CN1187655C - Retaining device for photo blanks - Google Patents

Retaining device for photo blanks Download PDF

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Publication number
CN1187655C
CN1187655C CNB998060275A CN99806027A CN1187655C CN 1187655 C CN1187655 C CN 1187655C CN B998060275 A CNB998060275 A CN B998060275A CN 99806027 A CN99806027 A CN 99806027A CN 1187655 C CN1187655 C CN 1187655C
Authority
CN
China
Prior art keywords
photo blanks
photo
spring plank
blanks
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998060275A
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Chinese (zh)
Other versions
CN1300384A (en
Inventor
G·戈德尔
A·厄尔曼
G·翁格尔
W·贝森贝克
A·雷特尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of CN1300384A publication Critical patent/CN1300384A/en
Application granted granted Critical
Publication of CN1187655C publication Critical patent/CN1187655C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/40—Electrostatic discharge [ESD] related features, e.g. antistatic coatings or a conductive metal layer around the periphery of the mask substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electron Beam Exposure (AREA)

Abstract

A retaining device for photo blanks, comprising a retaining member (1) with a supporting surface (3) for a photo blank (4) and a ground element (10) which can be brought into contact with an electroconductive layer (6) of said photo blank. The ground element is provided with a contact tip (15) which can be manipulated in such a way that it can be lowered substantially onto the photo blank (4) without any lateral movement in relation to said photo blank which is inserted into the retaining device.

Description

The method of photo blanks ground connection in holding device
Technical field
The present invention relates to a kind of method that is used for the holding device of photo blanks and makes the photo blanks ground connection of using at this device.
Background technology
When being used for the photomask of photoetching process, manufacturing will use as raw-material so-called photo blanks.This photo blanks relates to the quartz plate of polishing, this quartz plate scribble a chromium layer and be arranged on the chromium layer by optical cement form the layer.This photo blanks will make required mask graph transfer on this photo blanks with the electron beam irradiation in an electron beam recording apparatus thus.The necessary ground connection of photo blanks between this light period, because otherwise may form static at its surf zone, the electron beam when this can map to mask produces undesirable influence.
Known: for the ground connection of photo blanks, use a kind of ground spring, this spring is set at when irradiation and places in the box of photo blanks.When being loaded into photo blanks in the box, photo blanks be moved to ground spring below, wherein this spring forms with their under the situation of local damage optical cement layer and chromium layer and electrically contacts.In the case disadvantageously, when damaging, these layers will cause the formation of particle.These particles may form the covering of electron beam or make its distortion, and this just causes the formation in chromium district (chromium point) and site error occurs.This repairing that has the mask of error just might or be impossible when the big spending of cost only at all.When chromium point occurring, dechromise some the danger of the damage adjacent structure that so certain existence is big by laser beam by evaporating to remove aiming on the repairing facility of this design; Because the site error that the distortion of electron beam forms is unmendable.
Another shortcoming of this known ground spring is, tends to occur uncertainly electrically contact, and this can cause bad ground connection.This also can cause the mistake location of electron beam and cause unmendable defects on mask thus.
Summary of the invention
Task of the present invention is, the earthing method of a kind of photo blanks at holding device is provided, and can improve the yield rate of faultless mask during fabrication by the use of this method.
A technical solution of above-mentioned task is the earthing method of a kind of photo blanks in a holding device, this photo blanks is provided with a chromium layer, in the method, at first photo blanks is positioned on the carrying plane of holding device, make then and be contained in a top surface of the contact on the spring plank and be moved down on the photo blanks perpendicular to photo blanks, wherein: make on the surface that drops to photo blanks by being connected with spring plank with contacting top Be Controlled, the adjusting screw that constitutes scalable backstop on the holding device is regulated one and is determined amount, makes thus on the top surface that drops to photo blanks of contact and is pressed in the surface that pressure is pressed into photo blanks with predetermined.
By relatively moving and to realize will contacting the top side direction of avoiding contacting between top and the photo blanks when low of moving: can avoid breaking and getting rid of the formation of undesirable particle thus largely of layer ingredient in the time of will contacting top placement and be pressed in the superficial layer of photo blanks largely.Jie Chu formation is to form by contacting in the top surface region layer that is pressed onto photo blanks with no damage over the ground, has avoided thus in this lip-deep any " scratch ".
Another substantial advantage of the present invention is: can cause forming a kind of definite reaching reliable electrical contact and cause simultaneously good ground connection thus by ground unit of the present invention.
According to a kind of preferred implementing form of the present invention, ground unit is constituted as at the one end can be fixed on the spring plank that keeps on the body and be provided with the contact spring at its other end.In the case, being characterized as of a kind of advantageous embodiment: this spring plank is not having a flexibility under the pressured state, on this flexibility, spring plank on its longitudinal extension with an angle [alpha] by be offset under the alignment always.Wherein under the situation that suitably selected angle α, spring plank size and suitable material are selected, the spring performance of spring plank can be adjusted as required.
In addition, advantageously, be provided with a position adjusting mechanism on spring plank, it constitutes an adjustable backstop on the holding device.Can predeterminedly definitely on photo blanks, contact top stroke in this way, also can control top moving down by operating this position mechanism.
Contact toply preferably by the hard material with good conductance, especially a kind of hard metal constitutes.Can guarantee top height degree of resistance to wearing and high resistance to deformation degree and its small resistor thus.
According to a kind of preferred embodiment, it is top that this contacts the many seamed edges of top formation, and wherein at least one seamed edge is a sword limit.Thus, can reach on the one hand, large-area relatively surface of contact is provided between seamed edge, can keep little transition resistance whereby and improve reproducibility.On the other hand, the sharp keen property by the sword limit can guarantee top being cut in the superficial layer, can obviously reduce whereby to invade the danger that the composition of layer that causes peels off by horizontal material.
Though single ground unit has just been set up enough ground connection actually substantially, will further improve the ground connection reliability and reach the corresponding earth fault of minimizing by a plurality of ground units are set.
A kind of preferred form of implementation according to the present invention at first is fixed on photo blanks on the holding device on its final position, and then moves down on the direction vertical with the plane of surface of contact substantially the contact of ground unit is top.
Description of drawings
Describe the present invention by an embodiment in the mode of demonstrating hereinafter with reference to accompanying drawing.Accompanying drawing is:
Fig. 1 has the photo blanks of putting into and is provided with the cross-sectional view of a band spring plank and a box that contacts top ground connection spring;
The vertical view that installs shown in Fig. 2 Fig. 1;
The sectional view of spring plank among Fig. 3 a Fig. 1;
The vertical view of spring plank shown in Fig. 3 b Fig. 3 a;
The vertical view in the top zone of contact of ground connection spring among Fig. 4 a Fig. 1; And
The side view in the top zone of ground connection spring shown in Fig. 4 b Fig. 4 a.
Embodiment
According to Fig. 1, be used for the box that a photo blanks remains on mask drawing device (electron-beam recorder MEBES) is had the holding plate 1 of a band concavity 2.The upper surface of this concavity 2 constitutes the carrying plane 3 of photo blanks 4.Photo blanks 4 comprises the quartz plate 5 of a polishing, and the metal level that about 100nm is thick on this plate surface is as a chromium layer 6 and be arranged in the thick optical cement layer 7 of about 400mm on the chromium layer.Arrow X represents to be used for the direction of electron beam aiming on photo blanks of mask drawing.
Photo blanks 4 will be located by being pressed on the carrying plane 3 by a low level retainer 8 that is fixed on the holding plate 1.For this reason, this low level retainer 8 has a hemispheric fixture 9 in its end of leaving holding plate, and it for example can be formed and constituted in fact point-like contact area with photo blanks 4 surfaces by sapphire.
The available mode of not representing in the drawings is provided with a plurality of such low level retainers 8 on holding plate 1.
Be provided with a ground spring 10, be used to make the chromium layer 6 of photo blanks 4 and holding plate 1 formation to electrically contact.Ground spring 10 is made up of a spring plank 12 in fact, and this spring plank mechanically is fixed on the metal holding plate 1 with the favorable conductive contact by two connecting screws 11.This spring plank 12 is basically parallel to surface 13 extensions of holding plate 1 and stretches on the concavity 2 of holding plate 1 with its free end 14.It is top 15 to be provided with a contact on this free end 14, and this is top for example to can be taper or constitute many seamed edges as illustrated in fig. 1 top, and forms good electrical contact with chromium layer 6.Therefore, this chromium layer 6 is placed on the earth potential of holding plate 1 by ground spring 10.
Near the ledge structure 16 of concavity 2, this spring plank 12 also is provided with a screw 17, is screwed with the adjusting screw 18 of a band teflon coating in this hole.This adjusting screw 18 is pressed on the surface 13 of holding plate 1 with its screw side, can carry out point-device adjusting to contacting top 15 height on quartz plate 5 so that the rotation by adjusting screw 18 is regulated.
The front elevation of holding device shown in Fig. 2 presentation graphs 1.Though here low level retainer 8 and ground spring 10 are adjacent to arrange, these parts equally can apart big distance.
Working method according to holding device of the present invention is as follows:
At first photo blanks 4 is placed in the depression 2 of holding plate 1.Not only from holding plate 1, to pull down low level retainer 8 but also will pull down ground spring 10 in advance for this reason, so that depression 2 can freely be entered.After placing photo blanks 4, it will be fixed on its position by low level retainer 8 relative holding plates 1.Then carry out the ground connection of photo blanks 4 by installation ground spring 10.For this reason, regularly be screwed in holding plate 1 on by two connecting screws 11 spring plank 12 or be screwed in be located on the holding plate 1 space the seat 20 on.It should be noted that in the case contacting top 15 constantly at this can't contact with the surface formation of photo blanks 4.For example can guarantee like this this, adjusting screw 18 is screwed into long enough in the screw 17 before promptly on being installed to the seat that spaces.Another possibility is, utilizes the elasticity of spring plank 12 as best one can and makes contact top 15 be kept away from the surface of photo blanks 4 by suitable servicing unit when assembling.
After connecting screw 11 has been installed, will contact top 15 surfaces towards photo blanks 4 be moved down with monitor mode.It is achieved in that soon adjusting screw 18 is moved back definite amount of back-outing from screw 17 under described first kind of situation.Make contact top 15 drop on the surface of photo blanks 4 thus and be pressed in its two upper stratas 6 and 7.Its pressure will be determined by the distortion elasticity of spring plank 12 in the case, and this elasticity depends on that the configuration of material, size and the selection of spring plank 12 (sees Fig. 3 a), and can the change by these parameters come predetermined.Verified, electrically contact even under relatively little contact pressure, also can reach with the lasting and reproducible of chromium layer 6.This is very important, because especially can make photo blanks undesirable deflection occur by exerting pressure under the situation of glimmer mask blank.Therefore consider, make the warp resistance intensity of contact pressure apparent thickness or used photo blanks and the fixed adjusting that continues to do trace, so that avoid the deflection of photo blanks reliably.
Described second kind of possibility (by servicing unit decline contact top 15) has its advantage, promptly do not need to rotate adjusting screw in this process.Therefore can very accurately keep in touch top 15 final required stroke dimensionally by pre-determined bit adjusting screw 18 accurately.
Importantly, relatively move in the side direction of placing photo blanks 4 when top and contact between top 15 all avoiding effectively under this dual mode.
Fig. 3 a represents a kind of suitable possible configuration of spring plank 12 under passive state.Be to constitute a crankle 19 between the hole 21 that is provided with of connecting screw 11 and the screw 17 wherein, from the angle [alpha] of the curved next one of spring plank 12 relative its rectilinear directions between 2 ° and 15 ° here.Angle [alpha] for example can be 5 °.
Spring plank 12 can be made up of CuSn alloy (bronze), for example by the CuBe alloy composition with 6%Sn share.
The free end 14 of in Fig. 4 a and 4b, having represented spring plank 12 enlargedly.Spring plank 12 has a hole 22 at its free end 14, is pressed into the contact top 15 of a pin shape in this hole.Contact top 15 can be fixed with conducting resinl in the scope in hole 22.By press fit and set up conducting resinl in case of necessity and can and contact between top 15 the electrical connection that realizes little resistance at spring plank 12.
Contact top 15 and constitute three seamed edge tips in its front region, wherein each of three seamed edges arranged with 120 ° angle each other.Top 15 have a sharp keen and carrot-free fine gtinding part.About 30 ° of the inclined of a sword face 23 relative contacts top 15 that wherein between two sword limits, constitute.
Contact top 15 and preferably be made up of the hard metal of GTD type, it has high rigidity and excellent conducting performance, does not comprise the magnetic-field component that projection is disturbed to electron beam.

Claims (5)

1. the earthing method of photo blanks (4) in a holding device (1), this photo blanks (4) is provided with a chromium layer (6), in the method, at first photo blanks (4) is positioned on the carrying plane (3) of holding device (1), the contact that is contained on the spring plank (12) top (15) is moved down on the photo blanks (4) perpendicular to the surface of photo blanks (4), it is characterized in that: make on the surface that drops to photo blanks (4) by being connected with spring plank (12) with contacting top (15) Be Controlled, constitute holding device (1) and go up the adjusting screw (18) of scalable backstop and regulate one and determine amount, contact top (15) is dropped on the surface of photo blanks (4) and be pressed in the surface that pressure is pressed into photo blanks (4) with predetermined.
2. according to the method for claim 1, it is characterized in that: before spring plank (12) being installed on the holding device (1), make adjusting screw (18) be screwed into long enough in the screw (17) of spring plank (12), with the distance between the surface that guarantees contact top (15) and photo blanks (4).
3. according to the method for claim 1 or 2, it is characterized in that: for the position of stationary photomask base (4), a low level retainer (8) has been installed on holding device (1) at least, and it is by acting on the lip-deep pressure fixing of photo blanks (4) ground clamping photo blanks (4).
4. according to the method for claim 1 or 2, it is characterized in that: spring plank (12) has a crankle (19) under pressure-less state, departs from angle [alpha] of a rectilinear direction from spring plank (12) here at its longitudinal length.
5. according to the method for claim 4, it is characterized in that: angle [alpha] is between 2 ° and 15 °.
CNB998060275A 1998-03-13 1999-03-11 Retaining device for photo blanks Expired - Fee Related CN1187655C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19811081A DE19811081C1 (en) 1998-03-13 1998-03-13 Holding device for photoblanks
DE19811081.2 1998-03-13

Publications (2)

Publication Number Publication Date
CN1300384A CN1300384A (en) 2001-06-20
CN1187655C true CN1187655C (en) 2005-02-02

Family

ID=7860879

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998060275A Expired - Fee Related CN1187655C (en) 1998-03-13 1999-03-11 Retaining device for photo blanks

Country Status (7)

Country Link
US (1) US6972832B1 (en)
EP (1) EP1078301A1 (en)
JP (1) JP2002507768A (en)
KR (1) KR20010041845A (en)
CN (1) CN1187655C (en)
DE (1) DE19811081C1 (en)
WO (1) WO1999047977A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106104583A (en) * 2013-11-05 2016-11-09 伊利诺斯工具制品有限公司 For forming laminated board component and the manufacture method thereof of multiple individual card

Families Citing this family (2)

* Cited by examiner, † Cited by third party
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US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
CN108073035A (en) * 2016-11-08 2018-05-25 中芯国际集成电路制造(上海)有限公司 A kind of restorative procedure of lithography mask version and lithography mask version defect

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59114818A (en) * 1982-12-21 1984-07-03 Toshiba Corp Electron beam pattern drawing method
JPH07114182B2 (en) * 1987-03-10 1995-12-06 富士通株式会社 Method for producing dry plate in charged particle beam exposure
JPH0668240B2 (en) 1988-01-21 1994-08-31 佐藤工業株式会社 Concrete pouring equipment
JPH01187926A (en) * 1988-01-22 1989-07-27 Nec Corp Manufacture of mask and reticle
JPH01217349A (en) * 1988-02-25 1989-08-30 Dainippon Printing Co Ltd Blank plate, photomask using blank plate, and their manufacture
JPH0230047A (en) * 1988-07-18 1990-01-31 Nec Corp Sample holder for electron beam exposure device
JPH02125416A (en) * 1988-11-02 1990-05-14 Nec Corp Electron beam exposure system
JPH02125607A (en) * 1988-11-04 1990-05-14 Nec Corp Sample holder for electron beam drawing equipment
JPH03263814A (en) * 1990-03-14 1991-11-25 Matsushita Electron Corp Method for continuity to specimen
JPH04353848A (en) * 1991-05-31 1992-12-08 Fujitsu Ltd Production of mask
US5843623A (en) * 1996-09-10 1998-12-01 International Business Machines Corporation Low profile substrate ground probe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106104583A (en) * 2013-11-05 2016-11-09 伊利诺斯工具制品有限公司 For forming laminated board component and the manufacture method thereof of multiple individual card
CN106104583B (en) * 2013-11-05 2020-01-07 伊利诺斯工具制品有限公司 Composite laminate assembly for forming a plurality of individual cards and method of making same

Also Published As

Publication number Publication date
JP2002507768A (en) 2002-03-12
WO1999047977A1 (en) 1999-09-23
CN1300384A (en) 2001-06-20
KR20010041845A (en) 2001-05-25
US6972832B1 (en) 2005-12-06
EP1078301A1 (en) 2001-02-28
DE19811081C1 (en) 1999-10-28

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