CN112420560A - Semiconductor substrate baking device - Google Patents
Semiconductor substrate baking device Download PDFInfo
- Publication number
- CN112420560A CN112420560A CN202011246618.8A CN202011246618A CN112420560A CN 112420560 A CN112420560 A CN 112420560A CN 202011246618 A CN202011246618 A CN 202011246618A CN 112420560 A CN112420560 A CN 112420560A
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- baking
- box body
- groove
- semiconductor substrate
- plate
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- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000007789 sealing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000007779 soft material Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000011269 treatment regimen Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention relates to the field of semiconductors, in particular to a semiconductor substrate baking device which comprises a box body, wherein the box body comprises a baking groove, a baking plate, a substrate fixing device, a door plate, a baking machine and a rotating machine, the baking groove is positioned in the box body, a plurality of baking grooves are formed in the baking groove, the baking plate is arranged in the box body of the box body and positioned at the upper end and the lower end of the baking groove, the rotating machine is arranged on the outer side of the box body and positioned on the outer side of the baking groove, the rotating machine is provided with a plurality of rotating shafts, the rotating shafts penetrate through the box body and extend into the baking groove, the substrate fixing device is arranged at one end of the rotating shafts extending into the baking groove, an installation groove is formed in the substrate baking groove, an installation box is arranged at the bottom of the box body, the baking machine is arranged in the installation box, a baking pipe is arranged in the baking plate, and a heat conduction pipe is arranged between the baking machine, the heat conduction pipe is provided with a temperature adjusting block.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a semiconductor substrate baking device.
Background
In the low temperature poly-silicon (LTPS) process, a glass substrate is baked in an oven after being subjected to cleaning, coating, exposure, development, bleaching and other processes, so that resin and photosensitive compounds in photoresist are crosslinked and reflowed to improve the transmittance, harden the photoresist and adjust the taper angle of a photoresist pattern.
At present, an oven used in an LTPS process is mainly hot air drying, and compared with infrared drying, the oven has the advantages of low price, better volatile matter treatment strategy, smaller groove distance, and the like, and the same height can correspond to more furnace layers.
A prior patent "CN 201910075371.9" discloses a substrate baking apparatus and a substrate baking method, the substrate baking apparatus including: baking the cavity; the plurality of supporting plates are positioned in the baking cavity body and are arranged in parallel along a preset direction at intervals, when the supporting plates are in an unfolded state, a corresponding heating cavity is formed between every two adjacent supporting plates, and the heating cavity is used for baking the substrate entering the heating cavity; the side surface of the supporting plate is connected with the first moving unit and used for controlling the supporting plate to move along a preset direction; and the temperature control units are independently controlled and are used for enabling the substrate to have different baking temperatures.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the semiconductor substrate baking device which is uniform in baking and convenient to use.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the invention discloses a semiconductor substrate baking device which comprises a box body, wherein the box body comprises a baking groove, a baking plate, a substrate fixing device, a door plate, a baking machine and a rotating machine; the baking grooves are positioned in the box body, and a plurality of baking grooves are arranged; the baking plates are arranged in the box body and are positioned at the upper end and the lower end of the baking groove, the rotating machines are arranged on the outer side of the box body and are positioned on the outer side of the baking groove, and a plurality of rotating machines are arranged; the rotating machine is provided with a rotating shaft, the rotating shaft penetrates through the box body and extends into the baking groove, and the substrate fixing device is arranged at one end of the rotating shaft, which extends into the baking groove; the base plate toasts the inslot and is equipped with the mounting groove, the bottom of box is equipped with the install bin, the roaster is installed in the install bin, be equipped with the pipe of toasting in the stoving board, be equipped with the heat pipe between roaster and the pipe of toasting.
In order to conveniently realize the baking treatment of the substrate, the heat conduction pipe is provided with a temperature adjusting block, the temperature adjusting block is positioned at the bottom end of the baking groove, one side of the box body is provided with a temperature adjusting knob, and the temperature adjusting knob is connected with the temperature adjusting block.
In order to conveniently realize the baking treatment of the substrate, the door plate is arranged at the front side of the baking groove, a plurality of hinged chains are arranged between the door plate and the box body, and a handle is arranged on one side of the door plate.
In order to protect the substrate, the invention is improved in that a protection pad is arranged in the mounting groove.
In order to facilitate observation, the invention is improved in that the door panel is provided with an observation port.
In order to improve the sealing performance, the invention improves that a sealing gasket is arranged between the inner side of the door plate and the baking groove, and a sealing gasket is arranged between the rotating shaft and the box body.
In order to improve the safety, the invention improves that the protective pad and the sealing pad are made of high-temperature resistant soft materials.
In order to protect the rotating machine, the invention improves that a chassis is arranged outside the rotating machine.
In order to prevent the interior of the installation box from being easily affected with damp, the invention has the improvement that the two sides of the installation box are provided with vent holes.
(III) advantageous effects
Compared with the prior art, the invention provides a semiconductor substrate baking device which has the following beneficial effects:
this semiconductor substrate baking equipment passes through the mounting groove and fixes the base plate inside base plate fixing device to drive the axis of rotation through the rotating machine and drive the base plate fixing device rotatory, make the base plate evenly toast between the stoving board of the top of toasting the inslot and bottom, improve the yield that the base plate toasted, pass through the heating temperature of heat pipe to the stoving pipe in the stoving board through temperature adjusting knob and the control roaster of temperature adjusting block, thereby control the temperature in the oven, it is great to prevent the inside and outside difference in temperature, cause the base plate to burst, influence the quality of base plate.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a schematic front sectional view of the present invention;
FIG. 4 is a side cross-sectional structural view of the present invention;
FIG. 5 is a schematic view of a substrate fixing apparatus according to the present invention;
in the figure: 1. a box body; 2. a baking tank; 3. baking the plate; 4. a substrate fixing device; 5. an articulated chain; 6. a door panel; 7. a handle; 8. a viewing port; 9. a baking machine; 10. a heat conducting pipe; 11. a baking tube; 12. a temperature adjusting block; 13. a temperature adjusting knob; 14. rotating the machine; 15. a chassis; 16. mounting grooves; 17. and (6) a protective pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, a semiconductor substrate baking apparatus of the present invention includes a box 1, wherein the box 1 includes a baking tank 2, a baking plate 3, a substrate fixing device 4, a door 6, a baking machine 9, and a rotating machine 14.
Referring to fig. 1, the baking tanks 2 are located inside the cabinet 1 (the baking tanks 2 are a part of the internal space of the cabinet 1), and a plurality of baking tanks 2 (5 shown in fig. 1) are provided. The toasting slots 2 are formed by other structures which separate the interior of the housing 1 and are shown in figure 1 adjacent one another above and below and separated by respective toasting plates 3.
As can be seen from the above, the baking plates 3 are disposed inside the cabinet 1 and located at the upper and lower ends of the baking tub 2. In this case, it is understood that the first baking pan 2 is provided on the lowermost baking plate 3, the baking plate 3 is provided below the uppermost baking pan 2, and the adjacent baking pans 2 are partitioned by the baking plate 3. The baking plate 3 may be a flat plate body.
Referring to fig. 4, the rotating machine 14 is installed at the outer side of the box body 1, and the rotating machine 14 is located at the outer side of the baking tank 2, and a plurality of rotating machines 14 are provided. In this embodiment, the number of the rotating machines 14 is equal to the number of the baking tanks 2.
The rotating shaft (not labeled) is disposed on the rotating machine 14, the rotating shaft penetrates through the box body 1 and extends into the baking groove 2, referring to fig. 4, the rotating shaft is connected with the substrate fixing devices 4 (see fig. 4), in this embodiment, each baking groove 2 has a plurality of (four) substrate fixing devices 4. The base plate fixing device 4 is arranged at one end of the rotating shaft extending into the baking groove 2. The substrate fixing device 4 can clamp and fix the edge of the substrate, so that the substrate is suspended in the baking groove 2.
Referring to fig. 5, a mounting groove 16 is formed in the substrate baking tank 2.
Referring to fig. 3, the bottom of the box body 1 is provided with an installation box (not labeled), and the roaster 9 is installed in the installation box. Referring to fig. 4, a baking pipe 11 is disposed in the baking plate 3, and a heat conducting pipe 10 is disposed between the baking machine 9 and the baking pipe 11, that is, the baking machine 9 and the baking pipe 11 are connected by the heat conducting pipe 10.
In this embodiment, each baking plate 3 is provided with a baking tube 11 therein, and the length of the baking tube 11 is slightly smaller than that of the baking plate 3, however, the baking tube 11 basically ensures that the internal length of the baking plate 3 is occupied by the baking tube 11. The baking pipe 11 can be a metal heating pipe or a hot air conveying pipe. When being the steam transmission pipe, its end can be open-ended to make steam can release baking plate 3 in, and then make and to carry out better heating to baking plate 3, make baking plate 3 temperature rise, baking plate 3 can further toast the base plate that is located baking groove 2 again.
Since baking plate 3 has baking pipes 11 inside, the upper and lower surface temperatures of baking plate 3 are both increased, and thus, for baking plate 3 between two baking grooves 2, baking plate 3 can bake both the substrate located in lower baking groove 2 and the substrate located in upper baking groove 2.
Referring to fig. 3, a temperature adjusting block 12 is disposed on the heat conducting pipe 10, the temperature adjusting block 12 is located at the bottom end of the baking tank 2, a temperature adjusting knob 13 is disposed on one side of the box body 1, the temperature adjusting knob 13 is connected to the temperature adjusting block 12, and the temperature adjusting knob 13 may also refer to fig. 4. In this embodiment, the heat pipe 10 may be provided with a plurality of corresponding temperature adjusting blocks 12 and temperature adjusting knobs 13 in a segmented manner, so as to better realize corresponding multi-stage temperature adjusting operation and realize different multi-stage temperature adjusting effects.
Referring to fig. 2, the door panel 6 is installed at the front side of the baking tank 2, a hinge chain 5 is disposed between the door panel 6 and the box body 1, the door panel 6 and the box body 1 are connected by the hinge chain 5, the door panel 6 is provided with a plurality of door panels, and a handle 7 is disposed at one side of the door panel 6. The door plates 6 are in one-to-one correspondence with the toasting slots 2, and do not share a door for the entire toasting apparatus. Accordingly, each door panel 6 has a corresponding handle 7.
When the semiconductor substrate baking device is used, the corresponding substrate is fixed inside the substrate fixing device 4 through the mounting groove 16, and the rotating shaft is driven to rotate through the rotating machine 14, so that the substrate fixing device 4 is driven to rotate (the whole device can simultaneously process a plurality of substrates with smaller areas in one baking groove 2, and therefore, the whole device can uniformly bake the substrates between the baking plates 3 at the top end and the bottom end in the baking groove 2, and the substrate baking yield is improved;
the temperature adjusting knob 13 and the temperature adjusting block 12 are used for controlling the heating temperature of the baking machine 9 on the baking pipe 11 in the baking plate 3 through the heat conduction pipe 10, so that the temperature in the baking oven is controlled, the phenomenon that the substrate is cracked due to large internal and external temperature difference is prevented, and the quality of the substrate is influenced;
In order to protect the substrate, the present invention improves that a protection pad 17 is arranged in the mounting groove 16, as shown in fig. 5. The protective pad 17 can prevent the substrate from being damaged due to bumping.
In order to facilitate observation, the invention is improved in that the door panel 6 is provided with an observation port 8. The viewing opening 8 can be arranged in the central region of the door panel 6 in order to better enable a corresponding viewing.
In order to improve the sealing performance, the invention improves that a first sealing gasket (not shown) is arranged between the inner side of the door panel 6 and the baking groove 2, and a second sealing gasket (not shown) is arranged between the rotating shaft and the box body 1.
In order to improve the safety, the invention improves that the protection pad 17 and the sealing pad are made of high-temperature resistant soft materials, and the materials of the protection pad and the sealing pad can be the same.
Referring to fig. 4, in order to protect the rotating machine 14, the present invention is improved in that a cabinet 15 is disposed outside the rotating machine 14.
In order to prevent the interior of the installation box from being affected by moisture, the invention is improved in that the two sides of the installation box are provided with vent holes (not shown). The ventilation holes are formed in the two sides of the base body, so that air convection is facilitated, and a better moisture-proof effect is achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The semiconductor substrate baking device is characterized by comprising a box body (1), wherein the box body (1) comprises a baking groove (2), a baking plate (3), a substrate fixing device (4), a door plate (6), a baking machine (9) and a rotating machine (14); the baking grooves (2) are positioned in the box body (1), and a plurality of baking grooves (2) are arranged; the baking plates (3) are arranged in the box body (1) and are positioned at the upper end and the lower end of the baking groove (2); the rotating machines (14) are arranged on the outer side of the box body (1), the rotating machines (14) are positioned on the outer side of the baking groove (2), and a plurality of rotating machines (14) are arranged; a rotating shaft is arranged on the rotating machine (14), penetrates through the box body (1) and extends into the baking groove (2); the substrate fixing device (4) is arranged at one end of the rotating shaft extending into the baking groove (2); the base plate baking device is characterized in that a mounting groove (16) is formed in the base plate baking groove (2), a mounting box is arranged at the bottom of the box body (1), a baking machine (9) is mounted in the mounting box, a baking pipe (11) is arranged in the baking plate (3), and a heat conduction pipe (10) is arranged between the baking machine (9) and the baking pipe (11).
2. The semiconductor substrate baking apparatus according to claim 1, wherein a temperature adjusting block (12) is disposed on the heat pipe (10), the temperature adjusting block (12) is located at a bottom end of the baking tank (2), a temperature adjusting knob (13) is disposed on one side of the box body (1), and the temperature adjusting knob (13) is connected to the temperature adjusting block (12).
3. The semiconductor substrate baking apparatus according to claim 1, wherein the door panel (6) is installed at a front side of the baking tub (2), a hinge chain (5) is provided between the door panel (6) and the cabinet (1), and the door panel (6) is provided in plurality, and a handle (7) is provided at one side of the door panel (6).
4. The semiconductor substrate baking apparatus according to claim 1, wherein a protection pad (17) is provided in the mounting groove (16).
5. The semiconductor substrate baking apparatus according to claim 1, wherein the door panel (6) is provided with a viewing port (8).
6. The semiconductor substrate baking apparatus according to claim 4, wherein a first gasket is provided between the inner side of the door plate (6) and the baking tub (2).
7. The semiconductor substrate baking apparatus according to claim 6, wherein a second gasket is provided between the rotating shaft and the case (1).
8. The semiconductor substrate baking apparatus according to claim 7, wherein the protection pad (17), the first sealing pad and the second sealing pad are made of the same material.
9. The apparatus for baking a semiconductor substrate as claimed in claim 1, wherein a cabinet (15) is provided outside the rotary machine (14).
10. The semiconductor substrate baking apparatus of claim 9, wherein ventilation holes are formed at both sides of the mounting box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011246618.8A CN112420560A (en) | 2020-11-10 | 2020-11-10 | Semiconductor substrate baking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011246618.8A CN112420560A (en) | 2020-11-10 | 2020-11-10 | Semiconductor substrate baking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112420560A true CN112420560A (en) | 2021-02-26 |
Family
ID=74782334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011246618.8A Pending CN112420560A (en) | 2020-11-10 | 2020-11-10 | Semiconductor substrate baking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112420560A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1103182A2 (en) * | 1999-11-03 | 2001-05-30 | MIWE Michael Wenz GmbH | Baking oven |
| KR20040035031A (en) * | 2002-10-18 | 2004-04-29 | 삼성전자주식회사 | Baking apparatus for manufacturing semiconductor device |
| CN102798272A (en) * | 2011-05-27 | 2012-11-28 | 任永平 | Cereal drying box |
| CN106423780A (en) * | 2016-10-28 | 2017-02-22 | 无锡龙翔印业有限公司 | Enamel ground coat baking device |
| CN208570530U (en) * | 2018-02-10 | 2019-03-01 | 六安联众工业自动化技术有限公司 | A kind of LED substrate baking box |
| CN109830452A (en) * | 2019-01-25 | 2019-05-31 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate apparatus for baking and substrate baking method |
| CN210569759U (en) * | 2019-09-25 | 2020-05-19 | 福州福启橡塑有限公司 | Glass fiber cloth baking device |
| CN210935764U (en) * | 2019-10-14 | 2020-07-07 | 吉林市闼闼悦嘉工贸有限公司 | Baking equipment for preventing paint door from cracking |
| CN214099589U (en) * | 2020-11-10 | 2021-08-31 | 芯米(厦门)半导体设备有限公司 | Semiconductor substrate baking device |
-
2020
- 2020-11-10 CN CN202011246618.8A patent/CN112420560A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1103182A2 (en) * | 1999-11-03 | 2001-05-30 | MIWE Michael Wenz GmbH | Baking oven |
| KR20040035031A (en) * | 2002-10-18 | 2004-04-29 | 삼성전자주식회사 | Baking apparatus for manufacturing semiconductor device |
| CN102798272A (en) * | 2011-05-27 | 2012-11-28 | 任永平 | Cereal drying box |
| CN106423780A (en) * | 2016-10-28 | 2017-02-22 | 无锡龙翔印业有限公司 | Enamel ground coat baking device |
| CN208570530U (en) * | 2018-02-10 | 2019-03-01 | 六安联众工业自动化技术有限公司 | A kind of LED substrate baking box |
| CN109830452A (en) * | 2019-01-25 | 2019-05-31 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate apparatus for baking and substrate baking method |
| CN210569759U (en) * | 2019-09-25 | 2020-05-19 | 福州福启橡塑有限公司 | Glass fiber cloth baking device |
| CN210935764U (en) * | 2019-10-14 | 2020-07-07 | 吉林市闼闼悦嘉工贸有限公司 | Baking equipment for preventing paint door from cracking |
| CN214099589U (en) * | 2020-11-10 | 2021-08-31 | 芯米(厦门)半导体设备有限公司 | Semiconductor substrate baking device |
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