CN113685747A - LED lamp with high-heat-conduction and heat-dissipation intelligent chip - Google Patents
LED lamp with high-heat-conduction and heat-dissipation intelligent chip Download PDFInfo
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- CN113685747A CN113685747A CN202110969258.2A CN202110969258A CN113685747A CN 113685747 A CN113685747 A CN 113685747A CN 202110969258 A CN202110969258 A CN 202110969258A CN 113685747 A CN113685747 A CN 113685747A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract
The invention discloses an LED lamp with a high-heat-conduction and heat-dissipation intelligent chip, which comprises a lamp shell, wherein a lamp mounting groove is arranged in the lamp shell, an LED light source plate is arranged at the bottom side of the lamp mounting groove, a circle of thread groove is arranged on the side wall of an opening of the lamp mounting groove, a light transmitting plate is connected with the thread groove in a threaded manner, a light sensor is fixedly connected to the central position of the side wall of the light transmitting plate, a plurality of through holes are formed in the light transmitting plate, a refrigerating groove is formed in the side wall of the lamp shell, an internal thread is arranged on the annular side wall in the refrigerating groove, the refrigerating groove is connected with a sealing ring through the internal thread, a heat-dissipation plate block is fixedly connected to the side wall of the sealing ring, and a semiconductor chip is arranged on the side wall of the heat-dissipation plate block. The invention has reasonable design and ingenious conception, can detect the occurrence of a fire in time, and switch the power supply in time, can prevent the lamp from being extinguished in the fire, and eliminates the potential safety hazard that people are easy to be injured in the dark environment in the fire.
Description
Technical Field
The invention relates to the technical field of LED lamps, in particular to an LED lamp with a high-heat-conduction and heat-dissipation intelligent chip.
Background
The LED lamp is a lamp using a light emitting diode as a light source, a semiconductor LED is generally solidified on a support by using silver glue or white glue, then a chip and a circuit board are connected by using silver wires or gold wires, the periphery of the chip and the circuit board are sealed by epoxy resin, the effect of protecting an internal core wire is achieved, and finally a shell is installed.
Among the prior art, general LED lamps and lanterns all are connected with external municipal power supply, but in case when the conflagration breaing out, the conflagration probably causes the circuit short circuit, and then makes the LED lamp all extinguish, can cause certain panic to people's field of vision is restricted also can be injured more easily under the environment of dark.
The Chinese patent CN202010025283.0 discloses a heat dissipation type LED lamp, which comprises a lampshade, wherein the upper end of the lampshade is connected with an installation plate through threads, a lamp wick is fixed at the bottom of the installation plate, two groups of symmetrically arranged heat dissipation mechanisms are arranged inside the lampshade, each heat dissipation mechanism comprises a fixed plate fixed on the inner wall of the lampshade, an adjusting device is arranged at the upper end of the fixed plate, a liquid storage tank is fixed on the inner wall of the lampshade, an ejection groove is formed in the side wall of the liquid storage tank, and a nozzle communicated with the inside of the liquid storage tank is formed in the inner wall of the ejection groove. Has the advantages that: gasification through ether solution makes the inside atmospheric pressure increase of liquid reserve tank, and then makes gaseous state ether promote the magnetic path and enter into the air current case for the heat that gaseous state ether carried is absorbed by the coolant liquid in the cooler bin and is leaded to the liquefaction, and gasification heat absorption and liquefaction heat dissipation through ether have realized giving off to the inside heat of lamp shade, and then realize handling the cooling in the lamp shade, avoid the wick to work under high temperature. However, the heat dissipation method cannot effectively solve the problem of heat generation of the LED lamp during long-time operation.
Therefore, it is desirable to provide an intelligent high-thermal-conductivity heat-dissipation LED lamp.
Disclosure of Invention
The invention provides an LED lamp with a high-heat-conduction and heat-dissipation intelligent chip, which aims to solve the problems that in the prior art provided by the background art, the LED lamp is generally connected with an external municipal power supply, but once a fire disaster occurs, the fire disaster can cause a short circuit, so that the LED lamp is extinguished, a certain panic can be caused, and the visual field of people is limited in a dark environment and the people can be easily injured.
In order to achieve the purpose, the invention adopts the following technical scheme:
a Light Emitting Diode (LED) lamp with a high-heat-conduction and heat-dissipation intelligent chip comprises a lamp shell, wherein a lamp mounting groove is arranged in the lamp shell, an LED light source plate is arranged at the bottom side of the lamp mounting groove, a circle of thread groove is formed in the opening side wall of the lamp mounting groove, a light transmitting plate is connected with the thread groove in an internal thread manner, a light sensor is fixedly connected to the central position of the side wall of the light transmitting plate, a plurality of through holes are formed in the light transmitting plate, a refrigerating groove is formed in the side wall of the lamp shell and filled with ether liquid, an internal thread is formed in the annular side wall of the refrigerating groove, a sealing ring is connected with the refrigerating groove through the internal thread, a heat-dissipation plate block is fixedly connected to the side wall of the sealing ring, a semiconductor refrigerating plate is arranged on the other side of the heat-dissipation plate block, a controller is arranged on the side wall of the lamp shell, and the power output end of the controller is electrically connected with the power input end of the semiconductor refrigerating plate, the controller is respectively electrically connected with the semiconductor refrigeration sheet, the LED light source plate and the optical sensor, the LED light source plate is electrically connected with an external municipal line, and a limiting device is arranged on the side wall of the lamp shell;
a cold-heat exchange cavity is arranged on the inner wall of the lamp shell and outside the LED light source plate in a surrounding manner, the cold-heat exchange cavity is positioned below the refrigerating groove, an overflow groove is formed in the middle of the lamp shell below the refrigerating groove, two telescopic grooves are respectively arranged on the left side and the right side of the overflow groove, a compression spring is fixed in each telescopic groove, the compression spring extends out of the telescopic groove and is connected with a stop block, the stop block is rotatably connected with the side wall of the bottom of the refrigerating groove, and the compression spring extrudes the two stop blocks to seal the overflow groove;
ether liquid is filled in the cold-heat exchange cavity, the LED light source plate generates heat during working and is transferred into the cold-heat exchange cavity through the inner wall of the lamp shell, when the ether liquid in the cold-heat exchange cavity reaches a boiling point, the ether liquid is evaporated, the pressure of the cold-heat exchange cavity is increased, the two check blocks extrude the compression spring, the opening of the overflow groove is increased, the temperature in the cold-heat exchange cavity is higher, the opening of the overflow groove is larger, the ether liquid in the refrigerating groove enters the cold-heat exchange cavity to cool the cold-heat exchange cavity, and meanwhile, the heat transfer of the cold-heat exchange cavity is used for cooling the LED light source plate and the lamp shell;
all be equipped with temperature sensor in refrigeration groove and the cold and hot exchange cavity, light sensor real-time detection LED light source board's illumination intensity, when two the temperature sensor difference in temperature is less than when the difference in temperature threshold value, the controller reduces the electric current of LED light source board along with the reduction of difference in temperature gradually, and is when two the temperature sensor difference in temperature is higher than when the difference in temperature threshold value, the controller resumes the operating current to the normal value of LED light source board.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the LED light source plate, power is supplied by an external municipal line, the light sensor can receive light irradiation intensity of the LED light source plate and send light intensity signals to the semiconductor refrigerating sheet, when a fire disaster occurs indoors, smoke generated by the fire disaster enters the lamp shell from the through holes, the smoke receives the light signals by the light sensor, and the semiconductor refrigerating sheet starts the controller when receiving the light intensity signals and reduces in a short time;
2. according to the invention, the ether liquid in the refrigerating groove enters the cold-heat exchange cavity to cool the cold-heat exchange cavity, meanwhile, the heat transfer of the cold-heat exchange cavity is used for cooling the LED light source plate and the lamp shell, the evaporated ether gas enters the refrigerating groove and is liquefied again under the refrigerating effect of the semiconductor refrigerating sheet, and the higher the temperature in the cold-heat exchange cavity is, the larger the opening of the overflow groove is, so that the heat exchange efficiency is improved, the heat productivity of the lamp shell and the LED light source plate can be adaptively cooled, and the cooling effect is better.
3. According to the invention, the temperature sensors are arranged in the refrigerating groove and the cold-heat exchange cavity, the light sensor detects the illumination intensity of the LED light source plate in real time, when the temperature difference between the two temperature sensors is lower than the temperature difference threshold value, the controller gradually reduces the current of the LED light source plate along with the reduction of the temperature difference, so that after the current of the LED light source plate is reduced by the controller, the heating of the LED light source plate is reduced, thus the refrigerating groove and the cold-heat exchange cavity have enough heat exchange time, when the temperature difference between the two temperature sensors is higher than the temperature difference threshold value, the controller recovers the working current of the LED light source plate to a normal value, and normal heat exchange can be continuously carried out to radiate the lamp shell and the LED light source plate.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given in detail by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
fig. 1 is a schematic perspective view of an LED lamp with a high thermal conductivity and heat dissipation intelligent chip according to the present invention;
FIG. 2 is a schematic side sectional view of an LED lamp with a high thermal conductivity and heat dissipation intelligent chip according to the present invention;
fig. 3 is a schematic bottom structure diagram of an LED lamp with a high thermal conductivity and heat dissipation intelligent chip according to the present invention;
fig. 4 is a schematic view of a connection structure between a heat dissipation plate and a sealing ring in an LED lamp provided with a high thermal conductivity heat dissipation intelligent chip according to the present invention;
FIG. 5 is a schematic view of a portion A of FIG. 3;
fig. 6 is a partially enlarged structural diagram of B in fig. 2.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a controller; 2. a refrigeration tank; 3. a heat dissipating plate; 4. a semiconductor refrigeration sheet; 5. a seal ring; 6. a fixed block; 7. a fixed shaft; 8. a stop lever; 9. a lamp housing; 10. an LED light source plate; 11. a through hole; 12. a light sensor; 13. a light-reflecting film; 14. a thread groove; 15. a light-transmitting plate; 16. a torsion spring; 17. a heat exchange chamber; 18. an overflow trough; 19. a telescopic groove; 20. a compression spring; 21. and a stop block.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention. The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example 1
Referring to fig. 1 to 6, in an embodiment of the present invention, an LED lamp with a high thermal conductivity and heat dissipation intelligent chip includes a lamp housing 9, a lamp mounting groove is disposed in the lamp housing 9, an LED light source plate 10 is disposed at a bottom side of the lamp mounting groove 2, a circle of thread groove 14 is disposed on an opening side wall of the lamp mounting groove, the thread groove 14 is connected with a light transmission plate 15 in an internal thread manner, a light sensor 12 is fixedly connected to a central position of a side wall of the light transmission plate 15, a plurality of through holes 11 are disposed on the light transmission plate 15, a cooling groove 2 is disposed on a side wall of the lamp housing 9, ether liquid is filled in the cooling groove 2, an internal thread is disposed on an annular side wall in the cooling groove 2, the cooling groove 2 is connected with a sealing ring 5 through an internal thread, a heat dissipation plate block 3 is fixedly connected to a side wall of the sealing ring 5, a semiconductor cooling plate 4 is disposed on another side of the heat dissipation plate block 3, a controller 1 is disposed on the side wall of the lamp housing 9, the power output end of the controller 1 is electrically connected with the power input end of the semiconductor refrigeration sheet 4, the controller 1 is electrically connected with the semiconductor refrigeration sheet 4, the LED light source plate 10 and the optical sensor 12 respectively, and the LED light source plate 10 is electrically connected with an external municipal line. A limiting device is arranged on the side wall of the lamp shell 9;
the inner wall of the lamp shell 9 and the outer portion of the LED light source plate 10 are provided with a cold-heat exchange cavity 17 in a surrounding mode, the cold-heat exchange cavity 17 is located below the refrigerating groove 2, an overflow groove 18 is formed in the middle of the lamp shell 9 below the refrigerating groove, two telescopic grooves 19 are respectively arranged on the left side and the right side of the overflow groove 18, a compression spring 20 is fixed in each telescopic groove 19, the compression spring 20 extends out of the telescopic groove 19 to be connected with a stop block 21, the stop block 21 is rotatably connected with the side wall of the bottom of the refrigerating groove 2, the compression spring 20 extrudes the two stop blocks 21 to seal the overflow groove 18, ether liquid in the refrigerating groove 2 is prevented from entering the cold-heat exchange cavity 17, and therefore the ether liquid in the refrigerating groove 2 is effectively cooled by the semiconductor refrigerating sheet 4.
It has ether liquid to pack equally in cold and heat exchange chamber 17, LED light source board 10 work is generated heat and is transmitted cold and heat exchange chamber 17 in through 9 inner walls of lamps and lanterns shell, ether liquid temperature in cold and heat exchange chamber 17 reaches ether boiling point back evaporation, because ether liquid's boiling point is 34.5 ℃, after LED lamp plate work a period, cold and heat exchange chamber 17's temperature reaches the ether boiling point easily, ether liquid evaporation back makes cold and heat exchange chamber 17 pressure increase, thereby promote two dog 21 upturns extrusion compression spring 20, make overflow launder 18 opening increase.
Ether liquid in the refrigerating groove 2 enters the cold heat exchange cavity 17 to cool down the cold heat exchange cavity 17, the heat transfer through the cold heat exchange cavity 17 cools down the LED light source plate 10 and the lamp shell 9, and the ether gas after evaporation then enters the refrigerating groove 2, and liquefy again under the refrigeration effect of the semiconductor refrigerating sheet 4, because the temperature is higher in the cold heat exchange cavity 17, the opening of the overflow groove 18 is bigger, thereby the heat exchange efficiency is improved, so as to carry out adaptive cooling with the calorific capacity of the lamp shell 9 and the LED light source plate 10, and the cooling effect is better.
Example 2
On the basis of embodiment 1, in order to avoid long-time operation of the lamp, the heat exchange time between the refrigeration tank 2 and the heat and cold exchange cavity 17 is not enough to satisfy the refrigeration rate of the semiconductor refrigeration sheet 4, temperature sensors are respectively arranged in the refrigeration tank 2 and the heat and cold exchange cavity 17 of this embodiment, the light sensor 12 detects the illumination intensity of the LED light source board 10 in real time, when the temperature difference between the two temperature sensors is lower than the temperature difference threshold value, the controller 1 gradually reduces the current of the LED light source board 10 along with the reduction of the temperature difference, the temperature difference threshold value is set to be 5-10 ℃ according to the heating condition of the LED light source board, thus, after the current of the LED light source board 10 is reduced by the controller, the heating of the LED light source board 10 is reduced, so that the refrigeration tank 2 and the heat and cold exchange cavity 17 have enough heat exchange time, when the temperature difference between the two temperature sensors is higher than the temperature difference threshold value, the controller 1 recovers the working current of the LED light source board 10 to a normal value, normal heat exchange can be continued to dissipate heat from the lamp housing 9 and the LED light source board 10.
Example 3
Referring to fig. 1-2, on the basis of embodiment 1, the plurality of through holes 11 are located around the optical sensor 12 in an annular array, when a fire occurs indoors, after smoke generated by the fire enters the lamp housing 9 from the plurality of through holes 11, light signals received by the optical sensor 12 can change faster, the side wall of the edge of the lamp mounting groove is provided with the reflective film 13, the light reflection by the reflective film 13 can increase the illumination intensity of the LED light source board 10, and the torsion spring 16 is provided with the anti-oxidation coating, so that the torsion spring 16 can be prevented from being oxidized and corroded.
Example 4
Referring to fig. 3 and 5, a limiting device is disposed on a side wall of a lamp housing 9, the limiting device includes a plurality of square fixing blocks 6, the plurality of fixing blocks 6 are fixedly connected to the side wall of the lamp housing 9 in an annular array, a right-angle groove is disposed on the side wall of each fixing block 6, a fixing shaft 7 is fixedly connected to each right-angle groove, a stop lever 8 is rotatably connected to the fixing shaft 7, a torsion spring 16 is fixedly connected between the side wall of each stop lever 8 and the side wall of the right-angle groove, each torsion spring 16 is sleeved on the fixing shaft 7, when the lamp is installed, the plurality of stop levers 8 are firstly pushed to a vertical state from a horizontal state, then the bottom end of the lamp housing 9 is pushed into a preset cavity, after entering the cavity, each stop lever is restored to a horizontal state under the action of the torsion spring 16, and then the lamp is installed and fixed on a wall or a plate, when the lamp needs to be disassembled, the plurality of blocking rods 8 can be taken out from the hollow space in a vertical state only by pulling the lamp shell 9 outwards with force.
When a lamp is installed, firstly, a plurality of blocking rods 8 are horizontally pushed to be in a vertical state, then, the bottom end of a lamp shell 9 is pushed into a preset hollow hole, after the lamp enters the hollow hole, each blocking rod 8 is restored to be in a horizontal state under the action of a torsion spring 16, and then the lamp is installed and fixed on a wall or a plate, and when the lamp needs to be disassembled, the lamp shell 9 is pulled outwards with force, so that the blocking rods 8 can be taken out from the hollow hole in a vertical state;
LED light source board 10 provides the power by external town line at ordinary times, light sensor 12 can receive the light irradiation intensity of LED light source board 10, and with light intensity signal transmission to semiconductor refrigeration piece 4, when indoor conflagration breaing out, the smog that the conflagration produced will enter into in lamps and lanterns shell 9 from a plurality of through-holes 11, smog receives light signal with light sensor 12, semiconductor refrigeration piece 4 receives the light intensity signal short time and descends, start controller 1, provide the power for LED light source board 10 through controller 1.
After the LED lamp panel works for a period of time, the temperature of the cold-heat exchange cavity 17 easily reaches the ether boiling point, the pressure of the cold-heat exchange cavity 17 is increased after ether liquid is evaporated, so that the two stop blocks 21 are pushed to rotate upwards to extrude the compression spring 20, the opening of the overflow groove 18 is enlarged, the ether liquid in the refrigerating groove 2 enters the cold-heat exchange cavity 17 to cool the cold-heat exchange cavity 17, meanwhile, the heat transfer of the cold-heat exchange cavity 17 is used for cooling the LED light source plate 10 and the lamp shell 9, the evaporated ether gas enters the refrigerating groove 2 and is liquefied again under the refrigerating effect of the semiconductor refrigerating sheet 4, as the temperature in the cold-heat exchange cavity 17 is higher, the opening of the overflow groove 18 is larger, the heat exchange efficiency is improved, so as to carry out adaptive cooling with the heat productivity of the lamp shell 9 and the LED light source plate 10, the cooling effect is better, and temperature sensors are arranged in the refrigerating groove 2 and the cold-heat exchange cavity 17, light sensor 12 real-time detection LED light source board 10's illumination intensity, when two temperature sensor difference in temperature are less than the difference in temperature threshold value, controller 1 reduces the electric current of LED light source board 10 along with the reduction of difference in temperature gradually, this difference in temperature threshold value is established to 5 ~ 10 according to the condition of generating heat of LED lamp plate, so, after the electric current of LED light source board 10 is reduced through the controller, LED light source board 10 generates heat and reduces, thereby make refrigeration groove 2 and cold and hot exchange chamber 17 have sufficient heat exchange time, when two temperature sensor difference in temperature are higher than the difference in temperature threshold value, controller 1 resumes the operating current of LED light source board 10 to normal value, can continue to carry out normal heat exchange and dispel the heat to lamps and lanterns shell 9 and LED light source board 10.
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner; the present invention may be readily implemented by those of ordinary skill in the art as illustrated in the accompanying drawings and described above; however, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the scope of the invention as defined by the appended claims; meanwhile, any equivalent changes, modifications, evolutions, etc. made to the above embodiments according to the essential technology of the present invention still belong to the protection scope of the technical solution of the present invention.
Claims (8)
1. A light-emitting diode (LED) lamp with a high-heat-conduction and heat-dissipation intelligent chip comprises a lamp shell and is characterized in that a lamp mounting groove is formed in the lamp shell, an LED light source plate is arranged on the bottom side of the lamp mounting groove, a circle of thread groove is formed in the opening side wall of the lamp mounting groove, a light transmitting plate is connected with the thread groove in an internal thread manner, a light sensor is fixedly connected to the central position of the side wall of the light transmitting plate, a plurality of through holes are formed in the light transmitting plate, a refrigerating groove is formed in the side wall of the lamp shell and filled with ether liquid, an internal thread is formed in the annular side wall of the refrigerating groove, a sealing ring is connected with the refrigerating groove through the internal thread, a heat-dissipation plate block is fixedly connected to the side wall of the sealing ring, a semiconductor refrigerating plate is arranged on the other side of the heat-dissipation plate block, a controller is arranged on the side wall of the lamp shell, and the power output end of the controller is electrically connected with the power input end of the semiconductor refrigerating plate, the controller is respectively electrically connected with the semiconductor refrigeration sheet, the LED light source plate and the optical sensor, the LED light source plate is electrically connected with an external municipal line, and a limiting device is arranged on the side wall of the lamp shell;
a cold-heat exchange cavity is arranged on the inner wall of the lamp shell and outside the LED light source plate in a surrounding manner, the cold-heat exchange cavity is positioned below the refrigerating groove, an overflow groove is formed in the middle of the lamp shell below the refrigerating groove, two telescopic grooves are respectively arranged on the left side and the right side of the overflow groove, a compression spring is fixed in each telescopic groove, the compression spring extends out of the telescopic groove and is connected with a stop block, the stop block is rotatably connected with the side wall of the bottom of the refrigerating groove, and the compression spring extrudes the two stop blocks to seal the overflow groove;
the LED lamp comprises a lamp shell, a cold-heat exchange cavity, an LED light source plate, a light source box and a light source box, wherein ether liquid is filled in the cold-heat exchange cavity, the working heat of the LED light source plate is transmitted into the cold-heat exchange cavity through the inner wall of the lamp shell, when the ether liquid in the cold-heat exchange cavity reaches a boiling point and then evaporates, the pressure of the cold-heat exchange cavity is increased, two check blocks extrude a compression spring to increase the opening of an overflow groove, the temperature in the cold-heat exchange cavity is higher, the opening of the cold-heat exchange cavity is larger, the opening of the overflow groove is larger, the ether liquid in the cold-heat exchange cavity enters the cold-heat exchange cavity to cool the cold-heat-exchange cavity, and-heat-transfer of the LED light source plate and the lamp shell are cooled simultaneously.
2. The LED lamp with the smart chip having high thermal conductivity and heat dissipation of claim 1, wherein the cooling tank and the heat exchange chamber are both provided with a temperature sensor, the light sensor detects the illumination intensity of the LED light source board in real time, when the temperature difference between the two temperature sensors is lower than a temperature difference threshold, the controller gradually reduces the current of the LED light source board along with the reduction of the temperature difference, and when the temperature difference between the two temperature sensors is higher than the temperature difference threshold, the controller restores the operating current of the LED light source board to a normal value.
3. The LED lamp provided with the intelligent high-heat-conductivity heat-dissipation chip as claimed in claim 1, wherein the limiting device comprises a plurality of fixing blocks which are square, the fixing blocks are fixedly connected to the side wall of the lamp shell in an annular array mode, a right-angle groove is formed in the side wall of each fixing block, a fixing shaft is fixedly connected to the inside of each right-angle groove, a stop lever is rotatably connected to each fixing shaft, a torsion spring is fixedly connected between the two side walls of each stop lever and the two side walls of each right-angle groove, and each torsion spring is sleeved on each fixing shaft.
4. The LED lamp provided with the intelligent high-heat-conductivity heat-dissipation chip as claimed in claim 1, wherein the heat dissipation plate is a scale-shaped heat dissipation plate.
5. The LED lamp provided with the intelligent chip with high heat conduction and heat dissipation of claim 1, wherein the plurality of through holes are arranged around the light sensor in an annular array.
6. The LED lamp provided with the intelligent high-heat-conductivity heat-dissipation chip as claimed in claim 1, wherein the controller can adopt a No. 3 battery, a No. 5 battery or a No. 7 battery.
7. The LED lamp provided with the intelligent chip with high heat conduction and heat dissipation of claim 1, wherein a reflective film is disposed on a side wall of an edge of the lamp mounting groove.
8. The LED lamp provided with the intelligent chip with high heat conduction and heat dissipation of claim 3, wherein the torsion spring is provided with an anti-oxidation coating.
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| CN202110969258.2A CN113685747B (en) | 2021-08-23 | 2021-08-23 | LED lamp with high-heat-conduction and heat-dissipation intelligent chip |
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| CN202110969258.2A CN113685747B (en) | 2021-08-23 | 2021-08-23 | LED lamp with high-heat-conduction and heat-dissipation intelligent chip |
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| CN113685747A true CN113685747A (en) | 2021-11-23 |
| CN113685747B CN113685747B (en) | 2022-06-17 |
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| US9316387B1 (en) * | 2009-02-05 | 2016-04-19 | Mark S. Olsson | LED lighting devices with enhanced heat dissipation |
| CN101986001A (en) * | 2009-07-28 | 2011-03-16 | 富准精密工业(深圳)有限公司 | Light-emitting diode (LED) lamp |
| CN203671503U (en) * | 2013-09-22 | 2014-06-25 | 汪绍芬 | High-temperature-resistant LED integrated light source |
| CN208475188U (en) * | 2018-05-04 | 2019-02-05 | 思迪恩深圳智能集团有限公司 | A kind of LED landscape lamp of good heat dissipation effect |
| CN111700449A (en) * | 2020-06-23 | 2020-09-25 | 浙江丰源实业有限公司 | LED photo frame with aromatherapy |
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