CN114430001A - Glass substrate processing method and display device - Google Patents
Glass substrate processing method and display device Download PDFInfo
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- CN114430001A CN114430001A CN202210019839.4A CN202210019839A CN114430001A CN 114430001 A CN114430001 A CN 114430001A CN 202210019839 A CN202210019839 A CN 202210019839A CN 114430001 A CN114430001 A CN 114430001A
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- 239000011521 glass Substances 0.000 title claims abstract description 179
- 239000000758 substrate Substances 0.000 title claims abstract description 178
- 238000003672 processing method Methods 0.000 title claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 204
- 239000002184 metal Substances 0.000 claims abstract description 204
- 238000007747 plating Methods 0.000 claims abstract description 20
- 238000004080 punching Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 24
- 230000004888 barrier function Effects 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 26
- 238000005553 drilling Methods 0.000 description 5
- 229910000861 Mg alloy Inorganic materials 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a glass substrate processing method and a display device, wherein the glass substrate is applied to the display device, and the glass substrate processing method comprises the following steps: providing a glass substrate, wherein the glass substrate is provided with a first surface and a second surface which are arranged in an opposite way, and the first surface and the second surface are both provided with metal wiring; punching the position of the glass substrate, where the metal wire is arranged, so as to cut off the metal wire on the first surface and the metal wire on the second surface, and forming a through hole on the glass substrate; and plating metal on the cross section of the glass substrate at the through hole, the cross section of the metal wire on the first surface and the cross section of the metal wire on the second surface so as to connect the metal wire on the first surface with the metal wire on the second surface. The glass substrate processing method can improve the circuit connection yield of the two surfaces of the glass substrate of the display device.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a glass substrate processing method and a display device.
Background
With the development of display technology, more and more types of display devices are appearing in the market. LED (light-emitting diode) displays have appeared in succession to CRT (Cathode Ray Tube) displays and LCD (Liquid Crystal displays). With the development of semiconductor technology, the LED displays gradually develop MiniLED displays and micro LED displays with better display effect.
In the application of the existing LED display, Mini LED display and MicroLED display, a circuit of LED/Mini LED/MicroLED is pasted on one surface of a TFT AM glass substrate, a circuit of a driving IC is pasted on the other surface of the TFT AM glass substrate, and the circuits on the two surfaces of the glass substrate are communicated to enable the display to work. In the related art, the circuits on both sides of the glass substrate are usually connected by metal transfer at the edge of the glass substrate, but many problems in the prior art are difficult to solve, so that the yield of circuit connection on both sides of the glass substrate is low.
Therefore, it is necessary to provide a new glass substrate processing method and a display device to solve the above technical problems.
Disclosure of Invention
The embodiment of the application provides a glass substrate processing method and a display device, which are used for improving the circuit connection yield of two surfaces of a glass substrate of the display device.
The embodiment of the application provides a glass substrate processing method, which is characterized in that the glass substrate is applied to a display device, and the glass substrate processing method comprises the following steps:
providing a glass substrate, wherein the glass substrate is provided with a first surface and a second surface which are arranged in an opposite way, and the first surface and the second surface are both provided with metal wiring;
punching a position of the glass substrate, where the metal wiring is arranged, so as to cut off the metal wiring on the first surface and the metal wiring on the second surface, and forming a via hole in the glass substrate; and
and plating metal on the cross section of the glass substrate at the through hole, the cross section of the metal wire on the first surface and the cross section of the metal wire on the second surface so as to connect the metal wire on the first surface with the metal wire on the second surface.
Optionally, the number of the via holes is multiple, the via holes are arranged in a straight line on the glass substrate, and one via hole corresponds to one metal trace on the first surface and one metal trace on the second surface; after the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wire on the first surface and the cross section of the metal wire on the second surface, the method further comprises the following steps:
and splitting the glass substrate to enable the glass substrate to be broken into two pieces along the arrangement direction of the through holes.
Optionally, before the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface, the method further includes:
and arranging barrier materials on the metal routing lines on the first surface and the metal routing lines on the second surface so as to protect the metal routing lines on the first surface and the metal routing lines on the second surface.
Optionally, the step of disposing a barrier material on the metal trace of the first surface and the metal trace of the second surface specifically includes:
a reserved position is arranged on the periphery of each through hole, the size of the reserved position is larger than that of the through hole, and the through hole is arranged in the range of the reserved position; and
and coating barrier materials on the parts of the metal wires on the first surface except the reserved positions and the parts of the metal wires on the second surface except the reserved positions.
Optionally, the step of plating a metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface specifically includes:
and soaking the glass substrate provided with the barrier material in a metal liquid so as to deposit metal on the cross section of the glass substrate at the through hole and the reserved position to form a coating.
Optionally, after the step of plating a metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface, and before the step of splitting the glass substrate, the method further includes:
and removing the barrier material on the metal wire of the first surface and the barrier material on the metal wire of the second surface to expose the metal wire of the first surface and the metal wire of the second surface.
Optionally, the metal element in the molten metal includes any one or at least two of copper, silver, gold, nickel, platinum, palladium, chromium, and aluminum.
Optionally, the via hole and the reserved position are both circular, and the diameter of the reserved position is at least 10 micrometers larger than that of the via hole.
Optionally, the step of punching the position of the glass substrate where the metal trace is disposed to intercept the metal trace on the first surface and the metal trace on the second surface, and forming a via hole in the glass substrate specifically includes:
and punching the position, provided with the metal wire, of the glass substrate by using laser so as to cut off the metal wire on the first surface and the metal wire on the second surface, and forming a through hole with the diameter of 100-300 micrometers on the glass substrate.
The embodiment of the application also provides a display device, which is characterized by comprising a glass substrate, wherein the glass substrate is processed by adopting the glass substrate processing method.
In the glass substrate processing method provided by the embodiment of the application, the glass substrate is provided with the first surface and the second surface which are arranged in a back-to-back mode, the first surface and the second surface are both provided with the metal wiring, the position, where the metal wiring is arranged on the glass substrate, is punched to cut off the metal wiring on the first surface and the metal wiring on the second surface, the through hole is formed in the glass substrate, the metal is plated to enable the section of the metal wiring on the first surface to be in a cross section, a continuous metal coating is formed between the section of the glass substrate at the through hole and the section of the metal wiring on the second surface, the metal wiring on the first surface is electrically connected with the metal wiring on the second surface through the continuous metal coating, the problem that the circuit connection is poor due to the fact that the metal is not adhered enough and falls off in the traditional scheme is avoided, and the circuit connection yield of the two sides of the glass substrate of the display device is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. In the following description, like reference numerals denote like parts. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.
Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present application.
Fig. 2 is a flowchart of a glass substrate processing method according to an embodiment of the present disclosure.
Fig. 3 is another flowchart of a glass substrate processing method according to an embodiment of the present disclosure.
Fig. 4 is a front view of a first state of a glass substrate processing process according to an embodiment of the present disclosure.
Fig. 5 is a cross-sectional view of a first state of a glass substrate processing process according to an embodiment of the present disclosure.
Fig. 6 is a front view of a second state of a glass substrate processing process according to an embodiment of the present disclosure.
Fig. 7 is a cross-sectional view of a second state of a glass substrate processing process according to an embodiment of the present disclosure.
Fig. 8 is a front view of a third state in a glass substrate processing process according to an embodiment of the present application.
Fig. 9 is a cross-sectional view of a third state of a glass substrate processing process according to an embodiment of the present application.
Fig. 10 is a front view of a fourth state in a glass substrate processing process according to an embodiment of the present application.
Fig. 11 is a cross-sectional view of a fourth state in the process of processing a glass substrate according to an embodiment of the present application.
Fig. 12 is a front view of a fifth state in a glass substrate processing process according to an embodiment of the present application.
Fig. 13 is a cross-sectional view of a fifth state in a glass substrate processing process according to an embodiment of the present application.
Fig. 14 is a front view of a sixth state in a glass substrate processing process according to an embodiment of the present disclosure.
Fig. 15 is a cross-sectional view of a sixth state in the process of processing a glass substrate according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the described embodiments are merely exemplary of some, and not all, of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a glass substrate processing method and a display device, which are used for improving the circuit connection yield of two surfaces of a glass substrate of the display device. The following description will be made with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present disclosure. The display device 1 can be any product or component with a display function, such as a mobile phone, a navigator, electronic paper, a television, a digital photo frame, a tablet computer, a notebook computer, and the like. The drawings of the embodiments of the present application explain the display device 1 by taking the display device 1 as a television as an example, but the embodiments of the present application do not limit the specific type of the display device 1. The display device 1 may include a housing 11 and a display 12. The display 12 may be an LED display, a Mini LED display, or a micro LED display. The display 12 is mounted on the housing 11 to realize a display function (and a touch function) of the display device 1. When the display device 1 is a mobile terminal such as a smart phone or a tablet computer, the display 12 is used for both displaying and touch-controlling.
It should be noted that the structure of the display device 1 in the embodiment of the present application is not limited to this, and the display device 1 may further include elements (not shown in the figures) such as a cover plate, a main board, a battery, a camera module, a speaker, a sensor, and the like. For the introduction of the cover plate, the main board, the battery, the camera module, the speaker, the sensor and other elements, reference may be made to the description of the above elements in the related art, and details are not repeated here.
The housing 11 may form an outer contour of the display device 1. Meanwhile, the housing 11 may serve as a protective case for various internal elements of the display device 1, preventing the various internal elements of the display device 1 from being damaged due to collision, falling, or the like of the display device 1. The housing 11 may be integrally formed. In the forming process of the housing 11, a microphone hole, a speaker hole, a receiver hole, an earphone hole, a USB interface hole, a rear camera hole, a fingerprint identification module mounting hole, and the like may be formed on the housing 11.
The housing 11 may be a metal housing such as a metal of magnesium alloy, stainless steel, etc. It should be noted that the material of the housing 11 in the embodiment of the present application is not limited to this, and may be other materials. Such as: the housing 11 may be a plastic housing, the housing 11 may also be a ceramic housing, the housing 11 may also include a plastic part and a metal part, and the housing 11 may be a housing structure in which metal and plastic are matched with each other. Specifically, the metal part may be formed first, for example, by casting to form a magnesium alloy substrate, and then molding the plastic on the magnesium alloy substrate to form a plastic substrate, so as to form the complete housing structure. It should be noted that the material and the process of the housing 11 are not limited to this, and a glass housing may also be used, and the specific material and the specific manufacturing process of the housing 11 are not limited in the embodiment of the present application.
The display 12 may form an interactive interface of the display device 1. Meanwhile, the display 12 may serve as a display surface of the display device 1, and a user can see characters or images displayed on the display device 1 through the display surface. Display 12 may include a glass substrate and other components. Wherein, the upper and lower two surfaces of glass substrate all are provided with the metal and walk the line. The description of the glass substrate and other components can be referred to the description of the LED display, the Mini LED display or the micro LED display in the related art, and the description thereof is omitted here.
In a display such as an LED display, a Mini LED display, or a micro LED display, a TFTAM glass substrate is provided with a line for LED/Mini LED/micro LED on one surface and a line for driving an IC on the other surface, and the lines on both surfaces of the glass substrate need to be connected to each other to operate the display. In the related art, the metal transfer method is usually adopted at the edge of the glass substrate to realize the communication of the circuits on the two sides of the glass substrate, but the scheme has the following problems: the cost is high, the side section of the glass is uneven, the transfer metal circuit is too thin, and the adhesion force is not enough, so that the circuit communication yield of the two surfaces of the glass substrate is low. Therefore, the present disclosure provides a method for processing a glass substrate, which can improve the yield of circuit connection on both sides of the glass substrate of a display device.
Referring to fig. 2 and fig. 3, fig. 2 is a flowchart of a glass substrate processing method according to an embodiment of the present disclosure, and fig. 3 is another flowchart of the glass substrate processing method according to the embodiment of the present disclosure. The glass substrate processing method provided by the embodiment of the application comprises the following steps:
s110, providing a glass substrate, wherein the glass substrate is provided with a first surface and a second surface which are arranged in a back-to-back manner, and the first surface and the second surface are both provided with metal wiring.
Referring to fig. 4 and 5, fig. 4 is a front view of a first state of a glass substrate in a processing process according to an embodiment of the present disclosure, and fig. 5 is a cross-sectional view of the first state of the glass substrate in the processing process according to the embodiment of the present disclosure. The glass substrate 2 has a first surface 21 and a second surface 22 opposite to each other, the first surface 21 may be disposed near a display surface of the display 12, the second surface 22 may be disposed near a non-display surface of the display 12, the first surface 21 may also be disposed near the non-display surface of the display 12, and the second surface 22 may also be disposed near the display surface of the display 12. Wherein, metal traces 23 are disposed on both the first surface 21 and the second surface 22.
In some embodiments, the projection of the portion of the metal trace 23 on the second surface 22 and the portion of the metal trace 23 on the first surface 21 in the thickness direction of the glass substrate 2 coincide. That is, the metal traces 23 on the first surface 21 and the metal traces 23 on the second surface 22 are correspondingly disposed.
In some embodiments, the projection of the portion of the metal trace 23 located on the second surface 22 and the projection of the portion of the metal trace 23 located on the first surface 21 in the thickness direction of the glass substrate 2 are not overlapped. That is, the metal traces 23 on the first surface 21 are offset from the metal traces 23 on the second surface 22.
And S120, punching the position of the glass substrate provided with the metal wiring to cut off the metal wiring on the first surface and the metal wiring on the second surface, and forming a through hole on the glass substrate.
Referring to fig. 6 and 7, fig. 6 is a front view of a second state of the glass substrate processing process provided in the embodiment of the present application, and fig. 7 is a cross-sectional view of the second state of the glass substrate processing process provided in the embodiment of the present application. In the process of punching, since the metal trace 23 is disposed on the surface of the glass substrate 2, punching the position of the glass substrate 2 where the metal trace 23 is disposed tends to cut the metal trace 23 first, and then the glass substrate 2 is punched so as to penetrate the glass substrate 2 to form the via hole 20.
If the glass substrate 2 is punched from the first surface 21 to the second surface 22, the metal trace 23 on the first surface 21 is cut off, the via hole 20 is formed on the glass substrate 2, and the metal trace 23 on the second surface 22 is cut off.
If the glass substrate 2 is punched from the second surface 22 to the first surface 21, the metal trace 23 on the second surface 22 is cut off, the via hole 20 is formed on the glass substrate 2, and the metal trace 23 on the first surface 21 is cut off.
If the glass substrate 2 is perforated in such a way that the glass substrate 2 is perforated from the first surface 21 and the second surface 22 at the same time, the metal traces 23 on the first surface 21 and the metal traces 23 on the second surface 22 are simultaneously cut off, and then the via holes 20 are formed in the glass substrate 2.
If the metal traces 23 on the first surface 21 and the metal traces 23 on the second surface 22 are correspondingly disposed, the glass substrate 2 needs to be perforated vertically so that the axial direction of the formed via hole 20 is parallel to the thickness direction of the glass substrate 2. If the metal trace 23 on the first surface 21 and the metal trace 23 on the second surface 22 are disposed in a staggered manner, the glass substrate 2 needs to be punched obliquely so that the axial direction of the formed via hole 20 is oblique to the thickness direction of the glass substrate 2.
It should be further noted that, the metal trace 23 on the first surface 21 and the metal trace 23 on the second surface 22 may be multiple, and the multiple metal traces 23 may be arranged on the glass substrate 2 in parallel at intervals. Then, the number of the vias 20 may be plural, and the plural vias 20 may be arranged in a straight line on the glass substrate 2.
In some embodiments, the step of punching the position of the glass substrate where the metal trace is disposed to cut off the metal trace on the first surface and the metal trace on the second surface specifically includes:
and S121, punching the position, provided with the metal wire, of the glass substrate by using laser to cut off the metal wire on the first surface and the metal wire on the second surface, and forming a through hole with the diameter of 100-300 microns on the glass substrate.
The specific tool for drilling the glass substrate 2 can be various, and the embodiment of the present application takes the example of drilling the glass substrate 2 with laser as an example. It can be appreciated that laser drilling can be used with great accuracy and efficiency because of the directional emission, the extreme brightness, and the extreme power of the laser. On the other hand, the laser drilling can well control the drilling size. The diameter of the via hole 20 formed on the glass substrate may be in the order of micrometers, such as 100 micrometers to 300 micrometers, and may be 200 micrometers. Of course, the diameter of the via hole 20 may be adaptively adjusted according to specific requirements, and the specific diameter of the via hole 20 is not limited in the embodiment of the present application.
And S130, plating metal on the cross section of the glass substrate at the through hole, the cross section of the metal wire on the first surface and the cross section of the metal wire on the second surface so as to connect the metal wire on the first surface with the metal wire on the second surface.
After the glass substrate 2 is punched at the position where the metal trace 23 is disposed to cut off the metal trace 23 on the first surface 21 and the metal trace 23 on the second surface 22 and form the via hole 20 on the glass substrate 2, the glass substrate 2 forms a cross section at the via hole 20, and the metal trace 23 on the first surface 21 and the metal trace 23 on the second surface 22 also form a cross section at the cut-off position. The cross sections of the three are plated with metal, that is, a via is formed by the metal plating layer to electrically connect the metal trace 23 on the first surface 21 and the metal trace 23 on the second surface 22.
In some embodiments, before the step of plating a metal on a cross section of the glass substrate at the via hole, a cross section of the metal trace on the first surface, and a cross section of the metal trace on the second surface, the method further includes:
s131, arranging a reserved position on the periphery of each through hole, wherein the size of the reserved position is larger than that of the through hole, and the through hole is arranged in the range of the reserved position; and
s132, coating blocking materials on the portions of the metal trace on the first surface except the reserved position and the portions of the metal trace on the second surface except the reserved position, so as to protect the metal trace on the first surface and the metal trace on the second surface.
Referring to fig. 8 and 9, fig. 8 is a front view of a third state in a glass substrate processing process provided in an embodiment of the present application, and fig. 9 is a cross-sectional view of the third state in the glass substrate processing process provided in the embodiment of the present application. Because no barrier material 25 is coated within the reserved locations 24, the area within the reserved locations 24 (including the vias 20) is exposed. Then, when the metal is plated subsequently, all the exposed parts can be covered by the metal plating layer. The size of the reserved position 24 is larger than that of the via hole 20, so that the size of the metal coating formed by the reserved position 24 is larger than that of the metal coating formed in the via hole 20, the metal wiring 23 of the first surface 21 and the metal wiring 23 of the second surface 22 both have larger contact area with the coating metal, and the circuits on the two sides of the glass substrate 2 can be ensured to have higher connection yield.
The shape of the reserved position 24 may be a rectangle or a square, and the shape of the reserved position 24 may also be a circle, and the specific shape of the reserved position 24 is not limited in the embodiment of the present application. When the pre-existing locations 24 are circular, the diameter of the pre-existing locations 24 is at least 10 microns greater than the diameter of the vias 20. Of course, the difference between the diameter of the reserved position 24 and the diameter of the via hole 20 may be adaptively adjusted according to specific requirements, and the specific difference between the diameter of the reserved position 24 and the diameter of the via hole 20 is not limited in the embodiment of the present application.
In some embodiments, the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface specifically includes:
s133, soaking the glass substrate provided with the barrier material in a metal liquid to deposit metal on the cross section of the glass substrate at the through hole and the reserved position to form a coating.
Referring to fig. 10 and 11, fig. 10 is a front view of a fourth state in a glass substrate processing process provided in an embodiment of the present application, and fig. 11 is a cross-sectional view of the fourth state in the glass substrate processing process provided in the embodiment of the present application. The metal element in the molten metal may include any one or at least two of copper, silver, gold, nickel, platinum, palladium, chromium, and aluminum, and the molten metal containing a metal having a relatively good conductivity is usually used to soak the glass substrate 2, so that the metal plating layer 26 has a relatively good conductivity.
In some embodiments, after the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface, the method further includes:
s134, removing the blocking material on the metal trace on the first surface and the blocking material on the metal trace on the second surface to expose the metal trace on the first surface and the metal trace on the second surface.
Referring to fig. 12 and 13, fig. 12 is a front view of a fifth state in a glass substrate processing process according to an embodiment of the present application, and fig. 13 is a cross-sectional view of the fifth state in the glass substrate processing process according to the embodiment of the present application. After the glass substrate 2 is soaked in the metal liquid, the via holes 20 and the reserved positions 24 are filled with the metal plating layer 26, and only the metal traces 23 and the metal plating layer 26 on the glass substrate 2 can be reserved by removing the previously arranged barrier material 25.
In some embodiments, the step of removing the barrier material of the first surface and the barrier material of the second surface further comprises:
and S135, splitting the glass substrate to enable the glass substrate to be broken along the arrangement direction of the via holes.
Referring to fig. 14 and 15, fig. 14 is a front view of a sixth state in a glass substrate processing process according to an embodiment of the present application. Fig. 15 is a cross-sectional view of a sixth state in the process of processing a glass substrate according to an embodiment of the present application. The glass substrate 2 is cracked along the arrangement direction of the via holes 20, so that the glass substrate 2 is broken along the arrangement direction of the via holes 20, and then two glass substrate circuit boards with two glass edge routing lines communicated with the upper surface and the lower surface of the circuit and smooth glass edge sections can be obtained through one-step processing.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The glass substrate processing method and the display device provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are explained herein by using specific examples, and the description of the embodiments is only used to help understand the methods and core ideas of the present application; for those skilled in the art, based on the idea of the present application, the embodiments and the application scope may be changed, and in summary, the content of the present specification should not be construed as limiting the present application.
Claims (10)
1. A glass substrate processing method, wherein the glass substrate is applied to a display device, the glass substrate processing method comprising:
providing a glass substrate, wherein the glass substrate is provided with a first surface and a second surface which are arranged in an opposite way, and metal wiring is arranged on the first surface and the second surface;
punching the position of the glass substrate, where the metal wire is arranged, so as to cut off the metal wire on the first surface and the metal wire on the second surface, and forming a through hole on the glass substrate; and
and plating metal on the cross section of the glass substrate at the through hole, the cross section of the metal wire on the first surface and the cross section of the metal wire on the second surface so as to connect the metal wire on the first surface with the metal wire on the second surface.
2. The glass substrate processing method according to claim 1, wherein the number of the vias is plural, a plurality of the vias are arranged in a straight line on the glass substrate, and one via corresponds to one metal trace on the first surface and one metal trace on the second surface; after the step of plating metal on the cross section of the glass substrate at the via hole, the cross section of the metal wire on the first surface and the cross section of the metal wire on the second surface, the method further comprises the following steps:
and splitting the glass substrate to enable the glass substrate to be broken into two pieces along the arrangement direction of the through holes.
3. The glass substrate processing method according to claim 2, wherein before the step of plating the metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface, the method further comprises:
and arranging barrier materials on the metal routing lines on the first surface and the metal routing lines on the second surface so as to protect the metal routing lines on the first surface and the metal routing lines on the second surface.
4. The glass substrate processing method according to claim 3, wherein the step of disposing a barrier material on the metal traces on the first surface and the metal traces on the second surface specifically comprises:
setting a reserved position on the periphery of each through hole, wherein the size of the reserved position is larger than that of the through hole, and the through hole is positioned in the range of the reserved position; and
and coating barrier materials on the parts of the metal wires on the first surface except the reserved positions and the parts of the metal wires on the second surface except the reserved positions.
5. The glass substrate processing method according to claim 4, wherein the step of plating a metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface specifically comprises:
and soaking the glass substrate provided with the barrier material in a metal liquid so as to deposit metal on the cross section of the glass substrate at the through hole and the reserved position to form a coating.
6. The glass substrate processing method according to claim 5, wherein after the step of plating the metal on the cross section of the glass substrate at the via hole, the cross section of the metal trace on the first surface, and the cross section of the metal trace on the second surface, and before the step of splitting the glass substrate, the method further comprises:
removing the barrier material on the metal wire of the first surface and the barrier material on the metal wire of the second surface to expose the metal wire of the first surface and the metal wire of the second surface.
7. The glass substrate processing method according to claim 5, wherein the metal element in the molten metal includes any one or at least two of copper, silver, gold, nickel, platinum, palladium, chromium, and aluminum.
8. The glass substrate processing method of claim 3, wherein the via and the reserve locations are both circular and the reserve locations have a diameter at least 10 microns greater than a diameter of the via.
9. The glass substrate processing method according to any one of claims 1 to 8, wherein the step of punching the position of the glass substrate where the metal traces are disposed to cut off the metal traces on the first surface and the metal traces on the second surface and form the via hole in the glass substrate specifically comprises:
and punching the position, provided with the metal wire, of the glass substrate by using laser so as to cut off the metal wire on the first surface and the metal wire on the second surface, and forming a through hole with the diameter of 100-300 micrometers on the glass substrate.
10. A display device comprising a glass substrate processed by the glass substrate processing method according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210019839.4A CN114430001A (en) | 2022-01-10 | 2022-01-10 | Glass substrate processing method and display device |
| PCT/CN2022/131128 WO2023130832A1 (en) | 2022-01-10 | 2022-11-10 | Glass substrate processing method and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210019839.4A CN114430001A (en) | 2022-01-10 | 2022-01-10 | Glass substrate processing method and display device |
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| CN114430001A true CN114430001A (en) | 2022-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210019839.4A Pending CN114430001A (en) | 2022-01-10 | 2022-01-10 | Glass substrate processing method and display device |
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| Country | Link |
|---|---|
| CN (1) | CN114430001A (en) |
| WO (1) | WO2023130832A1 (en) |
Cited By (1)
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| WO2023130832A1 (en) * | 2022-01-10 | 2023-07-13 | 惠州视维新技术有限公司 | Glass substrate processing method and display device |
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| WO2023130832A1 (en) | 2023-07-13 |
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