relief area 5311 may also be located at a peripheral edge of the inner first device, at which time the height of the inner support may also be less than the height of the outer support, such that while the inner first device is in communication with the first circuit board 51 via the inner support, the outer support may be threaded through the relief area 5311 to communicate the outer first device with the first circuit board 51.
The structure of the circuit board assembly 5 of the present application will be further described below taking the example that the height of the inner side support is greater than the height of the outer side support.
As shown in fig. 13, in the thickness direction of the first circuit board 51, an overlapping area (not labeled in the drawing) is formed between two adjacent first devices 53, and the overlapping area is enclosed on the periphery of the avoidance area, so that the supporting element can be connected with the corresponding first device in a conductive manner after being inserted into the avoidance area.
Referring to fig. 13 in combination with fig. 11, the avoidance area 5311 is an avoidance hole, and the shape of the avoidance hole is matched with the shape of the outer edge of the penetrating support member 521, so that the influence of the opening of the avoidance area 5311 on the surface of the first device 53 or the arrangement of the electronic component 534 can be reduced while the support member 521 in the first support unit 52 passes through the avoidance area 5311.
As shown in fig. 10, the support 521 may be a closed frame structure. As shown in fig. 10, the frame structure may be a square ring frame structure, and the avoidance holes may be square holes matching the square ring frame. Alternatively, in some embodiments, the frame structure may be other frame structures such as a circular frame structure, and the relief hole may be a circular hole matching the shape of the circular frame.
In order to facilitate threading, the size of the relief hole and the structural size of the support 521 satisfy the following relationship:
C b ＝B k +b formula (III)
Wherein C is b To avoid the transverse dimension (ratio ofSuch as length L of hole 1 Or width W 1 )，B k B for the lateral dimension of the support 521 (e.g. the length or width of the support 521) to be threaded into the relief hole>0, and b may be greater than or equal to 0.05mm and less than or equal to 100mm. As shown in fig. 10 and 11, the support 521 is a square annular frame structure, the avoidance hole is a square hole, and the length L of the avoidance hole is as an example 1 May be the length L of the support 521 (such as the second support 524 in the first support unit 52) 2 And b, avoiding hole W 1 May be the width W of the support 521 2 And b. This can facilitate the penetration of the support 521 into the relief hole.
Fig. 14 illustrates a schematic structural view of yet another circuit board assembly, fig. 15 illustrates an enlarged view of a portion a of fig. 14, and fig. 16 illustrates an enlarged view of a portion B of fig. 14. Referring to fig. 14 to 16, in some embodiments, the first circuit board 51 has at least one conductive hole 511, and an end of the support 521 in the first support unit 52 is located in the conductive hole 511 and is in communication with the first circuit board 51. Wherein, the end of a part of the supporting pieces 521 in the first supporting unit 52 may be located in the conductive hole 511, or the end of each supporting piece 521 in the first supporting unit 52 may be located in the conductive hole 511. Here, the number of the supporting pieces 521 located in the conductive hole 511 is not further limited.
Fig. 14 to 16 illustrate an assembly schematic of the inside support member within the conductive aperture. Through the arrangement that the end of the supporting piece 521 is located in the conductive hole 511, on the basis that the conduction between the first device 53 and the first circuit board 51 through the supporting piece 521 is not affected, the diversity of connection between the supporting piece 521 and the first circuit board 51 can be enhanced, the application situation that the supporting piece 521 penetrates through the first circuit board 51 is met, and the position of the supporting piece 521 on the first circuit board 51 can be located through the conductive hole 511.
Referring to fig. 15, the conductive holes 511 may include a penetration hole 5111 and a conductive member 5112, the penetration hole 5111 being provided on the first circuit board 51, the conductive member 5112 being located on a wall of the penetration hole 5111. Wherein the conductive member 5112 can include, but is not limited to, a pad or a metal coating, etc.
As shown in fig. 15, in some embodiments, an end of the support 521 may penetrate the first circuit board 51. At this time, the penetration holes 5111 may be through holes. The side wall of the through hole 5111 may be provided with a conductive member 5112, and a bonding pad 522 is also disposed on the side wall of the end of the supporting member 521 at a position opposite to the conductive member 5112, and the bonding pad 57 may be disposed in a prefabricated manner by using a bonding pad 57 (such as solder paste) during the bonding process, and the bonding pad 57 may be filled in the gap between the conductive member 5112 and the bonding pad 522 of the supporting member 521, so as to realize the bonding between the end of the supporting member 521 and the first circuit board 51. The sidewall of the through hole 5111 includes a sidewall and a bottom wall of the through hole 5111.
Alternatively, as shown in fig. 16, in some embodiments, the ends of the support 521 may also be semi-buried within the first circuit board 51. At this time, the penetrating hole 5111 may be a blind hole, the side wall and the bottom wall of the penetrating hole 5111 may be provided with the conductive member 5112, and the end side wall and the end face of the supporting member 521 are also provided with the bonding pad 522 (not illustrated in the drawing) at the position opposite to the conductive member 5112. The arrangement of the solder bumps 57 may be referred to as described in relation to when the end of the supporting member 521 may penetrate the first circuit board 51, and is not further limited herein.
It should be noted that, when the supporting member 521 is a closed frame structure, the conductive hole 511 is a closed hole with an end to end shape adapted to the shape of the supporting member 521. For example, when the supporting member 521 is a square annular frame structure, the conductive hole 511 is a square annular hole matching the shape of the square annular frame structure. When the supporting member 521 is a circular frame structure, the conductive hole 511 is a circular hole matching the shape of the circular frame structure.
Fig. 17 is a schematic view illustrating the assembly of the solder bumps and the support member of fig. 14 in the first circuit board. In fig. 17, only a partial structure of the conductive hole 511 in fig. 15 and a top view structure of the support 521 in the conductive hole 511 are illustrated.
Referring to fig. 17, the solder bumps 57 are shaped to match the gap between the through holes 5111 and the support 521. Wherein the shape of the solder blocks 57 may be wedge-shaped so that the solder blocks 57 may be prefabricated in the gap between the through hole 5111 and the frame plate 525, and the end of the supporting member 521 is soldered to the first circuit board 51 at the time of soldering. By way of example, the solder bumps 57 may include, but are not limited to, circular wedge-shaped solder bumps 57a (a wedge shaped in a circular arc on one side toward the support 521), ring wedge-shaped solder bumps 57b (a wedge shaped in a concentric circular arc on opposite sides), and square ring wedge-shaped solder bumps 57c (a square on one side and a wedge shaped in a circular arc on the other side).
It should be noted that the number of the first devices on the inner side depends on the number of the first devices 53 and the arrangement position with respect to the first circuit board 51. When the first devices 53 are stacked on the first circuit board 51, the number of the inner first devices depends on the number of the first devices 53.
For example, as shown in fig. 13, the first electronic component may include two first devices 53, that is, the first devices 53 in the first electronic component include a second circuit board 531 and a third circuit board 532, and the second circuit board 531 is located between the first circuit board 51 and the third circuit board 532, which may be understood as an inner first device. The third circuit board 532 may be understood as an outside first device. The support 521 in the first support unit 52 includes a first support 523 and a second support 524, and the second support 524 is nested within the first support 523 to form a medial support. The first support 523 is an outer support, and the first support 523 is conductively connected between the first circuit board 51 and the second circuit board 531 to interconnect the second circuit board 531 with the first circuit board 51. The second supporting member 524 passes through the avoiding area 5311 on the second circuit board 531 and is connected between the first circuit board 51 and the third circuit board 532 in a conductive manner so as to interconnect the third circuit board 532 and the first circuit board 51, so that the phenomenon of discontinuous impedance of signals in the transmission process of the signals between the first circuit board 51 and the third circuit board 532 is reduced, and further, the loss of the signals in the transmission process is reduced.
Alternatively, in some embodiments, three or more first devices 53 stacked on each other may be further included in the first electronic component. Taking three first devices 53 as an example, the first electronic component includes two inner first devices and one outer first device, the first supporting unit 52 may include three supporting members 521, the two inner first devices are respectively provided with an avoidance area 5311, and the inner first devices close to the first circuit board 51 may be directly connected to the supporting members 521 between the first circuit board 51 in a conductive manner. One of the support members 521 may be provided to pass through the escape area 5311 of the inner first device near the first circuit board 51 to conductively connect the first device 53 with the first circuit board 51. The other support 521 may pass through the relief areas 5311 on the two inner first devices in turn, connecting the outer first devices directly in conductive communication with the first circuit board 51. It should be appreciated that when the first electronic assembly includes a plurality of first devices 53 stacked on each other, the closer to the relief area 5311 on the inner first device on the first circuit board 51, the more. The number of first devices 53 and the number of relief areas 5311 on the inner first device in the first electronic component are not further limited in the embodiments of the present application.
The structure of the circuit board assembly 5 of the present application will be further described below using two first devices 53 as an example. Referring to fig. 13, the height H of the second supporting member 524 n May be greater than the height H of the first support 523 w And a board thickness D of the second circuit board 531 n And so that the second supporting member 524 can pass through the avoiding area 5311 on the second circuit board 531 to interconnect the second circuit board 531 and the first circuit board 51, and at the same time, interference of the electronic components 534 on the opposite sides of the second circuit board 531 and the third circuit board 532 can be avoided, so that the electronic components 534 are arranged on the opposite sides of the second circuit board 531 and the third circuit board 532, and the density of the electronic components 534 on the circuit board assembly 5 is enhanced. The height calculation of the second supporting member 524 may be referred to the above description, and will not be further described herein.
Taking the structure of the circuit board assembly 5 in fig. 13 as an example, a processing process of any one of the above circuit board assemblies 5 will be described. As shown in fig. 13, the processing process of the circuit board assembly 5 includes the steps of:
step one: after the electronic component 534 is soldered on the second circuit board 531, the second circuit board 531 is connected to the first support 523
Welding;
Step two: after the electronic component 534 is soldered on the third circuit board 532, the third circuit board 532 is soldered with the second support 524;
step three: after the electronic component 534 is soldered on the side of the first circuit board 51 facing away from the first supporting unit 52, the electronic component 534 is soldered to the side of the first circuit board 51 facing toward the first supporting unit 52 while both the first supporting member 523 and the second supporting member 524 are soldered to the first circuit board 51 by one-time soldering to form the circuit board assembly 5.
In the first step, before the electronic component 534 is soldered on the second circuit board 531, the electronic component 534 may be first mounted on one side or two opposite sides of the second circuit board 531 by a surface mount technology (Surface Mounted Technology, SMT), and then the mounted electronic component 534 may be soldered on the second circuit board 531 by a soldering process such as reflow soldering. The present application may adopt a reflow soldering method to solder the second circuit board 531 to the first support member 523, and in the soldering process, the melting point temperature of the solder bumps 57 is controlled between 138 ℃ and 280 ℃.
In the second step, the soldering of the electronic component 534 on the third circuit board 532, the soldering of the third circuit board 532 and the second supporting member 524, and the soldering of the electronic component 534 on the first circuit board 51 may refer to the related description in the first step, and further description thereof will be omitted.
It should be noted that, the first circuit board 51, the second circuit board 531 and the third circuit board 532 may have the electronic components 534 soldered on one side or both sides, and specifically, the number of the electronic components 534 and the size of the accommodating space in the electronic device 100 may be adjusted, and whether each circuit board in the circuit board assembly 5 is a double-sided solder board is not further limited herein.
Fig. 18 illustrates a schematic structure of yet another circuit board assembly.
On the basis of the above, as shown with reference to fig. 18, the circuit board assembly 5 may further include a second electronic assembly (not shown in the drawing), which is located on the opposite side of the first circuit board 51 from the first electronic assembly. The second electronic assembly includes at least one second device 54, each second device 54 being in one-to-one correspondence and conductive with at least a portion of the first devices 53 in the first electronic assembly so as to make full use of the board edge structure of the first devices 53 (e.g., the circuit board), while satisfying signal transmission between the second devices 54 and the first devices 53 and the first circuit board 51, and while further enhancing the interconnection density between the circuit boards in the circuit board assembly 5 so as to be able to reduce the longitudinal dimension (e.g., the dimension in the Z direction) of the circuit board assembly 5 compared to the circuit board assembly 5 of fig. 6 when carrying the same number of electronic components 534.
With continued reference to fig. 18, at least one support 521 forms a second support unit 55, the second support unit 55 being located laterally of the first support unit 52. The supporting member 521 in the second supporting unit 55 is disposed corresponding to the second device 54 and is conductively connected between the second device 54 and the corresponding first device 53. In this way, the edge position of the first device 53 can be fully utilized without affecting the interconnection between the first device 53 and the first circuit board 51, the first device 53 and the second device 54 are directly conducted and interconnected through the supporting member 521 in the second supporting unit 55, so that the phenomenon that impedance discontinuity occurs in the signal transmission process between the first electronic component 534 and the second device 54 is reduced, and meanwhile, the strength of the circuit board assembly 5 can be enhanced by supporting the signal between the second device 54 and the first device 53 through the supporting member 521.
It should be noted that any of the above first electronic components may be used in the circuit board assembly 5 illustrated in fig. 18, and the arrangement of the first electronic components and the conduction of the first electronic components with the first circuit board 51 may be described in the above, which will not be further described herein. The supporting member 521 of the second supporting unit 55 may refer to the related description of the first supporting unit 52, which is not further described herein.
In some embodiments, the support 521 in the second support unit 55 may also be conductive and connected to the first circuit board 51 and the corresponding second device 54. At this time, the arrangement of the supporting member 521 in the second supporting unit 55 may refer to the related description in the above description about the first supporting unit 52, which is not further described herein.
The structure of the circuit board assembly 5 of the present application will be further described below taking the example that the supporting member 521 in the second supporting unit 55 directly connects the first device 53 and the second device 54.
With continued reference to fig. 18, in some embodiments, the supporting member 521 in the second supporting unit 55 may be located at a side of the first circuit board 51, so that the edge structure of the first device 53 can be directly conducted with the second device 54 through the supporting member 521 in the second supporting unit 55 without affecting the arrangement of the first supporting unit 52 and the layout of the electronic component 534 on the first circuit board 51, so as to reduce the occurrence of impedance discontinuity during the transmission of signals between the first electronic component 534 and the second device 54.
As shown in fig. 18, one side edge structure of the first device 53 may protrude from the first circuit board 51 and be exposed at a side of the first circuit board 51 so as to be directly conductive with the second device 54 through the support 521 in the second support unit 55 by using the edge structure of the first device 53.
With continued reference to fig. 18, or in some embodiments, when an edge of the first device 53 opposite to the second device 54 is blocked by the first circuit board 51, the first circuit board 51 has an opening therein, and the supporting member 521 in the second supporting unit 55 may also be inserted into the opening. Wherein the openings are adapted to the shape of the support 521 to be penetrated, so as to facilitate the penetration of the support 521. In this way, while the corresponding second device 54 is directly connected to the first device 53 to be connected through the supporting member 521 in the second supporting unit 55, the flexibility of setting the supporting member 521 in the second supporting unit 55 can be enhanced, so that the second device 54 is directly connected to the corresponding first device 53 by selecting a proper setting manner of the supporting member 521 according to the position of the first device 53 connected to the second device 54 relative to the first circuit board 51.
With continued reference to fig. 18, or in some embodiments, when the second electronic assembly includes two or more second devices 54, a portion of the support 521 in the second support unit 55 may be located at a side of the first circuit board 51, and another portion of the support 521 may be disposed through an inside of the first circuit board 51.
As shown in fig. 18, in some embodiments, the second device 54 may be a circuit board (e.g., a printed circuit board). By way of example, the second device 54 may include, but is not limited to, a radio frequency board. So that more electronic components 534 can be collectively disposed while conducting the circuit board within the first electronic assembly with the first circuit board 51 to enable signal transmission between the first circuit board 51 and the circuit board interconnected within the first electronic assembly, enhancing the density of electronic components 534 on the circuit board assembly 5 and the interconnection density between the multiple circuit boards in the circuit board assembly 5.
Alternatively, in some embodiments, the second device 54 may also be a single electronic component 534 in the radio frequency board (e.g., a radio frequency chip, a radio frequency power amplifier, etc.). Alternatively, the second device 54 may also be other electronic components 534 within the electronic device 100, such as a connector, a charging module, a WIFI module, or a compass.
The structure of the circuit board assembly 5 will be further described using the second device 54 as an rf board.
With continued reference to fig. 18, the second device 54 may include a fourth circuit board 541 and a fifth circuit board 542, and the second supporting unit 55 may include a third supporting member 551 and a fourth supporting member 552, the third supporting member 551 being positioned between the second circuit board 531 and the fourth circuit board 541 to conduct the second circuit board 531 to the fourth circuit board 541, and to interconnect the second circuit board 531 and the fourth circuit board 541.
The fourth supporting member 552 passes through the first circuit board 51 and is located between the fifth circuit board 542 and the third circuit board 532 to conduct the fifth circuit board 542 and the third circuit board 532, thereby realizing interconnection of the fifth circuit board 542 and the third circuit board 532. In this way, because of the interconnection between the second circuit board 531 and the fourth circuit board 541 and the interconnection between the fifth circuit board 542 and the third circuit board 532, compared with the interconnection between the fourth circuit board 541 and the fifth circuit board 542 and the first circuit board 51 through the supporting member 521, the impedance discontinuity phenomenon of the signals in the transmission process between the second circuit board 531 and the fourth circuit board 541 and between the first circuit board 51 and the third circuit board 532 can be reduced by the way that the first circuit board 51 is indirectly connected with the second circuit board 531 and the third circuit board 532 respectively, so as to further reduce the loss of the signals in the transmission process.
It should be noted that in some embodiments, more than two (e.g., three) second devices 54 may be included in the second electronic assembly. In the present embodiment, the number of the second devices 54 is not further limited. Since the rf front-end includes a large number of electronic components 534 such as rf chips, rf power amplifiers, filters, diplexers, low noise amplifiers, rf switches, and antenna tuners, when the second circuit board 531, the third circuit board 532, the fourth circuit board 541, and the fifth circuit board 542 are all rf boards, the second circuit board 531, the third circuit board 532, the fourth circuit board 541, and the fifth circuit board 542 can carry different or the same electronic components 534 in the rf front-end. In this application, the types of the electronic components 534 carried on the second circuit board 531, the third circuit board 532, the fourth circuit board 541, and the fifth circuit board 542 are not further limited, and specific reference may be made to the related description in the electronic apparatus 100 in the related art.
Fig. 19 illustrates a schematic structure of yet another circuit board assembly.
Referring to fig. 19, since the height of the supporting member 521 in the second supporting unit 55 is relatively large, in some embodiments, the circuit board assembly 5 may further include a fixing member 56, and the fixing member 56 is located at an intersection of the first circuit board 51 and the supporting member 521 (such as the fourth supporting member 552) in the second supporting unit 55, so that the supporting member 521 in the second supporting unit 55 is fixed by the fixing member 56, thereby enhancing the structural stability of the circuit board assembly 5.
Illustratively, the securing member 56 may include, but is not limited to, a connection pad 522 or a securing adhesive. Wherein the lateral dimensions (e.g., X-direction and Y-direction dimensions) of the connection pads 522 may be greater than or equal to 0.5X 0.5mm and less than or equal to 10X 10mm. The connection pads 522 may be fixed at intersections of the first circuit board 51 and the supporting pieces 521 in the second supporting unit 55 by soldering. The fixing glue may include, but is not limited to, an "L" shaped reinforcing fixing glue, wherein the "L" shaped reinforcing fixing glue may be fixed at the intersection of the first circuit board 51 and the support 521 in the second support unit 55 by way of dispensing.
Next, a process of manufacturing the circuit board assembly 5 including the second electronic assembly will be described with reference to fig. 18.
Step one: after the electronic component 534 is soldered on the second circuit board 531, the second circuit board 531 is soldered with the first support 523, and solder is preformed on the first electrical connection portion 53a of the second circuit board 531 corresponding to the position of the third support 551;
step two: after the electronic component 534 is soldered on the third circuit board 532, the third circuit board 532 is soldered with the second support 524, and solder is preformed on the first electrical connection portion 53a of the third circuit board 532 corresponding to the position of the fourth support 552;
step three: after the electronic component 534 is soldered to the side of the first circuit board 51 facing away from the first supporting unit 52, the electronic component 534 is soldered to the side of the first circuit board 51 facing toward the first supporting unit 52 while both the first supporting member 523 and the second supporting member 524 are soldered to the first circuit board 51 by one-time soldering;
step four: soldering the second circuit board 531 to the third support 551, and soldering the third circuit board 532 to the fourth support 552 to form a component to be flipped (not shown);
step five: the component to be flipped is flipped, the third circuit board 532 is used as a bottom plate, the fourth circuit board 541 is soldered to the third support 551, and the fifth circuit board 542 is soldered to the fourth support 552, forming the circuit board assembly 5.
It should be noted that, the welding of the second circuit board 531 and the first support member 523, the welding of the third circuit board 532 and the second support member 524, and the welding of the first support member 523 and the second support member 524 and the first circuit board 51 may refer to the related descriptions in the foregoing. The present process differs from the above process in that solder is pre-formed on the second circuit board 531 in step one and solder is pre-formed on the third circuit board 532 in step two, and in addition, there are the introduction of step four and step five.
In the fourth step, the welding between the second circuit board 531 and the third support 551 and the welding between the third circuit board 532 and the fourth support 552 may refer to the above description about the welding between the second circuit board 531 and the first support 523, which is not further described herein. In the fifth step, the fourth circuit board 541 may be soldered to the third support 551 by a process such as a spot tin process or a soldering flux process, and the fifth circuit board 542 may be soldered to the fourth support 552 to form the circuit board assembly 5.
It should be noted that, no matter what kind of structure is adopted in the circuit board assembly 5, before the soldering is started, each first device 53 needs to be stacked on the first circuit board 51 through the corresponding support 521, and each second device 54 needs to be stacked on the corresponding first device 53 through the corresponding support 521, so as to form a stacked structure to be soldered for subsequent soldering.
Any of the above circuit board assemblies 5 may replace the printed circuit board 3 of the electronic device 100 and be located in the housing assembly 2, so that the electronic device 100 is controlled by the circuit board assembly 5, and meanwhile, the loss of signals in the transmission process can be reduced by reducing the impedance discontinuity phenomenon of the signals in the transmission process, and the processing times of the circuit board assembly 5 can be reduced.
Since the incoming material of the first device 53 (e.g., a radio frequency board) is typically a plurality of sub-boards spliced to each other, the incoming material of the radio frequency board needs to be split before the sub-boards are soldered to the corresponding supporting members 521 by reflow, and the sub-boards to be soldered are separated from other sub-boards in the incoming material, so that when the sub-boards are soldered to the corresponding supporting members 521 by reflow, there is a risk of warpage of the first device 53 after the first device 53 is soldered to the supporting members 521 due to lack of tension on the peripheral edges of the sub-boards.
Therefore, on the basis of the above, the embodiment of the present application further provides a tool 200, where the tool 200 may be applied to any one of the above circuit board assemblies 5, so as to solve the risk of raising after the first device 53 is welded to the supporting member 521, and ensure that the first device 53 is stably connected to the supporting member 521.
Fig. 20 illustrates an assembly of a tool on the circuit board assembly of the figure.
Referring to fig. 20, the tool 200 includes a housing 210 and a pressing assembly 220, the housing 210 includes a housing body 2110 and a cover 2120, and the cover 2120 is disposed on the housing body 2110 and encloses a cavity 2130 with the housing body 2110. The circuit board assembly 5 is positioned within the cavity 2130. The hold down assembly 220 is positioned within the cavity 2130 and is pressed against each of the first devices 53 in the first electronic assembly in the circuit board assembly 5. Thus, while the stacked structure of the circuit board assembly 5 is located in the cavity 2130 and supported in the cavity 2130, simultaneous pressing of the first devices 53 by the pressing assembly 220 can be achieved, so that after pressing by the pressing assembly 220, the stacked structure of the circuit board assembly 5 is welded multiple times. Due to the press arrangement of the pressing assembly 220, the risk of the first device 53 being warped after being welded to the support 521 can be reduced or even avoided, and the quality of the connection of the first device 53 to the support 521 can be enhanced.
Moreover, according to the embodiment of the application, through the arrangement of the pressing assembly 220, the first devices 53 do not need to be pressed respectively, so that the pressing process of the tool 200 on the circuit board assembly 5 is simplified.
With continued reference to fig. 20, the housing body 2110 includes a bottom case 2111 and a side plate 2112, the bottom case 2111 being disposed opposite the cover plate 2120, the side plate 2112 being enclosed on the bottom case 2111 to enclose the housing body 2110 with the bottom case 2111. The cover plate 2120 is provided to the side plate 2112 and detachably connected to the side plate 2112 so that the cover plate 2120 can be moved or rotated with respect to the side plate 2112 to open the cover plate 2120, dispose the stacked structure of the circuit board assembly 5 in the cavity 2130, or take out the stacked structure from the cavity 2130 after the soldering is completed. The cover 2120 and the side plate 2112 may be detachably connected by, but not limited to, a snap connection, an adsorption connection (such as magnetic attraction), a rotation shaft connection, or the like.
When the cover plate 2120 is attached to the side plate 2112 by suction, the side plate 2112 and the cover plate 2120 may be two magnetic plates or a magnetic plate and a metal plate capable of magnetically attaching. The cover plate 2120 can be attracted to the side plate 2112 by the suction force of the side plate 2112, and the cover plate 2120 can be conveniently arranged on the shell assembly 2. In order to enhance the stability of the connection between the cover plate 2120 and the side plate 2112, the cover plate 2120 and the side plate 2112 may be connected by a buckle based on magnetic attraction.
As shown in fig. 20, the bottom case 2111 of the case body 2110 has a plurality of support portions 2113 thereon, and the plurality of support portions 2113 are located in the cavity 2130 and are arranged at intervals on the bottom case 2111 to support the stacked structure. Illustratively, the support portion 2113 may include, but is not limited to, a support protrusion.
With continued reference to fig. 20, the tool 200 further includes a positioning assembly (not labeled in the figures) positioned within the cavity 2130, the positioning assembly including at least one of the first positioning portion 240 and the second positioning portion 250. With continued reference to fig. 20, the number of first positioning portions 240 may include, but is not limited to, one, two, three, etc.
In some embodiments, the first positioning portion 240 may be located at a side of the circuit board assembly 5 to position the circuit board assembly 5, so as to avoid the circuit board assembly 5 moving relative to the housing 210 in a direction towards the side plate 2112 or away from the side plate 2112, which affects the pressing effect of the pressing assembly 220 on each first device 53. At this time, the first positioning portion 240 may include, but is not limited to, a positioning rib or the like on the bottom case 2111.
Alternatively, in some embodiments, the first positioning portion 240 may also be disposed through the circuit board assembly 5 and the pressing assembly 220 (such as the pressing block 221), so as to position the first devices 53 and the pressing block 221 by using the first positioning portion 240, so as to avoid relative movement between the first devices 53 or relative movement of the first devices 53 relative to the pressing block 221 during the welding process, which affects the pressing effect of the pressing assembly 220 on each first device 53. At this time, the first positioning part 240 may include, but is not limited to, a positioning pin, a positioning column, or a positioning needle (positioning pin).
Alternatively, when the number of the first positioning portions 240 is plural, in some embodiments, a part of (for example, two) first positioning portions 240 may be disposed at the sides of the circuit board assembly 5, and a part of (for example, two) first positioning portions 240 may be disposed in each layer of the circuit board and the pressing block 221 of the circuit board assembly 5 in a penetrating manner, so as to position the sides of the circuit board assembly 5 and between the first devices 53.
The first positioning part 240 can be used for positioning the position of the circuit board assembly 5 in the tool 200 and the position between the first device 53 and the first circuit board 51 in the circuit board assembly 5, so that the connection quality of the first device 53 and the first circuit board 51 is ensured.
With continued reference to fig. 20, the second positioning portion 250 may be located on a side of the first positioning portion 240 facing away from the circuit board assembly 5 to connect the cover 2120 and the bottom shell 2111 of the housing body 2110. One end of the second positioning portion 250 is connected to the bottom case 2111, and the other end of the second positioning portion 250 may be inserted into the cover plate 2120, so that the cover plate 2120 and the bottom case 2111 are connected through the second positioning portion 250, and meanwhile, the position of the cover plate 2120 relative to the bottom case 2111 can be positioned, so as to ensure the covering effect of the cover plate 2120 on the housing body 2110 and the pressing effect of the pressing assembly 220. The number of the second positioning parts 250 may include, but is not limited to, one, two, three, etc. The second positioning portion 250 may include, but is not limited to, a positioning pin, a positioning post, or a positioning pin (positioning pin). In this application, the number and kind of the second positioning portions 250 are not further limited.
With continued reference to fig. 20, the hold down assembly 220 is pressed against each first device 53 opposite the support 521 in the circuit board assembly to reduce or even avoid the risk of the first device 53 tilting after soldering with the support 521.
Since the first device 53 is soldered to the pad 522 on the support 521 through the first electrical connection 53a, the pressure is a key factor directly affecting the soldering quality, and in general, when soldering such as reflow soldering, the pressure applied to the chip to be soldered can be increased by adding means. Therefore, by the pressing of the pressing assembly 220, it is also possible to ensure a certain pressure on the pressed first electrical connection portion 53a and the bonding pad 522 of the support 521, so as to enhance the connection quality of the first device 53 and the support 521.
With continued reference to fig. 20, the pressing assembly 220 includes a pressing block 221 and a plurality of pressing portions 222, the pressing block 221 being located on a side of the first electronic assembly facing away from the first circuit board 51, and a cover plate 2120 configured to press on the pressing block 221. The pressing parts 222 are disposed at intervals on one side of the pressing block 221 facing the first electronic component, and are pressed at positions where the first devices 53 are opposite to the supporting member 521. After the cover plate 2120 is pressed on the pressing block 221, under the action of self-gravity of the cover plate 2120, the pressing block 221 and the pressing part 222, the pressing part 222 presses on the corresponding first device 53 and the supporting piece 521 corresponding to the first device 53, and pressure is applied to the first device 53 and the supporting piece 521, so that the risk of tilting of the first device 53 is reduced or even avoided, a certain pressure is ensured on the first electrical connection part 53a of the pressed first device 53 and the bonding pad 522 of the supporting piece 521, and a better connection effect between the first device 53 and the supporting piece 521 is obtained.
Fig. 21 is a schematic view illustrating an assembly of the compression assembly of fig. 20 onto the circuit board assembly of fig. 7.
Referring to fig. 21, in some embodiments, the height of the pressing part 222 located at the middle of the pressing block 221 is smaller than the height of the pressing part 222 located at the end of the pressing block 221, so that the pressing part 222 on the pressing block 221 exhibits the characteristic of being low in the middle and high on both sides, so that the pressing part 222 at the middle of the pressing block 221 may be pressed against the outer first device by the self-gravity of the cover plate 2120, the pressing block 221 and the pressing part 222, and the pressing part 222 at the end of the pressing block 221 may be pressed against the inner first device, thereby being pressed against each first device 53 by the plurality of pressing parts 222.
As shown in fig. 21, the lateral dimension (e.g., width W) of the first device (e.g., third circuit board 532) on the outside 3 ) Smaller than the width W of the inner first device (such as the second circuit board 531) 4 In this case, the pressing part 222 of the end of the pressing block 221 may be located at a side of the third circuit board 532 or pass through the third circuit board 532 and press against the inner first device by means of the self-weight of the cover plate 2120, the pressing block 221 and the pressing part 222.
Fig. 22 is a schematic view of an assembly of the compression assembly of fig. 20 onto the circuit board assembly of fig. 13.
Alternatively, in some embodiments, the pressing part 222 at the end of the pressing block 221 has an extension part 2221, and the extension part 2221 extends toward the middle of the pressing block 221 to be pressed at a position opposite to the inner first device and the supporting member 521 (e.g., the second circuit board 531 and the first supporting member 523). In adjacent two The first devices 53 have the same width (e.g., width W 3 Equal to W 4 ) When the extension portion 2221 may be pressed against a surface of the second circuit board 531 facing away from the first circuit board 51, so as to implement the pressing effect of the pressing assembly 220 on each inner first device.
Alternatively, in some embodiments, taking the second circuit board 531 and the third circuit board 532 as examples, the width W of the third circuit board 532 3 Is equal to the width W of the second circuit board 531 4 In this case, the pressing part 222 at the end of the pressing block 221 may pass through the second circuit board 531 and may be pressed against the second circuit board 531 by the cover 2120, the pressing block 221, and the self-weight of the pressing part 222. Here, the pressing portion 222 at the end of the pressing block 221 does not limit the pressing manner of the inner first device further.
It should be noted that the height of the pressing portion 222 located at the middle of the pressing block 221 may be greater than the height of the pressing portion 222 located at the end of the pressing block 221. As the structure of the circuit board assembly 5 is changed, the height of the plurality of pressing portions 222 on the pressing block 221 may also be changed. Here, the order of arrangement of the plurality of pressing portions 222 on the pressing block 221 is not further limited.
Fig. 23 illustrates an assembled schematic view of the hold-down assembly on the circuit board assembly of fig. 19.
Referring to fig. 23, when the circuit board assembly 5 includes the second electronic component, the stacked structure including the first circuit board 51, the first supporting unit 52 and the first electronic component may be disposed in the cavity 2130 of the tool 200 for soldering. When the welding is completed to form the component to be turned over, the component to be turned over is turned over in the tool 200, so that the outer first device is supported on the supporting portion 2113 of the bottom case 2111 as a bottom plate, and then the fourth circuit board 541 and the fifth circuit board 542 are stacked on the component to be turned over through the corresponding third supporting piece 551 and fourth supporting piece 552 in the second supporting unit 55. Finally, the fourth circuit board 541 is soldered to the third support 551 and the fifth circuit board 542 is soldered to the fourth support 552 by pressing the pressing assembly 220 again to the fourth and fifth circuit boards 541 and 542, forming the circuit board assembly 5.
On the basis of the above, as shown in fig. 20, the cover plate 2120 may include a cover plate body 2121 and at least one compressing member 2122, where the compressing member 2122 is located at a side of the cover plate body 2121 facing the compressing block 221 and is pressed against the compressing block 221, so that when the compressing member 2122 is pressed against the compressing block 221, the gravity of the cover plate 2120 may be transferred to the compressing block 221, and when the compressing portion 222 is pressed against each first device 53 by the compressing block 221, the pressures of the cover plate 2120, the compressing block 221 and the compressing portion 222 may be transferred to the corresponding first device 53 of the compressing block 221, so that the pressing of the first device 53 and the corresponding supporting member 521 is achieved by means of the gravity of the cover plate 2120 and the compressing assembly 220.
Referring to fig. 22 in combination with fig. 20, in some embodiments, the pressing portion 222 may be a pressing post, so that when the cover plate 2120 is disposed on the side plate 2112, the pressing post abuts against the pressing block 221, and the pressing portion 222 is pressed against each first device 53 and the corresponding supporting member 521 by gravity of the cover plate 2120 and the pressing assembly 220.
Referring to fig. 22 in combination with fig. 20, in some embodiments, the hold-down 222 may also be a magnetic portion, and the hold-down 2122 may be a magnetic member that is magnetically repulsive to the magnetic portion and disposed opposite at least a portion of the hold-down 222. The magnetic part may be a magnetic block, and the magnetic member may be located on a magnetic column magnetically repulsive to the magnetic part. According to the principle of like pole repulsion, the magnetic poles of the opposite sides of the magnetic part and the magnetic piece are the same, for example, the magnetic poles are both S poles or N poles. The magnetic block and the magnetic column can be prepared from magnetic materials such as neodymium-iron-boron magnets. Since the pressing piece 2122 magnetically repels the magnetic portion, when the pressing portion 222 is pressed against the pressing block 221, the pressing portion 222 has a tendency to move toward the pressed first device 53 according to the principle of like-pole repulsion, as compared to relying only on the self-gravity of the pressing assembly 220. Thus, under the combined action of the repulsive force of the pressing portion 222 and the gravity of the cover plate 2120, the pressing block 221 and the pressing portion 222, the pressing portion 222 can exert a larger pressure on the pressed first device 53 and the supporting member 521 to increase the pressure of the first electrical connection portion 53a on the first device 53 and the bonding pad 522 on the supporting member 521, so as to enhance the connection quality of the first device 53 and the supporting member 521.
As shown in fig. 20, in some embodiments, the bottom case 2111 may be a magnetic plate magnetically attracted to the magnetic portion. According to the principle of opposite attraction, the magnetic poles of the opposite surfaces of the magnetic plate and the magnetic part are different. For example, when the magnetic pole of the magnetic portion facing the end of the pressing portion 222 is the S pole, the magnetic pole of the magnetic portion facing the end of the first device 53 is the N pole, and in this case, the magnetic pole of the magnetic plate facing the end of the magnetic portion may be the S pole, and the magnetic pole of the magnetic plate facing away from the end of the magnetic portion is the N pole. The pressure exerted by the pressing portion 222 on the pressed first device 53 and the supporting member 521 can be further increased by the attraction force of the magnetic plate to further enhance the connection quality of the first device 53 and the supporting member 521. Alternatively, in some embodiments, the bottom case 2111 may be a metal plate magnetically attracted to the magnetic portion. Here, the material for preparing the bottom case 2111 is not further limited.
Fig. 24 is a schematic view of another assembly of the compression assembly of fig. 20 onto the circuit board assembly of fig. 7.
On the basis of the above, the tooling 200 may further include an elastic component 230, where the elastic component 230 is located at the connection position between the pressing block 221 and the pressing portion 222, so as to increase the pressure exerted by the pressing portion 222 on the pressed first device 53 and the supporting member 521 through the elasticity generated by the elastic component 230, so that the manner in which the pressing portion 222 applies the pressure is more flexible and various, so as to ensure the connection quality of the first device 53 and the supporting member 521 by adopting different pressing manners according to the requirement.
Fig. 25 is a schematic view illustrating an initial state of the elastic assembly of fig. 24, and fig. 26 is a schematic view illustrating a compressed state of the elastic assembly of fig. 24.
Referring to fig. 25 and 26, the elastic assembly 230 may include a guide 231, a stopper 233, and an elastic member 232, the pressing block 221 having a sliding groove 2211 on a side facing the pressing portion 222, the stopper 233 being positioned in the sliding groove 2211. Wherein the stop 233 may be located in a notch of the slide slot 2211 or other location within the slide slot 2211. One end of the guide member 231 is connected to the pressing portion 222, and the other end penetrates the limiting member 233 and is located in the sliding groove 2211. The elastic member 232 is sleeved on the guide member 231 and abuts between the pressing block 221 and the pressing portion 222. By way of example, the resilient member 232 may include, but is not limited to, a spring or other resilient structure (e.g., silicone, etc.). Thus, when the pressing assembly 220 is pressed against each first device 53 by the pressing portion 222, the pressing block 221 moves toward one side of the first device 53 under the pressing of the cover plate 2120, so that the elastic member 232 is compressed, the guide member 231 moves along the sliding groove 2211 toward one side of the cover plate 2120, and the pressing member 2122 presses the first device 53 under the action of the resilience of the elastic member 232, thereby increasing the pressure exerted by the pressing portion 222 on the pressed first device 53 and the supporting member 521.
The guide 231 may have a T-shaped structure at one end connected to the compressing portion 222, so that, based on the fact that the guide 231 is inserted into the limiting member 233, the guide 231 can be guided in the sliding slot 2211 through the T-shaped structure, and when the guide 231 moves in the sliding slot 2211 toward one side of the compressing portion 222, the T-shaped structure can be matched with the limiting member 233 to limit the moving position of the guide 231 in the sliding slot 2211, so as to avoid the guide 231 from falling out of the sliding slot 2211.
In some embodiments, when the compressing portion 222 is a compressing column or a magnetic portion, the elastic component 230 may be disposed at the connection position between the compressing portion 222 and the compressing portion 221, so that when the stacking structure of the circuit board assembly 5 is supported in the cavity 2130, the compressing portion 222 acts on the first device 53 in a manner of gravity and elasticity or a manner of combining gravity and elasticity with magnetic force, so that the pressure applied on the first device 53 and the supporting member 521 is increased, and the connection quality between the first device 53 and the supporting member 521 is ensured.
It should be noted that, when the gravity and the elastic force are applied to the first device 53 and the supporting member 521 (such as the first supporting member 523), the pressure corresponding to each first electrical connection portion 53a on the first device 53 and the pressure corresponding to each pad 522 on the first supporting member 523 are both 0.05g/pad-5g/pad.
When a combination of gravity, elastic force and magnetic force is used to apply pressure on the first device 53 and the supporting member 521 (such as the first supporting member 523), the pressure corresponding to each first electrical connection 53a on the first device 53 and the pressure corresponding to each bonding pad 522 on the first supporting member 523 are both 0.05g/pad-20g/pad.
Taking the combination of gravity, elastic force and magnetic force as an example, the pressure at the position of the first support member 523, the pressure F at the position where the first support member 523 is pressed by the pressing portion 222 needs to satisfy the following relationship:
F＝G+F 1 +F 2 formula (IV)
Wherein G is the weight of the tooling 200, and is mainly the total weight of the cover plate 2120 and the compression assembly 220, F 1 F for magnetic force of the pressing portion 222 2 Is the elastic force of the elastic member 232.
It should be noted that, according to the fourth formula, when the structure of the tool 200 is relatively fixed, the gravity G of the tool 200 is also relatively fixed, and may be calculated according to a conventional gravity calculation formula.
Taking the pressing portion 222 as an example of a neodymium-iron-boron magnet, the magnetic force of the neodymium-iron-boron magnet itself is 640 times of the self weight, that is, the neodymium-iron-boron magnet can absorb 640 times of the self weight. In general, the neodymium iron boron magnet can attract articles with 600 times of the self weight. The specification and shape of the neodymium-iron-boron magnet are many (such as a magnet with a hole and a special-shaped magnet), the specification and shape of the neodymium-iron-boron magnet are directly related to the attractive force and the repulsive force of the neodymium-iron-boron magnet, and the calculation is complex. The attraction force and the repulsion force are magnetic forces with opposite directions, and the sizes of the generated attraction force and the generated repulsion force are the same for the magnets with the same material, the same shape and the same size.
Taking suction force as an example, the magnetic force F of the pressing portion 222 1 The following relationship is satisfied:
F 1 =10ρvn formula (five)
Wherein ρ is the density of the neodymium-iron-boron magnet, n is the multiple of the weight of the object and the neodymium-iron-boron magnet that can be attracted by the neodymium-iron-boron magnet, and n is calculated by taking n as 600 as an example.
Here, the suction force of the pressing member 2122 against the pressing portion 222 is calculated using a square neodymium iron boron magnet and a round neodymium iron boron magnet, respectively.
Example one: the square NdFeB magnet has the length of 30mm, the width of 15mm, the thickness of 5mm and the density of about7.5g/cm 3 As can be seen from the formula four, the magnetic force of the square neodymium-iron-boron magnet
F 1 ＝10×7.5×10 -3 ×(30×15×5)×10 -3 ×600＝101.250(N)
From this, the square NdFeB magnet of example one can attract an object with a gravity of about 101N, and can generate a magnetic force F of about 101N 1 。
Example two: the radius of the round NdFeB magnet is 10mm, the thickness is 5mm, and the density is about 7.5g/cm 3 As can be seen from the formula four, the magnetic force of the round neodymium-iron-boron magnet
F 1 ＝10×7.5×10 -3 ×(10×10×3.14×5)×10 -3 ×600＝70.650(N)
From this, the round neodymium-iron-boron magnet in example two can attract about 70.65N of objects, and can generate about 70.65N of magnetic force F 1 。
Thus, embodiments of the present application may adjust the magnetic force F of the hold-down portion 222 (e.g., the magnetic portion) according to the amount of pressure desired to be applied to the first device 53 and the attached support 521 1 . Specifically, when the number of the pressing portions 222 is plural, the pressing portions 222 of the portion may be thickened or thinned to change the volume of the pressing portions 222 of the portion, thereby adjusting the pressure on the first electrical connection portion 53a and the pad 522 of the supporting member 521 on the first device 53 pressed by the pressing portions 222 of the portion.
For example, as shown in fig. 19, based on the width of the pressing portion 222 (abbreviated as a second pressing portion) corresponding to the second support 524, the width of the pressing portion 222 (abbreviated as a first pressing portion) corresponding to the first support 523 may be adjusted to 1.5 times the second pressing portion 222, and the width of the pressing portion 222 (abbreviated as a fourth pressing portion) corresponding to the fourth support 552 may be adjusted to 2 times the second pressing portion 222, thereby adjusting the magnetic forces of the first pressing portion 222 and the fourth pressing portion 222.
Alternatively, in some embodiments, the magnetic force may be applied to one or both sides of the same support 521 by changing the structure of the pressing portion 222. When the magnetic force is applied to one side of the same support 521, the pressing portion 222 corresponding to the magnetic force side may be provided as a magnetic portion according to the side where the magnetic force is applied (abbreviated as the magnetic force side), and the pressing portion 222 corresponding to the non-magnetic force side may be provided as a pressing column on the side where the magnetic force is not applied (abbreviated as the non-magnetic force side). When magnetic force is applied to both sides of the same supporting member 521, the pressing portions 222 corresponding to both sides of the same supporting member 521 are magnetic portions. This enables the structure of the corresponding pressing portion 222 to be changed according to the difference in pressure required for the bonding pad 522 at different positions on the supporting member 521.
The structure of the tooling 200 will be further described using the example where the pressures required for the pads 522 at different locations on the support 521 are all the same.
When the bottom case 2111 is a magnetic plate, it is mainly convenient to press the pressing portion 222 against the first device 53 and the supporting member 521 along a predetermined direction, and since the bottom case 2111 has a certain distance from the pressing portion 222, the influence of the suction force of the bottom case 2111 on the pressing portion 222 on the pressure of the first device 53 and the supporting member 521 is negligible
Elasticity F of the elastic member 232 1 The following relationship needs to be satisfied:
F 1 =kx formula (six)
Where k is the elastic coefficient (a known amount) of the elastic member 232, and x is the compression amount of the elastic member 232. Weight G of tool 200 and magnetic force F of hold-down 222 1 After the determination, the weight G of the tool 200 and the magnetic force F of the pressing part 222 1 The elastic member 232 is caused to compress, and the compression x of the elastic member 232 is also a known amount that can be obtained. Therefore, the elastic force F of the elastic member 232 can be obtained according to the formula six 1 . The application can adjust the weight G of the tool 200 and the magnetic force F of the compressing part 222 1 And elasticity F 1 So that the pressure corresponding to each first electrical connection portion 53a and the pressure corresponding to each bonding pad 522 on the first support member 523 are both 0.05g/pad-20g/pad.
In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
The terms first, second, third, fourth and the like in the description and in the claims of embodiments of the application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

Claims (31)

1. The circuit board assembly is characterized by comprising a first circuit board, a supporting assembly and a first electronic assembly, wherein the first electronic assembly comprises at least two first devices communicated with the first circuit board, and all the first devices are sequentially overlapped on the same side of the first circuit board along the thickness direction of the first circuit board;
the support assembly comprises a plurality of support pieces, at least two support pieces form a first support unit, and the support pieces in the first support unit and the first device are correspondingly arranged; the supporting pieces corresponding to different first devices are staggered with each other in the board surface direction of the first circuit board, and an avoidance area is formed towards the first device of the first circuit board in at least two first devices; a portion of the support member passes through the relief area and is conductively coupled between the first circuit board and the corresponding first device.
2. The circuit board assembly of claim 1, wherein the support has a first end that is conductive and connected to the first circuit board and a second end that is conductive and connected to the corresponding first device.
3. The circuit board assembly of claim 1, wherein the support member is a frame-shaped circuit board.
4. The circuit board assembly of claim 3, wherein the first support unit includes an outer support and an inner support, the inner support being located within a hollow space enclosed by the outer support.
5. The circuit board assembly of claim 4, wherein a height of the support member of the first support unit corresponding to the relief area is greater than a height of the support member laterally of the relief area.
6. The circuit board assembly of claim 5, wherein the relief area is located in a middle portion of the first device, and wherein the height of the inner support is greater than the height of the outer support.
7. The circuit board assembly according to claim 1, wherein in a thickness direction of the first circuit board, there is an overlap region between adjacent two of the first devices, the overlap region being provided around a peripheral side of the escape region.
8. The circuit board assembly of claim 7, wherein the relief area is a relief hole having a shape that matches a shape of an outer edge of the support member being threaded.
9. The circuit board assembly of claim 1, wherein the first circuit board has at least one conductive aperture, and wherein an end of the support in the first support unit is positioned within the conductive aperture and in communication with the first circuit board.
10. The circuit board assembly of any one of claims 1-9, wherein the first device is a circuit board interconnected with the first circuit board.
11. The circuit board assembly of claim 10, wherein the first device comprises a second circuit board and a third circuit board, the second circuit board being located between the first circuit board and the third circuit board;
the first support unit comprises a first support piece and a second support piece nested in the first support piece, and the first support piece is connected between the first circuit board and the second circuit board in a conducting manner;
the second supporting piece passes through the avoidance area on the second circuit board and is connected between the first circuit board and the third circuit board in a conducting way.
12. The circuit board assembly of claim 11, wherein a height of the second support is greater than a sum of a height of the first support and a board thickness of the second circuit board.
13. The circuit board assembly of claim 10, wherein the first circuit board is an application processor board and the first device is a radio frequency board.
14. The circuit board assembly of any of claims 1-9, further comprising a second electronic assembly located on the opposite side of the first circuit board from the first electronic assembly, the second electronic assembly comprising at least one second device, each second device being in one-to-one correspondence and conductive with at least a portion of the first devices in the first electronic assembly.
15. The circuit board assembly of claim 14, wherein at least one of the support members forms a second support unit located laterally of the first support unit, the support members in the second support unit being disposed in correspondence with the second devices and conductively connected between the second devices and the corresponding first devices.
16. The circuit board assembly of claim 15, wherein the support in the second support unit is located laterally of the first circuit board or has an aperture therein, the support in the second support unit being disposed through the aperture.
17. The circuit board assembly of claim 16, further comprising a fixture located at an intersection of the first circuit board and the support in the second support unit.
18. The circuit board assembly of claim 14, wherein the second device is a circuit board.
19. A tool, which is characterized by being applied to the circuit board assembly of any one of claims 1-18, and comprises a shell and a pressing assembly, wherein the shell comprises a shell body and a cover plate, the cover plate is covered on the shell body and forms a cavity with the shell body, and the circuit board assembly is positioned in the cavity; the pressing component is positioned in the cavity and is pressed on each first device of the first electronic component in the circuit board component.
20. The tooling of claim 19, wherein the hold down assembly is pressed against each of the first devices opposite a support in the circuit board assembly.
21. The tooling of claim 20, wherein the pressing assembly comprises a pressing block and a plurality of pressing parts, the pressing block is located on one side of the first electronic assembly, which is away from the first circuit board, the cover plate is configured to be pressed on the pressing block, and the plurality of pressing parts are arranged at intervals on one side of the pressing block, which is towards the first electronic assembly, and are pressed on the opposite positions of each first device and the supporting piece.
22. The tooling of claim 21, wherein the height of the hold-down portion at the middle of the press block is less than the height of the hold-down portion at the end of the press block.
23. The tooling of claim 22, wherein the hold down at the end of the press block has an extension extending toward the middle of the press block to be pressed against the first device on the side toward the first circuit board at a position opposite to the support.
24. The tooling of claim 21, wherein the cover plate comprises a cover plate body and at least one pressing member, the pressing member being located on a side of the cover plate body facing the press block and pressed against the press block.
25. The tool according to claim 24, wherein the pressing portion is a pressing post, or,
the compressing part is a magnetic part, the compressing piece is a magnetic piece which is magnetically repulsive to the magnetic part, and the compressing piece is arranged opposite to at least part of the compressing part.
26. The tooling of claim 25, wherein the housing body includes a bottom shell disposed opposite the cover plate, the bottom shell being a magnetic plate magnetically attracted to the magnetic portion.
27. The tooling of claim 25, further comprising an elastic assembly located at a junction of the press block and the press portion.
28. The tooling of claim 27, wherein the elastic assembly comprises a guide member, a limiting member and an elastic member, wherein a side of the pressing block facing the pressing part is provided with a sliding groove, and the limiting member is positioned in the sliding groove;
one end of the guide piece is connected with the pressing part, and the other end of the guide piece penetrates through the limiting piece and is positioned in the sliding groove; the elastic piece is sleeved on the guide piece and is abutted between the pressing block and the pressing part.
29. The tooling of claim 26, wherein the housing body further comprises a side plate, the side plate surrounding the bottom shell to form the housing body with the bottom shell; the cover plate is covered on the side plate and is detachably connected with the side plate.
30. The tooling of claim 19, further comprising a positioning assembly positioned within the cavity, the positioning assembly comprising at least one of a first positioning portion and a second positioning portion, the first positioning portion being positioned laterally of the circuit board assembly or the first positioning portion being threaded through the circuit board assembly and the compression assembly; the second positioning part is positioned at one side of the first positioning part, which is away from the circuit board assembly, so as to connect the cover plate and the bottom shell of the shell body.
31. An electronic device comprising a housing assembly and the circuit board assembly of any one of claims 1-18, the circuit board assembly being located within the housing assembly.
CN202222494979.5U 2022-09-20 2022-09-20 Circuit board assembly, tool and electronic equipment Active CN219107751U (en)

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