CN110370099B - Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding - Google Patents

Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding Download PDF

Info

Publication number
CN110370099B
CN110370099B CN201910462798.4A CN201910462798A CN110370099B CN 110370099 B CN110370099 B CN 110370099B CN 201910462798 A CN201910462798 A CN 201910462798A CN 110370099 B CN110370099 B CN 110370099B
Authority
CN
China
Prior art keywords
nickel alloy
magnetic
iron
abrasive particles
tool head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910462798.4A
Other languages
Chinese (zh)
Other versions
CN110370099A (en
Inventor
赵军
黄金锋
王睿
吕经国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang University of Technology ZJUT
Original Assignee
Zhejiang University of Technology ZJUT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang University of Technology ZJUT filed Critical Zhejiang University of Technology ZJUT
Priority to CN201910462798.4A priority Critical patent/CN110370099B/en
Publication of CN110370099A publication Critical patent/CN110370099A/en
Application granted granted Critical
Publication of CN110370099B publication Critical patent/CN110370099B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/20Drives or gearings; Equipment therefor relating to feed movement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/22Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The invention discloses a method for processing a micro-hemispherical concave die array by combining rotary ultrasonic processing and magnetic grinding. A strong rotating magnetic field is generated at the front end of the tool head through the conductive coil winding, and the rotating device drives the ultrasonic tool head to rotate horizontally at a high speed. The magnetic field is restrained at the front end of the tool head through the high-magnetic-conductivity material iron-nickel alloy sphere, the magnetic abrasive particles are adsorbed on the surface of the iron-nickel alloy sphere by strong magnetism, the tool head receives given frequency and amplitude to drive the iron-nickel alloy sphere restrained at the front end to vibrate at high speed and high frequency, the magnetic abrasive particles are excited to be emitted out to impact a substrate material, and the material is removed through the mechanical impact, shearing, polishing and grinding of the magnetic abrasive particles on the substrate material and the multi-stage polishing and polishing action of the magnetic abrasive particles on the substrate material driven by the iron-nickel alloy sphere rotating at high speed, so that the micro-hemispherical concave die array with ideal geometric properties is obtained. The invention can rapidly prepare the hemispherical female die with high shape precision and high surface quality in batches.

Description

Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding
Technical Field
The invention relates to the field of ultra-precision machining, in particular to a method for machining a micro-hemispherical concave die array by combining rotary ultrasonic machining with magnetic grinding.
Background
A Hemispherical Resonator Gyro (HRG) is an angular motion detection device that is made by using the coriolis effect generated by a Hemispherical Resonator during high-frequency vibration. The HRG is different from the principle that the momentum moment changes the space position when the mechanical rotor rotates at a high speed, so that the size of the gyroscope can be greatly reduced, and the HRG has strong impact resistance. The micro-hemispherical resonator gyroscope (mu HRG) technology prepared by combining with an MEMS (micro electro mechanical system) technology is widely applied to space flight, air defense and military industry, and is a key component for stable control of the inertia measurement unit and the attitude of flying units such as missiles, aircrafts and the like.
Currently, high precision and high quality HRG is mainly monopolized by the united states, france and russia. Because the quality factor of the hemispherical resonator gyroscope has high requirements on the geometric and physical precision of the oscillator, the existing HRG harmonic oscillator manufacturing method is to firstly obtain a hemispherical concave die with high rotation precision and high surface quality, then deposit a hemispherical cavity on the surface of the concave die by using various deposition methods, and finally realize the assembly of the harmonic oscillator through a series of process steps. The difficulty of the prior art lies in obtaining a hemispherical female die with high rotation precision and high surface quality, and the international traditional processing method for processing the hemispherical female die on a hard and brittle material mainly comprises the following steps: micro-electrical spark machining, high energy beam machining, ultrasonic machining, and the like.
Micro Electro Discharge Machining (EDM) is a method of etching a material by utilizing an electric erosion phenomenon of high intensity spark Discharge between two electrodes. High energy beam machining, such as laser machining, commonly used, uses the generated high temperature to melt and gasify the surface of the non-metallic brittle material with explosion to achieve the purpose of removing the material. Traditional ultrasonic machining is also called suspended abrasive particle ultrasonic impact machining, and materials are mechanically removed by utilizing ultrasonic high-energy impact abrasive particles. The defects that the semi-spherical concave die is fatal when being processed are overcome, the micro-spark machining efficiency is low, and better shape precision is difficult to obtain; laser machining also concentrates thermal stress on the material, producing cracks and thermal distortion, affecting the precision of the machined shape and the surface quality. In ultrasonic machining, a tool head is seriously worn, the machining efficiency is low, and the machining surface is always cracked when a hard and brittle material is machined, so that the quality of the machined surface is seriously influenced.
Disclosure of Invention
The method for processing the micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding can overcome the defects of the traditional micro-processing, and can efficiently prepare the hemispherical concave die array with higher surface quality and higher shape precision in batches.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for processing a micro-hemispherical concave die array by combining rotary ultrasonic processing and magnetic grinding comprises a grinding and polishing die platform, wherein the grinding and polishing die platform comprises: the ultrasonic wave generator comprises a transducer, a rotary ultrasonic magnetic tool head, a coating iron-nickel alloy ball body and a workpiece;
the high-speed rotating magnetic field is generated at the front end of the tool head through the conductive coil winding, the rotating device drives the ultrasonic tool head to rotate horizontally at a high speed, the magnetic field is constrained at the front end of the tool head by the iron-nickel alloy ball body made of high-permeability materials, magnetic abrasive particles are adsorbed on the surface of the iron-nickel alloy ball body by strong magnetism, the tool head receives given frequency and amplitude to drive the iron-nickel alloy ball body constrained at the front end to vibrate at a high speed and a high frequency, the magnetic abrasive particles are excited to be emitted out to impact a workpiece material, and the material is removed through mechanical impact, shearing, polishing and grinding of the magnetic abrasive particles on a substrate material and cavitation of a machining liquid, so that.
Furthermore, the strong magnetic field generated by the coil winding is confined in the iron-nickel alloy sphere by using a soft magnetic material, and the iron-nickel alloy sphere generates strong magnetism to adsorb magnetic abrasive particles on the surface, so that the iron-nickel alloy sphere is coated with the magnetic abrasive particles.
Furthermore, a detachable rotary tool head is used, a coil winding in the rotary device drives the amplitude transformer to rotate on a horizontal base surface, and meanwhile, the amplitude transformer of the axial limiting device stabilizing rotary device does not shake in the vertical direction except for ultrasonic vibration.
Furthermore, the iron-nickel alloy sphere is a sphere with the surface of the soft magnetic material deposited with the superhard wear-resistant ceramic material through CVD.
Furthermore, the magnetic abrasive particles are distributed in a circumferential manner in the rotating magnetic field, and the rotating direction of the iron-nickel alloy sphere is consistent with the circumferential direction. The hemispherical concave die with better roundness and surface quality can be obtained.
Furthermore, an industrial camera is arranged beside the tool head, the industrial camera captures the position of the iron-nickel alloy ball at the front end of the tool head, when the Z-direction sliding table drives the iron-nickel alloy ball at the front end of the tool head to reach 1mm above the surface of a workpiece, the control center transmits a signal to control the Z-axis motor to stop feeding downwards, and the tool head reaches the processing position. Meanwhile, the excitation coil winding on the tool head is electrified under the control of the control center to generate a strong magnetic field to adsorb the magnetic abrasive particles dripped on the substrate material.
Furthermore, the ultrasonic tool head reaching the processing position rotates at a certain speed, and the amplitude transformer drives the iron-nickel alloy sphere at the front end of the tool head to rotate and perform ultrasonic vibration at the same time, so that magnetic abrasive particles are excited to impact the substrate material, and the removal of the material of the micro-hemispherical female die is realized along with ultrasonic cavitation, shearing and hammering of the magnetic abrasive particles. With the micro downward feeding of the secondary precision platform, the machining of the hemispherical female die is gradually realized.
Furthermore, the industrial camera captures the position of the iron-nickel alloy ball, stops feeding of the secondary platform, and simultaneously reduces the amplitude of the frequency of the ultrasonic generator, so that the brittle failure at the former stage with the high processing speed is converted into the plastic processing at the later stage with the low processing speed. The former stage overcomes the defect of low ultrasonic processing speed, realizes the rough processing of the substrate material and obtains a hemispherical concave die with certain shape precision but poor surface quality. The fine machining of the hemispherical female die is realized at the later stage, the surface damage to the hard and brittle material (monocrystalline silicon) in the machining process can be obviously reduced by utilizing the principle of brittle material plastic machining under the condition of trace removal amount, and the number and scale of cracks are reduced, so that better surface roughness is obtained.
Furthermore, the rotary ultrasonic magnetic tool head can rotate radially at a high speed while being vibrated ultrasonically, and under the combined action of two directions, scraps can be timely removed, the machined surface is prevented from being scratched by the scraps, and the machining efficiency and the machining precision are improved. Meanwhile, due to the rotary motion in ultrasonic processing, the micro-hemispherical concave die can be ensured to have better roundness
Furthermore, the iron-nickel alloy sphere is made of soft magnetic materials (iron-nickel alloy, iron-silicon alloy, iron-cobalt alloy and the like) and the surface of the soft magnetic materials is plated or CVD deposited with the superhard wear-resistant ceramic materials. Can restrain strong magnetic field and is not easy to be worn by magnetic abrasive particles. The magnetic abrasive particles are composite phase abrasive particles formed by a ferromagnetic consolidation hard phase, can be magnetized and can be applied with a strong enough magnetic field force, and a plurality of hard particle particles are scattered on the surface of the magnetic abrasive particles to be used as a shearing grinding phase.
Further, the hardness of the iron-nickel alloy sphere coating is greater than the hardness of the magnetic abrasive particles is greater than the hardness of the substrate material.
By adopting the technical scheme of the invention, the invention has the beneficial effects that: compared with the prior art, the method has the advantages that the distribution of magnetic abrasive particles is controlled by the strong magnetic field generated by the coil winding, so that the magnetic abrasive particles are attached to the surface of the iron-nickel alloy sphere, the precision and the quality of ultrasonic processing are improved, the hierarchical multi-domain controllability is realized by controlling the rotating speed and the ultrasonic frequency of the tool head, the processing time is shortened, and the quality of the processed surface is improved. The method has great significance for batch manufacturing of the hemispherical harmonic oscillators and reduction of manufacturing cost.
Drawings
Fig. 1 is a structural diagram of an ultrasonic polishing experiment table provided by the invention.
Fig. 2 is a block diagram of a rotary ultrasonic tool head set according to the present invention.
FIG. 3 is a schematic diagram of a batch preparation method of micro-hemispherical shells by chemical-ultrasonic removal method according to the present invention.
FIG. 4 is a schematic diagram of the preparation of the polishing solution provided by the present invention.
Detailed Description
Specific embodiments of the present invention will be further described with reference to the accompanying drawings.
As shown in the figure, the rotary ultrasonic machining combines the magnetic grinding to prepare the device of the micro-hemisphere female die array, the grinding and polishing die platform comprises a Z-direction feeding sliding table 1, a marble frame 2, an X-direction feeding sliding table 3, a grinding and polishing die base 4, a control center (a common PC) 5, a Z-direction precise secondary platform 6, a tool head group 7, an industrial camera 8, a horizontal working table 9, a y-direction feeding sliding table 10 and an ultrasonic generating device 11. The tool head group 7 comprises a tool head clamp 7-1, and the rotary ultrasonic magnetic tool head 7-2 can be divided into a transducer 12-1, a rotating device 12-2, an amplitude transformer 12-3, a magnetic field device 12-4, a positioning substrate 13-2 and an iron-nickel alloy sphere 12-5.
Z is to feeding slip table 1 through the top central authorities of bolt fastening in marble frame 2, and Z can realize Z to the rapid feed to feeding slip table 1, and Z is to second grade precision platform 6 through fix with screw on Z is to feeding slip table 1, can realize accurate second grade Z to feeding along with Z to feeding slip table 1 removal in, mainly be responsible for feeding man-hour, and its precision can reach 1 mu m, guarantees the machining precision. The tool head clamp 7-1 is fixed on the Z-direction secondary precision platform 6 by a screw, and the ultrasonic tool head 7-2 is fixed with the tool head clamp 7-1 by a step and a screw. The ultrasonic tool head 7-2 comprises a transducer 12-1, a rotating device 12-2, a variable amplitude rod 12-3, a magnetic field device 12-4 and an iron-nickel alloy sphere 12-5. The transducer 12-1 receives high-frequency current pulses from the ultrasonic generating device 11, and the high-frequency current pulses and the amplitude transformer 12-3 act together to convert the current pulses into high-frequency mechanical vibration to drive the rotating device 12-2, the fixed substrate 13-2 and the iron-nickel alloy sphere 12-5 which are fixedly connected on the amplitude transformer 12-3 to vibrate longitudinally at high frequency. The amplitude transformer 12-3 and the transducer 12-1 are indirectly connected through the rotating device 12-2, so that the ultrasonic vibration conduction can be ensured and the rotating motion can be realized at the same time. The fixing substrate 13-2 is provided with a smooth through hole, the size of the through hole is slightly smaller than that of the iron-nickel alloy sphere 12-5, the iron-nickel alloy sphere 12-5 can be embedded into the fixing substrate 13-2, a bonding agent is filled between the fixing substrate 13-2 and the iron-nickel alloy sphere 12-5, and the iron-nickel alloy sphere 12-5 is fixed at the front end of the rotary ultrasonic magnetic tool head 7-2.
The positioning substrate 13-1 is provided with a smooth through hole, the size of the through hole is slightly smaller than that of the iron-nickel alloy sphere 12-5, the iron-nickel alloy sphere 12-5 can be embedded into the positioning substrate 13-1, an adhesive is filled between the positioning substrate 13-1 and the iron-nickel alloy sphere 12-5, and the iron-nickel alloy sphere 12-5 is fixed at the front end of the amplitude transformer 12-3. When the iron-nickel alloy spheres 12-5 are fixed, the rotary tool head 7-2 is fixed firstly and then is embedded into the positioning substrate 13-1 which is fully coated with the adhesive, and then the rotary tool head is fed downwards to the working platform 1 through adjusting Z direction until all the iron-nickel alloy spheres 12-5 contact the marble leveling device 13-3, the marble leveling device 13-3 is installed on the horizontal working platform 9, and the tool head assembly with the complete and consistent levelness is obtained after the adhesive is solidified. (error of vertical distance of contact point on lower surface of each iron-nickel alloy sphere is <3 μm).
The processing principle is as shown in a schematic diagram of a rotary ultrasonic processing combined with magnetic grinding processing micro-hemispherical concave die array in fig. 4, a magnetic device 12-4 is arranged at the front end of an amplitude transformer 13-1, an excitation coil winding 13-4 is arranged in the magnetic device, a fixed substrate 13-1 is fixed on the magnetic device 12-4 through a screw, a strong rotary magnetic field can be generated after the excitation coil 12-4 is electrified, the magnetic field is restrained at the front end of a tool head through a high-magnetic-conductivity material iron-nickel alloy sphere 12-5, and magnetic abrasive particles 13-2 are strongly adsorbed on the surface of the iron-nickel alloy sphere 12-5. Because the amplitude transformer 12-3 drives the iron-nickel alloy sphere to do high-frequency vibration and high-speed rotation motion, the iron-nickel alloy sphere 12-5 which is vibrated at high frequency impacts the adsorbed magnetic abrasive particles 13-2 and excites the magnetic abrasive particles, and materials are removed by utilizing the mechanical impact, shearing, polishing and grinding of the magnetic abrasive particles 13-2 on the workpiece 13-5, the cavitation phenomenon of processing liquid and the polishing and grinding effect of the iron-nickel alloy sphere which rotates at high speed to drive the magnetic abrasive particles 13-2 on the workpiece.
The iron-nickel alloy sphere 12-5 is a sphere of soft magnetic materials (iron-nickel alloy, iron-silicon alloy, iron-cobalt alloy and the like) with the surface CVD deposited with the superhard wear-resistant ceramic material. The strong magnetic field generated by the coil winding is confined in the iron-nickel alloy sphere by using a soft magnetic material, and the iron-nickel alloy sphere generates strong magnetism to adsorb magnetic abrasive particles on the surface, so that the iron-nickel alloy sphere is coated by the magnetic abrasive particles. Can restrain strong magnetic field and is not easy to be worn by magnetic abrasive particles. The magnetic abrasive grains are composite phase abrasive grains formed by a ferromagnetic consolidation hard phase, can be magnetized and subjected to a strong magnetic field force, and a plurality of hard particle grains are scattered on the surface of the composite phase abrasive grains to serve as a shearing grinding phase. Because the requirement of the hemispherical concave die on the roughness of the circular warp direction is far greater than the roughness of the circular weft direction in the deposition process of the hemispherical cavity, the magnetic abrasive particles are distributed circumferentially in the rotating magnetic field, the cutting damage in the warp direction can be greatly reduced, and the deposition quality of the hemispherical concave die is improved.
The problem of abrasion generated in the machining process of the iron-nickel alloy sphere 12-5 at the front end of the tool head is not solved, a ceramic material with high hardness and high wear resistance is used as the material of the iron-nickel alloy sphere, and a MOHS ceramic coating with specific hardness is a workpiece with MOHS magnetic abrasive grains and MOHS abrasive grains.
The method comprises the following steps of,
the ultrasonic generator generates current pulses which are transmitted to the transducer 12-1, which converts the high frequency electrical pulses into high frequency vibrations with a frequency of 20kHz to 50kHz and an amplitude of 20 μm to 50 μm. The energy of the abrasive particles is controlled through amplitude and frequency, and brittle failure with a high processing speed in the previous stage is realized.
Transmitted to the amplitude transformer 12-3 to drive the iron-nickel alloy sphere 12-5 fixed at the front end of the tool head to vibrate at high frequency. Meanwhile, the rotating device 12-2 drives the amplitude transformer 12-3 to rotate at a high speed, so that the rotary ultrasonic magnetic tool head 7-2 rotates at a high speed while performing high-frequency ultrasonic oscillation.
The industrial camera 8 captures the distance between the iron-nickel alloy ball 11-2 at the front end of the tool head group 7 and the workpiece surface 13-5, and transmits the distance to the control center 5, the control center 5 controls the Z-direction work sliding table to feed downwards, and when the iron-nickel alloy ball 11-2 reaches 1-2mm above the workpiece surface 13-5, the Z-direction work sliding table 1 stops feeding. At the moment, the excitation coil winding 13-4 on the magnetic field device 12-4 is electrified under the control of the control center to generate a strong magnetic field, the control center 5 controls the secondary precise working platform 6 to move downwards in a micro-feeding mode (10 mu m/s), the iron-nickel alloy sphere 12-5 with the strong magnetic field adsorbs and drips the magnetic abrasive particles 13-2 on the surface 13-5 of the workpiece, and simultaneously the high-frequency vibrating iron-nickel alloy sphere 12-5 excites the magnetic abrasive particles adsorbed on the surface of the iron-nickel alloy sphere to mechanically impact, shear, polish and grind the substrate material, the cavitation phenomenon of the processing liquid and the polishing effect of the abrasive particles on the substrate material driven by the high-speed rotating iron-nickel alloy sphere 12-5 to remove the material.
Through a multi-domain controllable method of ultrasonic processing, the electric pulse of the ultrasonic generating device 11 is controlled through the control center 5, so that the amplitude of the rotary ultrasonic magnetic tool head is 1-4 mu m, the frequency is 6-10 kHz, the specific amplitude depends on the mass of an emission sphere and the average grain diameter, mass and hardness of abrasive grains, the brittle failure with a high processing rate at the former stage is realized, and the plastic processing with a low processing rate at the latter stage is realized. The former stage overcomes the disadvantage of slow ultrasonic processing speed, realizes rough processing of substrate materials, and obtains a hemispherical concave die with shaping precision but poor surface quality. The later stage realizes the fine machining of the hemispherical female die, and by utilizing the principle of brittle material plastic processing, the surface damage, the chipping and the like of the hard and brittle material (workpiece) in the machining process can be obviously reduced under the condition of trace removal amount, the number and the scale of cracks are reduced, and better surface roughness is obtained.
When the industrial camera 8 catches that the iron-nickel alloy sphere 12-5 reaches the machining end position, the control center 5 controls the feeding stop and simultaneously closes ultrasonic oscillation of the tool head 7-2, the magnetic abrasive particles 13-2 are driven by means of rotation to remove flexible materials on the surface 13-6 of the tool, the surface roughness (Sa <20nm) of the surface of the hemispherical concave die is further reduced through multi-stage grinding, and finally the control center controls the precise secondary platform to ascend to complete machining of the hemispherical concave die array.
The surface roughness of the part processed by the method and the surface roughness of the traditional electric spark processed part are compared as shown in Table 1, and the surface quality of the hemispherical concave die processed by the micro-ultrasonic processing method under the Fenton effect is far better than that of the hemispherical concave die processed by the micro-electric spark processing method.
Figure BDA0002078555270000081
TABLE 1
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions without departing from the scope of the invention. Therefore, although the present invention has been described in more detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (5)

1. A method for processing a micro-hemispherical concave die array by combining rotary ultrasonic processing and magnetic grinding is characterized in that: including grinding and polishing the mould platform, grind and polish the mould platform and include: the ultrasonic wave generator comprises a transducer, a variable amplitude rod, a positioning substrate, a plated iron-nickel alloy ball and a workpiece, wherein;
generating a strong rotating magnetic field at the front end of a tool head through a conductive coil winding, driving an ultrasonic tool head to rotate horizontally at a high speed by a rotating device, constraining the magnetic field at the front end of the tool head through a coating iron-nickel alloy sphere, adsorbing magnetic abrasive particles on the surface of the coating iron-nickel alloy sphere by strong magnetism, receiving given frequency and amplitude by the tool head to drive the coating iron-nickel alloy sphere constrained at the front end to vibrate at a high speed and a high frequency, exciting the magnetic abrasive particles to emit the magnetic abrasive particles to impact a workpiece material, and removing the material through mechanical impact, shearing, polishing and grinding of the magnetic abrasive particles on a substrate material and cavitation of a processing liquid to obtain a micro-hemispherical female die array;
the plating layer iron-nickel alloy sphere is a sphere with the surface of the soft magnetic material deposited with the superhard wear-resistant ceramic material through CVD.
2. The method for machining the micro-hemispherical concave die array by combining rotary ultrasonic machining and magnetic grinding according to claim 1, wherein a soft magnetic material is used for restraining a strong magnetic field generated by a coil winding inside a plated iron-nickel alloy sphere, the plated iron-nickel alloy sphere generates strong magnetism to adsorb magnetic abrasive particles on the surface, and the magnetic abrasive particles cover the plated iron-nickel alloy sphere.
3. The method for processing the micro-hemispherical concave die array by combining the rotary ultrasonic processing and the magnetic grinding as claimed in claim 1, wherein a detachable rotary tool head is used, a coil winding in a rotating device drives a horn to rotate on a horizontal base surface, and an axial limiting device stabilizes the horn of the rotating device from shaking in the vertical direction except for ultrasonic vibration.
4. The method of claim 1, wherein the magnetic abrasive particles are circumferentially distributed in a rotating magnetic field, and the rotation direction of the coated iron-nickel alloy sphere is consistent with the circumferential direction.
5. The method of claim 1, wherein the hardness of the coated iron-nickel alloy spheres is greater than the hardness of the magnetic abrasive particles is greater than the hardness of the substrate material.
CN201910462798.4A 2019-05-30 2019-05-30 Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding Active CN110370099B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910462798.4A CN110370099B (en) 2019-05-30 2019-05-30 Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910462798.4A CN110370099B (en) 2019-05-30 2019-05-30 Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding

Publications (2)

Publication Number Publication Date
CN110370099A CN110370099A (en) 2019-10-25
CN110370099B true CN110370099B (en) 2021-01-29

Family

ID=68248803

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910462798.4A Active CN110370099B (en) 2019-05-30 2019-05-30 Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding

Country Status (1)

Country Link
CN (1) CN110370099B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111215970B (en) * 2020-01-24 2021-05-14 北京理工大学 Ultrasonic cavitation assisted ultrasonic magnetic polishing method for microstructure mold
CN112025486B (en) * 2020-08-25 2022-04-15 镤伟科技(深圳)有限公司 Numerical control full-automatic machine tool special for cam
CN115401530B (en) * 2022-08-30 2023-08-01 大连理工大学 Shape-controlled flexible polishing method for microarray die
CN115464472B (en) * 2022-10-14 2023-06-23 大连理工大学 Equipment and process method for hub die with shape surface self-adaptive ultrasonic chemical mechanical polishing

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048152A (en) * 2001-08-08 2003-02-18 Olympus Optical Co Ltd Recessed spherical face machining device by ultrasonic wave and method therefor
CN1613605A (en) * 2004-11-23 2005-05-11 哈尔滨工业大学 Ultrasonic magnetic rheological composite polishing method and polisher thereof
CN101104244A (en) * 2006-07-10 2008-01-16 宁波工程学院 Ultrasonic magnetic-granular composite milling method and its device
CN103042438A (en) * 2012-12-31 2013-04-17 天津大学 Constant pressure ultrasonic wave aiding magnetorheological finishing method and constant pressure ultrasonic wave aiding magnetorheological finishing device
CN104816203A (en) * 2015-05-04 2015-08-05 辽宁科技大学 Method for magnetic grinding superhard precision ceramic tube and device thereof
CN105364641A (en) * 2015-11-19 2016-03-02 浙江工业大学 Micro semi-ring female die array-mode lapping and polishing method and device
CN105479275A (en) * 2015-11-19 2016-04-13 浙江工业大学 Micro half ring die array micro ultrasonic classification polishing method
CN205342683U (en) * 2016-01-15 2016-06-29 辽宁科技大学 Multistation hard brittle material surface grinding device
CN206614346U (en) * 2017-03-23 2017-11-07 辽宁科技大学 A kind of rotary ultrasonic magnetic abrasive finishing device
CN108581648A (en) * 2018-03-16 2018-09-28 辽宁科技大学 The device and method of rotary ultrasonic wave magnetic abrasive finishing hemispherical face workpiece surface

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048152A (en) * 2001-08-08 2003-02-18 Olympus Optical Co Ltd Recessed spherical face machining device by ultrasonic wave and method therefor
CN1613605A (en) * 2004-11-23 2005-05-11 哈尔滨工业大学 Ultrasonic magnetic rheological composite polishing method and polisher thereof
CN101104244A (en) * 2006-07-10 2008-01-16 宁波工程学院 Ultrasonic magnetic-granular composite milling method and its device
CN103042438A (en) * 2012-12-31 2013-04-17 天津大学 Constant pressure ultrasonic wave aiding magnetorheological finishing method and constant pressure ultrasonic wave aiding magnetorheological finishing device
CN104816203A (en) * 2015-05-04 2015-08-05 辽宁科技大学 Method for magnetic grinding superhard precision ceramic tube and device thereof
CN105364641A (en) * 2015-11-19 2016-03-02 浙江工业大学 Micro semi-ring female die array-mode lapping and polishing method and device
CN105479275A (en) * 2015-11-19 2016-04-13 浙江工业大学 Micro half ring die array micro ultrasonic classification polishing method
CN205342683U (en) * 2016-01-15 2016-06-29 辽宁科技大学 Multistation hard brittle material surface grinding device
CN206614346U (en) * 2017-03-23 2017-11-07 辽宁科技大学 A kind of rotary ultrasonic magnetic abrasive finishing device
CN108581648A (en) * 2018-03-16 2018-09-28 辽宁科技大学 The device and method of rotary ultrasonic wave magnetic abrasive finishing hemispherical face workpiece surface

Also Published As

Publication number Publication date
CN110370099A (en) 2019-10-25

Similar Documents

Publication Publication Date Title
CN110370099B (en) Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding
CN105364641B (en) Micro- semi-ring cavity plate array polishing method and device
EP1925397B1 (en) Method of and apparatus for working structure
CN108972302B (en) Non-resonant vibration auxiliary polishing device and method
CN105479275B (en) A kind of micro- semi-ring cavity plate array micro ultrasound classification polishing method
CN108406324A (en) Rotary ultrasonic three-dimensional elliptical vibration leaching polishing fluid milling device and method
CN111215970B (en) Ultrasonic cavitation assisted ultrasonic magnetic polishing method for microstructure mold
CN103273386B (en) The auxiliary fine ultrasonic machine tool of a kind of electrophoresis and processing method
CN110340748A (en) A kind of rotary ultrasonic method processes the method and device of micro- hemisphere cavity plate array
CN102441820A (en) Non-contact type ultrasonic surface shape correcting and polishing method and device
CN114918742B (en) Microstructure in-situ grinding and polishing processing device based on electrorheological effect and processing method thereof
CN105364640B (en) A kind of chemical mechanical classification composite manufacturing method of micro- semi-ring cavity plate array
CN110421413B (en) Method and device for preparing micro-hemispherical concave die array by Fenton multi-domain ultrasonic processing
CN110355620B (en) Fenton-assisted rotary ultrasonic efficient polishing method for ceramic materials
JP6145548B1 (en) Chamfering grinding method and chamfering grinding apparatus
CN105150033B (en) A kind of large-size axis partses are to ultrasonic wave added cross grinding mill
CN108544306A (en) The ultrasonic finishing batch processing method and equipment of metal casting
JP2006305661A (en) Ultrasonic vibration processing device, and method for manufacturing electrodeposition tool used for ultrasonic vibration processing device
CN205218689U (en) Throwing device is ground to little semi -ring die array
CN110315398B (en) Micro-ultrasonic array sphere emission profiling constant force grinding and polishing method
CN116810558A (en) Tool and method for machining hemispherical harmonic oscillator
CN110340747B (en) Bubble-controlled micro-ultrasonic sphere emission profiling array polishing method and device
CN113172487A (en) Vibratory ferrofluid ultra-precision polishing device and method with micron-scale functional structure
JPH09290356A (en) Surface traverse grinding device using ultrasonic vibration
Verma et al. Advancement in Magnetic Field Assisted Finishing Processes

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant