CN117119744A

CN117119744A - Heat radiation structure and servo driver

Info

Publication number: CN117119744A
Application number: CN202310483459.0A
Authority: CN
Inventors: 李献奇; 黄国辉; 廖小华
Original assignee: Anhui Peitian Robotics Group Co Ltd
Current assignee: Anhui Peitian Robotics Group Co Ltd
Priority date: 2023-04-27
Filing date: 2023-04-27
Publication date: 2023-11-24

Abstract

The application relates to the technical field of electronic components, and particularly discloses a heat dissipation structure which comprises a mounting piece, a heat conduction assembly and a heat dissipation assembly. The heat conduction assembly is arranged on the mounting piece and divides the mounting piece into a first area and a second area, and is used for being in contact with a heat conduction object arranged in the first area; the heat dissipation assembly is arranged in the second area and used for dissipating heat of the heat conduction assembly. The heat dissipation structure provided by the application is characterized in that the heat of the object in the first area is transferred to the heat conduction assembly, the heat is guided to the second area by the heat conduction assembly, and finally the heat is dissipated through the heat dissipation assembly in the second area. The high-efficiency heat dissipation of the heat-conducting object is realized. The application also discloses a servo driver with the heat radiation structure, and the servo driver also has the technical effects.

Description

Heat radiation structure and servo driver

Technical Field

The present disclosure relates to electronic devices, and particularly to a heat dissipation structure and a servo driver.

Background

The servo motor driver is an electromechanical product widely applied to various automatic control industries such as 3C automation, mechanical arms, logistics and the like, and in the long-term use process, power devices such as capacitors and the like on a circuit board can generate heat which can influence the overall operation performance of the driver if not timely radiated, and even the service life of other elements of the circuit board is shortened due to overhigh temperature of an internal cavity of the driver.

In summary, how to effectively solve the problems of heat dissipation, sealing protection, etc. of the electronic components is a problem that needs to be solved by those skilled in the art at present.

Disclosure of Invention

In view of the above, the present application is directed to a heat dissipation structure and a servo driver, which can effectively solve the problems of heat dissipation and sealing protection of electronic components.

In order to achieve the above purpose, the present application provides the following technical solutions:

a heat dissipating structure, comprising:

a mounting member;

the heat conduction assembly is arranged on the mounting piece and divides the mounting piece into a first area and a second area, and the heat conduction assembly is used for being in contact with a heat conduction object arranged in the first area;

and the heat dissipation assembly is arranged in the second area and is used for dissipating heat of the heat conduction assembly.

Optionally, in the above heat dissipation structure, the heat conduction assembly includes a heat conduction plate, a surface of the heat conduction plate facing the first area is provided with at least one heat conduction groove, an opposite surface of the heat conduction plate facing the second area, and a shape of the heat conduction groove is consistent with a shape of an outer wall of the object to be heat-conducted.

Optionally, in the above heat dissipation structure, the heat conduction assembly further includes an elastic heat conduction insulating pad, and the elastic heat conduction insulating pad is disposed in the heat conduction groove and is used for contacting with the object to be heat-conducted.

Optionally, in the above heat dissipation structure, the heat dissipation device further includes a fixing member, and the heat conducting plate is provided with a fixing portion, where the fixing member cooperates with the fixing portion to fix the object to be heat-conducted.

Optionally, in the above heat dissipation structure, the fixing portion includes a clamping groove and/or a ribbon buckle ring disposed at two sides, the clamping groove is used for clamping with a buckle on the fixing piece, and the ribbon buckle ring is used for binding with the fixing piece.

Optionally, in the above heat dissipation structure, the fixing piece includes a bending portion and a reinforcing rib, the bending portion is bent to form at least one accommodating groove, and one side of the bending portion, which deviates from the notch of the accommodating groove, is connected with the reinforcing rib, the shape of the accommodating groove is consistent with the shape of the outer wall of the object to be thermally conducted, and two sides of the fixing piece are respectively connected with the fixing portion.

Optionally, in the above heat dissipation structure, the mounting piece includes a heat conduction frame, and the heat dissipation structure further includes a transformer heat conduction portion and/or a heat conduction substrate, where the transformer heat conduction portion is disposed on the heat conduction frame or the heat conduction component, and is used for contacting with a planar transformer disposed in the first area; the heat conducting substrate is arranged on the heat conducting frame or the heat conducting component, the surface of the heat conducting substrate, which faces the first area, is used for conducting heat in contact with the insulated gate bipolar transistor module, the opposite surface of the heat conducting substrate faces the second area, and the heat radiating component is also used for radiating heat of the heat conducting part of the transformer and/or the heat conducting substrate.

Optionally, in the above heat dissipation structure, an elastic heat-conducting gasket is disposed on the heat-conducting portion of the transformer.

Optionally, in the above heat dissipation structure, a surface of the heat conducting substrate facing the second area is provided with a heat dissipation fin extending to the second area.

Optionally, in the above heat dissipation structure, a surface of the heat conducting substrate facing the first area is coated with a heat dissipation coating.

Optionally, in the above heat dissipation structure, no air channel is communicated between the first area and the second area.

By applying the heat radiation structure provided by the application, the heat conduction assembly divides the mounting piece into the first area and the second area, the first area can be correspondingly provided with the heat conduction object, and the heat conduction assembly is contacted with the heat conduction object, so that the heat of the heat conduction object can be conducted to the heat conduction assembly, and the heat radiation assembly is arranged in the second area and radiates heat of the heat conduction assembly through the heat radiation assembly. The heat-conducting object and the heat-radiating component are arranged in the first area and the second area, so that the influence of the heat-radiating component on the heat-conducting object is reduced. In summary, the heat dissipation structure provided by the application firstly transfers the heat of the object in the first area to the heat conduction assembly, then the heat conduction assembly guides the heat to the second area, and finally the heat dissipation assembly in the second area dissipates the heat. The heat dissipation device has the advantages that efficient heat dissipation of the heat-conducting object is achieved, the heat-conducting object and the heat dissipation component are arranged in different areas, and effective protection of the heat-conducting object is facilitated.

In order to achieve the above object, the present application also provides a servo driver, which includes any one of the above heat dissipation structures. Because the heat dissipation structure has the technical effects, the servo driver with the heat dissipation structure should have the corresponding technical effects.

Optionally, in the above servo driver, the heat dissipation structure comprises a housing assembly, the heat dissipation structure is in sealing connection with the housing assembly and divides into a first cavity and a second cavity, the first cavity is a closed cavity, the heat dissipation assembly is arranged in the second cavity, and the object to be thermally conducted is arranged in the first cavity.

Optionally, in the servo driver, a brake resistor is further disposed in the second cavity.

Optionally, in the above servo driver, two opposite ends of the housing component corresponding to the second cavity are respectively provided with an air inlet and an air outlet, and the heat dissipation component includes a heat dissipation fan.

Optionally, in the above servo driver, the thermally conductive object includes a capacitor, a power board is disposed in the first cavity, and a kidney-shaped hole is formed in the power board, a soldering leg of the capacitor is disposed through the kidney-shaped hole, and a length of the kidney-shaped hole is greater than an outer diameter of the soldering leg so as to adjust a distance from the soldering leg to the thermally conductive assembly.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a heat dissipating structure according to an embodiment of the present application;

FIG. 2 is an enlarged schematic view of a portion of the portion A in FIG. 1;

FIG. 3 is a schematic structural view of a fixing member;

fig. 4 is a schematic view of the installation state of the object to be thermally conducted corresponding to fig. 1;

FIG. 5 is an exploded view of a servo driver using the heat dissipation structure of FIG. 1;

FIG. 6 is a schematic partial cross-sectional view of the servo drive of FIG. 5;

FIG. 7 is a schematic diagram of an assembly of the servo driver of FIG. 5;

FIG. 8 is another schematic view of FIG. 7;

FIG. 9 is a side view of FIG. 7;

FIG. 10 is a schematic view in section A-A of FIG. 9;

FIG. 11 is a schematic diagram of a heat dissipating structure according to another embodiment of the present application;

fig. 12 is a schematic view of the installation state of the object to be thermally conductive corresponding to fig. 11;

FIG. 13 is an exploded view of a servo driver using the heat dissipating structure of FIG. 11;

FIG. 14 is a side view of the servo drive of FIG. 13;

fig. 15 is a schematic view of section A-A of fig. 14.

The figures are marked as follows:

a heat conduction component 1, a first region 01, a second region 02 and a heat dissipation component 2;

the heat conducting plate 11, the heat conducting groove 111, the clamping groove 112, the ribbon retaining ring 113 and the elastic heat conducting insulating gasket 12;

the fixing piece 3, the bending part 31, the accommodating groove 311, the reinforcing rib 32 and the buckle 33;

a heat conduction frame 4, a positioning protrusion 42 and a limiting buckle 43;

a transformer heat conduction part 5-1, a transformer heat conduction part 5-2, a heat conduction substrate 6 and radiating fins 61;

the shell assembly 100, the first shell 110, the second shell 120, the cover plate 130, the first cavity 010, the second cavity 020, the air inlet 101, the air outlet 102, the upper limit surface 103, the lower limit surface 104, the limit clamping groove 105 and the decorative blind hole 106;

a thermally conductive object 210, a planar transformer 220, an IGBT module 230, and fillets 211;

brake resistor 300, power plate 400, control plate 500, kidney-shaped aperture 410;

the dashed lines in fig. 10 and 15 are the first and second cavity dividing lines.

Detailed Description

The embodiment of the application discloses a heat dissipation structure which is convenient for protecting a thermally conductive object while effectively dissipating heat of the thermally conductive object.

In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely used to illustrate the relative positional relationships between the components or portions, and do not particularly limit the specific mounting orientations of the components or portions.

Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present application will be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, the structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure for the purpose of understanding and reading by those skilled in the art, and are not intended to limit the scope of the application, which is defined by the appended claims, so that any structural modifications, proportional changes, or dimensional adjustments should not be made in the essential significance of the present disclosure without affecting the efficacy or achievement of the present application.

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The heat dissipation structure provided by the application can be suitable for, but not limited to, heat dissipation of a servo driver. The object to be thermally conductive according to the present application includes, but is not limited to, a heating element in an electronic device such as a servo driver, and specifically, a capacitor.

Referring to fig. 1 and 5, in one embodiment, the heat dissipation structure provided by the present application includes a mounting member, a heat conduction assembly 1 and a heat dissipation assembly 2. The mounting member may be a frame structure, a plate, a box, or the like for mounting the heat conductive assembly 1, or may be a structural member separately provided for mounting the heat conductive assembly 1, and the heat dissipating structure is assembled inside the electronic device when the heat dissipating structure is used for the electronic device. In addition, the mount may be used as a component such as a housing of an electronic device when the heat dissipating structure is used in the electronic device. The heat conducting component 1 is arranged on the mounting piece and divides the mounting piece into a first area 01 and a second area 02, and it can be understood that when the heat radiating structure is mounted in an electronic device such as a servo driver, the inner cavity of the electronic device is divided into a first cavity and a second cavity by the heat conducting component 1, the first area 01 of the mounting piece is located in the first cavity, and the second area 02 is correspondingly located in the second cavity. The heat conductive member 1 is configured to contact with the object 210 placed in the first region 01, so that heat of the object 210 can be transferred to the heat conductive member 1 and can be conducted along the heat conductive member 1. The heat dissipation assembly 2 is disposed in the second region 02, and the heat dissipation assembly 2 is configured to dissipate heat from the heat conduction assembly 1.

By applying the heat dissipation structure provided by the application, the heat conduction component 1 divides the mounting piece into the first area 01 and the second area 02, the first area 01 can be correspondingly provided with the object 210 to be heat-conducted, and the heat conduction component 1 is contacted with the object 210 to be heat-conducted, so that the heat of the object 210 to be heat-conducted can be conducted to the heat conduction component 1, the heat dissipation component 2 is arranged in the second area 02, and the heat dissipation component 2 dissipates heat of the heat conduction component 1. Since the first region 01 and the second region 02 are separated from the heat dissipating component 2 by the heat dissipating component 210, the influence of the heat dissipating component 2 on the heat dissipating component 210 is reduced. In summary, the heat dissipation structure provided by the present application firstly transfers the heat of the object 210 in the first area 01 to the heat conduction component 1, then the heat is guided to the second area 02 by the heat conduction component 1, and finally the heat is dissipated through the heat dissipation component 2 in the second area 02. The heat dissipation device realizes efficient heat dissipation of the object 210 to be thermally conductive, and the object 210 to be thermally conductive and the heat dissipation assembly 2 are arranged in different areas, so that the object 210 to be thermally conductive can be effectively protected.

In one embodiment, there is no airway communication between the first zone 01 and the second zone 02. That is, the object 210 to be thermally conductive is isolated from the heat dissipating component 2, the first region 01 has no air duct communicating with the second region 02, and only the thermally conductive portion conducts heat to the second region 02, so that the heat dissipating component 2 in the second region 02 dissipates heat. Compared with the heating element and the heat radiating component arranged in the same area, the external moisture, oil mist, dust, conductive powder and the like can be sucked into the inner cavity under the action of the fan airflow of the heat radiating component, so that the short circuit failure of the heating element of the inner cavity and the burning of the circuit board can be caused. And the first area 01 and the second area 02 are not communicated through a wind channel, so that the heat dissipation component 2 of the second area 02 cannot pollute the object 210 to be heat-conducted with water vapor, oil mist, conductive powder and the like.

In one embodiment, referring to fig. 1-4 together, for better heat conduction, the heat conduction assembly 1 may be closely contacted with the object 210 to be heat-conducted, so in this embodiment, the heat conduction assembly 1 includes a heat conduction plate 11, where a surface of the heat conduction plate 11 facing the first area 01 is provided with at least one heat conduction groove 111, the shape of the heat conduction groove 111 is consistent with that of an outer wall of the object 210 to be heat-conducted, and an opposite surface faces the second area 02. For convenience of description, the surface of the heat conducting plate 11 facing the first area 01 is a front surface, the opposite surface is a back surface, and the heat dissipating component 2 is used for dissipating heat from the back surface of the heat conducting plate 11. The shape of the heat conductive groove 111 is correspondingly set according to the shape of the outer wall of the object 210 to be heat-conductive, and the size of the heat conductive groove 111 is not smaller than the size of the object 210 to be heat-conductive, so that the object 210 to be heat-conductive can be in direct contact with the heat conductive groove 111 or in indirect contact with heat conductive via a heat conductive pad. Specifically, when the object 210 to be thermally conductive adopts a cylindrical structure, the heat-conducting groove 111 may be a circular arc groove, and the radius of the circular arc groove is not smaller than the radius of the object 210 to be thermally conductive. By the heat conduction groove 111 which is formed by copying the heat conduction object 210, the contact area between the heat conduction object 210 and the heat conduction plate 11 can be increased, so that the heat transfer efficiency is improved, and the heat dissipation effect is improved. The specific number of the heat conduction grooves 111 may be set to one or more as needed to be respectively engaged with the objects 210 to be heat-conducted. In the embodiment shown in fig. 1-10, the device is suitable for mounting four objects 210 to be thermally conductive, in the embodiment shown in fig. 11-15, two objects 210 to be thermally conductive are suitable for mounting, and the external dimensions of the objects are smaller than those of the embodiment shown in fig. 1-10, and the structural layout design is similar.

In one embodiment, referring to fig. 1 and fig. 5 together, the heat conducting assembly 1 further includes an elastic heat conducting and insulating pad 12, and the elastic heat conducting and insulating pad 12 is disposed in the heat conducting slot 111 and is used for contacting with the object 210 to be heat-conducted. Specifically, the elastic heat-conducting insulating pad 12 is made of an elastic insulating material with good heat-conducting effect. One side of the elastic heat-conducting insulating spacer 12 is attached to the heat-conducting groove 111, and the other side is able to be attached to the object 210 to be heat-conducted. In order to facilitate the arrangement of the elastic heat-conducting insulating spacer 12, the size of the heat-conducting groove 111 is 3-5mm larger than the size of the object 210 to be heat-conducting, and when the object 210 to be heat-conducting is in a cylindrical structure and the heat-conducting groove 111 is a circular arc groove correspondingly, the radius of the circular arc groove is 3-5mm larger than the outer diameter of the object 210 to be heat-conducting, so that the elastic heat-conducting insulating spacer 12 is arranged between the heat-conducting groove 111 and the curved wall of the side of the object 210 to be heat-conducting and transferring.

In order to ensure that the heat conducting groove 111 is in direct or indirect close contact with the object 210 to be heat-conducted, in one embodiment, referring to fig. 3 and 4, the heat dissipation structure further includes a fixing member 3, and the heat conducting plate 11 is provided with a fixing portion, and the fixing member 3 cooperates with the fixing portion to fix the object 210 to be heat-conducted. The fixing part is matched with the fixing piece 3 to fix, so that the object 210 to be thermally conductive is in good contact with the heat conducting groove 111 on the front surface of the heat conducting plate 11 directly or indirectly through the elastic heat conducting insulating gasket 12, and the influence of poor contact on heat conduction and heat dissipation of the object 210 to be thermally conductive is avoided under a vibration environment. The fixing member 3 may be made of a high temperature resistant material.

In one embodiment, the fixing portion includes a clamping groove 112 and/or a ribbon buckle 113 provided on two sides of the heat-conducting plate 11, the clamping groove 112 is used for clamping with the buckle 33 on the fixing member 3, and the ribbon buckle 113 is used for binding with the fixing member 3. It will be appreciated that in the case where one heat conducting slot 111 is provided, the clamping slots 112 may be provided on opposite sides of the heat conducting slot 111, or the strap retaining rings 113 may be provided, or the clamping slots 112 and the strap retaining rings 113 may be provided, respectively. When the plurality of heat conduction grooves 111 are provided, a plurality of corresponding objects 210 to be heat-conducted may be fixed by the same fixing member 3, or each object 210 to be heat-conducted may be fixed in one-to-one correspondence by a plurality of fixing members 3. When the heat conducting grooves are fixed by the same fixing piece 3, clamping grooves 112 are respectively arranged on two sides of the whole heat conducting grooves 111, or ribbon retaining rings 113 are respectively arranged, or the clamping grooves 112 and the ribbon retaining rings 113 are respectively arranged, so that higher connection reliability is obtained; when the fixing members 3 are used for fixing, the clamping grooves 112 are respectively arranged on two sides of each heat conducting groove 111, or the ribbon retaining rings 113 are respectively arranged, or the clamping grooves 112 and the ribbon retaining rings 113 are respectively arranged, so that higher connection reliability is obtained. When the fixing portion adopts the clamping groove 112, the corresponding fastener 33 is arranged on the fixing member 3 to be clamped with the clamping groove 112, so that the object 210 to be thermally conducted is pressed against the thermal conducting groove 111. When the fixing part adopts the ribbon buckle 113, then the fixing part 3 can adopt the ribbon to bind with the ribbon buckle 113, or the two ends of the fixing part 3 are respectively provided with the ribbon to bind with the ribbon buckle 113, and the ribbon can be specifically a nylon ribbon.

In one embodiment, the fixing member 3 includes a bending portion 31, the bending portion 31 is bent to form at least one accommodating groove 311, the shape of the accommodating groove 311 is consistent with the shape of the outer wall of the object 210 to be thermally conductive, and two sides of the fixing member 3 are respectively connected with the fixing portions. The receiving groove 311 is formed by the bent portion 31 so as to be in conformity with the shape of the outer wall of the object 210 to be thermally conductive, thereby securing the fixing effect. The fixing portion may specifically adopt a clamping groove 112 and/or a tie buckle 113 in the above embodiment, and two sides of the corresponding fixing member 3 are respectively provided with a buckle 33 matched with the clamping groove 112 and/or a tie fixing ring for binding the tie.

Further, the fixing member 3 further includes a reinforcing rib 32, and a side of the bending portion 31 facing away from the notch of the accommodating groove 311 is connected with the reinforcing rib 32. When the number of the objects 210 to be thermally conductive is large, the length of the fixing member 3 may be long, and therefore, the reinforcing ribs 32 may be provided on the fixing member 3 to enhance mechanical properties.

In the above embodiment, the object to be thermally conductive may be a capacitor, and the material of the fixing member 3 may specifically be PA66+30gf (30% glass fiber reinforced polyamide)), ABS (acrylonitrile-butadiene-styrene copolymer), PC (polycarbonate), PC/ABS, and other plastic materials, and PA66+30gf plastic may be preferred in this embodiment, so that the fixing member has good temperature resistance and mechanical properties.

In some applications, such as when the heat dissipating structure is used in a servo driver, it is also necessary to dissipate heat from other components, such as the planar transformer 220. Based on this, the mounting piece includes the heat conduction frame 4, and the heat dissipation structure still includes the transformer heat conduction portion, and the transformer heat conduction portion is located heat conduction frame 4 or heat conduction assembly 1 for with settle in the planar transformer 220 contact of first region 01, heat dissipation assembly 2 still is used for dispelling the heat to the transformer heat conduction portion.

In one embodiment, referring to fig. 11-15 together, the mounting member of the heat dissipating structure includes a heat conducting frame 4, the heat conducting frame 4 has a transformer heat conducting portion 5-1 for contacting with a planar transformer 220 disposed in the first area 01, and the heat dissipating component 2 is further used for dissipating heat from the transformer heat conducting portion 5-1. The planar transformer 220 is arranged in the first area 01, so that a protection effect can be better formed, in order to conduct heat to and dissipate heat from the planar transformer 220, the transformer heat conducting part 5-1 is arranged at the position, corresponding to the planar transformer 220, of the heat conducting frame 4, the transformer heat conducting part 5-1 is tightly attached to the planar transformer 220, heat generated by the planar transformer 220 is conducted to the transformer heat conducting part 5-1, and is conducted to the second area 02 along the heat conducting frame 4, so that heat is effectively dissipated under the action of the heat dissipating component 2. Through the arrangement, the planar transformer 220 can be effectively radiated, and meanwhile, pollution caused by introducing water vapor, dust and the like to the planar transformer by radiating is avoided.

Further, an elastic heat conduction pad is arranged on the heat conduction part 5-1 of the transformer. That is, the heat conduction part 5-1 of the transformer indirectly contacts with the planar transformer 220 through the elastic heat conduction gasket, and the arrangement of the elastic heat conduction gasket reduces the assembly requirement of the heat conduction part 5-1 of the transformer and the planar transformer 220, and ensures the effective close contact between the planar transformer 220 and the heat conduction part 5 of the transformer.

In other embodiments, referring to fig. 1 and 4, the transformer heat conducting portion 5-2 contacting with the planar transformer 220 for heat conduction may be disposed on the heat conducting assembly 1, for example, in the case that the heat conducting assembly 1 includes the heat conducting plate 11, the transformer heat conducting portion 5-2 may be connected to the heat conducting plate 11, and the two may be specifically formed integrally, or may be a split structure connected by a conventional fixing manner. Or the heat conducting part of the transformer can also independently extend to the second area 02, and can also conduct heat to the second area 02 for heat dissipation.

In some applications, such as when the heat dissipating structure is used in a servo driver, it may also be desirable to dissipate heat from other components, such as transistor modules, such as Insulated Gate Bipolar Transistor (IGBT) modules 230. Based on this, the mounting piece includes the heat conducting frame 4, the heat dissipation structure further includes the heat conducting substrate 6, the heat conducting substrate 6 is disposed on the heat conducting frame 4 or the heat conducting component 1, and the surface of the heat conducting substrate 6 facing the first area 01 is used for contacting with the insulated gate bipolar transistor module 230 for conducting heat, the opposite surface of the other side faces the second area 02, and the heat dissipation component 2 is further used for dissipating heat of the heat conducting substrate 6. Referring to fig. 1, 5, 6, 9 and 10, in one embodiment, the mounting member of the heat dissipation structure includes a heat conducting frame 4, a heat conducting substrate 6 is disposed on the heat conducting frame 4, a surface of the heat conducting substrate 6 facing the first area 01 is used for contacting with the insulated gate bipolar transistor module to conduct heat, an opposite surface of the heat conducting substrate 6 facing the second area 02, and the heat dissipation component 2 is further used for dissipating heat of the heat conducting substrate 6. The IGBT module 230 is disposed in the first area 01, and can better form the protection effect, in order to conduct heat and dissipate heat to the IGBT module 230, the position of the heat conducting frame 4 corresponding to the IGBT module 230 is provided with the heat conducting substrate 6, the heat conducting substrate 6 is in close contact with the IGBT module 230, and the IGBT module 230 conducts heat to the second area 02 through the heat conducting substrate 6, and dissipates heat through the heat dissipation component 2. Through the arrangement, the IGBT module 230 can be effectively radiated, and meanwhile, pollution caused by introducing water vapor, dust and the like to the radiation is avoided. The heat conducting substrate 6 can be an aluminum profile heat radiating substrate, and the heat conducting substrate 6 and the heat conducting frame 4 can be fixed by screws.

Further, the surface of the heat conductive substrate 6 facing the second region 02 is provided with heat dissipation fins 61 extending to the second region 02. The IGBT module 230 transfers heat to the heat conducting substrate 6, and the heat conducting substrate 6 transfers heat to the heat radiating fins 61 thereof, and the heat radiating fins 61 are provided in the second region 02, thereby realizing efficient heat radiation under the effect of the heat radiating component 2. By the arrangement of the heat radiating fins 61, the heat radiating area is increased, thereby further improving the heat radiating effect.

Further, the surface of the thermally conductive substrate 6 facing the first region 01 is coated with a heat dissipating coating. That is, a heat dissipation coating, such as a heat conductive silicone grease, is coated on the surface of the heat conductive substrate 6 contacting the IGBT module 230, so as to enhance heat conduction and improve heat conduction effect.

In other embodiments, the heat conducting substrate 6 may be disposed on the heat conducting component 1, for example, on the heat conducting plate 11, or the heat conducting substrate 6 may be separately extended to the second region 02, and may also be capable of conducting heat to the second region 02 for heat dissipation.

In one embodiment, the planar transformer 220 and the IGBT module 230 may also be heat-dissipated at the same time, for example, the heat conductive frame 4 is provided with both the heat conductive substrate 6 and the transformer heat conductive portion 5. For a specific structure, reference is made to the above-mentioned related embodiments. The dual structure design of heat conduction and radiation and protection carries out independent heat conduction and radiation for the planar transformer 220, the direct current bus capacitor 210 and the IGBT module 230 of the high-heat-generation device, can effectively improve the protection effect of electronic equipment such as a servo driver and the like, and effectively avoids the problems of high-temperature failure and short circuit failure of electronic elements caused by the entering of particles such as conductive dust and the like into an inner cavity in a high-temperature environment.

In one embodiment, the heat conducting component 1 and the mounting part can be in an integrated structure, such as an integrated die-casting molding, so that the structure is stable and reliable, the processing is convenient, the heat conduction (heat transfer) for the high-heating power device is convenient, and the heat dissipation performance is improved. In other embodiments, the two may also be separate structures that are connected by conventional fastening means. The above description has been made of the case where the mounting member includes the heat conductive frame 4, and the mounting member may be another component in the electronic apparatus or a structural member such as a plate member separately provided for fixing the heat conductive assembly 1, depending on the number and distribution of the heat generating elements.

In one embodiment, the heat dissipating assembly 2 includes a heat dissipating fan through which forced air cooling is performed. In other embodiments, the heat dissipation assembly 2 may also include a liquid pump, and the liquid cooling heat dissipation is achieved by driving the cooling liquid to flow in the second region 02 through the liquid pump.

Based on the heat dissipation structure provided in the above embodiment, the present application also provides a servo driver, which includes any one of the heat dissipation structures in the above embodiment. Since the servo driver adopts the heat dissipation structure in the above embodiment, the servo driver has the beneficial effects described in the above embodiment.

In one embodiment, referring to fig. 5-10, the servo driver includes a housing assembly 100, a heat dissipation structure is hermetically connected to the housing assembly 100, and a heat conduction assembly 1 divides an inner cavity formed by the heat dissipation structure and the housing assembly 100 into a first cavity 010 and a second cavity 020, the first cavity 010 is a closed cavity, the heat dissipation assembly 2 is disposed in the second cavity 020, and the heat conduction object 210 is disposed in the first cavity 010. It can be understood that the position of the housing assembly 100 corresponding to the first cavity 010 is not provided with a through hole, and the first cavity 010 is blocked by the heat conduction assembly 1 and the housing assembly 100, so that the first cavity 010 is a closed cavity relatively independent of the second cavity 020, and external water vapor, oil mist, conductive powder and other pollutants are difficult to inhale, thereby enhancing the heat dissipation protection effect of the whole machine, reducing the failure rate and prolonging the service life of the product. The control board 500 and the power board 400 may be specifically disposed in the first cavity 010, and the IGBT module 230, the planar transformer 220, and the capacitor 210, such as a plurality of dc bus capacitors distributed at equal intervals, are specifically disposed on the power board 400. In the case that the heat conduction assembly 1 includes the heat dissipation fins 61, the heat dissipation fins 61 protrude into the second cavity 020.

In one embodiment, a braking resistor 300 is also disposed within the second cavity 020. Namely, the heat dissipation component 2 can effectively dissipate heat of the brake resistor 300 in the second cavity 020 while realizing heat dissipation of the heat conduction component 1, so that the equipment utilization rate is improved.

In one embodiment, the two opposite ends of the housing assembly 100 corresponding to the second cavity 020 are respectively provided with an air inlet 101 and an air outlet 102, and the heat dissipation assembly 2 includes a heat dissipation fan. Forced air cooling and heat dissipation are carried out through a heat dissipation fan, the air inlet 101 and the air outlet 102 are specifically arranged on the two side surfaces of the shell assembly 100 perpendicular to the direction of the power board 400 or along the direction of the power board 400, air channels are formed to form smooth convection, and the heat generated in the second cavity 020 is subjected to forced air cooling through the heat dissipation fan and dissipated from the air outlet 102. The surface of the housing assembly 100 corresponding to the first cavity 010 has no heat dissipation through holes, so as to enhance the protection of the electronic components in the first cavity 010.

In one embodiment, the housing assembly 100 includes a cover 130 and a first housing 110 and a second housing 120 disposed opposite to each other, and the mounting member of the heat dissipation structure includes a baffle, so that the cover 130 is connected to front ends of the first housing 110 and the second housing 120, and the baffle is connected to rear ends of the second housing 120 and the second housing 120, thereby enclosing an internal cavity. The heat conduction assembly 1 is connected between the first shell 110 and the second shell 120 and is sealed with the contact position of the first shell and the second shell, so that the blocking effect on air flow is achieved, namely, the heat conduction assembly 1 separates a cavity enclosed by the heat dissipation structure and the shell assembly 100 into a first cavity 010 and a second cavity 020, so that the protection effect of a driver on the external field severe environment is effectively improved, and moisture, oil mist, conductive dust and the like inhaled by the air inlet 101 of the second cavity 020 cannot enter the first cavity 010 along with ventilation air flow from the air inlet 101 or gaps among the first shell 110, the second shell 120 and the heat dissipation structure greatly to damage important electronic elements of the first cavity 010. In other embodiments, the internal cavity may be enclosed solely by the housing assembly 100.

In one embodiment, the mounting member, such as one of the heat conducting frame 4 and the housing assembly 100, is provided with a positioning protrusion 42, and the other is provided with a matched positioning groove, so that the connection of the mounting member and the housing assembly 100 is facilitated through the positioning action of the positioning groove and the positioning protrusion 42. The edges of the specific heat conducting frame 4 extend upwards and downwards respectively to form positioning protrusions 42, the top ends of the positioning protrusions 42 can be semicircular, and grooves with corresponding structures are formed on the shell assembly 100 for positioning.

Further, the edge of the heat conducting frame 4 extends in a zigzag shape, and a zigzag groove is correspondingly formed on the housing assembly 100, so that an upper limit surface 103 and a lower limit surface 104 are respectively formed on the upper wall surface and the lower wall surface of the zigzag groove, and good positioning is achieved.

In one embodiment, the mount and housing assembly 100 are snap-fit. Specifically, at least one limiting buckle 43 is arranged on the mounting piece, and a limiting clamping groove 105 is correspondingly arranged on the housing assembly 100, so that good sealing connection between the mounting piece and the housing assembly 100 is realized.

In one embodiment, the object 210 to be thermally conductive includes a capacitor, a power board 400 is disposed in the first cavity 010, and a kidney-shaped hole 410 is formed on the power board 400, a soldering leg 211 of the capacitor is disposed through the kidney-shaped hole 410, and a length of the kidney-shaped hole 410 is greater than an outer diameter of the soldering leg 211 to adjust a distance between the soldering leg 211 and the thermal conductive component 1. Through the arrangement of the kidney-shaped holes 410, the capacitor can move along the kidney-shaped holes 410 relative to the heat conduction assembly 1, so that the distance between the capacitor and the heat conduction assembly is adjusted, the installation of the capacitor is facilitated, the assembly precision requirement of the whole machine is reduced, and the heat conduction stability of the capacitor is improved. Specifically, taking the heat conduction assembly 1 including the heat conduction plate 11 and the elastic heat conduction insulating gasket 12 as an example, the specific steps of assembling the capacitor are as follows: the elastic heat-conducting insulating gasket 12 is adhered to the heat-conducting groove 111 of the heat-conducting plate 11, then the capacitors are adhered to the elastic heat-conducting insulating gasket 12 one by one, the two welding pins 211 of the capacitors are required to be just aligned with the waist-shaped holes and at least reach the length of pins penetrating through the thickness of the power plate 400, the capacitors are fixed to the heat-conducting groove 111 through the fixing piece 3, and finally the capacitors are confirmed to be installed in place and welded to be fixed with the power plate 400 through the welding pins 211 of the capacitors, so that good and stable electric connection is formed.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation structure, comprising:

a mounting member;

a heat conduction assembly (1) which is arranged on the mounting piece and divides the mounting piece into a first area (01) and a second area (02), wherein the heat conduction assembly (1) is used for being contacted with a heat conduction object (210) arranged in the first area (01);

and the heat dissipation component (2) is arranged in the second area (02), and the heat dissipation component (2) is used for dissipating heat of the heat conduction component (1).

2. The heat dissipation structure as defined in claim 1, wherein the heat conduction assembly (1) comprises a heat conduction plate (11), the surface of the heat conduction plate (11) facing the first area (01) is provided with at least one heat conduction groove (111), the opposite side surface faces the second area (02), and the shape of the heat conduction groove (111) is consistent with the shape of the outer wall of the object (210) to be heat-conducted.

3. The heat dissipating structure of claim 2, wherein the heat conducting assembly (1) further comprises an elastic heat conducting insulating gasket (12), said elastic heat conducting insulating gasket (12) being provided in said heat conducting groove (111) and being adapted to be in contact with said object to be heat-conducted (210).

4. The heat dissipation structure as defined in claim 2, further comprising a fixing member (3), wherein a fixing portion is provided on the heat conduction plate (11), and the fixing member (3) cooperates with the fixing portion to fix the object (210) to be heat-conducted.

5. The heat dissipation structure as defined in claim 4, wherein the fixing portion includes a clamping groove (112) and/or a binding buckle (113) provided at two sides, the clamping groove (112) is used for clamping with a buckle (33) on the fixing piece (3), and the binding buckle (113) is used for binding with the fixing piece (3).

6. The heat dissipation structure according to claim 4, wherein the fixing member (3) comprises a bending portion (31) and a reinforcing rib (32), the bending portion (31) is bent to form at least one accommodating groove (311), one side of the bending portion (31) away from the notch of the accommodating groove (311) is connected with the reinforcing rib (32), the shape of the accommodating groove (311) is consistent with the shape of the outer wall of the object (210) to be heat-conducted, and two sides of the fixing member (3) are used for being connected with the fixing portions respectively.

7. The heat dissipating structure according to any of claims 1-6, wherein the mounting comprises a heat conducting frame (4), the heat dissipating structure further comprising a transformer heat conducting part and/or a heat conducting substrate (6), the transformer heat conducting part being provided to the heat conducting frame (4) or the heat conducting assembly (1) for contacting a planar transformer (220) arranged in the first area (01); the heat conducting substrate (6) is arranged on the heat conducting frame (4) or the heat conducting component (1), the surface of the heat conducting substrate (6) facing the first area (01) is used for contacting and conducting heat with the transistor module (230), the opposite side surface is facing the second area (02), and the heat radiating component (2) is also used for radiating heat of the heat conducting part of the transformer and/or the heat conducting substrate (6).

8. The heat dissipating structure of claim 7, wherein the transformer heat conducting portion is provided with an elastic heat conducting pad.

9. The heat dissipating structure according to claim 7, wherein a surface of the heat conducting substrate (6) facing the second area (02) is provided with heat dissipating fins (61) extending to the second area (02).

10. The heat dissipating structure according to claim 7, characterized in that the surface of the heat conducting substrate (6) facing the first area (01) is coated with a heat dissipating coating.

11. The heat dissipating structure according to claim 1, wherein there is no duct communication between the first region (01) and the second region (02).

12. A servo drive comprising a heat dissipating structure as claimed in any one of claims 1-11.

13. The servo driver according to claim 12, comprising a housing assembly (100), wherein the heat dissipating structure is in sealing connection with the housing assembly (100) and divides a first cavity (010) and a second cavity (020), the first cavity (010) is a closed cavity, the heat dissipating assembly (2) is arranged in the second cavity (020), and the thermally conductive object is arranged in the first cavity (010).

14. Servo drive according to claim 13, wherein a brake resistor (300) is further provided in the second cavity (020).

15. The servo driver according to claim 13, wherein the two opposite ends of the housing assembly (100) corresponding to the second cavity (020) are respectively provided with an air inlet (101) and an air outlet (102), and the heat dissipation assembly (2) comprises a heat dissipation fan.

16. The servo driver according to any of claims 13-14, wherein the thermally conductive object (210) comprises a capacitor, a power board (400) is arranged in the first cavity (010), a kidney-shaped hole (410) is formed in the power board (400), a soldering leg (211) of the capacitor is arranged in the kidney-shaped hole (410) in a penetrating manner, and the length of the kidney-shaped hole (410) is larger than the outer diameter of the soldering leg (211) so as to adjust the distance between the soldering leg (211) and the thermally conductive assembly (1).