CN201122588Y - High heat conductivity metal heat sink for light emitting diode - Google Patents
High heat conductivity metal heat sink for light emitting diode Download PDFInfo
- Publication number
- CN201122588Y CN201122588Y CNU2007200089701U CN200720008970U CN201122588Y CN 201122588 Y CN201122588 Y CN 201122588Y CN U2007200089701 U CNU2007200089701 U CN U2007200089701U CN 200720008970 U CN200720008970 U CN 200720008970U CN 201122588 Y CN201122588 Y CN 201122588Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- light emitting
- light
- heat sink
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a metal heat sink provided with high thermal conductivity and used for a light emitting diode. The utility model is characterized in that the heat sink comprises a vertical type metal sheet with high thermal conductivity which presents a continuously fluctuant wave shape in the length direction, and a plurality of longitudinal arc-shaped grooves arranged at intervals along the length direction are arranged on the surface of the vertical type metal sheet. The light emitting diode conducts heat and connects electrodes by utilizing the wave-shaped metal sheet with high thermal conductivity, the longitudinal arc grooves on the mental surface of the metal sheet are convenient for the positioning and the installation of the light emitting diode, massive thermal energy generated by the light emitting diode is evacuated and eliminated through the metal sheet in time, the thermal conductivity of the metal sheet is good, the heat radiating passage is smooth, and the thermal resistance is small, therefore, the junction temperature of the light emitting diode is low, so that the light emitting performance of the light emitting diode is better guaranteed, the service life thereof is prolonged, and the energy consumption is greatly reduced.
Description
Technical field
The utility model relates to the led technology field, specifically is the effective high-termal conductivity metal heat sink of a kind of light-emitting diodes.
Background technology
With reference to Fig. 1, Fig. 2.Common light-emitting diode (LED) device is that light-emitting diode 4 is fixedly mounted on the circuit board (PCB or aluminium wiring board) 5, again circuit board 5 is utilized insulating cement to be fixed on the radiating seat (not shown) of high-cooling property, the P of light-emitting diode 4, N electrode terminal electrically connect with the counter electrode district 51,52 of circuit board 5 respectively, external circuit imposes direct current by P, the N level of 51,52 pairs of light-emitting diodes 4 of circuit board 5 electrode districts, impels light-emitting diode 4 to produce brightness.The heat that light-emitting diode 4 produces is got rid of by radiating seat after circuit board 5 transmits.But, because printed circuit board (PCB) 5 is non-high heat conductive body, its thermal conductivity coefficient is low, heat dispersion is poor, particularly a large amount of heat energy of the power type LED light source generation of most light-emitting diode concentrating type encapsulation compositions can't in time be dredged and be got rid of, directly cause junction temperature of light emitting diode to raise, light source hot polymerization effect and thermal resistance are excessive, cause light-emitting diode short and light decay phenomenon in useful life, and therefore improve energy consumption.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of light-emitting diodes effective high-termal conductivity metal heat sink, solve existing LED light fixture because of dispel the heat bad cause shorten useful life, light decay and the high deficiency of power consumption.
Purpose of the present invention is achieved through the following technical solutions:
The high-termal conductivity metal heat sink that a kind of light-emitting diodes is effective, it is characterized in that: heat sinkly comprise that a length direction is the corrugated high-termal conductivity vertical metal of continuous fluctuating sheet, has a plurality of spaced apart along its length vertical arc grooves on the surface of this vertical metal sheet.
Above-mentioned sheet metal has one section transverse incision to the groove bottom middle part correspondence of the vertical arc groove of small part, and the sheet metal of bottom inwardly is pressed into the arc little groove relative with the arc groove bottom land on cross sections top between the transverse incision two ends; The upper and lower limit of each transverse incision surrounds the perforation of passing for the light-emitting diode leg.The sizableness of perforation and light-emitting diode leg is so that accurate catching diode.
The groove bottom middle part of all vertical arc grooves of described high-termal conductivity sheet metal all has one section transverse incision.
The two ends of described sheet metal are respectively equipped with clasp.
The occupation mode of above-mentioned metal heat sink: the insulating trip that sets up a vertical layout, the above-mentioned high-termal conductivity sheet metal of corresponding installing mutually insulated on two facades of insulating trip, the sheet metal convex arc facade of insulating trip both sides is close to corresponding insulating trip facade in opposite directions, it is fixing with the sheet metal welding that two leg of light-emitting diode are passed the correspondence perforation back of both sides sheet metal respectively, and the sheet metal of both sides electrically connects as P, N electrode district and external power source respectively.Light-emitting diode carries out heat conduction by sheet metal and electrode connects, rational in infrastructure, be convenient to the location and installation of light-emitting diode, a large amount of heat energy that light-emitting diode produces are directly dredged by sheet metal and are got rid of, and corrugated high-termal conductivity sheet metal radiating surface is big, heat-conductive characteristic is good, heat dissipation channel is unimpeded, thermal resistance is little, and junction temperature of light emitting diode is low, ensures the luminescent properties of light-emitting diode well, prolong the useful life of light-emitting diode, cut down the consumption of energy greatly.
Description of drawings
Below in conjunction with accompanying drawing the present invention is described in further detail.
Fig. 1 is the structural representation of existing light-emitting diode assembly.
Fig. 2 is the vertical view of the substrate among Fig. 1.
Fig. 3 is the schematic perspective view of the utility model first embodiment.
Fig. 4 is the user mode vertical view of the utility model first embodiment.
Fig. 5 is the cutaway view along A-A direction among Fig. 4.
Fig. 6 is the schematic perspective view of the utility model second embodiment.
Fig. 7 is the vertical view of Fig. 6.
Fig. 8 is the user mode cutaway view of the utility model second embodiment.
Embodiment
Embodiment 1: with reference to Fig. 3.The high-termal conductivity metal heat sink that a kind of light-emitting diodes is effective, this is heat sink to comprise that a length direction is the corrugated high-termal conductivity vertical metal of continuous fluctuating sheet 1, has a plurality of spaced apart along its length vertical arc grooves 11 on the surface of this vertical metal sheet 1.The two ends of sheet metal 1 are respectively equipped with the clasp 12 (figure only illustrates an end) that is used for installing and fixing.Sheet metal 1 adopts aluminium, copper or the aluminum copper alloy material of high-termal conductivity to make.
The installation of above-mentioned metal heat sink, occupation mode: with reference to Fig. 4, Fig. 5.Set up the insulating trip 2 of a vertical layout, install the sheet metal 1 of high-termal conductivity respectively at two side elevations of insulating trip 2, two-supremes conductive metal sheet 1 is corresponding vertical to be installed on two facades of insulation board 2 and vertical arc groove 11 positioned opposite of both sides sheet metal 1, and correspondence is provided with catching groove 21 on insulation board 2, both sides sheet metal 1,1 is snapped in the catching groove 21 by the clasp 12 of end respectively, sheet metal 1,1 mutually insulated of both sides.For guaranteeing the fastness of structure, can fix with gluing at the insulating trip 2 and the contact site of sheet metal 1, sheet metal 1 is close on the corresponding facade of insulating trip 2.The spacing of two leg 41,42 of spacing between the bottom land of corresponding vertical arc groove 11 of both sides sheet metal 1,1 and light-emitting diode 4 is suitable.Two leg 41,42 of light-emitting diode 4 are respectively by welding or gluing on corresponding vertically arc groove 11 groove bottom of two metal sheets 1,1, make the leg 41,42 of light-emitting diode 4 form reliable the electrical connection with corresponding sheet metal 1, metal backing 1,1 and external power source are connected to light-emitting diode 4 electric current are provided.Sheet metal 1 plays thermolysis, and the P electrode, the N electrode that also are electrically connected with external power source as light-emitting diode 4 respectively simultaneously are rational in infrastructure, and light-emitting diode 4 location are convenient, and waveform sheet metal 1 is big with outside contact area, perfect heat-dissipating.
Embodiment 2: with reference to Fig. 6, Fig. 7, Fig. 8.Present embodiment is as different from Example 1:
With reference to Fig. 6, Fig. 7.The groove bottom middle part correspondence of the vertical arc groove 11 of all of sheet metal 1 has one section transverse incision 13, and the sheet metal of bottom inwardly is pressed into the arc little groove 14 relative with the arc groove bottom land on cross sections 13 tops between each transverse incision 13 two ends; After little groove 14 moulding of arc, the upper and lower limit of each transverse incision 13 surrounds the perforation 3 (seeing Fig. 7 for details) of passing for light-emitting diode 4 leg.The sizableness of perforation 3 and light-emitting diode leg is so that accurate catching diode.The two ends of sheet metal 1 are provided with the clasp 12 that is used to install and fix equally.All the other structures are identical with embodiment 1, do not repeat them here.With reference to Fig. 8, its installation, occupation mode are identical substantially with embodiment 1: will get on corresponding two facades that are installed in insulating trip 2 of sheet metal that two present embodiments provide 1,1 and vertical arc groove 11 positioned opposite of two metal sheets 1, sheet metal 1,1 mutually insulated of both sides.After two leg 41,42 of light-emitting diode 4 are passed the correspondence perforation 3 of both sides sheet metal 1,1 respectively, the leg 41,42 of light-emitting diode 4 firmly reliably is electrically connected by welding or gluing formation with corresponding metal backing, and metal backing 1,1 and external power source are connected to light-emitting diode 4 electric current are provided.Present embodiment utilization perforation location light-emitting diode 4, it is more accurate, reliable to locate, and installs simple and convenient.
The above, it only is the utility model preferred embodiment, so can not limit the scope that the utility model is implemented with this, i.e. the equivalence of doing according to the application's claim and description changes and modifies, and all should still belong in the scope that the utility model patent contains.
Claims (4)
1, the effective high-termal conductivity metal heat sink of a kind of light-emitting diodes, it is characterized in that: heat sinkly comprise that a length direction is the corrugated high-termal conductivity vertical metal of continuous fluctuating sheet, has a plurality of spaced apart along its length vertical arc grooves on the surface of this vertical metal sheet.
2, high-termal conductivity metal heat sink according to claim 1, it is characterized in that: described sheet metal has one section transverse incision to the groove bottom middle part correspondence of the vertical arc groove of small part, and the sheet metal of bottom inwardly is pressed into the arc little groove relative with the arc groove bottom land on cross sections top between the transverse incision two ends; The upper and lower limit of each transverse incision surrounds the perforation of passing for the light-emitting diode leg, and the sizableness of perforation and light-emitting diode leg is so that accurate catching diode.
3, high-termal conductivity metal heat sink according to claim 2 is characterized in that: the groove bottom middle part of all vertical arc grooves of described high-termal conductivity sheet metal all has one section transverse incision.
4, according to claim 1,2,3 arbitrary described high-termal conductivity metal heat sinks, it is characterized in that: the two ends of described sheet metal are respectively equipped with clasp.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007200089701U CN201122588Y (en) | 2007-11-30 | 2007-11-30 | High heat conductivity metal heat sink for light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007200089701U CN201122588Y (en) | 2007-11-30 | 2007-11-30 | High heat conductivity metal heat sink for light emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201122588Y true CN201122588Y (en) | 2008-09-24 |
Family
ID=40009828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2007200089701U Expired - Fee Related CN201122588Y (en) | 2007-11-30 | 2007-11-30 | High heat conductivity metal heat sink for light emitting diode |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201122588Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102588927A (en) * | 2012-03-27 | 2012-07-18 | 朱丽华 | LED radiator and lamp |
-
2007
- 2007-11-30 CN CNU2007200089701U patent/CN201122588Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102588927A (en) * | 2012-03-27 | 2012-07-18 | 朱丽华 | LED radiator and lamp |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101334155A (en) | High radiation led lamp radiating module | |
CN201401765Y (en) | Radiating module used for light-emitting diode lamp | |
CN102537747A (en) | Led lamp strip | |
CN201141526Y (en) | Novel LED daylight lamp | |
CN101252157A (en) | Encapsulation structure of LED light source | |
CN201599745U (en) | LED lamp and substrate thereof | |
CN201053654Y (en) | Large power LED direct touch type heat-conductive circuit board | |
CN201215303Y (en) | Radiating module of high heat radiation LED lamp | |
CN201122588Y (en) | High heat conductivity metal heat sink for light emitting diode | |
CN204986521U (en) | Light -emitting diode device | |
CN201466057U (en) | High-power led circuit board | |
CN201339833Y (en) | Packaging structure of surface package type light emitting diode lamp | |
CN201190965Y (en) | Surface type led lamp | |
CN100557300C (en) | The led lamp substrate of high-cooling property | |
CN100567809C (en) | The surface type of high-cooling property (SMD) led lamp | |
CN201121859Y (en) | High cooling property led lamp substrates | |
CN201166324Y (en) | Encapsulated circuit using LED chip light fitting | |
CN102403444A (en) | Heat radiation structure of high-power LED | |
CN201518324U (en) | Aluminum base plate without thermal resistance | |
CN201237099Y (en) | LED light source module | |
CN210576020U (en) | Green's thermoelectric separation base plate | |
CN202839737U (en) | Infrared COB light source module | |
CN201066102Y (en) | Large power LED lamp support | |
CN202352730U (en) | Radiating structure for large-power LED (Light-emitting Diode) | |
CN201964221U (en) | Waterproof LED (light-emitting diode) lamp strip |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080924 Termination date: 20141130 |
|
EXPY | Termination of patent right or utility model |