CN112365813A - Novel Mini LED backlight unit of super large luminous angle - Google Patents
Novel Mini LED backlight unit of super large luminous angle Download PDFInfo
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Abstract
The invention discloses a novel Mini LED backlight module with an ultra-large light-emitting angle, which comprises a light bar; the lamp strip comprises a PCB board and a Mini LED lamp bead, and the Mini LED lamp bead is mounted on the PCB board; the Mini LED lamp bead comprises a Mini LED chip, a semitransparent shading layer and a diffusion layer, wherein the semitransparent shading layer is arranged on the upper surface of the Mini LED chip, and the diffusion layer is arranged above the semitransparent shading layer; the upper surface of the diffusion layer is an arc surface; the Mini LED chip is CSP, and the size of the Mini LED chip is 50-200 mu m. The invention has the characteristics of increasing the light emitting angle of the Mini LED lamp beads, reducing the density of the Mini LED lamp beads and reducing the cost of the backlight module.
Description
Technical Field
The invention relates to a novel Mini LED backlight module with an ultra-large light-emitting angle, in particular to a novel Mini LED backlight module with an ultra-large light-emitting angle, which has the advantages of increasing the light-emitting angle of a Mini LED lamp bead, reducing the density of the Mini LED lamp bead and reducing the cost of the backlight module.
Background
In recent years, the field of Mini LEDs has attracted much attention, and flip chip type Mini LEDs are designed for secondary optics without using a lens.
The chip has a small structure, so that the realization of higher contrast is facilitated, and the ultra-thinning effect can be achieved. The conventional Mini LED emission angle is approximately 130, PITCH < 8. In order to meet the requirement that the luminous surface has no visual defect, the distance between the LED lamps is short, and the quantity of the LEDs is large. Taking the mainstream 65-inch household electricity as an example, the number of the Mini LEDs of one television is about 18,000-20,000, so that the overall material cost is increased.
Disclosure of Invention
The invention aims to provide a novel Mini LED backlight module with an ultra-large light-emitting angle, which has the advantages of increasing the light-emitting angle of a Mini LED lamp bead, reducing the density of the Mini LED lamp bead and reducing the cost of the backlight module.
The purpose of the invention can be realized by the following technical scheme:
a novel Mini LED backlight module with an ultra-large light emitting angle comprises a light bar;
the lamp strip comprises a PCB board and a Mini LED lamp bead, and the Mini LED lamp bead is mounted on the PCB board;
the Mini LED lamp bead comprises a Mini LED chip, a semitransparent shading layer and a diffusion layer, wherein the semitransparent shading layer is arranged on the upper surface of the Mini LED chip, and the diffusion layer is arranged above the semitransparent shading layer; the upper surface of the diffusion layer is an arc surface;
the Mini LED chip is CSP, and the size of the Mini LED chip is 50-200 mu m;
a reflecting frame is arranged on the upper surface of the PCB outside the Mini LED lamp bead; the Mini LED lamp bead is positioned in the center of the light reflecting frame;
the shape of the light reflecting frame is a rectangular frame, and the edge of the side edge of the light reflecting frame is in a transitional arc shape;
a light reflecting frame clamping protrusion is arranged at the bottom side of the light reflecting frame; the upper surface of the PCB is provided with a light reflecting frame positioning groove matched with the light reflecting frame clamping projection; the light reflecting frame is positioned and installed on the upper surface of the PCB through the light reflecting frame positioning groove;
the light reflecting frame is fixed on the light reflecting frame positioning groove through adhesive;
the inner side surface of the light reflecting frame is provided with an outward inclined light emergent reflecting surface;
the outer side of the reflecting frame is provided with an inward inclined supporting surface;
the reflecting frames are arranged in a matrix form through reflecting frame connecting rods to form a reflecting frame combined cover, reflecting frame positioning columns are arranged on the bottom sides of the reflecting frames at the four corners of the reflecting frame combined cover, and the reflecting frame positioning columns extend downwards;
the upper surface of the PCB is provided with a reflecting frame positioning groove, an LED electrode pad, a reflecting frame combined cover connecting groove and a reflecting frame combined cover positioning and mounting hole, the LED electrode pad is positioned right below a Mini LED lamp bead on the lamp strip, the LED electrode pad is divided into an anode pad and a cathode pad, and the anode pad and the cathode pad respectively correspond to a positive electrode and a negative electrode of a Mini LED chip; the positive electrode and the negative electrode of the Mini LED chip are welded on the LED electrode bonding pad; the connecting groove of the reflecting frame combination cover is connected with a plurality of reflecting frame positioning grooves through a net shape; the reflecting frame positioning groove, the reflecting frame combined cover connecting groove and the reflecting frame combined cover positioning mounting hole are respectively matched with the reflecting frame clamping protrusion, the reflecting frame connecting rod and the reflecting frame positioning column; the positioning mounting hole of the reflecting frame combined cover is matched with the positioning column of the reflecting frame; the reflecting frame combined cover is arranged on the PCB through a reflecting frame clamping protrusion, a reflecting frame connecting rod and a reflecting frame positioning column, and the upper surface of the reflecting frame connecting rod is flush with the upper surface of the PCB;
the method for mounting the light reflecting frame on the PCB comprises the following steps:
step one, the reflecting frame is formed by hot pressing or curing by a grinding tool to manufacture the reflecting frame combined cover;
step two, demolding the bottom side of the reflecting frame combination cover positioned in the grinding tool, uniformly brushing a small amount of thermosetting adhesive on the convex card of the reflecting frame and the connecting rod of the reflecting frame, and scraping off the residual heat curing adhesive by using a scraper;
step three, demolding the grinding tools at the side part and the top part of the reflecting frame combined cover, and taking out the reflecting frame combined cover coated with the thermosetting adhesive;
positioning the reflection frame combined cover coated with the thermosetting adhesive on the PCB through the reflection frame positioning column, embedding the reflection frame positioning slot, the reflection frame combined cover connecting groove and the reflection frame combined cover positioning mounting hole in the PCB by uniform stress and light pressure, and then thermally curing through a reflow oven;
the curing temperature of the thermosetting adhesive is 60-80 ℃.
The invention provides a novel Mini LED backlight module with an ultra-large light-emitting angle, which has the characteristics of increasing the light-emitting angle of a Mini LED lamp bead, reducing the density of the Mini LED lamp bead and reducing the cost of the backlight module. The invention has the beneficial effects that: a diffusion layer is manufactured by adding a diffusion glue packaging process, so that the light emitting angle of the LED is increased through the diffusion layer, and the light emitting angle is increased from 130 degrees of the Mini LED chip to 140 degrees of the light emitting angle; therefore, the PITCH between every two original Mini LED lamp beads is increased to 10-15 mm from 8mm, the density of the Mini LED lamp beads is reduced, and the cost of the backlight module is reduced;
the Mini LED chip is matched with the characteristic that the light-emitting angle is increased by the diffusion layer through the light-emitting angle characteristic of the semitransparent light shielding layer; the light path Mini LED chip and the contact surface of the semitransparent shading layer, the contact surface of the semitransparent shading layer and the diffusion layer and the contact surface of the diffusion layer and the air, which are emitted by the Mini LED chip, are refracted for three times, the light-emitting angle is improved to 155 degrees, the PITCH of the PITCH can reach 30mm, the density of the Mini LED lamp beads is further reduced, the using amount of the Mini LED lamp beads is reduced to 1/16, the material cost is greatly reduced, the yield is improved, the production time is shortened, and the productivity is improved;
the PCB and the reflecting frame form a zigzag gap through the reflecting frame positioning groove and the reflecting frame clamping protrusion, so that light generated by the operation of the Mini LED lamp beads in the reflecting frame is reduced from leaking from the contact surface of the PCB and the reflecting frame, and the backlight module is caused to emit light unevenly;
the light-emitting and light-reflecting surface on the light-reflecting frame enhances the light-emitting rate of the Mini LED lamp beads and improves the brightness of the backlight module;
the light-emitting reflecting surface and the supporting surface are arranged on the inner side and the outer side of the reflecting frame, so that the reflecting frame is in a dam body shape, the strength of the reflecting frame is enhanced, and the reflecting frame is prevented from being deformed or easily damaged in the installation process;
the plurality of the reflecting frames are combined to form the reflecting frame combined cover, and the reflecting frame combined cover is integrally installed on the PCB, so that the processing efficiency is improved, the production time is shortened, and the production cost is reduced;
and (3) removing the bottom die of the reflecting frame combined cover, keeping the side die and the top die of the reflecting frame combined cover, reducing the flow of thermosetting adhesive to the side surface of the reflecting frame combined cover, causing the reflecting frame combined cover to be installed on a PCB (printed Circuit Board) in the process, escaping the thermosetting adhesive from the gap of the reflecting frame positioning groove and the reflecting frame connecting rod, and causing the abnormity of uneven light shape after the escaped adhesive is cured.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic longitudinal sectional view of a light bar of a novel Mini LED backlight module with an ultra-large light-emitting angle, provided by the invention;
fig. 2 is a top view of the light bar of example 1;
fig. 3 is a schematic view of the structure of the light bar in embodiment 1;
fig. 4 is a schematic view of a longitudinal cross-sectional structure of the light bar in embodiment 1;
FIG. 5 is an enlarged view of FIG. 4 at A;
FIG. 6 is a view showing the installation of the reflection frame in example 1;
FIG. 7 is a top view of the PCB of embodiment 1;
FIG. 8 is an enlarged view of FIG. 7 at B;
FIG. 9 is a back view of the reflector assembly of example 1;
fig. 10 is an enlarged view of fig. 9 at C.
Detailed Description
The purpose of the invention can be realized by the following technical scheme:
a novel Mini LED backlight module with an ultra-large light emitting angle is disclosed, and is shown in figures 1-4 and comprises a light bar;
the lamp strip comprises a PCB (printed circuit board) 1 and Mini LED lamp beads 2, and the Mini LED lamp beads 2 are mounted on the PCB 1;
the Mini LED lamp bead 2 comprises a Mini LED chip 4, a semitransparent shading layer 5 and a diffusion layer 6, wherein the semitransparent shading layer 5 is arranged on the upper surface of the Mini LED chip 4, and the diffusion layer 6 is arranged above the semitransparent shading layer 5; the upper surface of the diffusion layer 6 is an arc surface; the surface of the Mini LED chip 4 is coated by blade coating, spin coating or film-homogenizing post-curing to form a semi-transparent shading layer 5, and light emitted by the Mini LED chip 4 is uniformly mixed by the semi-transparent shading layer 5 and then enters the diffusion layer 6; the diffusion layer 6 is formed by solidifying transparent glue dripping; the diffusion layer 6 adjusts the light-emitting angle of the Mini LED lamp beads 2 from the arc surface of the diffusion layer 6 by controlling the glue dripping amount, viscosity, surface tension and curing time of the transparent glue and matching the refractive index of the cured glue, so that the production line scale production of the backlight module is realized;
a diffusion layer 6 is manufactured by adding a diffusion glue packaging process, so that the light emitting angle of the LED is increased through the diffusion layer 6, and the light emitting angle is increased to 140 degrees from 130 degrees of the light emitting angle of the Mini LED chip 4; therefore, the PITCH (PITCH <8 mm) of the two original adjacent Mini LED lamp beads 2 is increased to 10-15 mm, the density of the Mini LED lamp beads 2 is reduced, and the cost of the backlight module is reduced;
the Mini LED chip 4 is matched with the characteristic that the light-emitting angle is increased by the diffusion layer 6 through the light-emitting angle characteristic of the semitransparent light shielding layer 5; the light path Mini LED chip 4 and the contact surface of the semitransparent shading layer 5, the contact surface of the semitransparent shading layer 5 and the diffusion layer 6 and the contact surface of the diffusion layer 6 and the air, which are emitted by the Mini LED chip 4, are refracted three times, the light emitting angle is increased to 155 degrees, the PITCH of the PITCH can reach 30mm, the density of the Mini LED lamp beads 2 is further reduced, the using amount of the Mini LED lamp beads 2 is reduced to 1/16, the material cost is greatly reduced, the yield is improved, the production time is shortened, and the productivity is improved;
the Mini LED chip 4 is CSP, and the size of the Mini LED chip 4 is 50-200 mu m; the CSP is a chip scale package (ChipScalePackage).
Example 1
As shown in fig. 5 to 10, a novel Mini LED backlight module with an ultra-large light emitting angle comprises a light bar; the lamp strip comprises a PCB (printed circuit board) 1 and Mini LED lamp beads 2, and the Mini LED lamp beads 2 are mounted on the PCB 1;
the Mini LED lamp bead 2 comprises a Mini LED chip 4, a semitransparent shading layer 5 and a diffusion layer 6, wherein the semitransparent shading layer 5 is arranged on the upper surface of the Mini LED chip 4, and the diffusion layer 6 is arranged above the semitransparent shading layer 5; the upper surface of the diffusion layer 6 is an arc surface;
the Mini LED chip 4 is CSP, and the size of the Mini LED chip 4 is 50 μm;
a reflecting frame 3 is arranged on the upper surface of the PCB 1 outside the Mini LED lamp bead 2; the Mini LED lamp bead 2 is positioned in the center of the light reflecting frame 3;
the shape of the reflecting frame 3 is a rectangular frame, and the edge of the side edge of the reflecting frame 3 is in a transitional arc shape; the phenomenon that the reflecting area of the edge at the inner side of the reflecting frame 3 is darker and more obvious dark spots appear on the backlight module is avoided;
a reflecting frame clamping protrusion 8 is arranged at the bottom side of the reflecting frame 3; the upper surface of the PCB 1 is provided with a reflecting frame positioning groove 7 matched with the reflecting frame clamping protrusion 8; the reflecting frame 3 is positioned and installed on the upper surface of the PCB 1 through a reflecting frame positioning groove 7; a sawtooth-shaped gap is formed between the PCB 1 and the reflecting frame 3 through the reflecting frame positioning groove 7 and the reflecting frame clamping protrusion 8, so that light generated by the operation of the Mini LED lamp beads 2 in the reflecting frame 3 is prevented from leaking from the contact surface of the PCB 1 and the reflecting frame 3, and the backlight module is prevented from emitting light unevenly;
the reflecting frame 3 is fixed on the reflecting frame positioning groove 7 through adhesive bonding;
the inner side surface of the light reflecting frame 3 is provided with an outward inclined light-emitting light reflecting surface 9, and the light-emitting light reflecting surface 9 on the light reflecting frame 3 enhances the light-emitting rate of the Mini LED lamp bead 2 and improves the brightness of the backlight module;
the outer side of the reflecting frame 3 is provided with an inward inclined supporting surface 10, and the inner side and the outer side of the reflecting frame 3 are provided with a light-emitting reflecting surface 9 and a supporting surface 10, so that the reflecting frame 3 is in a dam shape, the strength of the reflecting frame 3 is enhanced, and the reflecting frame 3 is prevented from being deformed or easily damaged in the installation process;
the plurality of the reflecting frames 3 are arranged in a matrix form through reflecting frame connecting rods 14 to form a reflecting frame combined cover 13, reflecting frame positioning columns 16 are arranged at the bottom sides of the reflecting frames 3 at the four corners of the reflecting frame combined cover 13, and the reflecting frame positioning columns 16 extend downwards; the plurality of the reflecting frames 3 are combined to form the reflecting frame combined cover 13, and the reflecting frame combined cover 13 is integrally arranged on the PCB 1, so that the processing efficiency is improved, the production time is shortened, and the production cost is reduced;
the upper surface of the PCB 1 is provided with a reflecting frame positioning groove 7, an LED electrode pad 11, a reflecting frame combination cover connecting groove 12 and a reflecting frame combination cover positioning and mounting hole 15, the LED electrode pad 11 is positioned right below a Mini LED lamp bead 2 on the lamp strip, the LED electrode pad 11 is divided into an anode pad and a cathode pad, and the anode pad and the cathode pad respectively correspond to an anode and a cathode of a Mini LED chip 4; the positive electrode and the negative electrode of the Mini LED chip 4 are welded on the LED electrode bonding pad 11; the reflecting frame combination cover connecting groove 12 is connected with a plurality of reflecting frame positioning grooves 7 through a net shape; the reflecting frame positioning slot 7, the reflecting frame combined cover connecting groove 12 and the reflecting frame combined cover positioning mounting hole 15 are respectively matched with the reflecting frame clamping protrusion 8, the reflecting frame connecting rod 14 and the reflecting frame positioning column 16; the positioning mounting hole 15 of the reflecting frame combination cover is matched with a reflecting frame positioning column 16; the reflecting frame combined cover 13 is arranged on the PCB 1 through the reflecting frame clamping protrusion 8, the reflecting frame connecting rod 14 and the reflecting frame positioning column 16, and the upper surface of the reflecting frame connecting rod 14 is flush with the upper surface of the PCB 1; the upper surface of the reflecting frame connecting rod 14 and the upper surface of the PCB 1 are made of materials with the same emissivity and are flush, so that the difference between the reflection of the upper surface of the reflecting frame connecting rod 14 and the reflection of the upper surface of the PCB 1 is reduced, and the backlight module emits light unevenly;
the method for installing the reflecting frame 3 on the PCB board 1 comprises the following steps:
step one, the reflecting frame 3 is formed by hot pressing or curing by a grinding tool to manufacture a reflecting frame combined cover 13;
step two, demolding the bottom side of the reflecting frame combination cover 13 positioned in the grinding tool, uniformly brushing a small amount of thermosetting adhesive on the reflecting frame clamping protrusions 8 and the reflecting frame connecting rods 14, and scraping off the residual heat curing adhesive by using a scraper; removing the bottom die of the reflector combination cover 13, reserving the side die and the top die of the reflector combination cover 13, and reducing the flow of thermosetting adhesive to the side surface of the reflector combination cover 13 to cause that the thermosetting adhesive escapes from gaps of the reflector positioning slot 7 and the reflector connecting rod 14 in the process of installing the reflector combination cover 13 on the PCB 1, and the escaped adhesive causes the abnormity of non-uniform light shape after being cured;
step three, demolding the grinding tools at the side part and the top part of the reflecting frame combination cover 13, and taking out the reflecting frame combination cover 13 coated with thermosetting adhesive;
positioning the reflection frame combined cover 13 coated with the thermosetting adhesive on the PCB 1 through the reflection frame positioning column 16, uniformly stressed and lightly pressed and embedded into the reflection frame positioning groove 7, the reflection frame combined cover connecting groove 12 and the reflection frame combined cover positioning and mounting hole 15 on the PCB 1, and then thermally curing through a reflow oven;
the curing temperature of the thermosetting adhesive is 60-80 ℃.
The invention has the beneficial effects that:
according to the invention, a semi-transparent shading layer 5 is formed on the surface of a Mini LED chip 4 in a blade coating, spin coating or film-homogenizing post-curing mode, and light emitted by the Mini LED chip 4 passes through uniform light mixing of the semi-transparent shading layer 5 and then enters a diffusion layer 6; the diffusion layer 6 is formed by solidifying transparent glue water; the diffusion layer 6 adjusts the light-emitting angle of the Mini LED lamp beads 2 from the arc surface of the diffusion layer 6 by controlling the glue dripping amount, viscosity, surface tension and curing time of the transparent glue and matching the refractive index of the cured glue, thereby realizing the production line scale production of the backlight module;
a diffusion layer 6 is manufactured by adding a diffusion glue packaging process, so that the light emitting angle of the LED is increased through the diffusion layer 6, and the light emitting angle is increased to 140 degrees from 130 degrees of the light emitting angle of the Mini LED chip 4; therefore, the PITCH (PITCH <8 mm) of the two original adjacent Mini LED lamp beads 2 is increased to 10-15 mm, the density of the Mini LED lamp beads 2 is reduced, and the cost of the backlight module is reduced;
the Mini LED chip 4 is matched with the characteristic that the light-emitting angle is increased by the diffusion layer 6 through the light-emitting angle characteristic of the semitransparent light shielding layer 5; the light path Mini LED chip 4 and the contact surface of the semitransparent shading layer 5, the contact surface of the semitransparent shading layer 5 and the diffusion layer 6 and the contact surface of the diffusion layer 6 and the air, which are emitted by the Mini LED chip 4, are refracted three times, the light emitting angle is increased to 155 degrees, the PITCH of the PITCH can reach 30mm, the density of the Mini LED lamp beads 2 is further reduced, the using amount of the Mini LED lamp beads 2 is reduced to 1/16, the material cost is greatly reduced, the yield is improved, the production time is shortened, and the productivity is improved;
the edges on the side edges of the light reflecting frame 3 are arranged into excessive circular arcs, so that the phenomenon that the reflecting area of the edges on the inner side of the light reflecting frame 3 is darker and more obvious dark spots appear on the backlight module is avoided;
a zigzag gap is formed between the PCB 1 and the reflecting frame 3 through the reflecting frame positioning groove 7 and the reflecting frame clamping protrusion 8, so that light generated by the operation of the Mini LED lamp beads 2 in the reflecting frame 3 is prevented from leaking from the contact surfaces of the PCB 1 and the reflecting frame 3, and the backlight module is prevented from emitting light unevenly;
the light-emitting reflecting surface 9 on the reflecting frame 3 enhances the light-emitting rate of the Mini LED lamp beads 2 and improves the brightness of the backlight module;
the light-emitting reflecting surface 9 and the supporting surface 10 are arranged on the inner side and the outer side of the reflecting frame 3, so that the reflecting frame 3 forms a dam shape, the strength of the reflecting frame 3 is enhanced, and the reflecting frame 3 is prevented from being deformed or damaged easily in the installation process;
the plurality of the reflecting frames 3 are combined to form the reflecting frame combined cover 13, and the reflecting frame combined cover 13 is integrally arranged on the PCB 1, so that the processing efficiency is improved, the production time is shortened, and the production cost is reduced;
the upper surface of the reflecting frame connecting rod 14 and the upper surface of the PCB 1 are made of materials with the same emissivity and are flush, so that the difference between the reflection of the upper surface of the reflecting frame connecting rod 14 and the reflection of the upper surface of the PCB 1 is reduced, and the condition that the light of the backlight module is not uniform is caused;
and (3) removing the bottom die of the reflecting frame combined cover 13, keeping the side die and the top die of the reflecting frame combined cover 13, reducing the flow of thermosetting adhesive to the side surface of the reflecting frame combined cover 13, causing the reflecting frame combined cover 13 to be installed on the PCB (printed circuit board) 1, escaping the thermosetting adhesive from the gap between the reflecting frame positioning groove 7 and the reflecting frame connecting rod 14, and causing the non-uniform abnormality of the light type after the escaping adhesive is cured.
The invention provides a novel Mini LED backlight module with an ultra-large light-emitting angle, which has the characteristics of increasing the light-emitting angle of a Mini LED lamp bead, reducing the density of the Mini LED lamp bead and reducing the cost of the backlight module. The invention has the beneficial effects that: a diffusion layer is manufactured by adding a diffusion glue packaging process, so that the light emitting angle of the LED is increased through the diffusion layer, and the light emitting angle is increased from 130 degrees of the Mini LED chip to 140 degrees of the light emitting angle; therefore, the PITCH between every two original Mini LED lamp beads is increased to 10-15 mm from 8mm, the density of the Mini LED lamp beads is reduced, and the cost of the backlight module is reduced;
the Mini LED chip is matched with the characteristic that the light-emitting angle is increased by the diffusion layer through the light-emitting angle characteristic of the semitransparent light shielding layer; the light path Mini LED chip and the contact surface of the semitransparent shading layer, the contact surface of the semitransparent shading layer and the diffusion layer and the contact surface of the diffusion layer and the air, which are emitted by the Mini LED chip, are refracted for three times, the light-emitting angle is improved to 155 degrees, the PITCH of the PITCH can reach 30mm, the density of the Mini LED lamp beads is further reduced, the using amount of the Mini LED lamp beads is reduced to 1/16, the material cost is greatly reduced, the yield is improved, the production time is shortened, and the productivity is improved;
the PCB and the reflecting frame form a zigzag gap through the reflecting frame positioning groove and the reflecting frame clamping protrusion, so that light generated by the operation of the Mini LED lamp beads in the reflecting frame is reduced from leaking from the contact surface of the PCB and the reflecting frame, and the backlight module is caused to emit light unevenly;
the light-emitting and light-reflecting surface on the light-reflecting frame enhances the light-emitting rate of the Mini LED lamp beads and improves the brightness of the backlight module;
the light-emitting reflecting surface and the supporting surface are arranged on the inner side and the outer side of the reflecting frame, so that the reflecting frame is in a dam body shape, the strength of the reflecting frame is enhanced, and the reflecting frame is prevented from being deformed or easily damaged in the installation process;
the plurality of the reflecting frames are combined to form the reflecting frame combined cover, and the reflecting frame combined cover is integrally installed on the PCB, so that the processing efficiency is improved, the production time is shortened, and the production cost is reduced;
and (3) removing the bottom die of the reflecting frame combined cover, keeping the side die and the top die of the reflecting frame combined cover, reducing the flow of thermosetting adhesive to the side surface of the reflecting frame combined cover, causing the reflecting frame combined cover to be installed on a PCB (printed Circuit Board) in the process, escaping the thermosetting adhesive from the gap of the reflecting frame positioning groove and the reflecting frame connecting rod, and causing the abnormity of uneven light shape after the escaped adhesive is cured.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.
Claims (10)
1. A novel Mini LED backlight module with an ultra-large light emitting angle comprises a light bar and is characterized in that;
the lamp strip comprises a PCB (1) and Mini LED lamp beads (2), and the Mini LED lamp beads (2) are mounted on the PCB (1);
the Mini LED lamp bead (2) comprises a Mini LED chip (4), a semi-transparent shading layer (5) and a diffusion layer (6), wherein the semi-transparent shading layer (5) is arranged on the upper surface of the Mini LED chip (4), and the diffusion layer (6) is arranged above the semi-transparent shading layer (5); the upper surface of the diffusion layer (6) is a circular arc surface.
2. The novel Mini LED backlight module with an ultra-large light-emitting angle as claimed in claim 1, wherein the Mini LED chip (4) is CSP, and the size of the Mini LED chip (4) is 50-200 μm.
3. The novel Mini LED backlight module with the ultra-large light-emitting angle as claimed in claim 1, wherein a light-reflecting frame (3) is mounted on the upper surface of the PCB (1) outside the Mini LED lamp beads (2); the Mini LED lamp bead (2) is positioned in the center of the light reflecting frame (3).
4. The novel Mini LED backlight module with an ultra-large light-emitting angle as claimed in claim 3, wherein the shape of the light-reflecting frame (3) is a rectangular frame, and the edge of the side of the light-reflecting frame (3) is set to be an excessive arc.
5. The novel Mini LED backlight module with an ultra-large light-emitting angle as claimed in claim 3, wherein a light-reflecting frame locking protrusion (8) is arranged on the bottom side of the light-reflecting frame (3); the upper surface of the PCB (1) is provided with a reflecting frame positioning groove (7) matched with the reflecting frame clamping protrusion (8); the reflection frame (3) is positioned and installed on the upper surface of the PCB (1) through the reflection frame positioning groove (7).
6. The novel Mini LED backlight module with an ultra-large light-emitting angle as claimed in claim 3, wherein the light-reflecting frame (3) is fixed on the light-reflecting frame positioning groove (7) by gluing;
the inner side surface of the light reflecting frame (3) is provided with an outward inclined light emergent reflecting surface (9);
and an inward inclined supporting surface (10) is arranged on the outer side of the reflecting frame (3).
7. The novel Mini LED backlight module with an ultra-large light-emitting angle as claimed in claim 3, wherein the plurality of light-reflecting frames (3) are arranged in a matrix by the light-reflecting frame connecting rods (14) to form the light-reflecting frame combination cover (13), the light-reflecting frame positioning posts (16) are arranged on the bottom sides of the light-reflecting frames (3) at the four corners of the light-reflecting frame combination cover (13), and the light-reflecting frame positioning posts (16) extend downwards.
8. The novel Mini LED backlight module with the ultra-large light-emitting angle is characterized in that a light-reflecting frame positioning groove (7), an LED electrode pad (11), a light-reflecting frame combined cover connecting groove (12) and a light-reflecting frame combined cover positioning and mounting hole (15) are formed in the upper surface of the PCB (1), the LED electrode pad (11) is located right below a Mini LED lamp bead (2) on the lamp strip, the LED electrode pad (11) is divided into an anode pad and a cathode pad, and the anode pad and the cathode pad respectively correspond to an anode and a cathode of a Mini LED chip (4); the positive electrode and the negative electrode of the Mini LED chip (4) are welded on the LED electrode bonding pad (11); the reflecting frame combined cover connecting groove (12) is connected with a plurality of reflecting frame positioning grooves (7) through a net shape; the reflection frame positioning groove (7), the reflection frame combined cover connecting groove (12) and the reflection frame combined cover positioning mounting hole (15) are respectively matched with the reflection frame clamping protrusion (8), the reflection frame connecting rod (14) and the reflection frame positioning column (16); the positioning mounting hole (15) of the reflecting frame combined cover is matched with a reflecting frame positioning column (16); the reflection frame combined cover (13) is arranged on the PCB (1) through the reflection frame clamping protrusion (8), the reflection frame connecting rod (14) and the reflection frame positioning column (16), and the upper surface of the reflection frame connecting rod (14) is flush with the upper surface of the PCB (1).
9. The novel Mini LED backlight module with ultra-large light-emitting angle as claimed in claim 3, wherein the method for mounting the light-reflecting frame (3) on the PCB (1) comprises the following steps:
step one, the reflecting frame (3) is formed by hot pressing or curing by a grinding tool to manufacture a reflecting frame combined cover (13);
secondly, demolding the bottom side of the reflecting frame combined cover (13) in the grinding tool, uniformly brushing a small amount of thermosetting adhesive on the reflecting frame clamping protrusions (8) and the reflecting frame connecting rods (14), and scraping off the residual heat curing adhesive by using a scraper;
thirdly, demolding the grinding tools on the side part and the top part of the reflecting frame combined cover (13), and taking out the reflecting frame combined cover (13) coated with the thermosetting adhesive;
and fourthly, positioning the reflection frame combined cover (13) coated with the thermosetting adhesive on the PCB (1) through a reflection frame positioning column (16), embedding the reflection frame combined cover into the reflection frame positioning groove (7), the reflection frame combined cover connecting groove (12) and the reflection frame combined cover positioning mounting hole (15) on the PCB (1) under uniform stress and light pressure, and then carrying out thermal curing through a reflow oven.
10. The novel Mini LED backlight module with an ultra-large light-emitting angle as claimed in claim 9, wherein the curing temperature of the thermosetting adhesive is 60-80 ℃.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011304694.XA CN112365813A (en) | 2020-11-19 | 2020-11-19 | Novel Mini LED backlight unit of super large luminous angle |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011304694.XA CN112365813A (en) | 2020-11-19 | 2020-11-19 | Novel Mini LED backlight unit of super large luminous angle |
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| CN112365813A true CN112365813A (en) | 2021-02-12 |
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Cited By (1)
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| CN115425137A (en) * | 2022-09-05 | 2022-12-02 | 昆山锦林光电材料有限公司 | Processing method of small LED chip with large light-emitting angle |
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