CN111834478A - Conductive core board and manufacturing method thereof - Google Patents

Conductive core board and manufacturing method thereof Download PDF

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Publication number
CN111834478A
CN111834478A CN202010413120.XA CN202010413120A CN111834478A CN 111834478 A CN111834478 A CN 111834478A CN 202010413120 A CN202010413120 A CN 202010413120A CN 111834478 A CN111834478 A CN 111834478A
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China
Prior art keywords
layer
conductive
battery
conductive core
copper
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CN202010413120.XA
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Inventor
张彩霞
陈影
孙明亮
吴仕梁
张凤鸣
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Jiangsu Sunport Power Corp Ltd
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Jiangsu Sunport Power Corp Ltd
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Priority to CN202010413120.XA priority Critical patent/CN111834478A/en
Publication of CN111834478A publication Critical patent/CN111834478A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/044—PV modules or arrays of single PV cells including bypass diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
  • Battery Mounting, Suspending (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

The invention discloses a conductive core board and a manufacturing method thereof, wherein the conductive core board is sequentially provided with an insulating material layer, a metal conductive circuit layer, a packaging adhesive film layer and a back board layer from top to bottom, and all the layers are bonded in a low-temperature heating mode; the metal conducting circuit layer and the packaging adhesive film layer are bonded in a compounding manner, and a conducting circuit pattern is arranged on the metal conducting circuit layer; the insulating material layer is provided with a plurality of small holes, and the positions of the small holes correspond to the positions of the electrode points on the battery piece; the conductive circuit pattern is based on a set unit pattern, and the unit pattern is arranged in an array above the battery piece. The conductive core board adopts a longitudinal base number series 13 × 12 half-cell arrangement mode to realize base number series cell arrangement, the number of the cells of the diode connecting tubes is equal, the installation direction of the junction box is parallel to the short edge of the assembly, the position of the junction box is the same as that of the junction box of the conventional assembly, the connection mode can be almost impossible to realize if the junction box is a welding strip assembly, and meanwhile, the equipment transformation cost can be effectively reduced.

Description

Conductive core board and manufacturing method thereof
Technical Field
The invention relates to the technical field of novel MWT solar cell production equipment, in particular to a conductive core board and a manufacturing method thereof.
Background
Solar photovoltaic modules are used more and more widely due to the characteristics of energy conservation, pollution reduction and the like. The MWT type back contact component is more and more widely used due to the characteristics of silver paste saving, high reliability and the like. In response to market trend development, the current photovoltaic industry component develops towards large area and large size, the MWT technology is no exception, and large area and large size components are continuously developed. The area of the battery piece is enlarged in the main direction of large size and large area, and high power can be realized by enlarging the number of the battery pieces in the other direction, so that the arrangement mode of the battery pieces is required to be innovated, the even number row direction is basically expanded in the industry, the battery position required to be placed in a diode is limited in a base row, and therefore, higher requirements on a battery interconnection current path are required, but the MWT technology is a conductive circuit PCB plate type design, so that the technical advantages are great in this respect, circuits can be flexibly designed, and the problems that other devices are input, an extra diode wiring pad bus belt in a component is added with an insulating layer and the like can be reduced.
The conventional photovoltaic modules are mostly in arrays of 6 × 10, 6 × 12 and 6 × 24 rows, in this case, the diodes are well wired, and due to the market moving to large-size modules, modules such as 8 × 10, 8 × 12 and 8 × 24 arrays can be designed, but if the actual situation is due to the accommodation space of the equipment, the situation of adding 2 rows of cells cannot be experimented. The 13 × 12 or 13 × 10 cell array is difficult to implement based on conventional soldering techniques, or the diode wiring requires a relatively long and thick insulating layer, and the process becomes extremely complicated, which limits the development and implementation of efficient devices.
Disclosure of Invention
In order to solve the problems in the background art, the invention aims to provide a conductive core plate and a manufacturing method thereof, which can reduce the equipment transformation cost compared with the conventional welding component for changing the arrangement mode of battery pieces, hardly increase additional production procedures, are easy to process, do not need equipment upgrading, are suitable for mass production, can improve the component power, realize a high-efficiency component of 450 watts, and fully exert the advantages of an MWT component.
The invention relates to a conductive core board, which is characterized in that an insulating material layer, a metal conductive circuit layer, a packaging adhesive film layer and a back board layer are sequentially arranged from top to bottom, and the layers are bonded in a low-temperature heating mode;
the metal conducting circuit layer and the packaging adhesive film layer are bonded in a compounding manner, and a conducting circuit pattern is arranged on the metal conducting circuit layer; the insulating material layer is provided with a plurality of small holes, and the positions of the small holes correspond to the positions of the electrode points on the battery piece; the conductive circuit pattern is based on a set unit pattern, and the unit pattern is arranged in an array above the battery piece.
Furthermore, the unit pattern is in a form that the circuit unit adopts a bell mouth unit and an open positive and negative electrode dividing unit.
Further, the unit pattern is a circuit structure of a half cell, the unit pattern is arranged in a positive direction in a transverse direction, and the unit pattern is repeated along the transverse direction and the longitudinal direction of the conductive core board. Adjacent half cells are connected in series in sequence.
Preferably, the back plate is a polymer plate, the metal conductive circuit layer is a copper-aluminum foil layer or a copper foil layer, the packaging adhesive film layer is an EVA (ethylene vinyl acetate) layer or a POE (polyolefin elastomer) layer, and the insulating material layer is an EPE (expanded polyethylene) layer.
And the positions of the diode pipelines are reserved in the middle of the conductive unit lines of the two rows of battery strings, and the conductive copper foil wires of the diodes are inserted.
Furthermore, if the anode and cathode points of the battery are not on the same straight line, the anode and cathode points are arranged in a staggered longitudinal and transverse mode.
The invention also provides a manufacturing method of the conductive core board, which comprises the following steps:
manufacturing a metal conductive circuit layer by adopting a copper foil or copper-aluminum foil material, compounding the copper foil or copper-aluminum foil with the same width with a packaging adhesive film layer, scribing by using a solid laser, and etching a specific conductive circuit pattern on the copper foil or copper-aluminum foil coated with an adhesive film;
removing the etched copper foil or copper aluminum foil to form a specific conductive channel and an insulation channel, namely a conductive circuit pattern;
punching a plurality of small holes on the insulating material layer, wherein the positions of the holes correspond to the positions of electrode points on the battery pieces, and isolating a passage between the battery pieces and the conductive core plate;
and stacking the manufactured insulating material layer, the metal conducting circuit layer, the packaging adhesive film layer and the back plate layer in sequence from top to bottom, and bonding the insulating material layer, the metal conducting circuit layer, the packaging adhesive film layer and the back plate layer together in a low-temperature heating mode, so that the conductive core plate is manufactured.
Preferably, if a copper aluminum foil is used as the material of the metal conductive circuit layer, an ultrasonic welding process is added, and a soldering lug is welded on the electrode point so that the component can be welded.
Further, the conducting circuit pattern is based on a set unit pattern, and the unit pattern is arranged on the cell in a square array mode;
the diode pipeline is inserted in a mode that a diode pipeline position is reserved in the middle of the conductive unit circuit of the two rows of battery strings, and a diode conductive copper foil wire is inserted to distinguish the diode pipeline from a traditional welding assembly, the diode pipeline is inserted in a mode that on the batteries formed by the 3 paths of 52 batteries, one half of the batteries 13 x 6 and the other half of the batteries 13 x 6 are connected in a mode of sharing three diodes, one diode is responsible for two half of the batteries, namely 2 x 26 batteries, and the total number of the batteries is 3 x 52.
Has the advantages that:
1. the invention adopts a longitudinal base number series 13 × 12 half-cut cell arrangement mode to realize base number series cell arrangement, the number of the diode connecting tube cells is equal, the installation direction of the junction box is parallel to the short edge of the assembly, and the position of the junction box is the same as that of the junction box of the conventional assembly, and the connection mode can not be realized if the welding strip assembly is adopted.
2. The invention is applicable to the whole assembly of different cell sizes 158, 162, 166, 210 and the like, and different assembly models 13 x 12, 13 x 10 and the like.
3. The junction box is still arranged in the center of the assembly with the short sides parallel to each other, and the position of the junction box is the same as that of a conventional half main flow assembly, so that the equipment transformation investment and transformation time are reduced, and the mass production can be directly realized.
4. The conductive unit design of the invention can realize the micro-adjustment of the number of the positive electrodes of the battery piece and is compatible with the situation that the positive electrodes and the negative electrodes are also compatible with the staggered array condition in the same row.
Drawings
FIG. 1 is a schematic structural diagram of an electrically conductive core board according to the present invention;
FIG. 2 is a diagram of a conductive pattern layout of the conductive core of the present invention;
FIG. 3 is an electronic circuit diagram of an electrically conductive core plate in example 1 of the present invention;
FIG. 4 is a schematic plan view of a conductive core of the present invention;
FIG. 5 is an enlarged view of a portion of the conductive pattern of the inventive conductive core;
FIG. 6 is an electronic circuit diagram of an electrically conductive core plate in example 2 of the present invention;
FIG. 7 is a schematic diagram of the cell arrangement in inventive example 2;
in the figure, 1-an insulating material layer, 2-a metal conducting circuit layer, 3-a packaging adhesive film layer, 4-a back plate layer, 5-a positive electrode and 6-a negative electrode.
Detailed Description
The invention is described in detail below with reference to the accompanying drawings:
example 1
The invention relates to a conductive core board, which is characterized in that an insulating material layer 1, a metal conductive circuit layer 2, a packaging adhesive film layer 3 and a back board layer 4 are sequentially arranged from top to bottom, and all the layers are bonded in a low-temperature heating mode;
the metal conducting circuit layer 2 and the packaging adhesive film layer 3 are bonded in a compounding manner, and a conducting circuit pattern is arranged on the metal conducting circuit layer 2; a plurality of small holes are arranged on the insulating material layer 1, and the positions of the holes correspond to the positions of electrode points on the battery piece; the conductive circuit pattern is based on a set unit pattern, and the unit pattern is arranged in an array above the battery piece.
Further, the unit pattern is in a form that the line unit adopts a bell-mouthed unit and an open dividing unit of the positive electrode and the negative electrode 6.
Further, the unit pattern is a circuit structure of a half cell, the unit pattern is arranged in a positive direction in a transverse direction, and the unit pattern is repeated along the transverse direction and the longitudinal direction of the conductive core board. Adjacent half cells are connected in series in sequence.
Preferably, the backplate is a polymer board, the metal conductive circuit layer 2 is a copper aluminum foil layer or a copper foil layer, the encapsulation adhesive film layer 3EVA layer or POE layer, the insulating material layer 1 is an EPE layer.
And the positions of the diode pipelines are reserved in the middle of the conductive unit lines of the two rows of battery strings, and the conductive copper foil wires of the diodes are inserted.
Furthermore, if the positions of the positive and negative electrodes 6 of the battery are not on the same straight line, the battery is arranged in a staggered longitudinal and transverse mode.
According to the invention, an innovative battery interconnection mode is adopted, for example, a conductive circuit unit is shown in fig. 5, under the condition that the battery pieces are arranged in a longitudinal and transverse square matrix array, the circuit unit adopts a form of a bell-mouth unit and an open positive and negative electrode 6 dividing unit, through the circuit design shown in fig. 5, the series connection of adjacent battery pieces in the longitudinal direction and the transverse direction can be realized, and the battery series connection is realized in the assembly according to the current trend required.
The invention adopts the insertion mode of the conductive circuit diode pipeline of figure 3, the insertion mode of the diode pipeline is that the diode pipeline is connected to the battery formed by 3 paths of 52 batteries according to one third of the total number of the batteries, one half of the diode is 13 × 6 and the other half of the diode is 13 × 6, the diode shares three diodes, one diode is responsible for two half of the batteries, namely 2 × 26 batteries, and the total number of the batteries is 3 × 52, and the insertion mode corresponds to the insertion mode shown in figure 3. The position of a diode pipeline is reserved in the middle of the conductive unit lines of the two rows of battery strings, and a diode conductive copper foil wire is inserted, so that the diode pipeline is different from a traditional welding assembly. The positions and the number of the diode-connected cells of the traditional component are more limited by the arrangement of the cells, the arrangement of a 13 × 12 square matrix is shown in fig. 5, one half is 13 × 6, and the arrangement of the cells is shown in fig. 7. By adopting a half-cell design, the components are completely symmetrical up and down, the arrangement of the half components 13 x 6 is totally 78 half cells, each diode is connected with the circuit of 3 paths of 52 cells, the voltage drop of each diode is equal after the diode is started, the current mismatch or hot spot problem of the cells is avoided, and the risk of diode damage is reduced (the other cells are analogized in the same way). Ordered, series, even-numbered rows are well established in the industry. The invention is a basic number row, which realizes the interconnection of batteries and the connection of the batteries into a diode.
The outgoing line of the conducting circuit design is positioned in the center of the short side of the component in parallel, and the three-part junction boxes are symmetrically distributed. The invention adopts a longitudinal base number series 13 × 12 half-cut cell arrangement mode to realize base number series cell arrangement, the number of the diode connecting tube cells is equal, the installation direction of the junction box is parallel to the short edge of the assembly, and the position of the junction box is the same as that of the junction box of the conventional assembly, and the connection mode can not be realized if the welding strip assembly is adopted.
The conductive core plate structure is suitable for the whole-piece assembly of different cell specifications 158, 162, 166, 210 and the like, and different assembly models 13 x 12, 13 x 10 and the like.
Example 2
The invention also provides a manufacturing method of the conductive core board, which comprises the following steps:
a copper foil or a copper-aluminum foil material is adopted to manufacture a metal conductive circuit layer 2, the copper foil or the copper-aluminum foil with the same width is taken to be compounded with a packaging adhesive film layer 3, a solid laser is used for scribing, and a specific conductive circuit pattern is etched on the copper foil or the copper-aluminum foil covered with an adhesive film;
removing the etched copper foil or copper aluminum foil to form a specific conductive channel and an insulation channel, namely a conductive circuit pattern;
punching a plurality of small holes on the insulating material layer 1, wherein the positions of the holes correspond to the positions of electrode points on the battery pieces, and isolating a passage between the battery pieces and the conductive core plate;
and stacking the manufactured insulating material layer 1, the metal conducting circuit layer 2, the packaging adhesive film layer 3 and the back plate layer 4 in sequence from top to bottom, and bonding the layers together in a low-temperature heating mode, so that the conductive core plate is manufactured.
The conductive core plate structure provided by the invention is shown in figure 1, the structure comprises an insulating material layer 1, a metal conductive circuit layer 2, a packaging adhesive film layer 3 and a back plate layer 4 from top to bottom in sequence, and the manufacturing method comprises the following steps:
compounding copper foils (copper aluminum foils) with the same width and adhesive films (EVA or POE), scribing by using a solid laser, etching a specific conductive circuit pattern (as shown in figure 2) on the copper foil coated with the adhesive films, tearing off the copper foil at the black line part in the pattern after etching to form a specific conductive channel, and forming an insulating channel at the torn black line part; punching a plurality of small holes on the insulating layer (EPE), wherein the positions of the holes correspond to the positions of electrode points on the cell pieces, and isolating a passage between the cell pieces and the conductive core plate; stacking the manufactured insulating layer, copper foil (copper aluminum foil), adhesive film and back plate from top to bottom in sequence, and bonding the insulating layer, the copper foil (copper aluminum foil), the adhesive film and the back plate together in a low-temperature heating mode, so that the conductive core plate is manufactured; if the ultrasonic welding procedure is added to the copper aluminum foil, the welding sheet is welded on the electrode point, so that the component can be welded. The back sheet of the present invention uses a polymer sheet.
As a preference, if a copper aluminum foil is used as the material of the metal conductive circuit layer 2, an ultrasonic welding process is added to weld the soldering lug on the electrode spot so that the component can be welded.
Further, the conducting circuit pattern is based on a set unit pattern, and the unit pattern is arranged on the cell in a square array mode;
the diode pipeline is inserted in a mode that a diode pipeline position is reserved in the middle of the conductive unit circuit of the two rows of battery strings, and a diode conductive copper foil wire is inserted to distinguish the diode pipeline from a traditional welding assembly, the diode pipeline is inserted in a mode that on the batteries formed by the 3 rows of 52 batteries, one half of the batteries 13 x 6 and the other half of the batteries 13 x 6 are connected in a mode that the batteries share three diodes, and one diode is responsible for two and a half of 2 x 26 batteries, namely 3 x 52 batteries.
The conductive unit design of the invention can realize the micro adjustment of the number of the positive electrodes of the battery piece, and is compatible with the array situation that the positive electrodes and the negative electrodes are compatible with each other and staggered in the same row, for example, the 5-point positive electrode is changed from 3-point of one current battery to 4-point or 5-point (for example, the number of the electrode points of the battery at the two sides of the insulated wire in fig. 5 can be adjusted according to the power and the reliability of the component).
If the positions of the positive and negative electrodes 6 of the battery are not on the same straight line, the invention adopts staggered longitudinal and transverse arrangement, and the other conducting circuit design method is as shown in figure 6.
The invention is connected into a finished product drawing of a conductive core plate for a 13-12 component as shown in figure 4, and similarly, the components connected with 13-10 cells, 13-12 cells and 13-14 cells in an arrangement mode can be realized. Similar innovations are also applicable to other radix column arrangements, and the invention does not repeat the list, but is within the scope of the invention.
According to the invention, copper foils with the same width (1100-1200 mm) are compounded with EVA, the EVA is arranged below the copper foil, and the copper foil is arranged above the copper foil with the smooth surface upward during compounding; a solid laser is used for scribing, a specific conductive circuit pattern (as shown in figure 2) is etched on the copper foil compounded with the EVA, the copper foil at the black line part in the pattern is torn off after etching, a specific conductive channel is formed, an insulation channel is formed at the torn black line part, and the insulation channel is 1-4 mm; and (3) punching a plurality of small holes with the diameter of 2-6mm on the EPE by using a carbon dioxide laser, wherein the positions of the holes correspond to the positions of electrode points on the cell pieces, and finally, stacking the prepared EPE, copper foil, EVA and back plate in sequence from top to bottom, and bonding the EPE, the copper foil, the EVA and the back plate together in a low-temperature heating mode, so that the conductive core plate is prepared.
The invention uses copper aluminum foil with the same width (1100-; carrying out scribing by using a solid laser, etching a specific conductive circuit pattern (as shown in figure 2) on the copper aluminum foil compounded with the EVA, tearing off the copper aluminum foil at the black line part in the pattern after etching to form a specific conductive channel, and forming an insulating channel at the torn black line part, wherein the insulating channel is 1-4 mm; and then welding small soldering lugs on the aluminum surface at the electrode point part, wherein the aluminum surface is in contact with the aluminum surface, and the copper surface face towards two sides so as to facilitate welding of a lead-out wire at the assembly end. And then, punching a plurality of small holes with the diameter of 2-6mm on the EPE by using a carbon dioxide laser, wherein the positions of the small holes correspond to the positions of electrode points on the cell pieces, finally, stacking the prepared EPE, copper aluminum foil, POE and back plate from top to bottom in sequence (the copper surface faces towards the EPE side, and the aluminum surface faces towards the back plate side), and bonding the EPE, copper aluminum foil, POE and back plate together in a low-temperature heating mode, so that the conductive core plate is prepared.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, and the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (9)

1. A conductive core board is characterized in that the conductive core board is sequentially provided with an insulating material layer, a metal conductive circuit layer, a packaging adhesive film layer and a back board layer from top to bottom, and all the layers are bonded in a low-temperature heating mode;
the metal conducting circuit layer and the packaging adhesive film layer are bonded in a compounding manner, and a conducting circuit pattern is arranged on the metal conducting circuit layer; the insulating material layer is provided with a plurality of small holes, and the positions of the small holes correspond to the positions of the electrode points on the battery piece; the conductive circuit pattern is based on a set unit pattern, and the unit patterns are arranged in a square array mode.
2. The conductive core board of claim 1, wherein the unit pattern is in the form of a line unit in a bell-mouth structure and a positive-negative open-divided unit.
3. The conductive core board of claim 2, wherein the unit pattern is a line structure of half cells, the unit pattern is repeated in the transverse and longitudinal directions of the conductive core board with the transverse direction of the unit pattern being a forward direction.
4. Adjacent half cells are connected in series in sequence.
5. The conductive core board of claim 1, wherein the back board is a polymer board, the metal conductive circuit layer is a copper-aluminum foil layer or a copper foil layer, the encapsulating adhesive film layer is an EVA layer or a POE layer, and the insulating material layer is an EPE layer;
and the positions of the diode pipelines are reserved in the middle of the conductive unit lines of the two rows of battery strings, and the conductive copper foil wires of the diodes are inserted.
6. The conductive core board of claim 1, wherein if the positive and negative electrode points of the battery are not aligned, the battery is arranged in a staggered vertical and horizontal manner.
7. The method of manufacturing an electrically conductive core board according to claim 1, comprising the steps of:
manufacturing a metal conductive circuit layer by adopting a copper foil or copper-aluminum foil material, compounding the copper foil or copper-aluminum foil with the same width with a packaging adhesive film layer, scribing by using a solid laser, and etching a specific conductive circuit pattern on the copper foil or copper-aluminum foil coated with an adhesive film;
removing the etched copper foil or copper aluminum foil to form a specific conductive channel and an insulation channel, namely a conductive circuit pattern;
punching a plurality of small holes on the insulating material layer, wherein the positions of the holes correspond to the positions of electrode points on the battery pieces, and isolating a passage between the battery pieces and the conductive core plate;
and stacking the manufactured insulating material layer, the metal conducting circuit layer, the packaging adhesive film layer and the back plate layer in sequence from top to bottom, and bonding the insulating material layer, the metal conducting circuit layer, the packaging adhesive film layer and the back plate layer together in a low-temperature heating mode, so that the conductive core plate is manufactured.
8. The method of claim 6, wherein if a copper-aluminum foil is used as the material of the metal conductive circuit layer, an ultrasonic welding process is added to weld the soldering lug on the electrode point so that the component can be welded.
9. The method of claim 6, wherein the conductive circuit pattern is based on a predetermined unit pattern, and the unit pattern is arranged in a square matrix array on the battery plate;
the insertion mode of the diode pipeline is that a diode conductive copper foil wire is inserted by reserving a diode pipeline position in the middle of conductive unit lines of two rows of battery strings, the insertion mode of the diode pipeline is that on a battery formed by 3 paths of 52 batteries, one half of the battery is connected according to one third of the total number of the batteries, 13X 6 and the other half of the battery is connected according to one third of the total number of the batteries, three diodes are shared, and one diode is responsible for two half of the number of the batteries, namely 2X 26 batteries, and the total number of the batteries is 3X 52.
CN202010413120.XA 2020-05-15 2020-05-15 Conductive core board and manufacturing method thereof Pending CN111834478A (en)

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