CN111843621A - Method for forming holding surface - Google Patents

Method for forming holding surface Download PDF

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Publication number
CN111843621A
CN111843621A CN202010294888.XA CN202010294888A CN111843621A CN 111843621 A CN111843621 A CN 111843621A CN 202010294888 A CN202010294888 A CN 202010294888A CN 111843621 A CN111843621 A CN 111843621A
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China
Prior art keywords
holding surface
grinding
holding
chuck table
rotation axis
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Granted
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CN202010294888.XA
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Chinese (zh)
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CN111843621B (en
Inventor
久保徹雄
松原壮一
山下真司
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Disco Corp
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Disco Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

Provided is a method for forming a holding surface by grinding a holding surface (500) using a grinding wheel, the method comprising: a 1 st holding surface forming step of inclining the chuck table (5), adjusting the 1 st rotation axis as the rotation axis of the grinding wheel (34) and the 2 nd rotation axis as the rotation axis of the chuck table to form an angle (theta 3) with a predetermined size, and grinding the holding surface by setting the inclination relationship between the two axes to be the 1 st inclination relationship to form a 1 st surface (50C) having a shape of a conical surface; and a 2 nd holding surface forming step of, after the 1 st holding surface forming step, further inclining the chuck table so that an angle formed by the two axes becomes an angle (θ 4) larger than an angle between the two axes in the 1 st inclination relationship, and grinding the holding surface again with the inclination relationship between the two axes being the 2 nd inclination relationship, thereby forming a 2 nd surface (50D) having a side surface shape of a truncated cone continuing to an outer periphery of the 1 st surface.

Description

Method for forming holding surface
Technical Field
The present invention relates to a holding surface forming method.
Background
A grinding device for grinding a wafer includes a holding table for holding the wafer and a grinding unit having a grinding wheel for grinding the wafer held on the holding table.
In the grinding apparatus, after the grinding wheel or the holding table is replaced, self-polishing is performed in which the holding surface is ground by the grinding wheel so that the holding surface of the holding table is parallel to the grinding surface of the grinding wheel (for example, see patent document 1 below).
Patent document 1: japanese patent laid-open No. 2014-237210
The self-polishing is performed by slightly inclining the rotation axis of the grinding wheel with respect to the rotation axis of the holding table, and by bringing the grinding wheel into contact with the holding surface so as to hold the center of the holding surface of the table, grinding the holding surface of the holding table, thereby forming the holding surface of the holding table into a conical surface. When the wafer is thick, the wafer cannot follow the conical shape of the holding surface and a gap is formed between the vicinity of the apex of the conical surface of the holding surface and the center of the lower surface of the wafer when the wafer is held on the holding surface.
In a grinding device for feeding and grinding a rotating workpiece by rotating a grinding wheel, the following problems are solved: the center of the processed object is prevented from thinning and the processed object is finished into a flat wafer.
Disclosure of Invention
The invention aims to provide a method for forming a holding surface, which prevents a gap from being generated between a processed object and the holding surface, prevents the center of the processed object from being thinned, and finishes the processed object into a flat wafer.
According to the present invention, there is provided a holding surface forming method for forming a holding surface by grinding a holding surface with a grinding wheel in a grinding device, wherein the grinding wheel is rotated around a center of a grinding wheel in which the grinding wheel is annularly arranged, the chuck table is rotated around a center of the holding surface of the chuck table for sucking and holding a workpiece, and the workpiece held on the holding surface is ground with the grinding wheel, the holding surface forming method comprising: a 1 st holding surface forming step of arranging a 1 st rotation axis passing through the center of the grinding wheel as an axis for rotating the grinding wheel and a 2 nd rotation axis passing through the center of the holding surface as an axis for rotating the chuck table in a 1 st inclined relationship of a predetermined angle, positioning the grinding wheel at a position passing through the center of the holding surface to grind the holding surface, and forming a circular 1 st surface at least at the center of the holding surface; and a 2 nd holding surface forming step of arranging the 1 st rotation axis and the 2 nd rotation axis in a 2 nd inclination relation inclined at an angle larger than the 1 st inclination relation, grinding an outer peripheral portion of the holding surface by the grinding whetstone, leaving the 1 st surface of a circular shape at a center of the holding surface, forming a 2 nd surface of an annular shape as a side surface shape of a truncated cone connecting the 1 st surface, and grinding the holding surface at least 2 times by the grinding whetstone under different inclination relations to form a holding surface.
In the 1 st holding surface forming step of the present invention, it is preferable that the 1 st rotation axis and the 2 nd rotation axis are arranged in parallel to form the 1 st surface as a flat surface.
In the 1 st holding surface forming step of the present invention, it is preferable that the 1 st surface of the conical surface having the center of the holding surface as the apex is formed in the 1 st inclined relationship.
In the present invention, in order to eliminate a gap between the holding surface formed in the vicinity of the center of the holding surface and the workpiece when the workpiece is held on the holding surface, 2 times of grinding is performed to form the 1 st surface and the 2 nd surface. Therefore, since a force causing deformation of the workpiece is not applied to the center of the holding surface, a gap is not generated between the holding surface and the workpiece, and the problem that the workpiece in the center of the holding surface is excessively ground and becomes thin can be solved.
Thereby, the prior art will be
Figure BDA0002451815400000021
The silicon wafer of (2) is finished to a thickness difference of 200nm to 300nm, but in the present invention, the silicon wafer can be finished to a thickness difference of 100nm or less.
Further, by forming a plurality of surfaces such as the 3 rd surface and the 4 th surface in addition to the 2 nd surface, the workpiece can be more reliably held on the holding surface.
Drawings
Fig. 1 is a perspective view showing the entire grinding apparatus.
Fig. 2 (a) is a cross-sectional view showing a 1 st holding surface forming step of grinding a holding surface by a grinding unit to form a flat 1 st surface, fig. 2 (b) is a cross-sectional view showing a 2 nd holding surface forming step of grinding the holding surface again by the grinding unit after changing the inclination of the grinding unit and the chuck table 5 after the 1 st holding surface forming step is performed, to form a 2 nd surface of a frustum-side-surface shape continuing to the outer side of the circle of the 1 st surface, and fig. 2 (c) is a cross-sectional view showing a holding surface formed through two steps.
Fig. 3 (a) is a cross-sectional view showing a 1 st holding surface forming step of grinding the holding surface by the grinding means to form a 1 st surface of a conical shape, fig. 3 (b) is a cross-sectional view showing a 2 nd holding surface forming step of grinding the holding surface again by the grinding means after the 1 st holding surface forming step by changing the inclination of the grinding means and the chuck table 5, and forming a 2 nd surface of a conical side surface shape continuing to the outside of the 1 st surface, and fig. 3 (c) is a cross-sectional view showing the holding surface formed through two steps.
Fig. 4 (a) is a cross-sectional view of a 1 st holding surface forming step of forming a 1 st surface in a dome shape by inclining the chuck table to the deep side of the paper surface and grinding the holding surface by the grinding means, fig. 4 (b) is a cross-sectional view of a 2 nd holding surface forming step of forming a 2 nd surface in a side surface shape of a truncated cone connected to the outer side of the 1 st surface by changing the inclination of the grinding means and the chuck table 5 after the 1 st holding surface forming step is performed and grinding the holding surface again by the grinding means, and fig. 4 (c) is a cross-sectional view showing the holding surface formed through two steps.
Description of the reference symbols
1: a grinding device; 10: a base; 11: a column; 12: a cover; 13: corrugation; 2: a control unit; 3: a grinding unit; 30: a main shaft; 31: a housing; 32: a spindle motor; 33: a mounting seat; 34: grinding the grinding wheel; 340: grinding the grinding tool; 340 b: grinding the lower surface of the grinding tool; 431: a base station; 35: 1 st rotation axis; 4: a grinding feed unit; 40: a ball screw; 41: a guide rail; 42: a Z-axis motor; 43: a lifting plate; 44: a support; 45: a rotating shaft; 5: a chuck table; 50: a suction part; 500: a holding surface; 51: a frame body; 52: an aspiration path; 53: an attraction source; 54: a rotation unit; 55: a 2 nd rotation axis; 6: a thickness measuring unit; 60: a wafer upper surface height gauge; 61: maintaining the surface height gauge; 62: a calculation unit; w: a workpiece; wa: the front surface of the processed object; o: the center of the holding surface; 50A: a flat 1 st face; 50C: the 1 st surface of the conical surface shape; 50E: a dome-shaped 1 st surface; 50B, 50D, 50F: the 2 nd surface of the side shape of the truncated cone; θ 1 to θ 4: the angle formed by the 1 st rotation axis and the 2 nd rotation axis.
Detailed Description
1. Structure of grinding device
A grinding apparatus 1 shown in fig. 1 is a grinding apparatus for grinding a workpiece W such as a semiconductor wafer held on a chuck table 5 by using a grinding unit 3. The structure of the grinding apparatus 1 will be explained below.
The grinding apparatus 1 includes a control unit 2 that electrically controls various mechanisms included in the grinding apparatus 1.
As shown in fig. 1, the grinding apparatus 1 has a base 10 provided to extend in the Y-axis direction and a column 11 provided upright on the + Y-direction side on the base 10.
On the side of the column 11 on the-Y direction side, there are a grinding unit 3 and a grinding feed unit 4. The grinding unit 3 includes: a spindle 30 having a 1 st rotation axis 35 in a Z-axis direction; a spindle motor 32 for driving and rotating the spindle 30 about a 1 st rotation shaft 35; and a housing 31 rotatably supporting the main shaft 30. A mounting seat 33 is connected to a lower end of the spindle 30, and a grinding wheel 34 is detachably disposed on a lower surface of the mounting seat 33. The grinding wheel 34 is composed of a base 341 and a plurality of grindstones 340 annularly arranged on the lower surface of the base 341. The grinding wheel 340 is formed of, for example, diamond abrasive grains fixed by a resin bond, a metal bond, or the like, and the lower surface 340a thereof serves as a grinding surface for grinding the workpiece W.
The grinding feed unit 4 includes: a ball screw 40 having a rotation shaft 45 in the Z-axis direction; a pair of guide rails 41 arranged in parallel with the ball screw 40; a Z-axis motor 42 that rotates the ball screw 40 about a rotation shaft 45; a lifting plate 43, the inner nut of which is screwed with the ball screw 40, and the side part of the lifting plate 43 is in sliding contact with the guide rail 41; and a holder 44 coupled to the lifting plate 43 and holding the grinding unit 3.
When the ball screw 40 is driven by the Z-axis motor 42 to rotate about the rotary shaft 45, the lifting plate 43 is guided by the guide rail 41 to move up and down in the Z-axis direction, and the grinding unit 3 held by the holder 44 moves up and down in the Z-axis direction. The grinding wheel 340 can be moved toward and away from the workpiece W held on the chuck table 5 by driving the grinding unit 3 by the grinding feed unit 4.
As shown in fig. 1, a chuck table 5 is provided on a base 10 of a grinding apparatus 1. The chuck table 5 is a disk-shaped table for holding the workpiece W, and includes a suction portion 50 and a frame 51 surrounding the suction portion 50, and the suction portion 50 includes a holding surface 500. Further, the chuck table 5 is connected to a suction source 53 via a suction passage 52. For example, the workpiece W can be sucked and held on the holding surface 500 by transmitting the suction force generated by the suction source 53 to the holding surface 500 through the suction path 52.
A rotation unit 54 for rotating the chuck table 5 about a 2 nd rotation axis 55 in the Z-axis direction is disposed on the chuck table 5.
Further, a tilt adjusting means, not shown, is disposed on the chuck table 5. The 2 nd rotation axis 55 is inclined with respect to the Z-axis direction by tilting the chuck table 5 using the tilt adjusting unit. Further, as the tilt adjusting means, for example, the movable support portion of patent document 1 can be used.
Further, a cover 12 is disposed around the chuck table 5, and the bellows 13 is telescopically coupled to the cover 12. During grinding of the workpiece W, the cover 12 and the chuck table 5 are driven by a movement unit, not shown, disposed inside the base 10 in the Y-axis direction and integrally reciprocate in the Y-axis direction. At this time, the bellows 13 expands and contracts with the movement of the cover 12 in the Y-axis direction.
As shown in fig. 1, a thickness measuring unit 6 is disposed on a base 10 of a grinding apparatus 1, and the thickness measuring unit 6 includes a wafer upper surface height meter 60, a holding surface height meter 61, and a calculating unit 62. In the grinding process, the height of the front surface Wa of the workpiece W and the height of the holding surface 500 of the chuck table 5 are measured by bringing the wafer upper surface height gauge 60 into contact with the front surface Wa of the workpiece W and the holding surface height gauge 61 into contact with the holding surface 500 of the chuck table 5, and the thickness of the workpiece W can be calculated by the calculation unit 62 based on the measured height values of the two.
2. Method for forming holding surface
A holding surface forming method for grinding the holding surface 500 by using the grinding apparatus 1 to form the holding surface 500 having a desired shape will be described.
Embodiment 1
(1 st holding surface formation step)
First, the chuck table 5 shown in fig. 1 is moved in the Y-axis direction by using a moving means in the Y-axis direction, which is not shown, and as shown in fig. 2 (a), the lower surface 340b of the grinding stone 340 is aligned so as to pass through the center O of the holding surface 500 of the chuck table 5.
Next, the inclination of the 2 nd rotation shaft 55 is adjusted so that the inclination relationship between the 1 st rotation shaft 35 and the 2 nd rotation shaft 55 becomes the 1 st inclination relationship. In embodiment 1, the 1 st inclination relationship is a relationship in which the 1 st rotation axis 35 and the 2 nd rotation axis 55 are parallel to each other as shown in fig. 2 (a). Therefore, the chuck table 5 is tilted by a tilt adjusting means not shown, and adjusted so that the 1 st rotation axis 35 and the 2 nd rotation axis 55 are parallel to each other.
As shown in fig. 2 (a), when the 1 st rotation shaft 35 and the 2 nd rotation shaft 55 are parallel to each other, the angle θ 1 between the 1 st rotation shaft 35 and the 2 nd rotation shaft 55 is set to 0 degree for convenience.
Then, as shown in fig. 1 and 2, the spindle 30 is rotated about the 1 st rotation shaft 35 by using the spindle motor 32 of the grinding unit 3, whereby the grindstone 340 connected to the spindle 30 is rotated about the 1 st rotation shaft 35, and the chuck table 5 is rotated about the 2 nd rotation shaft 55 by using the rotating unit 54.
In a state where the grinding whetstone 340 and the chuck table 5 are rotated, the ball screw 40 is rotated by using the Z-axis motor 42 of the grinding feed unit 4, and the elevation plate 43 is lowered in the-Z direction along the guide rail 41. As a result, the grinding unit 3 supported by the elevating plate 43 via the holder 44 is lowered in the-Z direction, and the lower surface 340b of the grinding whetstone 340 abuts on the holding surface 500 of the chuck table 5 as shown in fig. 2 (a).
In a state where the lower surface 340b of the grinding whetstone 340 is in contact with the holding surface 500 of the chuck table 5, the grinding whetstone 340 is further pressed against the holding surface 500 of the chuck table 5 to grind the holding surface 500, thereby forming a flat 1 st surface 50A parallel to the XY plane as shown in fig. 2 (a).
(2 nd holding surface Forming step)
Next, the grinding wheel 340 is raised by the grinding feed unit 4, and the grinding wheel 340 is separated from the 1 st surface 50A. Then, the inclination of the 2 nd rotation shaft 55 is adjusted so that the inclination relationship between the 1 st rotation shaft 35 and the 2 nd rotation shaft 55 becomes the 2 nd inclination relationship. The 2 nd rotation shaft 55 is tilted in the-Y direction by using a tilt adjusting means (not shown), and for example, as shown in fig. 2 (b), the angle between the 1 st rotation shaft 35 and the 2 nd rotation shaft 55 is adjusted to θ 2(θ 2 ≠ 0).
In addition, an angle θ 2 formed between the 1 st rotation shaft 35 and the 2 nd rotation shaft 55 in the 2 nd inclination relationship is larger than an angle θ 1 formed between the 1 st rotation shaft 35 and the 2 nd rotation shaft 55 in the 1 st inclination relationship.
Then, while rotating the grinder 340 and the chuck table 5 about the 1 st rotation shaft 35 and the 2 nd rotation shaft 55, respectively, the grinder 340 is lowered by the grinding feed unit 4, and the lower surface 340b of the grinder 340 is brought into contact with the 1 st surface 50A constituting the holding surface 500 of the chuck table 5. At this time, as shown in fig. 2 (b), a gap is left between the center O of the 1 st surface 50A and the lower surface 340b of the grinder 340. In this state, the grinding wheel 340 is again pressed down in the-Z direction by the grinding feed unit 4, and the outer peripheral portion of the 1 st surface 50A is ground to form a 2 nd surface 50B.
At this time, as shown in fig. 2 (B), while grinding the 1 st surface 50A, for example, the height of the 2 nd surface 50B changed by the grinding is monitored by bringing the holding surface height gauge 61 into contact with the chuck table 5, whereby the 2 nd surface 50B can be ground to a predetermined height.
Further, grinding can be performed until the area of the 1 st surface 50A becomes a predetermined area. For example, the 1 st face 50A is ground to a circle having a diameter of 10 mm.
As described above, by grinding the holding surface 500, as shown in fig. 2 (c), the flat circular 1 st surface 50A is left at the center of the holding surface 500, and the 2 nd surface 50B is formed so as to extend between the radial direction of the circle of the 1 st surface and the-Z direction, and the 2 nd surface 50B is in the shape of a conical surface connected to the 1 st surface 50A or a side surface having a truncated cone.
Embodiment 2
(1 st holding surface formation step)
First, the chuck table 5 shown in fig. 1 is moved in the Y-axis direction by using a moving means in the Y-axis direction, which is not shown, and as shown in fig. 3 (a), the lower surface 340b of the grinding stone 340 is aligned so as to pass through the center O of the holding surface 500 of the chuck table 5.
Next, the chuck table 5 is tilted by using a tilt adjusting means not shown, and the tilt relationship between the 1 st rotation shaft 35 and the 2 nd rotation shaft 55 is adjusted to the 1 st tilt relationship. In embodiment 2, the 1 st inclination relationship is a relationship in which the 1 st rotation axis 35 and the 2 nd rotation axis 55 form a predetermined angle θ 3 different from 0 degrees, as shown in fig. 3 (a).
Then, as in embodiment 1, the grinding wheel 340 and the chuck table 5 are rotated about the 1 st rotation shaft 35 and the 2 nd rotation shaft 55, respectively. The grinding whetstone 340 is lowered in the-Z direction by using the grinding feed unit 4 in a state where the grinding whetstone 340 and the chuck table 5 are rotated. As a result, as shown in fig. 3 (a), the lower surface 340b of the grinding wheel 340 abuts against the holding surface 500 of the chuck table 5.
In a state where the lower surface 340b of the grinding whetstone 340 is in contact with the holding surface 500 of the chuck table 5, the grinding whetstone 340 is further pressed against the holding surface 500 of the chuck table 5 to grind the holding surface 500, and as shown in fig. 3 (a), a 1 st surface 50C of a conical shape having a center O of the holding surface 500 as a vertex is formed.
(2 nd holding surface Forming step)
Next, the grinding wheel 340 is raised by the grinding feed unit 4, and the grinding wheel 340 is separated from the 1 st surface 50C. Then, the chuck table 5 is tilted by a tilt adjusting means, not shown, so that the tilt relationship between the 1 st rotation shaft 35 and the 2 nd rotation shaft 55 becomes the 2 nd tilt relationship. At this time, as shown in fig. 3 (b), the angle θ 4 between the 1 st rotation axis 35 and the 2 nd rotation axis 55 is inclined so as to be larger than the angle θ 3 between the 1 st rotation axis 35 and the 2 nd rotation axis 55 in the 1 st inclination relationship.
Then, while the chuck table 5 and the grinding whetstone 340 are rotated about the 1 st rotation shaft 35 and the 2 nd rotation shaft 55, respectively, the grinding whetstone 340 is lowered by the grinding feed unit 4, and the lower surface 340b of the grinding whetstone 340 is brought into contact with the 1 st surface 50C of the chuck table 5. At this time, as shown in fig. 3 (b), a gap is left between the center O of the 1 st surface 50C and the lower surface 340b of the grindstone 340, and in this state, the grindstone 340 is pressed in the-Z direction to grind the outer peripheral portion of the 1 st surface 50C, thereby forming a 2 nd surface 50D.
In this case, as shown in fig. 3 (b), in the same manner as in embodiment 1, in the grinding of the 1 st surface 50C, for example, the holding surface height meter 61 is brought into contact with the 2 nd surface 50D, and the height of the 2 nd surface 50D changed by the grinding is monitored, whereby the grinding can be performed until the 2 nd surface 50D becomes a predetermined height.
Further, grinding can be performed until the area of the 1 st surface 50C becomes a predetermined area.
By grinding the holding surface 500 in this way, as shown in fig. 3 (C), the 1 st surface 50C having a conical surface shape is left at the center, and the 2 nd surface 50D having a shape of a side surface of a truncated cone connecting the 1 st surface 50C can be formed.
In the 1 st holding surface forming step, for example, as shown in fig. 4 (a), the 1 st surface 50E can be formed in a dome shape by tilting the chuck table 5 in the-Y direction to form the angle θ 3 between the 1 st rotation axis 35 and the 2 nd rotation axis 55, tilting the chuck table 5 in the X axis direction, and then grinding the holding surface 500 by bringing the grinding whetstone 340 into contact with the holding surface 500.
Then, as shown in fig. 4 (b), the chuck table 5 is further tilted in the-Y direction, the angle between the 1 st rotating shaft 35 and the 2 nd rotating shaft 55 is made θ 4 having an angle larger than θ 3, and thereafter, the holding surface 500 is ground again, whereby as shown in fig. 4 (c), the 2 nd surface 50F having a side surface shape of a truncated cone continuing to the dome-shaped 1 st surface 50E can be formed.
When the angle between the 1 st rotation axis 35 and the 2 nd rotation axis 55 is θ 4, the chuck table may be inclined in the X-axis direction.
As described above, by sequentially performing the 1 st holding surface forming step and the 2 nd holding surface forming step, the circular 1 st surface and the annular 2 nd surface can be formed. Thus, when the workpiece W is held on the 1 st surface and the 2 nd surface of the holding surface 500, a gap is not formed between the center O and the workpiece W, and the problem that the workpiece W located near the center of the holding surface 500 is excessively ground can be solved.
The method of forming the holding surface of the present invention is not limited to the method comprising the 1 st holding surface forming step and the 2 nd holding surface forming step as described above. That is, after the 2 nd surface is formed in the 2 nd holding surface forming step, for example, the chuck table 5 is further inclined so that the angle formed by the 1 st rotating shaft 35 and the 2 nd rotating shaft 55 becomes a third inclined relationship in which the angle is larger than the angle formed by the 1 st rotating shaft 35 and the 2 nd rotating shaft 55 in the 2 nd inclined relationship, and then the 2 nd surface is ground, whereby the 3 rd surface continuing to the outer periphery of the 2 nd surface can be formed. Similarly, a plurality of surfaces may be further formed as in the 4 th surface and the 5 th surface, and when the workpiece W is held, the gap between the holding surface 500 and the workpiece W can be more reliably prevented.

Claims (3)

1. A method of forming a holding surface by grinding a holding surface with a grinding wheel in a grinding device, wherein the grinding wheel is rotated around a center of a grinding wheel in which the grinding wheel is annularly arranged, the chuck table is rotated around a center of the holding surface of the chuck table for sucking and holding a workpiece, and the workpiece held on the holding surface is ground with the grinding wheel,
the method for forming the holding surface comprises the following steps:
a 1 st holding surface forming step of arranging a 1 st rotation axis passing through the center of the grinding wheel as an axis for rotating the grinding wheel and a 2 nd rotation axis passing through the center of the holding surface as an axis for rotating the chuck table in a 1 st inclined relationship of a predetermined angle, positioning the grinding wheel at a position passing through the center of the holding surface to grind the holding surface, and forming a circular 1 st surface at least at the center of the holding surface; and
a 2 nd holding surface forming step of arranging the 1 st rotation axis and the 2 nd rotation axis in a 2 nd inclination relation inclined at a larger angle than the 1 st inclination relation, grinding an outer peripheral portion of the holding surface by the grinding wheel, leaving the 1 st surface of a circular shape at a center of the holding surface, and forming a 2 nd surface of an annular shape as a side surface shape of a truncated cone connecting the 1 st surface,
The holding surface is formed by grinding the holding surface at least 2 times with the grinding stone under different inclination relationships.
2. The holding surface forming method according to claim 1,
in the 1 st holding surface forming step, the 1 st rotation axis and the 2 nd rotation axis are arranged in parallel, and the 1 st surface is formed as a flat surface.
3. The holding surface forming method according to claim 1,
in the 1 st holding surface forming step, the 1 st surface of the conical surface having the center of the holding surface as the apex is formed in the 1 st inclined relationship.
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