CN113479007A

CN113479007A - Rear cover, manufacturing method thereof and electronic device

Info

Publication number: CN113479007A
Application number: CN202110747295.9A
Authority: CN
Inventors: 章颂云
Original assignee: Dongguan Julong Gaoke Electronic Technology Co ltd
Current assignee: Dongguan Julong Gaoke Electronic Technology Co ltd
Priority date: 2021-07-02
Filing date: 2021-07-02
Publication date: 2021-10-08

Abstract

The application discloses a rear cover, a manufacturing method of the rear cover and an electronic device. The manufacturing method comprises the following steps: providing a substrate, wherein the substrate comprises a polymethyl methacrylate layer and a polycarbonate layer which are arranged in a laminated manner; forming a transfer layer on the surface of the polycarbonate layer; forming an optical coating layer on the surface of the transfer printing layer; forming an ink layer on the optical coating layer; forming a reflecting film on the surface of the ink layer; forming a light guide layer on the surface of the reflecting film; the substrate, the transfer printing layer, the optical coating layer, the ink layer, the reflecting film and the light guide layer are sequentially stacked; the light guide layer is located the inside of electronic device, and the light that the light source of the inside of electronic device sent can kick into from the light guide layer, jets out to electronic device's outside through the back lid. Like this, the light that the light source of the inside of electron device sent can follow the leaded light layer and kick into, jets out to electron device's outside through the back lid for electron device's back lid can demonstrate the decoration colour. Therefore, richer colors can be provided by the light source, the decorative effect is improved, and the user experience is improved.

Description

Rear cover, manufacturing method thereof and electronic device

Technical Field

The present disclosure relates to the field of electronic devices, and particularly, to a rear cover, a method for manufacturing the rear cover, and an electronic apparatus.

Background

In the related art, the decoration scheme of the rear shell of the mobile phone is mainly as follows: the mobile phone is decorated by forming the colored decoration layer on the base material, so that the rear cover of the mobile phone is more attractive. For example, in a mobile phone, the back cover may be made of a plurality of colors, such as red, yellow, black, white, and the like. However, with the development of society, the progress of science and technology and the improvement of living standard, such a device scheme cannot meet the requirements of users.

Disclosure of Invention

The embodiment of the application provides a rear cover, a manufacturing method of the rear cover and an electronic device.

In a first aspect, an embodiment of the present application provides a method for manufacturing a rear cover for an electronic device, the method including:

providing a substrate, wherein the substrate comprises a polymethyl methacrylate layer and a polycarbonate layer which are arranged in a laminated manner;

forming a transfer printing layer on the surface of the polycarbonate layer;

forming an optical coating layer on the surface of the transfer printing layer;

forming an ink layer on the optical coating layer;

forming a reflecting film on the surface of the ink layer;

forming a light guide layer on the surface of the reflecting film;

the substrate, the transfer printing layer, the optical coating layer, the ink layer, the reflecting film and the light guide layer are sequentially stacked; the light guide layer is arranged in a battery compartment of the electronic device, and a light source in the battery compartment can be injected from the light guide film and is injected to the outside of the electronic device through the rear cover.

In the embodiment of the application, a light source is arranged inside the electronic device. Light emitted by a light source inside the electronic device can be injected from the light guide layer and is emitted to the outside of the electronic device through the rear cover.

For example, the inside of the electronic device may be provided with a light source mounting area for mounting the light source. Alternatively, the electronic device may include a battery compartment for housing the battery, and the light source may be disposed within the battery compartment.

It can be seen that, among the technical scheme of this application embodiment, the light that the light source of electron device's inside sent can follow the leaded light layer jets into, warp back lid jets out extremely electron device's outside for electron device's back lid can demonstrate the decoration colour, can provide abundanter color by the light source like this, improves decorative effect, promotes user experience.

For example, the light source can be controlled by a program, the colors of various devices can be changed, and decorative patterns can be formed even on the rear cover. The program for controlling the light source may be executed by a processor of the electronic device, or may be executed by a separate logic circuit having a processing function. The light source may be, for example, but not limited to, an LED light source.

In some embodiments, the forming a transfer layer on the surface of the polycarbonate layer comprises:

and forming a transfer printing layer with optical textures on the surface of the polycarbonate layer through ultraviolet light curing glue.

Specifically, the tensile strength of the ultraviolet curing adhesive is greater than or equal to 20MPa and less than or equal to 50 MPa; and/or the elongation at break of the ultraviolet light curing adhesive is greater than or equal to 30%; and/or the viscosity of the ultraviolet light curing glue is larger than or equal to 300cP and smaller than or equal to 1000 cP.

In some embodiments, the thickness of the optical coating layer is greater than or equal to 40nm and less than or equal to 600 nm.

In some embodiments, the ink layer has a light transmittance of greater than or equal to 20% and less than 90%; and/or the thickness of the ink layer is greater than or equal to 15 μm and less than or equal to 40 μm.

In some embodiments, the reflective film is configured to reflect at least a portion of light projected from outside the electronic device to the reflective film to outside the electronic device.

Optionally, the reflective film is characterized by a thickness of 125-188 microns and a light reflectivity of greater than 90% within a wavelength range of 450-650 nm.

In some embodiments, the light guiding layer is made of polycarbonate or polymethyl methacrylate.

In some embodiments, the light guiding layer has a thickness greater than or equal to 0.1mm, less than or equal to 0.3 mm.

In a second aspect, embodiments of the present application provide a back cover of an electronic device, which is manufactured by the manufacturing method of any of the above embodiments.

In a third aspect, an embodiment of the present application provides an electronic device, including: the rear cover of the embodiment of the second aspect described above; and the display screen assembly is arranged on the rear cover.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of embodiments of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a flowchart of a method of manufacturing a rear cover according to an embodiment of the present application.

Fig. 2 is a flowchart of manufacturing the rear cover according to the embodiment of the present application.

FIG. 3 is a flow chart of a method of manufacturing a rear cover according to another embodiment of the present application.

FIG. 4 is a flow chart of manufacturing a back cover according to another embodiment of the present application.

FIG. 5 is a flow chart of a method of manufacturing a rear cover according to yet another embodiment of the present application.

Fig. 6 is a flow chart of a method of manufacturing a rear cover according to yet another embodiment of the present application.

Fig. 7 is a perspective view of a rear cover according to an embodiment of the present application.

Fig. 8 is a schematic perspective view of an electronic device according to an embodiment of the present application.

Description of the main element symbols:

the display screen comprises a rear cover 100, a rear shell 102, a middle frame 103, a mounting groove 104, a hole site 105, a substrate 10, a PC layer 11, a PMMA layer 12, a transfer printing layer 20, an optical coating layer 30, an ink layer 40, a reflecting film 50, a light guide layer 60, an offset printing layer 70, a hard coating layer 80, an electronic device 200 and a display screen assembly 201.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise" indicate orientations or positional relationships based on the orientation or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be considered as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1 and 2, an embodiment of the present disclosure provides a back cover 100, and the back cover 100 can be used in an electronic device 200. The method for manufacturing the rear cover 100 according to the embodiment of the present application includes:

001, providing a substrate, wherein the substrate 10 is a composite plate, and the substrate includes a polymethyl methacrylate (PMMA) layer 11 and a Polycarbonate (PC) layer 12 which are stacked;

the PMMA layer 11 is a surface layer, and the PC layer 12 is a main body, and specifically, the thickness of the PC layer 12 is greater than that of the PMMA layer 11.

Optionally, the thickness of the PMMA layer 11 is greater than or equal to 30 μm and less than or equal to 80 μm. For example, the thickness of the PMMA layer 11 may be any one of 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, and the like.

Optionally, the thickness of the substrate 10 is greater than or equal to 0.25mm and less than or equal to 1 mm. For example, the thickness of the substrate 10 may be any one of 0.25mm, 0.4mm, 0.5mm, 0.64mm, 0.8mm, 1.0mm, and the like.

002, forming a transfer layer 20 on the surface of the PC layer 12 far away from the PMMA layer 11;

specifically, the transfer layer 20 with the optical texture may be formed on the surface of the polycarbonate layer by an ultraviolet light curing paste. Alternatively, the transfer layer 20 is formed by transferring UV light curing glue on the side of the PC layer 12 remote from the PMMA layer 11 by a UV (ultraviolet rays) transfer process. The transfer layer 20 may exhibit an optical texture.

For example, the transfer layer 20 may be obtained by transferring a UV light curing adhesive on the PC layer 12 side, imprinting a transfer mold having a desired texture on the UV light curing adhesive, and performing UV light curing and mold release. The texture on the transfer mold may include any one or more of cd (code division) texture, wire drawing texture, sun texture, narcissus texture, weaving texture, sand blasting texture, dermatoglyph, 3D surface, multicolor effect, bulging effect, cat eye effect, matte surface, bright surface, highlight surface effect, and the like.

The viscosity of the light-curing glue is 300cP to 1000cP, for example, the viscosity of the light-curing glue can be any one of 300cP, 400cP, 500cP, 600cP, 700cP, 800cP, 900cP, 1000cP, and the like. The tensile strength of the transfer layer 20 after curing is 20MPa to 50MPa, and for example, the tensile strength of the transfer layer 20 after curing may be any one of 20MPa, 25MPa, 30MPa, 35MPa, 40MPa, 45MPa, 50MPa, and the like. The elongation at break of the transfer layer 20 after curing is more than 30%, and for example, the elongation at break of the transfer layer 20 after curing may be any one of 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, and the like.

003, forming an optical coating layer 30 on the side of the transfer layer 20 far away from the PC layer 12;

in step 003, an optical coating 30 may be formed by Physical Vapor Deposition (PVD) on the side of transfer layer 20 away from PC layer 12. The target material of the optical coating layer 30 includes any one or more of silicon, zirconium, niobium, titanium, and the like. The thickness of the optical coating layer 30 is 40nm to 600nm, and for example, the thickness of the optical coating layer 30 may be any one of 40nm, 65nm, 80nm, 200nm, 280nm, 400nm, 490nm, and 600 nm.

004, forming an ink layer 40 on the side of the optical coating layer 30 far away from the transfer printing layer 20;

in step 004, a color ink layer 40 is formed on the side of the optical coating layer 30 away from the transfer layer 20 by silk-screening. The color ink may be any one or combination of more of black, white, gray, red, blue, green, and the like. The color of the ink layer 40 may be a single color, a contrasting color, a gradient color, or multiple colors. The thickness of the ink layer 40 is 14 μm to 40 μm, and for example, the thickness of the ink layer 40 may be any one of 15 μm, 18 μm, 25 μm, 30 μm, 35 μm, 40 μm, and the like.

005, a reflective film 50 is bonded to the side of the ink layer 40 away from the optical coating layer 30.

The reflective film 50 is used to reflect at least a portion of light projected from the outside of the electronic device to the outside of the electronic device.

Optionally, the thickness of the reflective film 50 is 125-188 micrometers, and the reflectivity of light within a wavelength range of 450-650 nm is greater than 90%.

It is understood that when incident light from the electronic device is projected to the reflective film 50, the reflective film can reflect at least a portion of the light beam out of the electronic device. Specifically, the reflected light is emitted out of the electronic device through the ink layer. The color of the reflected light is affected by the color of the ink layer. For example, when the ink layer is black, the reflected light is also black. Therefore, the color of the light emitted out of the electronic device can be adjusted through the color of the ink layer.

006, disposing a light guide layer 60 on the side of the reflective film 50 away from the ink layer 40;

the light guide layer can be made of PC or acrylic. The thickness of the light guide layer is greater than or equal to 0.1mm and less than or equal to 0.3 mm.

In the embodiment of the present application, the electronic device 200 is provided with a light source inside. Light emitted from the light source inside the electronic device 200 can enter the light guide layer 60 and exit the electronic device through the rear cover.

For example, the inside of the electronic device 200 may be provided with a light source mounting area for mounting a light source. Alternatively, the electronic device may include a battery compartment for housing the battery, and the light source may be disposed within the battery compartment.

It can be seen that, in the technical scheme of this application embodiment, the light that the light source of the inside of electronic device 200 sent can follow leaded light layer 60 and jet into, jets out to electronic device 200's outside through the back lid for electronic device 200's back lid can demonstrate the decoration colour, can provide abundanter color by the light source like this, improves decorative effect, promotes user experience.

For example, the light source may be programmed to change the color of the device, and may even form a decorative pattern on the rear cover 100. The program for controlling the light source may be executed by a processor of the electronic device, or may be executed by a separate logic circuit having a processing function. The light source may be, for example, but not limited to, an LED light source.

In some optional embodiments, the ink layer 40 is translucent, so that light entering from the outside of the electronic device 200 can be projected to the reflective film 50 through the ink layer 40, and after being reflected by the reflective film 50, the light exits through the ink layer 50 to the outside of the electronic device 200, and the color of the rear cover seen by a user from the outside of the electronic device 200 is the light exiting through the colored ink layer 50 after being reflected by the reflective film 50, so that a visual decorative effect can be formed. Thus, when the electronic device 200 emits light, the light source can provide visual color decoration for the rear cover; when the light source does not emit light, a visual decorative effect can be achieved by the reflective film 50.

Referring to fig. 3 and 4, in some embodiments, before forming the transfer layer 20 on the surface of the PC layer 12 away from the PMMA layer 11 (step 002), the method for manufacturing the rear cover 100 further includes:

007 an offset layer 70 is formed on the side of the PC layer 12 remote from the PMMA layer 11.

In step 008, the offset layer 70 is directly formed on the side of the PC layer 12 away from the PMMA layer 11 through an offset process, and at this time, the transfer layer 20 may be directly formed on the side of the offset layer 70 away from the PC layer 12. The thickness of the offset layer 70 is 3 μm to 20 μm, and for example, the thickness of the offset layer 70 may be any one of 3 μm, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, and the like.

It is understood that the composite material obtained in the step 001-. Wherein the offset layer 70 is optional in the construction of the back cover, and step 007 is also optional during the manufacture of the back cover 100.

Referring to fig. 5, in some embodiments, the method for manufacturing the rear cover 100 further includes:

008, spraying and coating a hard coating on the side, far away from the PC layer 12, of the PMMA layer 11, and curing to form a hard coating 80.

In step 008, the hard coating 80 is formed by curtain coating a hard coating on the side of the PMMA layer 11 away from the PC layer 12 and curing. The hard-coating may include at least one of a urethane acrylate-added silicone resin and a perfluoropolyether acrylate. The thickness of the hard coat layer 80 may be 3 μm to 20 μm, and for example, the thickness of the hard coat layer may be any one of 3 μm, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, and the like. The hardness of the hard coat layer 80 is 3H to 6H, and for example, the hardness of the hard coat layer 80 may be any one of 3H, 4H, 5H, and 6H. Specifically, the hardness of hardbanding layer 80 may be adjusted by controlling the composition and thickness of the material forming hardbanding layer 80, with the greater the thickness of hardbanding layer 80, the higher the hardness.

Optionally, the composite material obtained through the step 001-007 is subjected to a high pressure molding treatment to obtain the molded rear cover 100.

After the composite material obtained through the above-mentioned step 001-.

Referring to fig. 7 and 8, the molded rear cover 100 includes a rear shell 102 and a middle frame 103, the middle frame 103 extends from an edge of the rear shell 102 and surrounds the rear shell 102, and the rear shell 102 and the middle frame 103 enclose a mounting groove 104, and the surface of the light guide layer 60 encloses the bottom surface and the side surface of the mounting groove 104. The back cover 100 of the present application has an inside diameter of 0.2mm to 1mm, and for example, the back cover 100 may have any one of the inside diameters of 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, and the like. Referring to fig. 7, the height h of the middle frame 103 is 6mm to 12mm, wherein the height h of the middle frame 103 may be any one of 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, and the like.

The rear shell 102 and the middle frame 103 of the molded rear cover 100 manufactured by the manufacturing method of the rear cover 100 are of an integral structure, so that no gap exists between the rear shell 102 and the middle frame 103, and dust and water vapor on one side of the rear cover 100 can be prevented from entering the rear cover 100 (namely, the mounting groove 104) along the gap between the rear shell 102 and the middle frame 103; in addition, the rear shell 102 and the middle frame 103 of the rear cover 100 are of an integral structure, so that the appearance of the rear cover 100 is more attractive, and the user cannot be cut by the edge between the rear shell 102 and the middle frame 103 when holding the rear cover 100.

Referring to fig. 6 and 7 regarding the process of forming the rear cover 100, the method of manufacturing the rear cover 100 further includes:

010, processing the outer shape of the rear cover 100 by a Numerical Control (CNC); and

011 and forming hole sites 105 in the rear cover 100 by numerical control machining.

In step 010, CNC machining the back cover 100 includes cutting the junction of the middle bezel 103 and the back shell 102 to make the transition between the back shell 102 and the middle bezel 103 smoother for the user to grasp the back cover 100. In step 011, the hole sites 105 may include at least one of a key mounting hole, a rear cover mounting hole, a sound outlet hole, a camera mounting hole, an interface hole, and the like.

The rear cover 100 of the present application is manufactured by the manufacturing method of any one of the above embodiments, and the rear cover 100 includes a rear shell 102 and a middle frame 103, the middle frame 103 extends from an edge of the rear shell 102 and surrounds the rear shell 102, and the rear shell 102 and the middle frame 103 enclose a mounting groove 104. The mounting slot 104 may be used, for example, but not limited to, for mounting a battery, a light source, etc. of the electronic device 200. Optionally, the electronic device 200 may further include a display screen assembly 201, and the display screen assembly 201 may be disposed on the rear cover 100.

In the description herein, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. A method of manufacturing a rear cover for an electronic device, the method comprising:

forming a transfer printing layer on the surface of the polycarbonate layer;

forming an optical coating layer on the surface of the transfer printing layer;

forming an ink layer on the optical coating layer;

forming a reflecting film on the surface of the ink layer;

forming a light guide layer on the surface of the reflecting film;

the substrate, the transfer printing layer, the optical coating layer, the ink layer, the reflecting film and the light guide layer are sequentially stacked; the light guide layer is located inside the electronic device, and light emitted by a light source inside the electronic device can be shot into the electronic device from the light guide layer and is shot out to the outside of the electronic device through the rear cover.

2. The manufacturing method according to claim 1, wherein the forming of the transfer layer on the surface of the polycarbonate layer comprises:

3. The manufacturing method according to claim 2, wherein the tensile strength of the ultraviolet light-curable adhesive is greater than or equal to 20MPa and less than or equal to 50 MPa; and/or

The elongation at break of the ultraviolet curing adhesive is greater than or equal to 30 percent; and/or

The viscosity of the ultraviolet light curing glue is larger than or equal to 300cP and smaller than or equal to 1000 cP.

4. The method of claim 1, wherein the thickness of the optical coating is greater than or equal to 40nm and less than or equal to 600 nm.

5. The method of claim 1, wherein the ink layer has a light transmittance of greater than or equal to 20% and less than 90%; and/or

The thickness of the ink layer is greater than or equal to 15 μm and less than or equal to 40 μm.

6. The method of claim 1, wherein the reflective film is configured to reflect at least a portion of light projected from outside the electronic device to the reflective film to outside the electronic device.

7. The method of claim 1, wherein the light guiding layer is made of polycarbonate or polymethyl methacrylate.

8. The rear cover according to claim 1, wherein the light guide layer has a thickness greater than or equal to 0.1mm and less than or equal to 0.3 mm.

9. A rear cover for an electronic device, characterized in that it is manufactured by the manufacturing method of any one of claims 1 to 8.

10. An electronic device, comprising a light source disposed within the electronic device, and the back cover of claim 9.