CN202252981U - Led lamp panel - Google Patents
Led lamp panel Download PDFInfo
- Publication number
- CN202252981U CN202252981U CN2011203244565U CN201120324456U CN202252981U CN 202252981 U CN202252981 U CN 202252981U CN 2011203244565 U CN2011203244565 U CN 2011203244565U CN 201120324456 U CN201120324456 U CN 201120324456U CN 202252981 U CN202252981 U CN 202252981U
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- Prior art keywords
- substrate
- led lamp
- hole
- led
- lamp plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000000084 colloidal system Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000015271 coagulation Effects 0.000 claims description 6
- 238000005345 coagulation Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000005286 illumination Methods 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 230000000630 rising effect Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VQKWAUROYFTROF-UHFFFAOYSA-N arc-31 Chemical compound O=C1N(CCN(C)C)C2=C3C=C4OCOC4=CC3=NN=C2C2=C1C=C(OC)C(OC)=C2 VQKWAUROYFTROF-UHFFFAOYSA-N 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
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- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a LED illumination field discloses a LED lamp plate. The utility model discloses in, include: the LED light source comprises a substrate, a light gathering plate, an LED chip and a lens; the substrate is made of heat conducting material; the light-gathering plate is provided with a through hole and is arranged on the substrate; the LED chip is arranged in the through hole and is tightly attached to the substrate; the lens is formed by solidifying the transparent colloid after the whole through hole is filled with the transparent colloid. The utility model provides a present high-power LED lamp heat dissipation bad, the too big serious problem of light decay that causes of light outgoing medium. The LED lamp has the advantages of good heat dissipation effect, high light utilization rate, long service life and the like.
Description
Technical field
The utility model relates to the LED lighting field, particularly a kind of LED lamp plate.
Background technology
Substrate: form by circuit layer (copper foil layer), heat conductive insulating layer and metal-based layer.Circuit layer requires to have very big current capacity, thereby should use thicker Copper Foil, the general 35 μ m of thickness～280 μ m; The heat conductive insulating layer is the place of substrate core technology, and it generally is to be made up of the specific polymers that special cermacis is filled, and thermal resistance is little, and viscoelastic property is good, has the ability of resistant to thermal aging, can bear machinery and thermal stress; Metal-based layer is the supporting member of substrate, requires to have high-termal conductivity, and generally be aluminium sheet, also can use copper coin (wherein copper coin can provide better thermal conductivity), be suitable for conventional mechanical processing such as boring, punching and cutting.
The LED lens: change the optical system of the optical field distribution of LED, function is that the lighting angle with led light source converges the angle that light becomes to want arbitrarily, and the distribution of light field mainly can be divided into: circle, ellipse, rectangle etc.
Light-Emitting Diode (Light Emitting Diode is called for short " LED ") is a kind of semiconductor solid luminescence device.It is to utilize the solid semiconductor chip as luminescent material, in semiconductor, through carrier compound energy of emitting surplus takes place and causes photo emissions.The LED illuminating product utilizes LED as the produced ligthing paraphernalia of light source exactly.Light emitting diode is mainly formed by some kinds in these several kinds of elements of arsenic (AS) aluminium (AL) gallium (Ga) indium (IN) phosphorus (P) nitrogen (N) strontium (Si).
At present the LED illumination application more and more widely, but the LED heat radiation is the biggest factor that influences its life-span always.When increasing electric current raising brightness, the heat that LED produces also strengthens the damage of self thereupon.As shown in Figure 1, the lamp plate framework that present great power LED is combined into is generally the mode that single LEDs adds independent lens 1, and the LED LED heat radiating need pass through LED self package support 2, and the heat-conducting glue 4 between LED and aluminium base is transmitted on the aluminium base.This mode thermoresistance layer is many, and the LED heat can not timely and effectively shed, and heat conduction is obstructed and is caused the excessive light decay of LED heat to accelerate.And light need pass through LED self encapsulation silica gel, the air between LED lens and the collector lens, and three layers of medium of collector lens just can emit, and the light loss loss-rate is bigger.And between LED and the lens difference in height is arranged, light can not well be collected, and causes the light waste.
Summary of the invention
The purpose of the utility model is to provide a kind of LED lamp plate, and it is bad to have solved the heat radiation of present high-powered LED lamp, the excessive serious problem of light decay that causes of beam projecting medium.Have good heat dissipation effect, light utilization is high, advantages such as long service life.
For solving the problems of the technologies described above, the embodiment of the utility model provides a kind of LED lamp plate, comprising: substrate, solar panel, led chip and lens;
Substrate is processed by Heat Conduction Material;
Solar panel is provided with through hole, and places on the substrate;
Led chip places in the through hole, and is close on the substrate;
Lens are filled with whole through hole after coagulation by transparent colloid and are formed.
The utility model embodiment compared with prior art, the main distinction and effect thereof are:
Substrate is processed by Heat Conduction Material, and led chip is close on the substrate, so the heat of led chip can be directly conducted to power supply board, it is few to lead thermoresistance layer, and the LED heat can shed timely and effectively, possesses good performance of heat dissipation, has improved the life-span of LED widely.Simultaneously, fill with the through hole after coagulation through transparent colloid and form lens, the light of led chip only need be propagated through a kind of medium, and the light loss consumption is less, and light utilization is high.And do not have difference in height between LED and the solar panel basically, can collect light preferably, improved light utilization greatly.
Further, the through hole that contains LED and lens is a plurality of.A plurality of through holes can be arranged a plurality of led chips, can select quantity and the layout of corresponding LED according to design requirement, satisfy different brightness of illumination demands.
Further, the surface of through hole is an arc.This surperficial radian can change according to required spotlight effect, thereby realizes the rising angle requirement of LED lamp plate.
Further, through-hole surfaces has reflector layer, and reflector layer is smooth surface or matsurface.Luminescent layer can improve the light extraction efficiency of led chip.Reflector layer is a smooth surface, can realize through modes such as silver-plated, copper facing, and smooth surface has higher light reflectance, can improve light extraction efficiency.Reflector layer is a matsurface, then can increase the scattering of light through coarse surface.
Further, led chip directly places on the substrate of processing with Heat Conduction Material.This structure decrease diffusing thermoresistance layer, the LED heat can be in time and effectively discharge, and has better radiating effect.
Further, the surface of lens is circular arc, ellipse or double-peak shape.Lens surface shape difference can form different hot spots, thereby satisfies the designing requirement of different rising angles,
Further, the metal-based layer of substrate is processed by metal or ceramic material.The material of high thermal conductivity has good performance of heat dissipation, and the heat that can as early as possible led chip be produced when switching on sheds, and improves the service life of led chip.
Further, solar panel is processed by the material of high thermal conductivity, can have better radiating effect than general material.
Description of drawings
Fig. 1 is the structural representation of single LEDs chip in the prior art LED lamp plate;
Fig. 2 is the structural representation of a kind of single LEDs chip of LED lamp plate in the utility model first embodiment;
Fig. 3 is the stereogram of a kind of LED lamp plate in the utility model first embodiment;
Fig. 4 is the profile of a kind of LED lamp plate in the utility model first embodiment;
Fig. 5 is the vertical view of a kind of LED lamp plate in the utility model first embodiment.
The specific embodiment
In following narration, many ins and outs have been proposed in order to make the reader understand the application better.But, persons of ordinary skill in the art may appreciate that even without these ins and outs with based on the many variations and the modification of following each embodiment, also can realize each claim of the application technical scheme required for protection.
For the purpose, technical scheme and the advantage that make the utility model is clearer, will combine accompanying drawing that the embodiment of the utility model is done to describe in detail further below.
The utility model first embodiment relates to a kind of LED lamp plate.Fig. 2 is the structural representation of single LEDs chip of this LED lamp plate, and Fig. 3, Fig. 4, Fig. 5 are respectively stereogram, profile and the vertical views of this LED lamp plate.This LED lamp plate comprises: substrate 1, solar panel 2, led chip 4 and lens 3.
Led chip 4 places in the through hole 21, and is close on the substrate 1.
One of led chip 4 extremely directly or through lead is connected with substrate 1, and another utmost point passes through lead 5 and is connected with circuit in the substrate 1.
In addition, be appreciated that of led chip 4 extremely can directly be connected with substrate 1, another utmost point is connected with circuit in the substrate 1 through lead 5.Perhaps, the two-stage of led chip 4 can be connected with substrate 1 circuit through lead 5 respectively.
Through hole 21 is a plurality of, and a plurality of through holes 21 can be arranged a plurality of led chips 4, can select the quantity of corresponding LED according to design requirement, satisfies different brightness of illumination demands.
In addition, be appreciated that through hole 21 quantity of lamp plate also can be 1 certainly.Through hole 21 can adopt machining perhaps directly through injection mo(u)lding.
The surface of through hole 21 is an arc, and the radian of this arc can change according to required spotlight effect, thereby realizes the rising angle requirement of LED lamp plate.
In addition, be appreciated that in some other embodiment of the utility model, the surface of through hole 21 can not be a cambered surface also.
Through hole 21 surfaces have reflector layer 22, and reflector layer 22 is smooth surface or matsurface.Reflector layer 22 is a smooth surface, can realize through modes such as silver-plated, copper facing, and smooth surface has higher light reflectance, can improve light extraction efficiency.Reflector layer 21 is a matsurface, then can increase the scattering of light through coarse surface.
In addition, be appreciated that in some other embodiment of the utility model also can not have this reflector layer 22.
Led chip 4 directly places on the substrate 1.Led chip 4 directly places on the substrate of processing with Heat Conduction Material 1, has reduced diffusing thermoresistance layer, and the LED heat can in time and effectively be discharged, and has better radiating effect.
In addition, be appreciated that glue fixing that led chip 4 also can be through high thermal conductivity on substrate, earlier with the glue fixing led chip, adds silica gel again in through hole, led chip is difficult for displacement in process, processes more or less freely.
The surface 31 of lens 3 is circular arc, ellipse or double-peak shape.The surface 31 shape differences of lens 3 can form different hot spots, thereby satisfy the designing requirement of different rising angles, and the surface configuration of lens 3 can form when the glue solidifies through additional suitable mold to through hole 21 perfusion glue the time naturally.
In addition, the rising angle that is appreciated that lens 3 is by the lonely face 31 of lens, 32 decisions of lens cambered surface height.Surface 31 shapes of lens 3 are not limited to circular arc, ellipse or double-peak shape.As long as satisfy the rising angle requirement of LED etc., all belong to the protection domain of the utility model.During design; Can confirm the quantity of the LED and the respective angles LED of equal angular or multiple different angles according to user's request; Carry out the arc 31 and height 32 of optical analog design lens 3 then, solar panel 2 is realized required LED rising angle through the arc of through hole 21 cambered surfaces.
The metal-based layer of substrate 1 is processed by the ceramic material of metal or heat conduction.The material of high thermal conductivity has good performance of heat dissipation, and the heat that can as early as possible led chip 4 be produced when switching on sheds, and improves the service life of led chip 4.
In addition, the metal-based layer that is appreciated that substrate 1 can be processed by the material of the high thermal conductivities such as pottery of metal materials such as aluminium, copper, iron or heat conduction.
In addition, be appreciated that solar panel 2 can process with the material of high thermal conductivity, like materials such as copper, iron, aluminium.Perhaps also can process with general materials such as plastics.Solar panel 2 can be bonding through high temperature glue with substrate 1, also can connect through mechanical systems such as screws.
The material of lens 3 is a silica gel, in some other embodiment of the utility model, also can adopt other transparent colloids.Lens 3 adopt silica gel that solar panel through hole 21 is filled via particular mold, and high temperature solidifies and forms then, and becomes as a whole with the radian of solar panel through hole 21, makes it satisfy certain shooting angle requirement.
Though through some preferred implementation with reference to the utility model; The utility model is illustrated and describes; But those of ordinary skill in the art should be understood that and can do various changes to it in form with on the details, and do not depart from the spirit and the scope of the utility model.
Claims (10)
1. a LED lamp plate is characterized in that, comprising: substrate, solar panel, led chip and lens;
Said substrate is processed by Heat Conduction Material;
Said solar panel is provided with through hole, and places on the said substrate;
Said led chip places in the said through hole, and is close on the said substrate;
Said lens are filled with whole said through hole after coagulation by transparent colloid and are formed.
2. LED lamp plate according to claim 1 is characterized in that, one of said led chip extremely directly or through lead is connected with said substrate, and another utmost point passes through lead and is connected with circuit in the said substrate.
3. LED lamp plate according to claim 1 is characterized in that,
A plurality of through holes are arranged on the said solar panel, the led chip that is close on the said substrate is all arranged in each through hole and fill with the lens that whole through hole after coagulation forms by transparent colloid.
4. LED lamp plate according to claim 1 is characterized in that, the surface of said through hole is an arc.
5. according to each described LED lamp plate in the claim 1 to 4, it is characterized in that said through-hole surfaces has reflector layer, said reflector layer is smooth surface or matsurface.
6. according to each described LED lamp plate in the claim 1 to 4, it is characterized in that said led chip directly places on the substrate.
7. according to each described LED lamp plate in the claim 1 to 4, it is characterized in that the surface of said lens is circular arc, ellipse or double-peak shape.
8. according to each described LED lamp plate in the claim 1 to 4, it is characterized in that the metal-based layer of said substrate is processed by the ceramic material of metal or heat conduction.
9. according to each described LED lamp plate in the claim 1 to 4, it is characterized in that said solar panel is processed by the material of high thermal conductivity.
10. according to each described LED lamp plate in the claim 1 to 4, it is characterized in that the material of said lens is a silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203244565U CN202252981U (en) | 2011-08-31 | 2011-08-31 | Led lamp panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203244565U CN202252981U (en) | 2011-08-31 | 2011-08-31 | Led lamp panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202252981U true CN202252981U (en) | 2012-05-30 |
Family
ID=46114222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203244565U Expired - Lifetime CN202252981U (en) | 2011-08-31 | 2011-08-31 | Led lamp panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202252981U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102278647A (en) * | 2011-08-31 | 2011-12-14 | 杭州海康威视数字技术股份有限公司 | LED (light-emitting diode) lamp panel |
| CN115016201A (en) * | 2022-06-17 | 2022-09-06 | 杭州海康威视数字技术股份有限公司 | Zoom camera light supplementing system |
-
2011
- 2011-08-31 CN CN2011203244565U patent/CN202252981U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102278647A (en) * | 2011-08-31 | 2011-12-14 | 杭州海康威视数字技术股份有限公司 | LED (light-emitting diode) lamp panel |
| CN102278647B (en) * | 2011-08-31 | 2014-02-26 | 杭州海康威视数字技术股份有限公司 | LED (light-emitting diode) lamp panel |
| CN115016201A (en) * | 2022-06-17 | 2022-09-06 | 杭州海康威视数字技术股份有限公司 | Zoom camera light supplementing system |
| CN115016201B (en) * | 2022-06-17 | 2023-09-29 | 杭州海康威视数字技术股份有限公司 | Light supplementing system for zoom camera |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120530 Effective date of abandoning: 20140226 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20120530 Effective date of abandoning: 20140226 |
|
| RGAV | Abandon patent right to avoid regrant |