CN202374560U

CN202374560U - Chip attachment printed circuit board (PCB)

Info

Publication number: CN202374560U
Application number: CN2011205239364U
Authority: CN
Inventors: 董剑华
Original assignee: Chicony Electronics Suzhou Co Ltd
Current assignee: Chicony Electronics Suzhou Co Ltd
Priority date: 2011-12-15
Filing date: 2011-12-15
Publication date: 2012-08-08
Anticipated expiration: 2021-12-15

Abstract

The utility model relates to a chip attachment printed circuit board (PCB), which is provided with a substrate. Solder mask windows, pads and optical positioning points are arranged on the substrate. Solder mask ink is arranged on edges around the solder mask windows. The pads and the optical positioning points are arranged on the solder mask windows. The pads are connected through wires. The optical positioning points are L-shaped, and the center points of the optical positioning points are overlapped with the center points of corresponding solder mask windows. The L-shaped windowed optical positioning points are used instead of the conventional circular optical positioning points, so that the optical positioning point reference position offset caused by the offset of the ink can be effectively prevented, and the placement accuracy and quality are effectively improved.

Description

A kind of chip attachment pcb board

Technical field

The utility model relates to a kind of chip attachment pcb board.

Background technology

Along with the develop rapidly of electron trade, the trend of electronic product microminiaturization is obvious day by day, and pcb board begins to be widely used on each electronic product and main equipment and the device.For satisfying the needs that automated production is handled; Must on the top layer of pcb board and bottom, add the optical alignment point; The general circular appearance that adopts of existing optical alignment point, and circular size the problem of anti-welding skew can occur by the size decision of anti-solder ink in this design; Can cause the equipment location not accurate, thereby part precision and quality are put in influence.

The utility model content

The purpose of the utility model is to overcome the defective that prior art exists, and provides a kind of and can strengthen the chip attachment pcb board of putting part precision and quality.

The technical scheme that realizes the utility model purpose is: a kind of chip attachment pcb board has substrate; Have on the said substrate anti-weldingly window, pad and optical alignment point; Said anti-welding edge of windowing is provided with anti-solder ink; Said pad and optical alignment point are arranged on anti-welding the windowing, and connect through cabling between the pad; Said optical alignment point is " L " shape, and the central point of optical alignment point overlaps with corresponding anti-welding central point of windowing.

The said pad of technique scheme laterally or vertically be provided with salient point.

The said salient point of technique scheme is a square.

The utlity model has positive effect:

The utility model is abandoned original circular optics anchor point, uses the optical alignment point that " L " shape is put in a skylight instead, has prevented effectively because of the printing ink skew causes the skew of optical alignment point reference position, thereby has improved the precision and the quality of putting part effectively.

Description of drawings

For the content that makes the utility model is expressly understood more easily,, the utility model is done further detailed explanation, wherein below according to specific embodiment and combine accompanying drawing

Fig. 1 is the structural representation of the utility model;

1. substrates among the figure, 11. anti-welding windowing, 12. pads, 13. optical alignments point, 14. salient points.

Embodiment

See Fig. 1, the utlity model has substrate 1; Have on the substrate 1 anti-weldingly window 11, pad 12 and optical alignment point 13; Anti-welding 11 the edge of windowing is provided with anti-solder ink; Pad 12 and optical alignment point 13 are arranged on anti-welding windowing on 11, between the pad 12 through the cabling connection, pad 12 laterally or vertically be provided with foursquare salient point 14; Optical alignment point 13 is " L " shape, and the central point of optical alignment point 13 overlaps with corresponding anti-welding 11 the central point of windowing.

Above-described specific embodiment; Purpose, technical scheme and beneficial effect to the utility model have carried out further explain, it should be understood that the above is merely the specific embodiment of the utility model; Be not limited to the utility model; All within the spirit and principle of the utility model, any modification of being made, be equal to replacement, improvement etc., all should be included within the protection range of the utility model.

Claims

1. a chip attachment pcb board has substrate (1); Have anti-welding windowing (11), pad (12) and optical alignment point (13) on the said substrate (1); The edge of said anti-welding windowing (11) is provided with anti-solder ink; Said pad (12) and optical alignment point (13) are arranged on anti-welding the windowing, and connect through cabling between the pad (12); It is characterized in that: said optical alignment point (13) is " L " shape, and the central point of the central point of optical alignment point (13) and corresponding anti-welding windowing (11) overlaps.

2. chip attachment pcb board according to claim 1 is characterized in that: said pad (12) laterally or vertically be provided with salient point (14).

3. chip attachment pcb board according to claim 2 is characterized in that: said salient point (14) is square.