CN111215684A - Ultra-thin gold-tin solder cutting device - Google Patents
Ultra-thin gold-tin solder cutting device Download PDFInfo
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- CN111215684A CN111215684A CN202010058635.2A CN202010058635A CN111215684A CN 111215684 A CN111215684 A CN 111215684A CN 202010058635 A CN202010058635 A CN 202010058635A CN 111215684 A CN111215684 A CN 111215684A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D15/00—Shearing machines or shearing devices cutting by blades which move parallel to themselves
- B23D15/04—Shearing machines or shearing devices cutting by blades which move parallel to themselves having only one moving blade
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D33/00—Accessories for shearing machines or shearing devices
- B23D33/02—Arrangements for holding, guiding, and/or feeding work during the operation
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Abstract
The invention provides an ultrathin gold-tin solder cutting device, which belongs to the technical field of solder cutting and comprises a fixed rack, a raw material assembly, a feeding assembly and a cutter assembly, wherein the raw material assembly comprises a solder wheel for winding solder and a wheel bracket for supporting the solder wheel; the feeding assembly comprises a transverse moving mechanism and a longitudinal moving mechanism for driving the transverse moving mechanism to move longitudinally, the longitudinal moving mechanism is arranged on the fixed rack, the wheel bracket is arranged on the transverse moving mechanism or a sliding block of the longitudinal moving mechanism, and the transverse moving mechanism is used for conveying the solder wound on the solder wheel; the cutter assembly is used for cutting the welding flux conveyed to the cutter assembly. The ultrathin gold-tin solder cutting device provided by the invention has the advantages of high cutting efficiency, time and labor saving, high size precision of the cut solder and good size consistency of the solder.
Description
Technical Field
The invention belongs to the technical field of solder cutting, and particularly relates to an ultrathin gold-tin solder cutting device.
Background
In mass production, the gold-tin solder for high-end soldering needs to be customized to various required sizes, but in small-batch and multi-variety production, the raw material of the gold-tin solder is usually a strip-shaped ultra-thin (0.001inch, namely 0.001 inch) coiled material, and when the gold-tin solder is actually used for product soldering, the gold-tin solder is cut into various sizes. At present, all the general cutting methods are manual cutting, have the defects of low efficiency, inaccurate size, high danger and the like, and can not cut soldering lugs with small sizes (such as 0.1mm multiplied by 0.1 mm).
Disclosure of Invention
The invention aims to provide an ultra-thin gold-tin solder cutting device, and aims to solve the problems of low efficiency and inaccurate cutting size of the existing manual cutting mode.
In order to achieve the purpose, the invention adopts the technical scheme that: the ultra-thin gold-tin solder cutting device comprises a fixed rack, a raw material assembly, a feeding assembly and a cutter assembly, wherein the raw material assembly comprises a solder wheel for winding solder and a wheel bracket for supporting the solder wheel; the feeding assembly comprises a transverse moving mechanism and a longitudinal moving mechanism for driving the transverse moving mechanism to move longitudinally, the longitudinal moving mechanism is arranged on the fixed rack, the wheel bracket is mounted on the transverse moving mechanism or a sliding block of the longitudinal moving mechanism, and the transverse moving mechanism is used for conveying the solder wound on the solder wheel; the cutter assembly is used for cutting the welding flux conveyed to the cutter assembly.
As another embodiment of the present application, the cutter assembly includes: the welding device comprises a linear actuating element, an upper blade, a pressing plate, a lower blade and a blade platform, wherein the upper blade is fixedly connected with the linear actuating element and used for realizing reciprocating linear motion along with the linear actuating element, and a cutter used for cutting solder is arranged on the upper blade; the pressing plate is connected with the upper cutting edge through an elastic guide element and used for pressing solder along with the up-and-down movement of the upper cutting edge, and a through hole for the cutter to pass through is formed in the pressing plate; the lower cutting edge is positioned below the pressing plate, and a punching hole which is used for the cutter to penetrate through and is in sliding fit with the cutter is formed in the lower cutting edge; the cutting edge platform is arranged on the fixed rack and used for supporting the lower cutting edge.
As another embodiment of the present application, the elastic guide member includes: one end of the sliding column is fixedly connected with the upper cutting edge, the other end of the sliding column penetrates through the pressing plate to be connected with the lower cutting edge in a sliding mode, a guide hole for the sliding column to penetrate through is formed in the pressing plate, and a limiting part for stopping the pressing plate is arranged at one end, close to the lower cutting edge, of the sliding column; the first spring is sleeved on the sliding column and is positioned between the upper cutting edge and the pressing plate.
As another embodiment of the present application, the cutter assembly further comprises an upper connection plate fixedly connected with the linear actuator, and the upper blade is connected to a lower surface of the upper connection plate.
As another embodiment of this application, the cutter unit spare still includes set up in the lower connecting plate on the cutting edge platform, the cutting edge sets up down on the connecting plate.
As another embodiment of the application, a material leaking hole for the cut solder to pass through is arranged below the lower connecting plate and opposite to the punched hole.
As another embodiment of the application, the cutting edge platform comprises two supporting plates which are vertically arranged on the fixed rack, the two supporting plates are parallel to each other, two ends of the lower connecting plate are lapped on the supporting plates, and the material leaking hole is formed between the two supporting plates.
As another embodiment of the present application, the lateral movement mechanism includes: the guide groove is connected with a sliding block of the longitudinal moving mechanism, the center line of the guide groove in the width direction is coplanar with the center line of the solder wheel in the width direction, and the width of the guide groove is larger than that of the solder; the friction wheel is rotatably installed in the guide groove, the center line of the friction wheel is perpendicular to the conveying direction of the solder, and the solder is tangent to the friction wheel; the driving motor is installed outside the guide groove and is in driving connection with the friction wheel, the driving motor drives the friction wheel to rotate, and under the driving of the driving motor, the solder is conveyed to the cutter assembly through the friction force between the solder and the friction wheel.
As another embodiment of the present application, the lateral moving mechanism further includes an extrusion wheel and a compression screw, the extrusion wheel is mounted in the guide groove by means of a wheel shaft and is located right below the friction wheel, a center line of the extrusion wheel is parallel to a center line of the friction wheel, a slot wall of the guide groove is provided with a long hole for the wheel shaft to pass through, and a length direction of the long hole is perpendicular to a transfer direction of the solder; and the compression screw penetrates upwards through a threaded hole formed in the groove wall of the guide groove from the groove bottom of the guide groove, abuts against the wheel shaft and is used for enabling the extrusion wheel to be in close contact with the friction wheel.
As another embodiment of the application, the ultra-thin gold-tin solder cutting device further comprises a touch screen and a programmable controller, wherein the touch screen is installed on the fixed rack; the programmable controller is electrically connected with the touch screen, and the transverse moving mechanism, the longitudinal moving mechanism and the cutter assembly are electrically connected with the programmable controller.
The ultrathin gold-tin solder cutting device provided by the invention has the beneficial effects that: compared with the prior art, the ultrathin gold-tin solder cutting device has the advantages that the longitudinal moving mechanism drives the transverse moving mechanism to move the solder to the cutting position, the transverse moving mechanism conveys the solder to the cutter assembly, the position of the solder is adjusted by adopting a mechanical mode, the cutter assembly cuts the solder into the proper solder, the cutting efficiency is high, the time and the labor are saved, the size precision of the cut solder is high, the size consistency of the solder is good, and the ultrathin gold-tin solder cutting device is particularly suitable for cutting the ultrathin gold-tin solder.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic perspective view of an ultra-thin au-sn solder trimming apparatus according to an embodiment of the present invention;
fig. 2 is a schematic perspective view of a second embodiment of an ultra-thin au-sn solder trimming apparatus according to the present invention;
FIG. 3 is a schematic perspective view of the longitudinal shifting mechanism shown in FIG. 2;
FIG. 4 is a schematic perspective view of the material assembly shown in FIG. 2;
FIG. 5 is a schematic top view of the lateral shifting mechanism shown in FIG. 2;
FIG. 6 is a sectional view taken along line A-A of FIG. 5;
FIG. 7 is a first perspective view of the lateral shifting mechanism shown in FIG. 2;
FIG. 8 is a second schematic top view of the lateral shifting mechanism shown in FIG. 2;
FIG. 9 is a schematic view of the internal perspective of the lateral shifting mechanism shown in FIG. 8;
FIG. 10 is a schematic view of the cutter assembly shown in FIG. 2;
FIG. 11 is a schematic view of the slide bar of the cutter assembly shown in FIG. 10;
FIG. 12 is a schematic bottom view of the lower blade and lower web of the cutter assembly of FIG. 10;
FIG. 13 is a schematic view of the construction of the lower web of the cutter assembly shown in FIG. 10;
FIG. 14 is a schematic view of a solder trimming configuration;
fig. 15 is a partial enlarged view at B in fig. 14.
In the figure: 1. a touch screen; 2. a fixed rack; 3. a longitudinal movement mechanism; 31. a first drive motor; 32. a slide rail; 33. a slider; 4. a programmable controller; 5. a cutter assembly; 51. a linear actuator; 52. an adapter plate; 53. an upper connecting plate; 54. an upper blade; 541. a cutter; 55. pressing a plate; 56. a lower blade; 561. punching; 57. a lower connecting plate; 571. a material leaking hole; 58. a blade table; 59. a traveler; 591. a first spring; 592. a limiting member; 6. a lateral movement mechanism; 61. a guide groove; 62. a second drive motor; 63. a friction wheel; 64. an extrusion wheel; 65. locking the screw; 66. a second spring; 67. a wheel axle; 68. a strip hole; 7. a feedstock component; 71. a solder wheel; 72. an annular groove; 73. a wheel support; 8. and (3) soldering.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and fig. 2, the ultra-thin au-sn solder trimming apparatus provided by the present invention will now be described. The ultra-thin gold-tin solder cutting device comprises a fixed rack 2, a raw material assembly 7, a feeding assembly and a cutter assembly 5, wherein the raw material assembly 7 comprises a solder wheel 71 for winding solder 8 and a wheel bracket 73 for supporting the solder wheel 71; the feeding assembly comprises a transverse moving mechanism 6 and a longitudinal moving mechanism 3 for driving the transverse moving mechanism 6 to move longitudinally, the longitudinal moving mechanism 3 is arranged on the fixed rack 2, the wheel bracket 73 is arranged on the transverse moving mechanism 6 or a slide block of the longitudinal moving mechanism 3, and the transverse moving mechanism 6 is used for conveying the solder 8 wound on the solder wheel 71; the cutter assembly 5 is used to trim the solder 8 delivered to the cutter assembly 5.
Compared with the prior art, the ultrathin gold-tin solder cutting device provided by the invention has the advantages that the longitudinal moving mechanism 3 drives the transverse moving mechanism 6 to move the solder 8 to the cutting position, the transverse moving mechanism 6 conveys the solder 8 to the cutter assembly 5, the position of the solder 8 is adjusted by adopting a mechanical mode, the cutter assembly 5 cuts the solder 8 into proper solder, the cutting efficiency is high, the time and the labor are saved, the size precision of the cut solder is high, and the size consistency of the solder is good. This embodiment cuts through mechanical system, has also avoided the artifical hidden danger that causes the injury that cuts. The ultrathin gold-tin solder cutting device provided by the invention is not only suitable for cutting ultrathin gold-tin solder, but also suitable for cutting other types of solder.
In the embodiment, referring to fig. 4, the solder wheel 71 is provided with an annular groove 72 for winding the solder 8, so as to protect and limit the solder 8; the wheel carriage 73 is connected to the slider of the longitudinal movement mechanism 3 and moves in accordance with the movement of the slider.
In this embodiment, referring to fig. 3, the longitudinal moving mechanism 3 includes a slide rail 32, a slide block 33 slidably engaged with the slide rail 32, and a first driving motor 31 for driving the slide block 33 to slide.
Referring to fig. 1 to 2 and 10 to 13, the cutting blade assembly 5 includes: the welding device comprises a linear actuator 51, an upper blade 54, a pressure plate 55, a lower blade and a blade platform 58, wherein the upper blade 54 is fixedly connected with the linear actuator 51 and used for realizing reciprocating linear motion along with the linear actuator 51, and a cutter 541 for cutting solder is arranged on the upper blade 54; the pressing plate 55 is connected with the upper cutting edge 54 through an elastic guide element and is used for pressing the solder 8 along with the up-and-down movement of the upper cutting edge 54, and a through hole for the cutter 541 to pass through is formed in the pressing plate 55; the lower cutting edge is positioned below the pressing plate 55, and a punched hole which is used for the cutter 541 to penetrate through and is in sliding fit with the cutter 541 is formed in the lower cutting edge; a blade table 58 is provided on the stationary gantry 2 for supporting the lower blade.
In this embodiment, the upper blade 54 is driven by the linear actuator 51 to perform a linear reciprocating motion, when the solder 8 is fed onto the lower blade, the linear actuator 51 drives the upper blade 54 and the pressing plate 55 to move downward, the pressing plate 55 contacts with the solder 8 first, the linear actuator 51 continues to operate, the pressing plate 55 presses the solder 8, at this time, the linear actuator 51 continues to perform a downward motion, the pressing plate 55 presses the lower blade to press the solder 8, the cutter 541 continues to move downward due to the action of the elastic element and extends into a punch hole below, so as to cut the solder 8, and then the linear actuator 51 performs an upward motion to drive the upper blade 54, the cutter 541 and the pressing plate 55 to leave the lower blade, so as to complete a cutting motion, and continue to repeat feeding and cutting motions, thereby completing a required blanking process. In this embodiment, since the thickness of the solder 8 is very thin, a structure for preventing damage to the solder 8 needs to be additionally provided, and an elastic member is provided between the upper blade 54 and the pressing plate 55, which functions as; firstly, the pressure plate 55 is limited when moving upwards; secondly, the action of pressing the solder 8 by moving the pressing plate 55 downwards is buffered, namely the solder 8 is prevented from being crushed by the pressing plate 55 through an elastic element; thirdly, the pressing plate 55 is pressed tightly; fourthly, when the upper blade 54 continues to move downwards to cut the solder 8, the upper blade 54 is buffered, and the damage to the solder 8 during cutting is avoided.
In this embodiment, referring to fig. 12 and 13, and fig. 14 and 15, the cross section of the cutting blade 541 is a square structure, and four corners of the cutting blade 541 can be used as base points, so that the service life of the cutting blade 541 is prolonged, and the service life of the cutting blade 541 is prolonged. Correspondingly, a punching hole in sliding fit with the cutter 541 is arranged on the lower cutting edge, and the punching hole is a square hole.
The invention utilizes the principle of sheet punching, takes one corner of the square cutter 541 as a base point, and takes two adjacent edges as cutting edges, so that the solder can be cut in any size within the size range smaller than the square punching size, only the feeding amount needs to be accurately controlled, and the problem of cutting various solders in small batch is better solved.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 10 to 11, the elastic guiding element includes: a sliding column 59 and a first spring 591, wherein one end of the sliding column 59 is fixedly connected with the upper cutting edge 54, the other end of the sliding column 59 penetrates through the pressure plate 55 to be slidably connected with the lower cutting edge, a guide hole for the sliding column 59 to penetrate through is arranged on the pressure plate 55, and a limit piece 592 for stopping the pressure plate 55 is arranged at one end of the sliding column 59 close to the lower cutting edge; a first spring 591 is fitted over the spool 59 and is located between the upper blade 54 and the pressure plate 55. In operation, the spool 59 moves downward with the upper blade 54, guiding the pressure plate 55. Specifically, a guide hole through which the slide post 59 slides up and down is also provided in the lower blade.
In this embodiment, referring to fig. 10 and 11, the lower end of the sliding column 59 is also provided with a limiting member 592 to prevent the sliding column 59 from coming out of the guiding hole of the lower blade. The position-limiting member 592 is a snap spring, and may also be a nut or a cotter pin.
Furthermore, referring to fig. 11, four sliding columns 59 are provided, and the four sliding columns 59 are arranged in a square structure, so that the stability and reliability of the movement of the upper blade 54 are improved.
Referring to fig. 10, as a specific implementation manner of the embodiment of the present invention, the cutter assembly 5 further includes an upper connection plate 53 fixedly connected to the linear actuator 51, and the upper blade 54 is connected to a lower surface of the upper connection plate 53. The upper end of the sliding column 59 is provided with a limiting circular truncated cone, the upper cutting edge 54 is provided with a counter bore, the limiting circular truncated cone is recessed in the counter bore, the upper end of the sliding column 59 is limited through the upper connecting plate 53, the sliding column 59 sequentially penetrates through the upper cutting edge 54, the pressing plate 55 and the lower cutting edge during installation, and the installation and the disassembly are convenient.
In an embodiment, referring to fig. 10, the telescopic rod of the linear actuator 51 is provided with an adapter plate 52, and the upper connecting plate 53 is connected to the adapter plate 52 by bolts.
The linear actuator 51 may be one of a cylinder, an electric push rod, and a hydraulic telescopic cylinder.
Referring to fig. 10, as a specific implementation manner of the embodiment of the present invention, the cutter assembly 5 further includes a lower connection plate 57 disposed on the cutting edge platform 58, and the lower cutting edge is disposed on the lower connection plate 57. The lower connecting plate 57 supports the lower blade. The sliding column 59 penetrates through the lower connecting plate 57, and specifically, guide holes through which the sliding column 59 penetrates are formed in the lower connecting plate 57 and the lower blade. The aforementioned stopper 592 is disposed below the lower connecting plate 57, and connects the lower end of the strut 59 to the lower connecting plate 57.
Referring to fig. 10, 12 and 13, as a specific implementation manner of the embodiment of the present invention, a material leaking hole 571 for passing the cut solder is arranged on the lower connecting plate 57 under the punched hole. The cut solder can fall down from the punched hole through the drain hole 571, and then collected. In this embodiment, the material leaking hole 571 may be a circular hole, a square hole or a polygonal hole, and the inner wall of the material leaking hole does not protrude from the inner wall of the punched hole, so as to ensure that the cut solder leaks.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 10, the cutting edge platform 58 includes two support plates vertically disposed on the fixed rack 2, the two support plates are parallel to each other, two ends of the lower connecting plate 57 are overlapped on the support plates, and the material leaking hole 571 is located between the two support plates. Specifically, a receiving tray is arranged below the leakage hole 571, and the cut solder falls into the receiving tray below and is taken away after being filled.
As a specific implementation of the embodiment of the present invention, referring to fig. 5 to 9, the lateral moving mechanism 6 includes: a guide groove 61, a friction wheel 63 and a second driving motor 62, wherein the guide groove 61 is connected with a slide block of the longitudinal moving mechanism 3, the center line of the width direction of the guide groove 61 is coplanar with the center line of the width direction of the welding material wheel 71, and the width of the guide groove 61 is larger than the width of the welding material 8; a friction wheel 63 is rotatably arranged in the guide groove 61, the central line of the friction wheel 63 is vertical to the conveying direction of the welding flux 8, and the welding flux 8 is tangential to the friction wheel 63; the second driving motor 62 is installed outside the guide groove 61 and is in driving connection with the friction wheel 63, the second driving motor 62 drives the friction wheel 63 to rotate, and the solder 8 is conveyed to the cutter assembly 5 by the friction force between the second driving motor 62 and the friction wheel 63. In this embodiment, the longitudinal moving mechanism 3 drives the transverse moving mechanism 6 to adjust the position of the solder 8, so that the center line of the solder 8 in the length direction and the center of the punching or cutting knife are in the same plane, the friction wheel 63 is driven by the driving motor to drive the solder 8 to move forward, and the length of the solder 8 moving forward is controlled by controlling the rotating speed of the driving motor, so as to control the feeding precision. In this embodiment, the driving motor is a stepping motor, and the micron-sized feeding precision can be achieved by controlling the stepping motor. The solder 8 moves forward along the guide groove 61, so that the solder 8 can be prevented from deviating, and the position accuracy can be improved.
In this embodiment, the friction wheel 63 is made of Polyurethane, or the friction wheel 63 is wrapped with Polyurethane around its outer circumference, and the abbreviation of Polyurethane is PU, also known as Polyurethane, which is called Polyurethane for short in chinese. By using the friction wheel 63 made of polyurethane, physical properties such as different densities, elasticity, rigidity and the like can be obtained only by simply modifying the formula, and the ultrathin gold-tin solder cannot be damaged.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 6 and 9, the lateral moving mechanism 6 further includes a pressing wheel 64 and a pressing screw, the pressing wheel 64 is installed in the guide groove 61 via a wheel shaft 67 and is located right below the friction wheel 63, a center line of the pressing wheel 64 is parallel to a center line of the friction wheel 63, a long hole 68 for the wheel shaft 67 to pass through is provided on a groove wall of the guide groove 61, and a length direction of the long hole 68 is perpendicular to a conveying direction of the solder 8; the compression screw penetrates through a threaded hole formed in the groove wall of the guide groove 61 upwards from the groove bottom of the guide groove 61, abuts against the wheel shaft 67, and is used for enabling the extrusion wheel 64 to be in close contact with the friction wheel 63. In the present embodiment, the pressing wheel 64 is provided, and the friction wheel 63 is pressed by the pressing wheel 64 to always maintain sufficient contact with the solder 8, thereby improving the reliability of the solder 8 transfer. Wherein the pressing wheel 64 can be moved upward to be in full contact with the friction wheel 63 by the provision of the elongated hole 68.
In this embodiment, referring to fig. 9, the threaded hole communicates with the lower end of the elongated hole 68, and the adjustment operation is simple and convenient by using a compression screw.
In this embodiment, referring to fig. 9, a second spring 66 is further disposed in the threaded hole, the locking screw 65 presses the second spring 66, the second spring 66 elastically presses the axle 67 of the pressing wheel 64, and the second spring 66 is disposed to provide a certain buffer between the pressing wheel 64 and the friction wheel 63, so as to prevent damage to the ultra-thin solder 8.
As a specific implementation manner of the embodiment of the invention, referring to fig. 1 and fig. 2, the ultra-thin gold-tin solder cutting device further includes a touch screen 1 and a programmable controller 4, wherein the touch screen 1 is mounted on the fixed rack 2; the programmable controller 4 is electrically connected with the touch screen 1, and the transverse moving mechanism 6, the longitudinal moving mechanism 3 and the cutter assembly 5 are electrically connected with the programmable controller 4. The touch screen 1 is used for setting parameters, inputting commands and the like, and the PLC 4 is used for controlling the motion of a driving motor and the action of an air cylinder. In this embodiment, the programmable controller is of siemens 7-300 series, mitsubishi fx series, or the like, and may be of any other type.
The cutting process of the invention is as follows:
after starting up, the system is reset, the transverse moving mechanism in the X direction returns to the zero position, so that the right edge of the welding flux is just aligned with the edge in the X direction of the cutting edge, the longitudinal moving mechanism in the Y direction advances, so that the front edge of the welding flux is just aligned with the edge in the Y direction of the cutting edge, then the upper cutting edge moves downwards, trial cutting is carried out, and the resetting is finished.
The direction in which the transverse moving mechanism 6 advances is set to be the X direction, and the direction in which the longitudinal moving mechanism 3 moves is set to be the Y direction.
When cutting is performed, the size (length a, width b) and the number (n) of the solder to be cut are set on the touch screen 1, and the system starts to work by clicking a 'start' button.
Referring to fig. 14 and 15, firstly, the advancing length a of the transverse moving mechanism 6 is set, then the moving width b of the longitudinal moving mechanism 3 is set, after the transverse moving mechanism is in place, the upper cutting edge 54 moves downwards, the pressing plate 55 contacts with the solder, the solder is firmly pressed above the lower cutting edge, then the upper cutting edge 54 continues to move downwards until the exposed solder is cut off, the cut solder directly leaks to a receiving tray below from a material leakage hole 571, the upper cutting edge 54 resets, blanking of one solder is completed, the previous feeding and blanking operations are continuously repeated until the set number n is completed, and the whole blanking process is completed.
Referring to fig. 14 and 15, the invention utilizes the principle of sheet punching, takes one corner of the square punched hole as a base point, and takes two adjacent edges as cutting edges, so that the solder can be cut in any size within the range smaller than the size of the square punched hole, only the feeding amount needs to be accurately controlled, and the problem of cutting various solders in small batches is better solved.
In this embodiment, the cross section of cutter is square structure, and it also is the direction structure to punch a hole, and the symmetry design for four angles that square punched a hole all can regard as the basic point, and the actual life of cutter is four times of ordinary cutter structure, has prolonged the cutter greatly and has used the maintenance cycle.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. Ultra-thin gold tin solder cutting device, its characterized in that includes:
a fixed rack;
a raw material assembly including a solder wheel for winding solder and a wheel support for supporting the solder wheel;
the feeding assembly comprises a transverse moving mechanism and a longitudinal moving mechanism for driving the transverse moving mechanism to move longitudinally, the longitudinal moving mechanism is arranged on the fixed rack, the wheel bracket is mounted on the transverse moving mechanism or a sliding block of the longitudinal moving mechanism, and the transverse moving mechanism is used for conveying the solder wound on the solder wheel; and
and the cutter assembly is used for cutting the solder conveyed to the cutter assembly.
2. The ultra-thin gold-tin solder trimming apparatus of claim 1, wherein the cutter assembly comprises:
a linear actuator;
the upper cutting edge is fixedly connected with the linear actuating element and used for realizing reciprocating linear motion along with the linear actuating element, and a cutter used for cutting the solder is arranged on the upper cutting edge;
the pressing plate is connected with the upper cutting edge through an elastic guide element and used for pressing solder along with the up-and-down movement of the upper cutting edge, and a through hole for the cutter to pass through is formed in the pressing plate;
the lower cutting edge is positioned below the pressing plate, and a punched hole which is used for the cutter to penetrate through and is in sliding fit with the cutter is formed in the lower cutting edge; and
and the cutting edge table is arranged on the fixed rack and used for supporting the lower cutting edge.
3. The ultra-thin gold-tin solder trimming apparatus of claim 2, wherein the resilient guide element comprises:
one end of the sliding column is fixedly connected with the upper cutting edge, the other end of the sliding column penetrates through the pressing plate to be connected with the lower cutting edge in a sliding mode, a guide hole for the sliding column to penetrate through is formed in the pressing plate, and a limiting part for stopping the pressing plate is arranged at one end, close to the lower cutting edge, of the sliding column; and
and the first spring is sleeved on the sliding column and is positioned between the upper cutting edge and the pressing plate.
4. The ultra-thin au-sn solder trimming apparatus of claim 2, wherein the cutter assembly further comprises an upper attachment plate fixedly attached to the linear actuator, the upper blade being attached to a lower surface of the upper attachment plate.
5. The ultra-thin gold-tin solder trimming apparatus of claim 3, wherein the cutter assembly further comprises a lower web disposed on the blade table, the lower blade being disposed on the lower web.
6. The ultra-thin Au-Sn solder trimming apparatus according to claim 5, wherein a material leaking hole for the solder to be trimmed to pass through is formed in the lower connecting plate under the punched hole.
7. The ultra-thin Au-Sn solder cutting apparatus of claim 6, wherein the blade platform comprises two support plates vertically arranged on the fixed rack, the two support plates are parallel to each other, two ends of the lower connecting plate are overlapped on the support plates, and the material leaking hole is positioned between the two support plates.
8. The ultra-thin gold-tin solder trimming apparatus of claim 1, wherein the lateral movement mechanism comprises:
the guide groove is connected with the sliding block of the longitudinal moving mechanism, the center line of the guide groove in the width direction is coplanar with the center line of the solder wheel in the width direction, and the width of the guide groove is larger than that of the solder;
the friction wheel is rotatably arranged in the guide groove, the central line of the friction wheel is vertical to the conveying direction of the solder, and the solder is tangent to the friction wheel; and
and the driving motor is arranged outside the guide groove and is in driving connection with the friction wheel, the driving motor drives the friction wheel to rotate, and the solder is conveyed to the cutter assembly through the friction force between the solder and the friction wheel under the driving of the driving motor.
9. The ultra-thin gold-tin solder trimming apparatus of claim 8, wherein the lateral movement mechanism further comprises:
the extrusion wheel is arranged in the guide groove by means of a wheel shaft and is positioned right below the friction wheel, the center line of the extrusion wheel is parallel to the center line of the friction wheel, a long hole for the wheel shaft to pass through is formed in the wall of the guide groove, and the length direction of the long hole is perpendicular to the conveying direction of the welding flux; and
and the compression screw penetrates upwards through a threaded hole formed in the groove wall of the guide groove from the groove bottom of the guide groove, abuts against the wheel shaft and is used for enabling the extrusion wheel to be in close contact with the friction wheel.
10. The ultra-thin au-sn-solder trimming apparatus of claim 1, further comprising:
the touch screen is arranged on the fixed rack; and
and the transverse moving mechanism, the longitudinal moving mechanism and the cutter assembly are electrically connected with the programmable controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010058635.2A CN111215684A (en) | 2020-01-19 | 2020-01-19 | Ultra-thin gold-tin solder cutting device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010058635.2A CN111215684A (en) | 2020-01-19 | 2020-01-19 | Ultra-thin gold-tin solder cutting device |
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| CN111215684A true CN111215684A (en) | 2020-06-02 |
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| CN202010058635.2A Pending CN111215684A (en) | 2020-01-19 | 2020-01-19 | Ultra-thin gold-tin solder cutting device |
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| CN (1) | CN111215684A (en) |
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