CN112783352B - Touch screen and preparation method thereof - Google Patents
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- CN112783352B CN112783352B CN201911072193.0A CN201911072193A CN112783352B CN 112783352 B CN112783352 B CN 112783352B CN 201911072193 A CN201911072193 A CN 201911072193A CN 112783352 B CN112783352 B CN 112783352B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The invention provides a preparation method of a touch screen and the touch screen, which sequentially comprises the following steps: providing a first substrate and a second substrate; forming a first line and a second line on both surfaces of the first substrate, respectively; attaching the first substrate to the second substrate; forming a first input/output port on a surface of the first substrate facing away from the second substrate; forming a second input/output port on a surface of the first substrate facing the second substrate; and forming a third input/output port on the surface of the second substrate opposite to the first substrate. This application is through inciting somebody to action first base plate with reform behind the laminating of second base plate first input/output port second input/output port with third input/output port has guaranteed first input/output port second input/output port with the position that third input/output port set up is accurate.
Description
Technical Field
The invention relates to the technical field of display, in particular to a touch screen and a preparation method thereof.
Background
The touch screen is provided with the data connection port, but the data connection port cannot be arranged at an accurate position due to the limitation of alignment precision in the current preparation method of the touch screen, so that the connection deviation of the data connection port and a related interface in a downstream process is caused, the product yield is influenced, and even related functional hidden dangers are caused.
Disclosure of Invention
The invention aims to provide a preparation method of a touch screen, which avoids the problem that a data connection port cannot be arranged at an accurate position.
The invention further provides a touch screen.
The invention provides a preparation method of a touch screen, which sequentially comprises the following steps:
providing a first substrate and a second substrate;
forming a first line and a second line on both surfaces of the first substrate, respectively;
attaching the first substrate to the second substrate;
forming a first input/output port on a surface of the first substrate facing away from the second substrate;
forming a second input/output port on a surface of the first substrate facing the second substrate;
and forming a third input/output port on the surface of the second substrate, which faces away from the first substrate.
First input/output port, second input/output port and third input/output port are the data connection port of touch-sensitive screen, and this application through with first base plate with reform behind the laminating of second base plate first input/output port second input/output port with third input/output port has guaranteed first input/output port second input/output port and the position that third input/output port set up is accurate, with the realization first input/output port second input/output port and third input/output port are connected with the external port accuracy, have improved the reliability of touch-sensitive screen.
Before the step of bonding the first substrate to the second substrate, the method further includes:
forming an avoidance notch on the second substrate;
the "forming a second input/output port on a surface of the first substrate facing the second substrate" includes:
and forming a second input/output port at the position where the surface of the first substrate facing the second substrate is aligned with the avoidance notch.
And an avoidance notch is formed in the second substrate so as to facilitate the electrical connection between the second input/output port and the outside.
The second input/output port and the third input/output port are formed simultaneously, so that the working procedures are reduced, and the time is saved.
Wherein, in "set up the breach of dodging on the second base plate", include:
the avoidance notch is formed by cutting along the edge of the second substrate towards the middle of the second substrate.
The method further comprises forming a third circuit on the surface of the second substrate opposite to the first substrate, wherein the third circuit comprises depositing a third conductive layer on the surface of the second substrate opposite to the first substrate, and etching the third conductive layer to form a third circuit.
The second input/output port, the third input/output port and the third circuit are formed simultaneously, so that the manufacturing processes are further reduced, and the time cost is saved.
Wherein, in "forming the first circuit and the second circuit on two surfaces of the first substrate disposed opposite to each other respectively", includes:
depositing a first conductive layer on a first surface of the first substrate;
etching the first conductive layer to form a first circuit;
depositing a second conductive layer on the second surface of the first substrate;
and etching the second conductive layer to form a second circuit.
Etching the first conductive layer and the second conductive layer includes processes of film lamination, exposure, development, etching, and film stripping.
Depositing a first conductive layer on the first surface of the first substrate; etching the first conductive layer to form a first line "includes:
depositing a first indium tin oxide layer and a first metal layer on the first surface of the first substrate in sequence;
etching the first metal layer to form a first conductive circuit, and etching the first indium tin oxide layer to form a first signal circuit, wherein the first conductive circuit is electrically connected with the signal circuit to form a first circuit, and the first conductive circuit is located at the edge of the first signal circuit.
Depositing a second conductive layer on the second surface of the first substrate; etching the second conductive layer to form a second line "includes:
depositing a second indium tin oxide layer and a second metal layer on the second surface of the first substrate in sequence;
and etching the second metal layer to form a second conductive circuit, and etching the second indium tin oxide layer to form a second signal circuit, wherein the second conductive circuit is electrically connected with the second signal circuit to form a second circuit, and the second conductive circuit is positioned at the edge of the second signal circuit.
The metal layer is one of a copper layer or a silver layer.
The first input/output port is electrically connected to the first conductive line, and the second input/output port is electrically connected to the second conductive line, so that the first input/output port is communicated with the first signal line, and the second input/output port is communicated with the second signal line.
The first input/output port and the second input/output port are disposed near the edge of the first substrate, and the third input/output port is disposed near the edge of the second substrate, so that the first input/output port, the second input/output port, and the third input/output port are electrically connected to an external circuit.
The invention also provides a touch screen which is manufactured by the manufacturing method of the touch screen, and the first input/output port, the second input/output port and the third input/output port are electrically connected with a circuit mainboard to transmit information to the circuit mainboard.
According to the manufacturing method of the touch screen, the first input/output port, the second input/output port and the third input/output port are formed after the first substrate and the second substrate are attached, so that the accurate positions of the first input/output port, the second input/output port and the third input/output port are ensured, the first input/output port, the second input/output port and the third input/output port are accurately connected with an external port, and the reliability of the touch screen is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for manufacturing a touch screen provided in an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of a touch screen prepared by the method of preparing a touch screen provided in FIG. 1;
FIG. 3 is a schematic view of a first substrate of the touch screen provided in FIG. 2;
FIG. 4 is a schematic view of a second substrate of the touch screen provided in FIG. 2;
FIG. 5 is a schematic view of a first substrate and a second substrate of the touch screen provided in FIG. 2;
FIG. 6 is a schematic view of another angle of the touch screen provided in FIG. 2;
fig. 7 is a schematic flowchart of another method for manufacturing a touch screen according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for manufacturing a touch screen, which is provided in the present application, and is used for manufacturing the touch screen, where the method for manufacturing the touch screen includes:
s101: a first substrate 10 and a second substrate 20 are provided.
Specifically, the first substrate 10 and the second substrate 20 may have the same shape and size. Here, taking the first substrate 10 as an example, a substrate blank may be provided first, and then the substrate blank is processed to obtain a plurality of first substrates 10. Referring to fig. 2, the first substrate 10 and the second substrate 20 are made of COP (cyclic olefin polymer) or PET (polyethylene terephthalate).
S103: first and second wirings 11 and 12 are formed on both surfaces of the first substrate 10, respectively.
Specifically, referring to fig. 3, two surfaces of the first substrate 10 are a first surface 101 and a second surface (not shown) which are opposite to each other, respectively, the first surface 101 has a plurality of first areas 1011, the second surface has second areas (not shown) which are opposite to the first areas 1011, a first line 11 is formed in each first area 1011, and a second line 12 is formed in each second area. The first circuit 11 and the second circuit 12 may be selected as a first functional circuit of the touch screen, so that the first substrate 10 having the first circuit 11 and the second circuit 12 can be used to sense/receive signals.
By dividing the two surfaces of the first substrate 10 into a plurality of areas, a plurality of touch screens can be manufactured simultaneously, mass production is realized, manufacturing time is reduced, and cost is saved. After the manufacturing is completed, a plurality of touch screens can be formed by cutting. In other embodiments, the first surface 101 has a first area and the second surface has a second area disposed opposite the first area.
The first substrate 10 may be formed with the first circuit 11 and the second circuit 12 by depositing a first conductive layer (not shown) on the first surface 101 of the first substrate 10, and etching the first conductive layer to form the first circuit 11; a second conductive layer is deposited on the second surface of the first substrate 10, and the second conductive layer is etched to form a second circuit 12.
It can be understood that the deposition of the first conductive layer on the first surface 101 of the first substrate 10 and the deposition of the second conductive layer on the second surface of the first substrate 10 are simultaneously performed, and the etching of the first conductive layer to form the first line 11 and the etching of the second conductive layer to form the second line 12 are simultaneously performed, so that the manufacturing time can be shortened and the time cost can be reduced. Of course, in other embodiments, the deposition of the first conductive layer and the deposition of the second conductive layer may not be performed simultaneously, and the sequence is not limited.
A first ito layer and a first metal layer are sequentially deposited on the first surface 101 of the first substrate 10, the first metal layer is etched to form a first conductive trace 111, and the first ito layer is etched to form a first signal trace 112. The first conductive trace 111 is electrically connected to the first signal trace 112 to form the first trace 11, and the first conductive trace 111 is located at an edge of the first signal trace 112. In this embodiment, the first signal line 112 is in a grid shape and is used for sensing/receiving signals. The first conductive trace 111 includes a first conductive portion 1111 and a first interface portion 1112, the first conductive portion 1111 is located at the periphery of the first signal trace 112 and electrically connected to the first signal trace 112 for transmitting the signal information received by the first signal trace 112, the first interface portion 1112 is in a block shape and connected to the edge of the first conductive portion 1111, and the first interface portion 1112 is used for being connected to an external circuit for transmitting the signal information received by the first signal trace 112 to a related circuit board. The metal layer is a copper layer. Of course, the metal layer may be other conductive metal layers such as silver.
Etching the first conductive layer includes processes of film lamination, exposure, development, etching, and film stripping.
The first substrate 10 is turned over, a second ito layer and a second metal layer are sequentially deposited on the second surface of the first substrate 10, the second metal layer is etched to form a second conductive trace (not shown), and the second ito layer is etched to form a second signal trace (not shown). The second conductive trace is electrically connected to the second signal trace to form a second trace 12, and the second conductive trace is located at an edge of the second signal trace. In this embodiment, the second signal line is in a grid shape and is used for sensing/receiving signals. The second lead-connection circuit comprises a second lead part and a second interface part, the second lead part is located on the periphery of the second signal circuit and electrically connected with the second signal circuit and used for transmitting signal information received by the second signal circuit, the second interface part is in a block shape and connected with the edge of the second lead part, and the second interface part is used for being connected with an external circuit so as to transmit the signal information received by the second signal circuit to a related circuit mainboard. The metal layer is a copper layer. Of course, the metal layer may be other conductive metal layers such as silver.
Etching the second conductive layer includes film pressing, exposing, developing, etching and film stripping processes.
S105: and bonding the first substrate 10 and the second substrate 20.
Specifically, referring to fig. 4 and 5, the second substrate 20 has a third surface 201 and a fourth surface (not shown) opposite to each other, and the second surface of the first substrate 10 is attached to the fourth surface of the second substrate 20 by an adhesive. Optionally, the adhesive is an optically clear adhesive.
S107: a first input/output port a is formed on a surface of the first substrate 10 facing away from the second substrate 20.
Specifically, referring to fig. 6, a first input/output port a is formed on the first surface 101 of the first substrate 10. The first input/output port a is formed by etching the first interface portion 1112, and is electrically connected to the first ground wiring 111, so that the first input/output port a communicates with the first signal wiring 112.
S109: a second input/output port b is formed on a surface of the first substrate 10 facing the second substrate 20.
Specifically, referring to fig. 6, a second input/output port b is formed on the second surface of the first substrate 10. A second input/output port b is formed by etching the second interface portion, the second input/output port b being electrically connected to the second lead line, the second input/output port b being communicated with the second signal line.
S111: a third input/output port c is formed on a surface of the second substrate 20 facing away from the first substrate 10.
Specifically, referring to fig. 6, a third input/output port c is formed on the third surface 201 of the second substrate 20.
In this embodiment, S109 and S111 are performed simultaneously, that is, the second input/output port b and the third input/output port c are formed simultaneously, so as to reduce the number of processes and save time. Of course, the first input/output port a may also be formed simultaneously with the second input/output port b and the third input/output port c, or the first input/output port a, the second input/output port b, and the third input/output port c may also be formed non-simultaneously, and the order of formation of the first input/output port a, the second input/output port b, and the third input/output port c is not limited.
In this embodiment, the first input/output port a, the second input/output port b, and the third input/output port c are all data connection ports of the touch screen, the first input/output port a and the second input/output port b are disposed near the edge of the first substrate 10, and the third input/output port c is disposed near the edge of the second substrate 20, so that the first input/output port a, the second input/output port b, and the third input/output port c are electrically connected to an external circuit. Optionally, orthographic projections of the first input/output port a, the second input/output port b and the third input/output port c are arranged side by side at intervals.
When a finger touches the first line 11 and the second line 12, a coupling capacitance is formed between a user and the surface of the touch screen due to an electric field of a human body, the finger sucks a small current from a contact point, the first line, the second line 1 and the second line 12 transmit the current change to a related control mainboard through the first input/output port a and the second input/output port b, and the position of the touch point is obtained through accurate calculation.
Referring to fig. 7, fig. 7 is a schematic flow chart of another touch screen manufacturing method provided in the present application, for manufacturing a touch screen, where the touch screen manufacturing method includes:
s201: a first substrate 10 and a second substrate 20 are provided.
Specifically, referring to fig. 2, the first substrate 10 and the second substrate 20 may have the same shape and size.
S203: first and second wirings 11 and 12 are formed on both surfaces of the first substrate 10, respectively. Referring to fig. 2 and fig. 3, the specific forming method is the same as S103 in the first embodiment.
S205: the second substrate 20 is provided with a relief notch 22.
Specifically, referring to fig. 4, the avoiding notch 22 penetrates through the third surface 201 and the fourth surface of the second substrate 20, which are opposite to each other, and is cut along the edge of the second substrate 20 toward the middle of the second substrate 20 to form the avoiding notch 22. The shape of the avoiding gap 22 corresponds to the shape of the second interface portion, and the avoiding gap 22 is used for facilitating the second interface portion to expose the second substrate 20 after the first substrate 10 and the second substrate 20 are attached to each other, so that the second interface portion is electrically connected with the outside.
S207: the first substrate 10 and the second substrate 20 are bonded.
Specifically, referring to fig. 5, the second surface of the first substrate 10 and the fourth surface of the second substrate 20 are bonded together by an adhesive. Optionally, the adhesive is an optically clear adhesive. After the first substrate 10 and the second substrate 20 are bonded, the second interface portion formed on the second surface of the first substrate 10 exposes the second substrate 20.
S209: a third wiring 21 is formed on a surface of the second substrate 20 facing away from the first substrate 10.
Specifically, referring to fig. 6, a third circuit 21 is formed on the third surface 201 of the second substrate 20. Third areas (not shown) are provided on the third surface, which are disposed one-to-one opposite to the first areas 1011, and third lines 21 are formed in each of the third areas. The third circuit 21 can be selected as a second functional circuit of the touch screen, so that the second substrate 20 with the third circuit 21 can perform a pressure sensing function, a signal shielding function, or a touch sensitivity enhancing function according to actual needs.
A specific way of forming the third line 21 on the second substrate 20 may be to deposit a third conductive layer on the third surface 201 of the second substrate 20, and etch the third conductive layer to form the third line 21.
A third ito layer and a third metal layer are sequentially deposited on the third surface 201 of the second substrate 20, the third metal layer is etched to form a third conductive trace 211, and the third ito layer is etched to form a third signal trace 212. The third conductive line 211 is electrically connected to the signal line to form a third line 21, and the third conductive line 211 is located at an edge of the third signal line 212. In this embodiment, the third signal line 212 is in a grid shape, and can perform a pressure sensing function, a signal shielding function, or a touch sensitivity enhancing function according to actual needs. The third conductive line 211 includes a third conductive portion 2111 and a third interface portion (not shown), the third conductive portion 2111 is located at the periphery of the third signal line 212 and electrically connected to the third signal line 212 for transmitting information of the third signal line 212, the third interface portion is in a block shape and connected to the edge of the third conductive portion 2111, and the third interface portion is used for being connected to an external circuit for transmitting information of the third signal line 212 to a related circuit board. The metal layer is a copper layer. Of course, the metal layer may be other conductive metal layers such as silver.
Etching the first conductive layer includes processes of film lamination, exposure, development, etching, and film stripping.
S211: a first input/output port a is formed on a surface of the first substrate 10 facing away from the second substrate 20.
Specifically, referring to fig. 6, a first input/output port a is formed on the first surface 101 of the first substrate 10. The first input/output port a is formed by etching the first interface portion 1112, and is electrically connected to the first ground wiring 111, so that the first input/output port a communicates with the first signal wiring 112.
S213: a second input/output port b is formed on a surface of the first substrate 10 facing the second substrate 20.
Specifically, referring to fig. 6, a second input/output port b is formed at a position where the surface of the first substrate 10 facing the second substrate 20 is aligned with the avoidance gap 22, that is, a second interface portion where the avoidance gap 22 is exposed is formed at the second surface of the first substrate 10. A second input/output port b is formed by etching the second interface portion, the second input/output port b being electrically connected to the second ground line, the second input/output port b being communicated with the second signal line.
S215: a third input/output port c is formed on a surface of the second substrate 20 facing away from the first substrate 10.
Specifically, referring to fig. 6, a third input/output port c is formed on the third surface 201 of the second substrate 20. The third input/output port c is formed by etching the third interface portion, and is electrically connected to the third conductive line 211, so that the third input/output port c communicates with the third signal line 212.
In this embodiment, S209, S213 and S215 are performed simultaneously, that is, the second input/output port b, the third input/output port c and the third line 21 are formed simultaneously, so as to reduce the number of processes and save time. Of course, the first input/output port a may also be formed at the same time as the second input/output port b, the third input/output port c, and the third line 21, the first input/output port a, the second input/output port b, the third input/output port c, and the third line 21 may also be formed at different times, and the order of the first input/output port a, the second input/output port b, the third input/output port c, and the third line 21 is not limited.
In this embodiment, the first input/output port a, the second input/output port b, and the third input/output port c are all data connection ports of the touch screen, the first input/output port a and the second input/output port b are disposed near the edge of the first substrate 10, and the third input/output port c is disposed near the edge of the second substrate 20, so that the first input/output port a, the second input/output port b, and the third input/output port c are electrically connected to an external circuit. Optionally, orthographic projections of the first input/output port a, the second input/output port b and the third input/output port c are arranged side by side at intervals.
Referring to fig. 6, the present invention further provides a touch screen 100, wherein the touch screen 100 is manufactured by the above method, and the first input/output port a, the second input/output port b, and the third input/output port c are electrically connected to the circuit board to transmit information to the circuit board. The touch screen 100 is applied to electronic devices such as a mobile phone, a watch, a wearable device, a display screen, and a tablet.
According to the manufacturing method of the touch screen, the first input/output port a, the second input/output port b and the third input/output port c are formed after the first substrate 10 and the second substrate 20 are attached, so that the accurate positions of the first input/output port a, the second input/output port b and the third input/output port c are ensured, the first input/output port a, the second input/output port b and the third input/output port c are accurately connected with an external port, and the reliability of the touch screen 100 is improved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (11)
1. The preparation method of the touch screen is characterized by sequentially comprising the following steps of:
providing a first substrate and a second substrate;
forming a first line and a second line on both surfaces of the first substrate, respectively;
the first circuit comprises a first lead connection circuit and a first signal circuit, the first lead connection circuit is electrically connected with the first signal circuit to form the first circuit, the first lead connection circuit comprises a first lead part and a first interface part, and the first signal circuit is used for sensing/receiving signals;
the second circuit comprises a second lead connection circuit and a second signal circuit, the second lead connection circuit is electrically connected with the second signal circuit to form the second circuit, the second lead connection circuit comprises a second lead part and a second interface part, and the second signal circuit is used for sensing/receiving signals;
bonding the first substrate and the second substrate, forming a circuit with a signal circuit of a lead circuit before bonding the substrates, etching a block-shaped interface part to form an input/output port after bonding the substrates, and connecting the input/output port with the corresponding lead circuit;
the first interface part forms a first input/output port which is electrically connected to the first conductive line;
the second interface part forms a second input/output port which is electrically connected with the second pilot line;
forming a first input/output port on a surface of the first substrate facing away from the second substrate;
forming a second input/output port on a surface of the first substrate facing the second substrate;
and forming a third input/output port on the surface of the second substrate opposite to the first substrate.
2. The method for manufacturing a touch panel according to claim 1, further comprising, before the attaching the first substrate to the second substrate: forming an avoidance notch on the second substrate;
the forming of the second input-output port on the surface of the first substrate facing the second substrate includes:
and forming a second input/output port at the position where the surface of the first substrate facing the second substrate is aligned with the avoidance notch.
3. The method of manufacturing a touch screen according to claim 2, wherein the second input-output port and the third input-output port are formed simultaneously.
4. The method for manufacturing the touch screen according to claim 3, wherein the forming of the avoidance gap in the second substrate includes:
the avoidance notch is formed by cutting along the edge of the second substrate towards the middle of the second substrate.
5. The method for manufacturing the touch screen according to claim 4, further comprising forming a third wiring on a surface of the second substrate facing away from the first substrate.
6. The method of manufacturing a touch panel according to claim 5, wherein the second input/output port, the third input/output port, and the third line are formed at the same time.
7. The method for manufacturing the touch screen according to any one of claims 1 to 6, wherein the step of respectively forming the first circuit and the second circuit on the two surfaces of the first substrate opposite to each other comprises:
depositing a first conductive layer on a first surface of the first substrate;
etching the first conductive layer to form a first circuit;
depositing a second conductive layer on the second surface of the first substrate;
and etching the second conductive layer to form a second circuit.
8. The method for manufacturing a touch screen according to claim 7, wherein a first conductive layer is deposited on the first surface of the first substrate; etching the first conductive layer to form a first line includes:
depositing a first indium tin oxide layer and a first metal layer on the first surface of the first substrate in sequence;
etching the first metal layer to form a first conducting circuit, and etching the first indium tin oxide layer to form a first signal circuit, wherein the first conducting circuit is electrically connected with the signal circuit to form a first circuit; and
depositing a second conducting layer on the second surface of the first substrate; etching the second conductive layer to form a second line includes:
depositing a second indium tin oxide layer and a second metal layer on the second surface of the first substrate in sequence;
and etching the second metal layer to form a second conductive circuit, and etching the second indium tin oxide layer to form a second signal circuit, wherein the second conductive circuit is electrically connected with the second signal circuit to form a second circuit.
9. The method of claim 8, wherein the first input/output port is electrically connected to the first conductive trace, and the second input/output port is electrically connected to the second conductive trace.
10. The method of claim 9, wherein the first input/output port and the second input/output port are disposed near an edge of the first substrate, and the third input/output port is disposed near an edge of the second substrate.
11. A touch screen, wherein the touch screen is manufactured by the method for manufacturing a touch screen according to any one of claims 1 to 10, and the first input/output port, the second input/output port, and the third input/output port are used for electrically connecting to a circuit board.
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