CN110227566A - A kind of PDMS Micro-fluidic chip die clone method - Google Patents
A kind of PDMS Micro-fluidic chip die clone method Download PDFInfo
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- CN110227566A CN110227566A CN201910634347.4A CN201910634347A CN110227566A CN 110227566 A CN110227566 A CN 110227566A CN 201910634347 A CN201910634347 A CN 201910634347A CN 110227566 A CN110227566 A CN 110227566A
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- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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Abstract
The invention belongs to technical field of micro-nano manufacture, disclose a kind of PDMS Micro-fluidic chip die clone method, are poured duplication PDMS former using micro-fluidic chip master mold；PDMS former is fitted on the smooth substrate of punching, communicates any microchannel of PDMS former or microcavity at least with an aperture on substrate, and carry out Fruit storage；Glue is added dropwise in all substrate tappings, so that glue under the suction function that vacuum outgas PDMS is generated, is full of entire PDMS former space；Make the glue curing of filling by way of light radiation or heating；PDMS former is removed, the Micro-fluidic chip die completely the same with original master structure is obtained.The quick, inexpensive of PDMS Chip mold, high-fidelity duplication can be achieved in the present invention, helps to realize the mass production of PDMS micro-fluidic chip, is expected to promote the fast development and extensive use of PDMS micro-fluidic chip.
Description
Technical field
The invention belongs to technical field of micro-nano manufacture more particularly to a kind of PDMS Micro-fluidic chip die clone methods.
Background technique
In recent years, micro-fluidic chip is ground because of advantages such as its micromation, low consumption sample, high throughput, portability in biomedicine
Study carefully, before clinical examination, chemical synthesis, environmental monitoring, health quarantine, the various fields such as judicial expertise present good application
Scape.Currently, dividing according to making material, there are mainly three types of types for micro-fluidic chip: PDMS chip, rigid polymer chip
(PMMA, PC, COC etc.) and glass-chip, wherein glass micro-fluidic chips are usually to use microelectronic processing technology combination hydrogen fluorine
Sour wet etching realizes that entire manufacturing process period is long, at high cost, and is related to hazardous chemical；And rigid polymer miniflow
Control chip is usually that microelectronic technique is used to combine plating production formpiston, is then realizing in conjunction with injection molding or hot pressing, is making
Process needs expensive injection molding or hot-press equipment, and the problems such as demoulding is difficult often easily occurs for fine structure；Comparatively,
PDMS chip fabrication processes are simple, easy to process, production cost is low, thus become current laboratory research and primary is micro-fluidic
Most widely used a kind of micro-fluidic chip form in product development process.Traditional PDMS facture of microchip technique is led to
It is often formpiston is made using microelectronic processing technology based on so-called " soft lithography ", realizes, have in conjunction with casting duplication
Body process include the production of mask, photolithography patterning production formpiston (photoetching process include gluing, drying glue, exposure, development, after
Dry and etc.), PDMS prepare, casting, solidification, bonding.Wherein the production of formpiston is the entire production process of PDMS micro-fluidic chip
Middle time-consuming longest, the highest link of cost, but because micro-fluidic chip formpiston is usually the silicon substrate using the silicon wafer of polishing as substrate fabrication
Brittleness and the interfacial stress of photoresist and silicon substrate lead to damaged condition easily occur in formpiston use process.Therefore, often
It is spare to need to make multiple formpistons, and cost of manufacture can then be increase accordingly by making multiple formpistons；In addition, due to being deposited in photoetching process
In some uncontrollable factors, cause also even if between the mold made of same instrument and technological parameter, different batches
Have subtle structural difference (especially mold height), and then influences experimental result.It is then desired to develop a kind of quick letter
Clean, low-cost PDMS Micro-fluidic chip die clone method, to avoid because burn failure or different batches mould structure it is thin
Elementary errors is different to have an impact experimental study, accelerates the research and development of microflow control technique；Meanwhile also there is an urgent need to develop can be fast
The method of the completely the same mold of fast, a large amount of preparation structures is promoted with realizing the mass production of low cost PDMS micro-fluidic chip
Into the extensive use of microflow control technique.
In conclusion problem of the existing technology is:
(1) traditional glass micro-fluidic chips manufacturing process period is long, at high cost and dangerous.
(2) traditional rigid polymer facture of microchip needs complicated mold processing, and relies on expensive hot pressing
Or injection molding machine, it is unsuitable for common lab or establishment small business.
(3) in traditional PDMS facture of microchip technique, the brittleness and photoresist of silicon substrate and the interface of silicon substrate are answered
Power leads to damaged condition easily occur in formpiston use process.
(4) due to, there are some uncontrollable factors, causing in photoetching process even if using same instrument and technological parameter,
It is also had subtle structural difference (especially mold height) between the mold of different batches production, and then influences experiment knot
Fruit.
Solve the difficulty of above-mentioned technical problem: since the level and maturity of the development of current technology are inadequate.
Solve the meaning of above-mentioned technical problem:
Although microflow control technique shows technical advantage outstanding and good application prospect, due to micro-fluidic at present
Chip manufacturing is at high cost, low efficiency, lacks mature scale manufacture craft, greatly limits the technology inexpensive, primary
The application in property routine testing field, such as medical diagnosis, environmental monitoring, food safety detection.Therefore, there is an urgent need to develop it is low at
Originally, high consistency micro-fluidic chip mass production method keeps microflow control technique true to promote the extensive use of microflow control technique
Just serving scientific research, human health and life, allow ordinary populace, common lab, small enterprise can enjoy it is micro-fluidic
" technology bonus ".
Summary of the invention
In view of the problems of the existing technology, the present invention provides a kind of PDMS Micro-fluidic chip die clone methods.
The invention is realized in this way a kind of PDMS Micro-fluidic chip die clone method, the PDMS micro-fluidic chip
Mold clone method the following steps are included:
The first step is poured duplication PDMS former using micro-fluidic chip master mold；It prepares for positive replica below；
Second step fits in PDMS former on the smooth substrate of punching, makes PDMS former any microchannel or micro-
Chamber is at least communicated with an aperture on substrate, and carries out Fruit storage；It is for shape that PDMS former is bonded with punching substrate
At restricted micro-structure space, for limiting the shape for filling subsequent glue, so that glue ultimately forms micro-structure and original mother
Mould is consistent, and Fruit storage is in order to make PDMS block form similar vacuum, so that PDMS former microstructure side wall can not
It is disconnected to absorb air, so that forming the glue filled micro-structure space of negative pressure drive load in restricted micro-structure space；
Glue is added dropwise in all substrate tappings third step, so that glue is made in the negative pressure that vacuum outgas PDMS is generated
Under, it is full of entire PDMS former space；
4th step makes the glue curing of filling by way of light radiation or heating；
5th step removes PDMS former, is made and the completely the same Micro-fluidic chip die of original master structure.
Further, in the first step, micro-fluidic chip master mold is for the micro-structure based on photoresist or based on silicon substrate
Micro-structure, the micro-structure master mold based on photoresist are made by photoetching process, and the micro-structure master mold based on silicon substrate passes through photoetching work
Skill combination deep ion etching technics is made.
Further, in the first step, PDMS former thickness is greater than 1 millimeter, and the Fruit storage time is 1 hour~24
Hour.
Further, in the second step, smooth substrate be polished silicon slice, glass, quartz, sheet metal, organic glass,
One of potsherd.
Further, in the second step, substrate includes at least one through-hole or a through-hole and coupled micro-
Slot.
Further, the through-hole passes through one of ultrasonic punching, numerical control punching, laser boring method preparation, and diameter is small
In 2 millimeters；The microflute is portrayed by glass cutter or laser ablation preparation, and width of mini longitudinal channels is less than 1 millimeter.
Further, in the second step, after PDMS former is bonded with substrate, any microchannel or microcavity body on PDMS former
At least communicated with a through-hole or PDMS former on any microchannel or microcavity body by the microflute on substrate at least with one
Through-hole communicates, and any micro-structure space of PDMS former is connected to the extreme length of through-hole less than 3 centimetres.
Further, in the third step, filling glue be one of ultraviolet glue, epoxy glue, negative photoresist, glue
Viscosity is less than 1000 lis Pa Secs.
Further, in the 4th step, after all micro-structure spaces of PDMS former are full of glue, made by different modes
Glue curing；If filling glue is ultraviolet glue, solidification can be realized by light radiation mode；If filling glue is epoxy glue, can lead to
It crosses heating method and realizes solidification；If filling glue is negative photoresist, it can be realized and be solidified by light radiation combination heating method.
It is obtained another object of the present invention is to provide a kind of by the PDMS Micro-fluidic chip die clone method
PDMS Micro-fluidic chip die.
In conclusion advantages of the present invention and good effect are as follows: the present invention is without being repeated several times cumbersome, expensive photoetching work
Skill process, without harsh processing environment and professional technique training, it is only necessary to pass through the PDMS former reverse mould of Fruit storage
Operation can be realized the quick, inexpensive of PDMS Chip mold, high-fidelity duplication, quickly prepare at the same time it can also exponential manner
Tens, same structure mold up to a hundred is expected to promote PDMS micro-fluidic chip for the mass production of PDMS micro-fluidic chip
Fast-developing and extensive use, from the perspective of application, in most cases, market has cost sensitivity, therefore,
Low cost, it is disposable, can prepare with scale micro-fluidic device be push microflow control technique move towards in-vitro diagnosis, health quarantine,
The key of the application markets such as scientific research.Due to current facture of microchip higher cost, lack efficient prepare with scale
Technique limits its practical application, once micro-fluidic device application cost, which is reduced to ordinary populace and common lab, to hold
The range received, in view of the advantage of microflow control technique, micro-fluidic device will be quickly in the clinical laboratory of hospital, portion, base, Food Supervision Bureau
Door, university institute common lab be used widely.
Traditional photoetching process production PDMS mold generally go through substrate preparations, spin coating photoresist, front baking, exposure, rear baking,
Development, firmly baking and etc., whole flow process time-consuming about 6~7 hours, expend about 16 milliliters of SU-8 (~$300)；And the technical program
In the case where PDMS former has been made, substrate preparation, fitting, vacuum outgas, filler, solidification, removing are usually only needed,
Whole flow process time-consuming about~2 hour, expends glue and is usually less than 10 microlitres (~), and the technical program can realize index
Incrementally replicate, 1 → 2 → 4 → 8 → 16 →... ..., thus replicate mold is more, the time that the preparation of single mold expends gets over
It is few.
Detailed description of the invention
Fig. 1 is the flow chart of PDMS Micro-fluidic chip die clone method provided in an embodiment of the present invention.
Fig. 2 is the realization schematic diagram of production PDMS micro-fluidic chip backed stamper provided in an embodiment of the present invention.
Fig. 3 is that the production of embodiment 1 provided in an embodiment of the present invention has simple microtube structure PDMS micro-fluidic chip multiple
The flow diagram of molding.
Fig. 4 is that the production of embodiment 1 provided in an embodiment of the present invention has complicated microtube structure PDMS micro-fluidic chip multiple
The flow diagram of molding.
Fig. 5 is that the production of embodiment 2 provided in an embodiment of the present invention is micro- without microtube structure, integrated microcavity array structure PDMS
The flow diagram of fluidic chip backed stamper.
Fig. 6, which is that the embodiment of the present invention 1 is made, has simple microtube structure PDMS micro-fluidic chip backed stamper right with it
Master mold is answered to compare microphoto.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
In view of the problems of the existing technology, the present invention provides a kind of PDMS Micro-fluidic chip die clone method, under
Face is explained in detail the present invention in conjunction with attached drawing.
As shown in Figure 1, Micro-fluidic chip die clone method provided in an embodiment of the present invention the following steps are included:
S101: micro-fluidic chip master mold casting duplication PDMS former is utilized；
S102: PDMS former is fitted on the smooth substrate of punching, makes any microchannel of PDMS former or microcavity
It is at least communicated with an aperture on substrate, and carries out Fruit storage；
S103: glue is added dropwise in all substrate tappings, so that the suction function that glue is generated in vacuum outgas PDMS
Under, it is full of entire PDMS former space；
S104: make the glue curing of filling by way of light radiation or heating；
S105: removing PDMS former obtains the Micro-fluidic chip die completely the same with original master structure.
As shown in Fig. 2, specifically, the method makes the mother based on photoresist micro-structure by traditional photoetching process
Mould, or the master mold based on silicon substrate micro-structure is made by photoetching process combination deep ion etching technics.
After completing master mold preparation, by soft lithography, PDMS former is replicated using the master mold.It is subsequent true in order to guarantee
After the reason of vacancy, PDMS cavity block body can absorb enough air, and then enough in the generation of the former micro-structure space PDMS
Negative pressure drives glue filling, and the PDMS former thickness replicated should be greater than 1 millimeter.
After PDMS former is made, the structural plane alignment of the PDMS former is fitted on the smooth substrate of punching.
Substrate material can be one of polished silicon slice, glass, quartz, sheet metal, organic glass, potsherd.In addition, in order to avoid height
Elastic PDMS material leads to the local deformation in through-hole joint place PDMS female mould structure face because of self gravitation effect, and through-hole diameter is answered small
In 2 millimeters.
In order to guarantee all micro-structure high-fidelities of PDMS former, complete copy, that is, guarantee that subsequent glue can fill PDMS yin
All micro-structure spaces of mould should be such that any microchannel of PDMS former of fitting or microcavity at least communicates with an aperture on substrate；
In addition, in order to realize that glue in quick, the complete filling in PDMS former micro-structure space, should make to connect any micro-structure to be filled
The micro-pipe length of space and tapping is less than 3 centimetres, for complicated micro-pipe road PDMS former, can by substrate many places beat
Microflute is portrayed in hole, reduces the length that micro-structure space to be filled is connected to microchannel with tapping.
After completing fitting, the PDMS former/substrate combination body is placed in vacuum tank, is carried out 1 hour~24 hours
Fruit storage.
It takes out described after the PDMS of Fruit storage former/substrate combination body, is added dropwise in all tappings of substrate purple
One of outer glue, epoxy glue, photoresist, so that glue is full of all apertures；Due to the PDMS block through Fruit storage
The air for constantly absorbing former micro-structure space causes formation negative pressure driving tapping glue in micro-structure to pass through former microchannel
Or the microflute portrayed on substrate enters former micro-structure space.In order to guarantee all micro-structures of glue energy Fast Filling PDMS former
Space, the viscosity for filling glue should be less than 1000 lis Pa Secs (CPS).
After all micro-structure spaces of PDMS former are full of glue, make glue curing by different modes；If filling glue
For ultraviolet glue, solidification can be realized by light radiation mode；If filling glue is epoxy glue, it can be realized and be solidified by heating method；
If filling glue is photoresist, it can be realized and be solidified by light radiation combination heating method.
After completing filling adhesive curing, PDMS former is removed from substrate, i.e. duplication obtains and the micro- knot of micro-fluidic chip master mold
The completely the same formpiston of structure.
Technical scheme of the present invention will be further described combined with specific embodiments below.
Embodiment 1
As shown in figure 3, making the micro-fluidic chip mould of integrated 1 microchannel and 10 microcavitys based on the method for the present invention duplication
Tool is captured for drop or microballoon, is comprised the concrete steps that:
(1) PDMS former makes: a certain amount of PDMS precursor and crosslinking agent are mixed with 10:1 first, and froth in vacuum, then
PDMS performed polymer after froth in vacuum is cast on micro-fluidic chip master mold, is placed on 90 DEG C of hot plates and heats 1 hour, is realized
PDMS solidification；After PDMS solidification, it is removed from chip master mold, PDMS former is made.
(2) substrate prepares: in order to guarantee that 1 microchannel of PDMS former and its concatenated 10 microcavitys quickly, can be filled out effectively
Glue is filled, to realize the complete copy of mold.PDMS former injection port and out sample are corresponded in substrate first with ultrasonic punching machine
At mouthful and microchannel midpoint respectively makes the through-hole that diameter is 1.5 millimeters, cleans glass substrate finally by supersonic cleaning machine,
And it is dried with nitrogen.
(3) PDMS former/substrate combination: the glass that the structural plane of the PDMS former of step (1) preparation and step (2) are prepared
The alignment fitting of glass substrate, it is ensured that substrate intermediate throughholes across PDMS former microchannel, and both ends through-hole respectively with PDMS former into
Sample mouth and outlet structure communicate.
(4) Fruit storage: PDMS former/substrate combination body prepared by step (3) is placed in vacuum alms bowl, in pressure
Less than degassing process 1 hour under conditions of 10kPa.
(5) former glue is filled: PDMS former/substrate combination body after step (4) are vacuum-treated takes from vacuum alms bowl
Out, about 1.8 microlitres of Norland ultraviolet glues are added dropwise in three through holes of substrate, utilize the PDMS block of Fruit storage
Gettering ability, generate negative pressure in PDMS former microchannel/microcavity system, each through hole ultraviolet glue driven to be filled with former automatically
Micro-structure space.
(6) glue curing is filled: after ultraviolet glue is full of all micro-structure spaces of PDMS former, by PDMS former/base
Piece assembly is placed under ultraviolet lamp and radiates 15 minutes, makes the ultraviolet adhesive curing of filling.
(7) former is removed: completing after filling ultraviolet adhesive curing in PDMS former, PDMS former is removed from substrate, make
Obtain micro-fluidic chip backed stamper.
Embodiment 2
As shown in figure 4, making the micro-fluidic core of integrated 40 microchannels and 20000 microcavitys based on the method for the present invention duplication
Sheet mold is studied for digital pcr, is comprised the concrete steps that:
(1) PDMS former makes: a certain amount of PDMS precursor and crosslinking agent are mixed with 10:1 first, and froth in vacuum, then
PDMS performed polymer after froth in vacuum is cast on micro-fluidic chip master mold, is placed on 90 DEG C of hot plates and heats 1 hour, is realized
PDMS solidification；After PDMS solidification, it is removed from chip master mold, PDMS former is made.
(2) substrate prepares: in order to guarantee that 40 microchannels of PDMS former and its concatenated 20000 microcavitys energy are quick, have
Effect filling glue, to realize the complete copy of mold.It is specific in glass substrate using glass cutter according to chip structure arrangement first
Three independent microflutes are portrayed at position, are then corresponded at PDMS former injection port using ultrasonic punching machine in substrate and three micro-
Slot midpoint makes the through-hole that diameter is 1.5 millimeters, cleans glass substrate finally by supersonic cleaning machine, and be dried with nitrogen.
(3) PDMS former/substrate combination: the glass that the structural plane of the PDMS former of step (1) preparation and step (2) are prepared
Glass substrate microflute is in face of quasi- fitting, it is ensured that three microflutes are across 40 microchannels of PDMS former, and three microflute both ends are respectively positioned on
In PDMS body region.
(4) Fruit storage: PDMS former/substrate combination body prepared by step (3) is placed in vacuum alms bowl, in pressure
Less than degassing process 1 hour under conditions of 10kPa.
(5) former glue is filled: PDMS former/substrate combination body after step (4) are vacuum-treated takes from vacuum alms bowl
Out, about 2 microlitres of Norland ultraviolet glues are added dropwise in four through holes of substrate, utilize the PDMS block of Fruit storage
Gettering ability generates negative pressure in PDMS former microchannel/microcavity system, drives each through hole ultraviolet glue to be filled with former automatically micro-
Structure space.
(6) glue curing is filled: after ultraviolet glue is full of all micro-structure spaces of PDMS former, by PDMS former/base
Piece assembly is placed under ultraviolet lamp and radiates 15 minutes, makes the ultraviolet adhesive curing of filling.
(7) former is removed: completing after filling ultraviolet adhesive curing in PDMS former, PDMS former is removed from substrate, make
Obtain micro-fluidic chip backed stamper.
Embodiment 3
As shown in figure 5, making integrated 5000 independent microcavitys, the miniflow without connection microchannel based on the method for the present invention duplication
Chip mold is controlled, unicellular research is used for, comprises the concrete steps that:
(1) PDMS former makes: a certain amount of PDMS precursor and crosslinking agent are mixed with 10:1 first, and froth in vacuum, then
PDMS performed polymer after froth in vacuum is cast on micro-fluidic chip master mold, is placed on 90 DEG C of hot plates and heats 1 hour, is realized
PDMS solidification；After PDMS solidification, it is removed from chip master mold, PDMS former is made.
(2) substrate prepare: in order to guarantee 5000 microcavitys of PDMS former can quickly, effectively fill glue, to realize mold
Complete copy.It is portrayed first using laser marking machine in glass substrate intermediate region according to chip structure arrangement horizontal and vertical
The microflute of intertexture, adjacent microflute spacing are less than microcavity diameters, and microflute region shape is similar to former microcavity array region shape, and face
Product is slightly larger than the latter；Then utilize ultrasonic punching machine in microflute intermediate region away from system at both lateral sides about peak width one third
Make the through-hole that two diameters are 1.5 millimeters, cleans glass substrate finally by supersonic cleaning machine, and be dried with nitrogen.
(3) PDMS former/substrate combination: the glass that the structural plane of the PDMS former of step (1) preparation and step (2) are prepared
Glass substrate microflute is in face of quasi- fitting, it is ensured that microflute region overlay PDMS former microcavity array region.
(4) Fruit storage: PDMS former/substrate combination body prepared by step (3) is placed in vacuum alms bowl, in pressure
Less than degassing process 1 hour under conditions of 10kPa.
(5) former glue is filled: PDMS former/substrate combination body after step (4) are vacuum-treated takes from vacuum alms bowl
Out, about 2.5 microlitres of Norland ultraviolet glues are added dropwise in two through holes of substrate, utilize the PDMS block of Fruit storage
Gettering ability, generate negative pressure in PDMS former microchannel/microcavity system, each through hole ultraviolet glue driven to be filled with former automatically
Micro-structure space.
(6) glue curing is filled: after ultraviolet glue is full of all micro-structure spaces of PDMS former, by PDMS former/base
Piece assembly is placed under ultraviolet lamp and radiates 15 minutes, makes the ultraviolet adhesive curing of filling.
(7) former is removed: completing after filling ultraviolet adhesive curing in PDMS former, PDMS former is removed from substrate, make
Obtain micro-fluidic chip backed stamper.
The backed stamper that Case-based Reasoning 1 as shown in Figure 6 makes is as a result, can be seen that backed stamper perfection by micro- comparison diagram
Replicate master structure.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of PDMS Micro-fluidic chip die clone method, which is characterized in that PDMS Micro-fluidic chip die duplication side
Method the following steps are included:
The first step is poured duplication PDMS former using micro-fluidic chip master mold；
Second step fits in PDMS former on the smooth substrate of punching, makes any microchannel of PDMS former or microcavity extremely
It is few to be communicated with an aperture on substrate, and carry out Fruit storage；
Glue is added dropwise in all substrate tappings third step, so that glue is under the suction function that vacuum outgas PDMS is generated,
Full of entire PDMS former space；
4th step makes the glue curing of filling by way of light radiation or heating；
5th step removes PDMS former, is made and the completely the same Micro-fluidic chip die of original master structure.
2. PDMS Micro-fluidic chip die clone method as described in claim 1, which is characterized in that in the first step,
Micro-fluidic chip master mold is the micro-structure based on photoresist or the micro-structure based on silicon substrate, the micro-structure master mold based on photoresist
It is made by photoetching process, the micro-structure master mold based on silicon substrate is made by photoetching process combination deep ion etching technics.
3. PDMS Micro-fluidic chip die clone method as described in claim 1, which is characterized in that in the first step,
PDMS former thickness is greater than 1 millimeter, and the Fruit storage time is 1 hour~24 hours.
4. PDMS Micro-fluidic chip die clone method as described in claim 1, which is characterized in that in the second step,
Smooth substrate is one of polished silicon slice, glass, quartz, sheet metal, organic glass, potsherd.
5. PDMS Micro-fluidic chip die clone method as described in claim 1, which is characterized in that in the second step,
Substrate includes at least one through-hole or a through-hole and coupled microflute.
6. PDMS Micro-fluidic chip die clone method as claimed in claim 5, which is characterized in that the through-hole passes through ultrasound
The preparation of one of punching, numerical control punching, laser boring method, diameter is less than 2 millimeters；The microflute portrayed by glass cutter or
Laser ablation preparation, width of mini longitudinal channels is less than 1 millimeter.
7. PDMS Micro-fluidic chip die clone method as described in claim 1, which is characterized in that in the second step,
After PDMS former is bonded with substrate, any microchannel or microcavity body is at least communicated with a through-hole or PDMS on PDMS former
Any microchannel or microcavity body are at least communicated with a through-hole by the microflute on substrate on former, and any micro- knot of PDMS former
Conformational space is connected to the extreme length of through-hole less than 3 centimetres.
8. PDMS Micro-fluidic chip die clone method as described in claim 1, which is characterized in that in the third step,
Filling glue is one of ultraviolet glue, epoxy glue, photoresist, and the viscosity of glue is less than 1000 lis Pa Secs.
9. PDMS Micro-fluidic chip die clone method as described in claim 1, which is characterized in that in the 4th step,
After all micro-structure spaces of PDMS former are full of glue, make glue curing by different modes；If filling glue is ultraviolet glue,
Solidification can be realized by light radiation mode；If filling glue is epoxy glue, it can be realized and be solidified by heating method；If filling glue
For negative photoresist, it can be realized and be solidified by light radiation combination heating method.
10. a kind of PDMS miniflow that PDMS Micro-fluidic chip die clone method obtains as described in claim 1~9 any one
Control Chip mold.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108187767A (en) * | 2017-12-30 | 2018-06-22 | 北京化工大学 | A kind of programmable modularized PDMS Micro-fluidic chip die systems |
| CN111014959A (en) * | 2019-12-30 | 2020-04-17 | 东华大学 | Bionic surface preparation method based on laser impact imprinting technology |
| CN112892619A (en) * | 2019-12-04 | 2021-06-04 | 香港城市大学深圳研究院 | PDMS master model with arc-shaped edge section, micro-fluidic valve and chip and preparation thereof |
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| CN108187767B (en) * | 2017-12-30 | 2020-02-21 | 北京化工大学 | Programmable modular PDMS micro-fluidic chip mold system |
| CN112892619B (en) * | 2019-12-04 | 2022-07-15 | 香港城市大学深圳研究院 | PDMS (polydimethylsiloxane) master mold with arc-shaped edge section, micro-fluidic valve and chip and preparation thereof |
| CN112892619A (en) * | 2019-12-04 | 2021-06-04 | 香港城市大学深圳研究院 | PDMS master model with arc-shaped edge section, micro-fluidic valve and chip and preparation thereof |
| CN111014959B (en) * | 2019-12-30 | 2021-08-27 | 东华大学 | Bionic surface preparation method based on laser impact imprinting technology |
| CN111014959A (en) * | 2019-12-30 | 2020-04-17 | 东华大学 | Bionic surface preparation method based on laser impact imprinting technology |
| CN113211720A (en) * | 2021-05-07 | 2021-08-06 | 中国科学院上海微系统与信息技术研究所 | Injection mold for PDMS micro-fluidic chip and manufacturing method |
| CN113334647A (en) * | 2021-05-20 | 2021-09-03 | 中国计量大学 | Method for copying and forming photoresist master die |
| CN113351269A (en) * | 2021-06-25 | 2021-09-07 | 清华大学深圳国际研究生院 | Preparation process of hemispherical cavity on PDMS (polydimethylsiloxane) micro-fluidic chip |
| CN114043649A (en) * | 2021-11-05 | 2022-02-15 | 浙大城市学院 | Composite structure male die for manufacturing plastic microfluidic chip, forming method and application thereof |
| CN114043649B (en) * | 2021-11-05 | 2024-04-26 | 浙大城市学院 | Composite structure male die for manufacturing plastic microfluidic chip, molding method and application thereof |
| CN114798022A (en) * | 2022-04-21 | 2022-07-29 | 北京工业大学 | Portable device and method for vacuumizing PDMS bubbles |
| CN114798022B (en) * | 2022-04-21 | 2024-04-19 | 北京工业大学 | Device and method for portable vacuumizing of PDMS (polydimethylsiloxane) bubbles |
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