CN117450883B - Quick measuring method for vertical probe - Google Patents

Quick measuring method for vertical probe Download PDF

Info

Publication number
CN117450883B
CN117450883B CN202311808416.1A CN202311808416A CN117450883B CN 117450883 B CN117450883 B CN 117450883B CN 202311808416 A CN202311808416 A CN 202311808416A CN 117450883 B CN117450883 B CN 117450883B
Authority
CN
China
Prior art keywords
vertical
segment
vertical probe
probe
needle head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202311808416.1A
Other languages
Chinese (zh)
Other versions
CN117450883A (en
Inventor
蒋文德
王海波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Doctor Technology Co ltd
Original Assignee
Shenzhen Doctor Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Doctor Technology Co ltd filed Critical Shenzhen Doctor Technology Co ltd
Priority to CN202311808416.1A priority Critical patent/CN117450883B/en
Publication of CN117450883A publication Critical patent/CN117450883A/en
Application granted granted Critical
Publication of CN117450883B publication Critical patent/CN117450883B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/004Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/02Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00Testing or calibrating of apparatus covered by the other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention relates to a quick measurement method of a vertical probe, which comprises a tip section, a circular arc section and a needle head section, wherein the three sections are connected into a whole. The method comprises the steps of using a square grid array and a 3D tester to perform full measurement on vertical probes, using a rectangular coordinate system of the 3D tester to measure pattern coordinates of the vertical probes in the 3D tester, using the 3D tester to obtain size data of relevant parts of all vertical probes to be measured by measuring coordinate values of relevant parts of patterns of the vertical probes, comparing and analyzing the measured size data of the vertical probes with the size data of standard vertical probes, rapidly and accurately detecting the quality of the vertical probes to be measured in batches, effectively ensuring the quality of products, and improving the production efficiency.

Description

Quick measuring method for vertical probe
Technical Field
The invention relates to the technical field of semiconductor chip testing, in particular to a method for quickly measuring a vertical probe for semiconductor chip testing.
Background
With the rapid development of integrated circuit technology, the higher the integration level of a semiconductor chip, the semiconductor chip needs to be tested before being packaged into an integrated circuit, so that defective chips are prevented from entering a subsequent packaging process to generate unqualified integrated circuits, a probe card with a test probe is used for testing the chips, and the test of the highly integrated semiconductor chip has very high requirements on the precision of the probe, so that the produced probe needs to be measured, the requirement of the semiconductor chip on testing is met, the measurement is required to be accurate due to the large number of the probes, the measurement speed is also required to be high, and the test requirement of a production line is met.
Disclosure of Invention
The invention provides a vertical probe rapid measurement method which is accurate and rapid in measurement, batch and convenient to operate.
A method for rapidly measuring a vertical probe, in which a plurality of predetermined test points are set in the vertical probe, comprising the steps of:
s01, providing a glass plate and a 3D tester for full probe measurement, wherein the glass plate is carved with a grid array formed by arranging a plurality of grids;
s02, mounting the glass plate in a test area of a 3D tester by using a clamp, placing vertical probes to be tested in a square array, placing one vertical probe to be tested in each square, wherein the 3D tester is provided with a rectangular coordinate measuring system, and measuring the graphic coordinates of the vertical probes in the test area of the 3D tester by using the rectangular coordinate system;
s03, acquiring current vertical probes to be tested and sites related to a preset test point in a vertical probe graph to be tested, and acquiring coordinate value data of each site corresponding to the preset test point on all the vertical probes to be tested by measuring coordinates of the sites falling on a measurement rectangular coordinate system of a 3D tester, wherein the 3D tester calculates size data of the vertical probes to be tested, and the 3D tester pre-stores the size data of the standard vertical probes;
s04, comparing and analyzing the measured dimension data of the vertical probe to be detected with the dimension data of the standard vertical probe, and judging whether the vertical probe to be detected is qualified or not.
Further, the plurality of predetermined test points includes: a terminal point of the probe tip segment, an end point of the probe tip segment, and a tip point of the probe tip segment; the tail end point of the probe needle head section is a connection point of the probe needle head section and the arc section; the end point of the probe tip section is the connection point of the probe tip section and the arc section.
Further, the 3D tester scans the vertical probes to be tested in each square one by one to obtain the vertical probe patterns to be tested, the positions related to the predetermined test points in the vertical probe patterns to be tested, and coordinate value data of the positions.
Further, the step S03 in the measuring method of the vertical probe further includes the following substeps:
a1, firstly measuring coordinates of the tip of the vertical probe tip section, secondly measuring coordinates of the tail end of the vertical probe tip section, and calculating the length dimension of the vertical probe tip section according to the measured coordinates of the tip section and the measured coordinates of the tail end of the tip section;
a2, measuring coordinates of two ends of a straight line segment of the vertical probe tip segment through the step A1, obtaining coordinate values of two ends of the straight line segment of the vertical probe tip segment, calculating a straight line equation of the straight line segment of the vertical probe tip segment, and further calculating a straight line offset value of the circular arc segment;
a3, measuring coordinates of a terminal end of the vertical probe needle head segment, measuring coordinates of a tip end of the vertical probe needle head segment, and calculating total length of the vertical probe according to the two coordinates;
a4, measuring coordinates of two ends of the vertical probe needle head segment, including measuring coordinate values of an intersection point of the vertical probe needle head segment and the circular arc segment and coordinate values of a terminal end of the vertical probe needle head segment, calculating to obtain a linear equation of the vertical probe needle head segment according to the coordinate values of two ends of a linear segment of the vertical probe needle head segment, obtaining an extension line of the vertical probe needle head segment and an extension line of the linear segment of the vertical probe needle head segment, and further calculating an angle of the included angle of the needle head segment;
a5, calculating the length of the needle head section of the vertical probe according to the measured coordinate values of the two ends of the straight line section of the needle head section of the vertical probe.
Further, after the 3D tester finishes measuring in the steps A1-A5, the 3D tester counts the number of the qualified vertical probes and the number of the unqualified vertical probes of the batch of probes, calculates the qualification rate of the batch of vertical probes, and the qualification rate does not meet the standard requirement, and the batch of vertical probes are unqualified products.
According to the rapid measurement method for the vertical probes, the 3D tester precise measurement function and the square grid array are utilized, the size of the vertical probes to be measured can be rapidly and accurately detected in batches, the qualified products and the unqualified products of the probes to be measured can be accurately judged by simple comparison with the standard probe size, the product quality of the probes can be effectively ensured during mass production, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic view of a vertical probe according to an embodiment of the present invention.
FIG. 2 is a measurement flow chart of a vertical probe rapid measurement method according to an embodiment of the present invention.
Fig. 3 is a diagram of a glass sheet engraved with a square grid array in accordance with an embodiment of the present invention.
In the figure: 1. square, 2 square arrays, 3, glass plates.
Detailed Description
The present invention will be described in detail with reference to specific embodiments and drawings.
Referring to fig. 1-3, a method for quickly measuring a vertical probe according to an embodiment of the present invention is shown, in which the vertical probe is made of metal, and the vertical probe includes a tip segment, an arc segment, and a needle segment, where the tip segment is linear, the arc segment is curved and the needle segment is linear, the vertical probe is set with a plurality of predetermined test points, the tip point of the tip segment is T4, the tip point of the tip segment is T3, the arc segment is curved and the needle segment is linear, the tip point of the needle segment is T2, and the terminal end point of the needle segment is T1.
The linear offset distance between the extension line of the straight line segment of the needle point segment and the line parallel to the reference line passing through the connection point of the circular arc segment and the needle point segment is the linear offset distance between the two end points of the circular arc segment, and the needle point segment included angle is formed between the extension line of the straight line segment of the needle point segment and the line parallel to the reference line passing through the connection point T2 of the circular arc segment and the needle point segment. The tip T4 of the tip section is used for contacting a test point of a chip, the tail end T3 of the tip section is connected with one end of the circular arc section, the other end of the circular arc section is connected with the tail end T2 of the needle head section, and the needle head section is a straight line section and is used for installing and fixing a vertical probe to a probe card.
In order to ensure the quality of the produced vertical probes, the sizes of all the produced vertical probes need to be detected, and the sizes of the vertical probes need to be tested are as follows: the length of the needle tip section, the total length of the probe, the length of the needle tip section, the linear offset and the angle of the included angle of the needle tip section.
The method for quickly measuring the vertical probe in the embodiment is characterized in that a plurality of preset test points are set on the vertical probe, and the method for quickly measuring the vertical probe comprises the following steps:
s01, performing probe full-digital measurement by using a glass plate and a 3D tester, wherein the glass plate is carved with a grid array formed by arranging a plurality of grids;
s02, mounting the glass plate in a test area of a 3D tester by using a clamp, placing vertical probes to be tested in a square array, placing one vertical probe to be tested in each square, wherein the 3D tester is provided with a rectangular coordinate measuring system, and measuring the graphic coordinates of the vertical probes in the test area of the 3D tester by using the rectangular coordinate system;
s03, acquiring current vertical probes to be tested and sites related to a preset test point in a vertical probe graph to be tested, and acquiring coordinate value data of each site corresponding to the preset test point on all the vertical probes to be tested by measuring coordinates of the sites falling on a measurement rectangular coordinate system of a 3D tester, wherein the 3D tester calculates size data of the vertical probes to be tested, and the 3D tester pre-stores the size data of the standard vertical probes;
s04, comparing and analyzing the measured dimension data of the vertical probe to be detected with the dimension data of the standard vertical probe, and judging whether the vertical probe to be detected is qualified or not.
In step S01, the 3D tester is an existing apparatus, and the 3D tester adopted in this embodiment is a Micro-Vu high-precision image measuring apparatus, and has the specification and model number of: MICRO-VU, VERTEX 410.
Further, the plurality of predetermined test points includes: a termination point T1 of the probe tip segment; the end point T2 of the probe needle head segment is a connection point T2 of the probe needle head segment and the arc segment; the end point T3 of the probe tip section is a connection point T3 of the probe tip section and the arc section; the tip point T4 of the probe tip segment.
The 3D tester scans the vertical probes to be tested in each square one by one so as to obtain the vertical probe patterns to be tested, the positions related to the preset test points in the vertical probe patterns to be tested and coordinate value data of the positions. Specifically, the 3D tester is provided with a scanning lens, which is disposed corresponding to the position of the glass plate.
In the measuring method of the vertical probe, the measuring step S03 of the measuring method of the vertical probe further includes the sub-steps of:
s100, firstly measuring coordinates of a tip T4 of a vertical probe tip section, secondly measuring coordinates of a tail end T3 of the vertical probe tip section, and calculating the length dimension of the vertical probe tip section by applying a general equation of solving a straight line by two-point coordinates on a known straight line according to the measured coordinates of the tip T4 of the tip section and the measured coordinates of the tail end T3 of the tip section;
s200, measuring coordinates of two ends T3 and T4 of a straight line part of the vertical probe tip section, and applying a general equation formula for solving a straight line by using coordinates of two points on a known straight line according to the measured coordinates of the two ends of the straight line part of the tip section to obtain a straight line equation of the straight line part of the vertical probe tip section;
s300, measuring the coordinates of a straight line segment terminal T1 of the vertical probe needle head segment, measuring the coordinates of the tip end of the tip segment of the vertical probe, and calculating the total length of the vertical probe according to the coordinate values of the two points T1 and T4.
S400, measuring coordinate values of intersection points T2 of the straight line segment and the circular arc segment of the probe needle head, and applying a point-to-straight line distance formula to further calculate straight line offset of two end points of the circular arc segment.
S500, coordinate measurement is carried out through two ends T1 and T2 of the straight line segment of the vertical probe needle head segment, namely coordinate values of an intersection point T2 of the straight line segment of the probe needle head segment and the circular arc segment and coordinate values of a terminal T1 of the straight line segment of the vertical probe needle head segment are measured, and a straight line equation of the straight line segment of the vertical probe needle head segment is obtained according to the measured coordinate values of two ends of the straight line part of the vertical probe needle head segment, so that an extension line of the needle head segment of the vertical probe and an extension line of the needle tip segment of the vertical probe are obtained, and then an angle value of an included angle of the needle head segment of the vertical probe is calculated.
S600, measuring coordinates of two ends T1 and T2 of the straight line segment of the vertical probe needle head segment, namely measuring the coordinate value of the intersection point T2 of the straight line segment of the probe needle head segment and the circular arc segment and the coordinate value of the terminal T1 of the straight line segment of the vertical probe needle head segment, and obtaining the length of the vertical probe needle head segment according to the measured coordinate values of two ends of the straight line part of the vertical probe needle head segment.
And S700, after the measurement is completed, counting the measurement data by the 3D tester, counting the number of qualified probes and the number of unqualified probes, wherein the ratio of the number of the qualified vertical probes to the total number of the probes to be measured in each measurement batch is the qualification rate of the probes in the batch, calculating the qualification rate of the vertical probes to be measured in the batch, judging the batch with the qualification rate reaching the inspection standard as qualified products, judging the batch with the qualification rate not reaching the inspection standard as unqualified products, and classifying the probes in the subsequent process.
According to the vertical probe rapid measurement method, the size of each vertical probe to be measured can be rapidly and accurately detected in batches by utilizing the precise measurement function of the 3D tester and the square grid array, and the qualified products and the unqualified products of the probes to be measured can be accurately judged by simply comparing the sizes of the vertical probes with the standard probe sizes, so that the product quality is effectively ensured, and the production efficiency is improved.
It should be noted that the present invention is not limited to the above embodiments, and those skilled in the art can make other changes according to the inventive spirit of the present invention, and these changes according to the inventive spirit of the present invention should be included in the scope of the present invention as claimed.

Claims (2)

1. The quick measurement method of the vertical probe is characterized in that the vertical probe is provided with a plurality of preset test points, and the preset test points comprise: a termination point of the probe tip segment; an end point of the probe tip segment, and a tip point of the probe tip segment; the tail end point of the probe needle head section is a connection point of the probe needle head section and the arc section; the end point of the probe tip section is a connection point of the probe tip section and the arc section, and the measuring method of the vertical probe comprises the following steps:
s01, performing probe full-digital measurement by using a glass plate and a 3D tester, wherein the glass plate is carved with a grid array formed by arranging a plurality of grids;
s02, mounting the glass plate in a test area of a 3D tester by using a clamp, placing vertical probes to be tested in a square array, placing one vertical probe to be tested in each square, wherein the 3D tester is provided with a rectangular coordinate measuring system, and measuring the graphic coordinates of the vertical probes in the test area of the 3D tester by using the rectangular coordinate system;
s03, acquiring current vertical probes to be tested and sites related to a preset test point in a vertical probe graph to be tested, and acquiring coordinate value data of each site corresponding to the preset test point on all the vertical probes to be tested by measuring coordinates of the sites falling on a measurement rectangular coordinate system of a 3D tester, wherein the 3D tester calculates size data of the vertical probes to be tested, and the 3D tester pre-stores the size data of the standard vertical probes;
this step S03 further comprises the sub-steps of:
a1, firstly measuring coordinates of the tip of the vertical probe tip section, secondly measuring coordinates of the tail end of the vertical probe tip section, and calculating the length dimension of the vertical probe tip section according to the measured coordinates of the tip section and the measured coordinates of the tail end of the tip section;
a2, measuring coordinates of two ends of a straight line segment of the vertical probe tip segment through the step A1, obtaining coordinate values of two ends of the straight line segment of the vertical probe tip segment, calculating a straight line equation of the straight line segment of the vertical probe tip segment, and further calculating a straight line offset value of the circular arc segment;
a3, measuring coordinates of a terminal end of the vertical probe needle head segment, measuring coordinates of a tip end of the vertical probe needle head segment, and calculating total length of the vertical probe according to the two coordinates;
a4, measuring coordinates of two ends of the vertical probe needle head segment, including measuring coordinate values of an intersection point of the vertical probe needle head segment and the circular arc segment and coordinate values of a terminal end of the vertical probe needle head segment, calculating to obtain a linear equation of the vertical probe needle head segment according to the coordinate values of two ends of a linear segment of the vertical probe needle head segment, obtaining an extension line of the vertical probe needle head segment and an extension line of the linear segment of the vertical probe needle head segment, and further calculating an angle of the included angle of the needle head segment;
a5, calculating the length of the needle head section of the vertical probe according to the measured coordinate values of the two ends of the straight line section of the needle head section of the vertical probe;
s04, comparing and analyzing the measured dimension data of the vertical probe to be detected with the dimension data of the standard vertical probe, and judging whether the vertical probe to be detected is qualified or not;
and the 3D tester counts the number of the qualified vertical probes and the number of the unqualified vertical probes, and calculates the qualification rate of the batch of vertical probes.
2. The method of claim 1, wherein the 3D tester scans the vertical probes to be tested in each square one by one to obtain the vertical probe patterns to be tested, the positions of the vertical probe patterns to be tested, and coordinate value data of the positions.
CN202311808416.1A 2023-12-26 2023-12-26 Quick measuring method for vertical probe Active CN117450883B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311808416.1A CN117450883B (en) 2023-12-26 2023-12-26 Quick measuring method for vertical probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311808416.1A CN117450883B (en) 2023-12-26 2023-12-26 Quick measuring method for vertical probe

Publications (2)

Publication Number Publication Date
CN117450883A CN117450883A (en) 2024-01-26
CN117450883B true CN117450883B (en) 2024-03-29

Family

ID=89582280

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311808416.1A Active CN117450883B (en) 2023-12-26 2023-12-26 Quick measuring method for vertical probe

Country Status (1)

Country Link
CN (1) CN117450883B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102116609A (en) * 2009-12-30 2011-07-06 鸿富锦精密工业(深圳)有限公司 Probe verification system and method
CN102478385A (en) * 2010-11-26 2012-05-30 京隆科技(苏州)有限公司 Probe card detection method and system
KR20170031815A (en) * 2015-09-11 2017-03-22 안동대학교 산학협력단 Probe alignment measurement method for probe rotary type atomic force microscope
CN116953590A (en) * 2023-09-21 2023-10-27 上海泽丰半导体科技有限公司 Omnibearing probe measuring device and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102116609A (en) * 2009-12-30 2011-07-06 鸿富锦精密工业(深圳)有限公司 Probe verification system and method
CN102478385A (en) * 2010-11-26 2012-05-30 京隆科技(苏州)有限公司 Probe card detection method and system
KR20170031815A (en) * 2015-09-11 2017-03-22 안동대학교 산학협력단 Probe alignment measurement method for probe rotary type atomic force microscope
CN116953590A (en) * 2023-09-21 2023-10-27 上海泽丰半导体科技有限公司 Omnibearing probe measuring device and method

Also Published As

Publication number Publication date
CN117450883A (en) 2024-01-26

Similar Documents

Publication Publication Date Title
JP3005681B1 (en) CMM calibration gauge and CMM calibration method
KR20080102708A (en) Map building system for probing tester and method for building map using the same
US4607525A (en) Height measuring system
JP3800394B2 (en) Method for optimizing probe card analysis and scrub mark analysis data
CN117450883B (en) Quick measuring method for vertical probe
CN113570550B (en) Gold wire bonding size detection method based on three-dimensional point cloud
CN213750299U (en) Wafer standard template containing multiple calibration types
CN103954854B (en) Testing method and device for pogo pin electrical performance
CN101246830A (en) Method for emending output current by amending semiconductor pin test voltage
CN100363709C (en) Method for verifying scanning accuracy of laser measurement platform
US6255827B1 (en) Search routine for 2-point electrical tester
CN112927948A (en) Method for correcting probe position of resistance instrument and method for measuring square resistance
CN115407179A (en) Wafer testing method for improving accuracy by utilizing corresponding relation of testing welding spots
KR100262655B1 (en) Alignment method and device of the wafer prober
JPH06331653A (en) Measuring method for probe-to-probe error in x-y circuit substrate inspection device
CN115656639A (en) Capacitance measuring method
CN215810765U (en) Circuit board uniformity measuring tool
CN117781959B (en) Method for detecting and aligning Pin flatness of shielding case
CN117706316B (en) Wafer testing method, device, equipment and medium of probe station
CN112985276B (en) Thickness measuring method and system for circuit board
CN112556653B (en) Pattern measuring method in semiconductor manufacturing process, electronic device, and storage medium
CN114178904B (en) Resolution measuring method of machine tool measuring system
CN215005828U (en) Magnetic field center detector
CN108872399A (en) One kind being used for the microscopical positioning system of ultrasonic scanning and method
CN117129928A (en) Wafer test system calibration device and calibration method based on-chip standard

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant