CN110026329A - Ultrasonic transducer and preparation method thereof - Google Patents

Ultrasonic transducer and preparation method thereof Download PDF

Info

Publication number
CN110026329A
CN110026329A CN201910339051.XA CN201910339051A CN110026329A CN 110026329 A CN110026329 A CN 110026329A CN 201910339051 A CN201910339051 A CN 201910339051A CN 110026329 A CN110026329 A CN 110026329A
Authority
CN
China
Prior art keywords
piezoelectricity
array element
conductive
piezoelectric
piezoelectricity array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910339051.XA
Other languages
Chinese (zh)
Other versions
CN110026329B (en
Inventor
戴吉岩
伍伟昌
黄智文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Kong Polytechnic University HKPU
Original Assignee
Hong Kong Polytechnic University HKPU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Kong Polytechnic University HKPU filed Critical Hong Kong Polytechnic University HKPU
Priority to CN201910339051.XA priority Critical patent/CN110026329B/en
Publication of CN110026329A publication Critical patent/CN110026329A/en
Application granted granted Critical
Publication of CN110026329B publication Critical patent/CN110026329B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/50—Application to a particular transducer type
    • B06B2201/55—Piezoelectric transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Abstract

The embodiment of the invention discloses a kind of ultrasonic transducer and preparation method thereof, back structure has multiple the first grooves for running through the back structure in a second direction in said first direction, and first groove and piezoelectricity rows of array elements correspond；It include multiple flexible circuit board with the first conductive structure that the back structure is detachably connected, when first conductive structure and the back structure are fixed together, the flexible circuit board is located in first groove, the flexible circuit board has a plurality of conducting wire in a second direction in said first direction, the conducting wire and the piezoelectricity array element correspond, for being electrically connected with the piezoelectricity array element, to realize the corresponding conducting wire electrical connection of all piezoelectricity array elements, complete the signal transmission of all piezoelectricity array elements, without individually carrying out conducting wire connection to each piezoelectricity array element again, and then simplify the complexity of the wiring technique of piezoelectricity array element.

Description

Ultrasonic transducer and preparation method thereof
Technical field
The present invention relates to ultrasonic transducer technical fields more particularly to a kind of ultrasonic transducer and preparation method thereof.
Background technique
Real-time three-dimensional ultrasonography technology is that current imaging of medical diagnoses important one of means, this technology can be improved and be swept Frame frequency is retouched, while being also able to satisfy the imaging requirements of high-quality, to be widely used.
And realize that the critical component of the supersonic imaging apparatus of real-time three-dimensional ultrasonography is two dimensional array ultrasound energy converter, this It is the detection space solution since two dimensional array ultrasound energy converter (i.e. the phased array system of two-dimensional array) can focus in two directions Analysis degree is higher, and acquisition data process is rapid, stablizes, and does not need movement and rotate freely to deflect and focus to realize three Dimension imaging produces four-dimension image if the time is calculated into another dimension.
However, two dimensional array ultrasound energy converter has a huge array element number, each array element size is smaller and each battle array Member needs independent patch, could generate independent pulse signal, therefore, in actual fabrication process, two dimensional array ultrasound energy converter Array element wiring it is relatively difficult, wiring complex process.
Summary of the invention
In order to solve the above technical problems, the embodiment of the invention provides a kind of ultrasonic transducers and preparation method thereof, with letter Change the complexity of its wiring technique, reduces preparation expense.
To solve the above problems, the embodiment of the invention provides following technical solutions:
A kind of ultrasonic transducer, comprising:
Piezoelectric structure, the piezoelectric structure include multiple piezoelectricity rows of array elements along first direction, each piezoelectricity rows of array elements packet Include at least one piezoelectricity array element；
Back structure, the back structure are located at below the piezoelectric structure, have in the back structure along second party To the first groove, first groove runs through the back structure, the first direction and described the along the second direction Two directions are vertical, and the back structure has multiple first grooves, first groove and the pressure on third direction Electric rows of array elements corresponds, and positioned at the lower section of the piezoelectricity rows of array elements, the third direction is vertical with the second direction, and with The first direction is at predetermined angle；
First conductive structure is detachably connected with the back structure, and first conductive structure includes multiple flexible circuitries Plate, the flexible circuit board and first groove correspond, when first conductive structure is fixed with the back structure When together, the flexible circuit board is located in first groove, and the flexible circuit board has in said first direction A plurality of conducting wire in a second direction, the conducting wire and the piezoelectricity array element correspond, and positioned at the lower section of the piezoelectricity array element, use It is electrically connected in the piezoelectricity array element.
Optionally, the distance between two neighboring described first groove with its corresponding to the two neighboring piezoelectricity array element The distance between row is equal.
Optionally, the distance between two neighboring described conducting wire with its corresponding to two neighboring piezoelectricity array element center The distance between it is equal.
Optionally, the back structure has the first surface and second surface being oppositely arranged along the second direction, institute First surface is stated close to the piezoelectric structure, the second surface far from the piezoelectric structure, described flexible circuit board one end with The first surface is concordant, and the other end stretches out from the second surface.
It optionally, further include the second conductive structure between the piezoelectric structure and the back structure, described Two conductive structures include multiple conductive units, and the conductive unit and the piezoelectricity array element correspond, and are located at the piezoelectricity battle array The lower section of member, the piezoelectricity array element are electrically connected by the conductive unit with the conducting wire.
Optionally, further include the first insulation system between the piezoelectricity array element, first insulation system by every Sound decoupling material composition, the string acoustic jamming for fixing between the piezoelectricity array element, and the adjacent piezoelectricity array element of reduction.
It optionally, further include the mating structure for deviating from the back structure side positioned at the piezoelectric structure, the matching Structure includes single layer matching layer or multi-layer Matched layer.
Optionally, the matching layer is made of insulating materials, or is constructed from a material that be electrically conducting,
When the matching layer is constructed from a material that be electrically conducting, the matching layer includes multiple identical with piezoelectricity array element size With layer unit, the matching layer unit and piezoelectricity array element are corresponded, and are matched between layer unit filled with positioned at the pressure The first insulation system between electric array element.
It optionally, further include the acoustic lens in the mating structure, the acoustic lens is for focusing the piezoelectricity battle array The sound wave of member transmitting.
A kind of production method of ultrasonic transducer, comprising:
Piezoelectric patches is cut, forms piezoelectric structure, the piezoelectric structure includes multiple piezoelectricity rows of array elements along first direction, often A piezoelectricity rows of array elements includes at least one piezoelectricity array element；
Back sheet is cut, back structure is formed, the back structure is located at the lower section of the piezoelectric structure, the backing knot There is the first groove in a second direction, first groove runs through the back structure along the second direction, described in structure First direction is vertical with the second direction, and the back structure has multiple first grooves on the third direction, First groove and the piezoelectricity rows of array elements correspond, positioned at the lower section of the piezoelectricity rows of array elements, the third direction with The second direction is vertical, and with the first direction at predetermined angle；
First conductive structure is inserted in first conductive structure, wherein first conductive structure includes multiple soft Property wiring board, the flexible circuit board and first groove correspond, when first conductive structure and the backing knot When structure is fixed together, the flexible circuit board is located in first groove, and the flexible circuit board is in the first direction Upper to have a plurality of conducting wire in a second direction, the conducting wire and the piezoelectricity array element correspond, positioned at the piezoelectricity array element Lower section, for being electrically connected with the piezoelectricity array element.
Optionally, the distance between two neighboring described first groove with its corresponding to the two neighboring piezoelectricity array element The distance between row is equal.
Optionally, the distance between two neighboring described conducting wire with its corresponding to two neighboring piezoelectricity array element center The distance between it is equal.
Optionally, the back structure has the first surface and second surface being oppositely arranged along the second direction, institute First surface is stated close to the piezoelectric structure, the second surface far from the piezoelectric structure, described flexible circuit board one end with The first surface is concordant, and the other end stretches out from the second surface.
Optionally, further include forming the second conductive layer between the piezoelectric patches and the back structure, cut described the Two conductive layers form the second conductive structure, and second conductive structure includes multiple conductive units, the conductive unit with it is described Piezoelectricity array element corresponds, and positioned at the lower section of the piezoelectricity array element, the piezoelectricity array element is led by the conductive unit with described Line electrical connection.
Optionally, the cutting second conductive layer forms the second conductive structure, comprising: first to the piezoelectric patches into Row cutting, then second conductive layer being located at below the piezoelectric patches is cut, or to the piezoelectric patches and described the Two conductive layers are cut simultaneously.
Optionally, further include fill insulant in the cutting gap between the piezoelectricity array element, form the first insulation Structure, first insulation system are made of sound insulation decoupling material, for fixing the piezoelectricity array element, and are reduced adjacent described String acoustic jamming between piezoelectricity array element.
It optionally, further include forming mating structure, the matching away from the side of the back structure in the piezoelectric patches Structure includes single layer matching layer or multi-layer Matched layer.
Optionally, the matching layer is made of insulating materials, or is constructed from a material that be electrically conducting,
When the matching layer is constructed from a material that be electrically conducting, cuts the matching layer and form the multiple and piezoelectricity array element size Identical matching layer unit, the matching layer unit and the piezoelectricity array element correspond, and between the matching layer unit Filled with the first insulation system between the piezoelectricity array element, the cutting matching layer includes: first to the matching Layer is cut, then is cut to the piezoelectric patches being located at below the matching layer, finally to positioned at the piezoelectric patches Second conductive layer of lower section is cut, or to the matching layer, the piezoelectric patches and second conductive layer simultaneously into Row cutting.
It optionally, further include that acoustic lens is formed in the mating structure, the acoustic lens is for focusing the piezoelectricity battle array The sound wave of member transmitting.Compared with prior art, above-mentioned technical proposal has the advantage that
In ultrasonic transducer provided by the embodiment of the present invention, the back structure below piezoelectric structure is in a first direction It is upper that there is multiple the first grooves for running through the back structure in a second direction, and first groove and the piezoelectric structure Piezoelectricity rows of array elements corresponds；It include multiple flexible circuit board with the first conductive structure that the back structure is detachably connected, The flexible circuit board and first groove correspond, when first conductive structure and the back structure are fixed on one When rising, the flexible circuit board is located in first groove, and the flexible circuit board has a plurality of in said first direction Conducting wire in a second direction, the conducting wire and the piezoelectricity array element correspond, positioned at the lower section of the piezoelectricity array element, for The piezoelectricity array element electrical connection completes all piezoelectricity battle arrays to realize the corresponding conducting wire electrical connection of all piezoelectricity array elements The signal transmission of member, without individually carrying out conducting wire connection to each piezoelectricity array element again, and then simplifies connecing for piezoelectricity array element The complexity of Wiring technology.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of ultrasonic transducer provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of another ultrasonic transducer provided in an embodiment of the present invention；
Fig. 3 is a kind of structural decomposition diagram of ultrasonic transducer provided in an embodiment of the present invention；
Fig. 4 is a kind of flow diagram of the production method of ultrasonic transducer provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but the present invention can be with Implemented using other than the one described here other way, those skilled in the art can be without prejudice to intension of the present invention In the case of do similar popularization, therefore the present invention is not limited by the specific embodiments disclosed below.
Secondly, combination schematic diagram of the present invention is described in detail, when describing the embodiments of the present invention, for purposes of illustration only, table Show that the sectional view of device architecture can disobey general proportion and make partial enlargement, and the schematic diagram is example, is not answered herein Limit the scope of protection of the invention.In addition, the three-dimensional space of length, width and depth should be included in actual fabrication.
, can be more and more extensive to the application of 3-D supersonic imaging technology with the development of current medical treatment, therefore to two-dimentional battle array The demand of column ultrasonic transducer can be increasing, and just as described in the background section, two dimensional array ultrasound energy converter has huge Array element number, each array element size is smaller, and each array element needs independent patch, independent pulse signal could be generated, because This, in actual fabrication process, the array element wiring of two dimensional array ultrasound energy converter is relatively difficult, wiring complex process, currently, Only fewer companies could produce two dimensional array ultrasound energy converter, and technology of preparing is not able to satisfy actual demand.
On the basis of the studies above, the embodiment of the invention provides ultrasonic transducer, which includes:
Piezoelectric structure 100, the piezoelectric structure 100 include multiple piezoelectricity rows of array elements along first direction, each piezoelectricity battle array First row includes at least one piezoelectricity array element；
Back structure 200, the back structure 200 is located at below the piezoelectric structure 100, in the back structure 200 The first groove with Y in a second direction, first groove runs through the back structure 200 along the second direction Y, described First direction is vertical with the second direction Y, and the back structure 200 has multiple described first on the third direction Z Groove, first groove and the piezoelectricity rows of array elements correspond, positioned at the lower section of the piezoelectricity rows of array elements, the third party It is vertical with the second direction to Z, and with the first direction at predetermined angle；
First conductive structure 300 is detachably connected with the back structure 200, and first conductive structure 300 includes more A flexible circuit board 310, the flexible circuit board 310 is corresponded with first groove, when first conductive structure 300 When being fixed together with the back structure 200, the flexible circuit board 310 is located in first groove, the flexible wires Road plate 310 has a plurality of conducting wire 311 in a second direction, the conducting wire 311 and the piezoelectricity array element in said first direction It corresponds, positioned at the lower section of the piezoelectricity array element, for being electrically connected with the piezoelectricity array element.
Optionally, the distance between adjacent rows piezoelectricity rows of array elements is equal, i.e., the described piezoelectricity rows of array elements be it is evenly arranged, And piezoelectricity array element included by each piezoelectricity rows of array elements be also it is evenly arranged, i.e., between two piezoelectricity array elements of arbitrary neighborhood away from From equal.
In one embodiment of the invention, the predetermined angle can be 90 °, i.e. third direction and first direction hangs down Directly, in other embodiments of the invention, the predetermined angle can also be other angles, arbitrarily set with specific reference to actual needs It sets, the present invention is to this and is not specifically limited.
In ultrasonic transducer provided by the embodiment of the present invention, the back structure below piezoelectric structure is in a first direction It is upper that there is multiple the first grooves for running through the back structure in a second direction, and first groove and the piezoelectric structure Piezoelectricity rows of array elements corresponds；It include multiple flexible circuit board with the first conductive structure that the back structure is detachably connected, The flexible circuit board and first groove correspond, when first conductive structure and the back structure are fixed on one When rising, the flexible circuit board is located in first groove, and the flexible circuit board has a plurality of in said first direction Conducting wire in a second direction, the conducting wire and the piezoelectricity array element correspond, positioned at the lower section of the piezoelectricity array element, for The piezoelectricity array element electrical connection completes all piezoelectricity array elements to realize the corresponding conducting wire electrical connection of piezoelectricity array element Signal transmission without individually carrying out conducting wire connection to each piezoelectricity array element, and then optimizes two dimensional array ultrasound energy converter Piezoelectricity array element wiring technique, simplify the complexity of the wiring technique of piezoelectricity array element, reduce the preparation of ultrasonic transducer Expense.
Further, ultrasonic transducer provided by the embodiment of the present invention, without individually being led to each piezoelectricity array element Wire bonding makes the pad in two neighboring piezoelectricity array element be in contact so as to avoid since each piezoelectricity array element is undersized, And cause the problem of short circuit.
In addition, the back structure in the present invention can provide for the conducting wire in flexible circuit board and accurately connect with piezoelectricity array element Position is connect, and the useless sound wave at the piezoelectric patches back side can be absorbed when ultrasonic transducer works simultaneously, it is super to greatly improve two-dimensional array The quality of sonic transducer.
In addition, the first conductive structure is detachably connected with the back structure in the present invention, is arranged in back structure One groove is arranged in a one-to-one correspondence by the flexible circuit board and first groove, so that leading included by flexible circuit board Line is electrically connected with piezoelectricity array element one-to-one correspondence, i.e., the described back structure can fix flexible circuit board, will without mold Flexible circuit board is fixed in advance, and therefore, this kind of back structure is applicable to various different frequencies and various sizes of super The demand of sonic transducer, it is applied widely.
Optionally, each piezoelectricity rows of array elements includes multiple piezoelectricity array elements, the number of the piezoelectricity array element in each piezoelectricity rows of array elements Measure identical, also, the piezoelectricity array element in the quantity of the piezoelectricity rows of array elements in the piezoelectric structure and each piezoelectricity rows of array elements Quantity it is equal, with the processing program of the simplification piezoelectric structure, and guarantee each piezoelectricity array element in the piezoelectric structure Height is consistent.Meanwhile so that in single piezoelectricity array element less than 10-1Mm-scale and have huge array element quantity when, by each Conducting wire is possibly realized in the success of piezoelectricity array element and independent connection.Specifically, the size and shape of each piezoelectricity array element is all the same, The shape of piezoelectricity array element can be to be rectangular or round, and the present invention to this and without limitation, specifically depends on the circumstances.
Optionally, the piezoelectric structure can be made of piezoelectric ceramics, piezoelectric monocrystal or piezo-electricity composite material, specifically, The piezo-electricity composite material is 1-3 type piezo-electricity composite material, and in other embodiments of the present invention, the piezoelectric structure can also be by Other satisfactory piezoelectric materials are made, and the present invention to this and without limitation, specifically depends on the circumstances.It should be noted that 1-3 type piezo-electricity composite material has the characteristics such as low-density, high sensitivity.It should also be noted that, the size of piezoelectric structure be by The quantity of the frequency of ultrasonic transducer and piezoelectricity array element determines.
Specifically, in one embodiment of the invention, as shown in Fig. 2, being located at the piezoelectric structure 100 away from described The side of back structure 400 is vapor-deposited with first electrode structure 101, and the first electrode structure 101 is public electrode structure, described First electrode structure 101 includes multiple first electrode units, and the first electrode unit and the piezoelectric unit are corresponded, needed The equal in magnitude of the corresponding piezoelectricity array element of the first electrode unit is noted that, positioned at corresponding institute Piezoelectricity array element is stated away from the back structure side, that is, is located at the surface of the corresponding piezoelectricity array element, and any phase The distance between the corresponding two neighboring piezoelectricity array element of the distance between two adjacent first electrode units is equal.
Specifically, in one embodiment of the invention, continue as shown in Fig. 2, being located at the piezoelectric structure 100 close The side of the back structure 200 is vapor-deposited with second electrode structure 102.The second electrode structure 102 includes multiple second electricity Pole unit, the second electrode unit and the piezoelectric unit correspond, it should be noted that the second electrode unit with Its corresponding piezoelectricity array element it is equal in magnitude, positioned at the corresponding piezoelectricity array element close to the back structure one Side is located at the underface of the corresponding piezoelectricity array element, and between two second electrode units of arbitrary neighborhood The distance between the corresponding two neighboring piezoelectricity array element of distance it is equal.
Optionally, the size of the piezoelectricity array element and thickness depend on frequency required for ultrasonic transducer and acoustics ginseng Number, specifically, when frequency required for the ultrasonic transducer is 0.1MHz-1000MHz, including endpoint value, the piezoelectricity battle array The number of member can be any number, and the size value range of the piezoelectricity array element is 1 μm2-1cm2, including endpoint value；The piezoelectricity 1 μm of -1cm of Thickness range of array element.It should be noted that the parameters,acoustic of the ultrasonic transducer is by piezoelectric ceramics former material The material included attribute of institute and the polarization of producer later period are determined with processing technology.
Optionally, the value range of the number of the piezoelectricity array element is 4-100000000, including endpoint value, the present invention couple This and without limitation, depending on actual conditions.
Based on any of the above embodiments, in an embodiment of the present invention, the back structure is insulation backing knot Structure, preparing material can be common material, for example, common material can be with low-viscosity epoxy resin glue and tungsten powder Mixture；In other embodiments, the material for preparing material and other can also being selected common of the back structure, for example, often The material seen can be the mixture with low-viscosity epoxy resin glue and bismuth oxide, and common material can also be others Mixture, the present invention to this and without limitation, specifically depend on the circumstances.It should be noted that above two prepare material not It is the difference to the absorbability of acoustic wave energy with place.
And for the back structure of same material, the thickness of the back structure is bigger, the corresponding backing knot The volume of structure will be bigger, but can be better to the assimilation effect of repercussions, and the thickness of the back structure is smaller, corresponding described The volume of back structure will be smaller, but will be poorer to the assimilation effect of repercussions, for above situation, in order to obtain smaller body Long-pending back structure, while it being also able to satisfy the requirement of the existing assimilation effect to repercussions, the thickness of the back structure can be set The value range of degree is 0.1mm-10cm, including endpoint value.
Based on any of the above embodiments, in one embodiment of the invention, two neighboring first groove The distance between it is equal with the distance between the two neighboring piezoelectricity rows of array elements corresponding to it so that being each located at first Flexible circuit board in groove is identical as the contact position of the piezoelectricity rows of array elements.It should be noted that two neighboring described The distance between one groove refers to the distance between the central axis of two neighboring first groove；The two neighboring piezoelectricity The distance between rows of array elements refers to the distance between the central axis of two neighboring piezoelectricity rows of array elements.
On the basis of the above embodiments, in one embodiment of the invention, between the two neighboring conducting wire away from From with its corresponding to the distance between two neighboring piezoelectricity array element center variation and change, and two neighboring institute State the distance between conducting wire with its corresponding to the distance between two neighboring piezoelectricity array element center it is always consistent, can Choosing, the distance between two neighboring described conducting wire with its corresponding to the distance between two neighboring piezoelectricity array element center It is equal so that each conducting wire with its corresponding to piezoelectricity array element link position it is essentially identical.
It should be noted that the distance between two neighboring described conducting wire should not be too large, it is also unsuitable too small, if adjacent two The distance between a conducting wire is excessive, can make the volume mistake with the piezoelectric structure of the piezoelectricity array element of same number and size Greatly, and then it is unfavorable for obtaining the ultrasonic transducer of smaller size smaller, if, too small, the meeting of the distance between two neighboring described conducting wire The conducting wire for needing smaller diameter size that is, to the more demanding of conducting wire, and then improves the cost of manufacture of ultrasonic transducer, because This, in embodiments of the present invention, the value range of the distance between two neighboring described conducting wire is 10nm-10mm, including endpoint Value.
In other embodiments of the invention, the ultrasonic transducer further includes being located at back structure far from piezoelectric structure one The integrated circuit board of side, the integrated circuit board are used to fix one end that flexible circuit board stretches out back structure second surface, make The single wire obtained in each flexible circuit board is controllable, to control each piezoelectricity array element；In addition, the integrated circuit board is also For being electrically connected with imaging system, the imaging system on every conducting wire for will be transferred at the signal of the imaging system Reason obtains 3-D image.
Specifically, the back structure has the first surface and second surface being oppositely arranged along the second direction, institute First surface is stated close to the piezoelectric structure, the second surface far from the piezoelectric structure, described flexible circuit board one end with The first surface is concordant, and for being electrically connected with the piezoelectricity array element, the other end stretches out from the second surface, the flexibility The other end of wiring board stretches out from the second surface, for being welded on integrated circuit board, forms multiple solder joints, wherein The number of the solder joint and the number of conducting wire are identical, so that the single wire in each flexible circuit board is controllable, to control Each piezoelectricity array element.Moreover, the ultrasonic transducer further includes the printed circuit board positioned at back structure second surface, wherein institute The other end for stating flexible circuit board stretches out the lower surface for extending to printed circuit board from the second surface, for being welded on product On circuit board body, multiple solder joints are formed, so that the single wire in each flexible circuit board is controllable, to control each piezoelectricity Array element.
Based on any of the above embodiments, in one embodiment of the invention, continue as shown in Fig. 2, described super Sonic transducer further includes the second conductive structure 400 between the piezoelectric structure 100 and the back structure 200, described Second conductive structure 400 includes multiple conductive units, and the conductive unit and the piezoelectricity array element correspond, and is located at the pressure The lower section of electric array element, the piezoelectricity array element are electrically connected by the conductive unit with the conducting wire, it should be noted that described to lead The corresponding piezoelectricity array element of electric unit it is equal in magnitude, positioned at the underface of the corresponding piezoelectricity array element, and The distance between the corresponding two neighboring piezoelectricity array element of the distance between two conductive units of arbitrary neighborhood is equal.
Optionally, the conductive unit in the second conductive structure is made of conducting resinl, both can will be in the piezoelectric structure All piezoelectricity array elements and back structure bonding fit together, and piezoelectricity array element that can be corresponding by all conducting wires Electrical connection.
It should be noted that the multiple conductive unit can independently form, can also be formed simultaneously with piezoelectric structure, from And save technique.
On the basis of the above embodiments, in one embodiment of the invention, continue as shown in Fig. 2, the ultrasound is changed Energy device further includes the first insulation system 500 between the piezoelectricity array element, and first insulation system decouples material by sound insulation Material composition, the string acoustic jamming for fixing between the piezoelectricity array element, and the adjacent piezoelectricity array element of reduction.It needs to illustrate It is to have the first insulation system between the arbitrary neighborhood two piezoelectricity array elements.
On the basis of the above embodiments, in one embodiment of the invention, continue as shown in Fig. 2, the ultrasound is changed Energy device further includes the mating structure 600 for deviating from 200 side of back structure positioned at the piezoelectric structure 100, the matching knot Structure 600 includes single layer matching layer or multi-layer Matched layer.
It should be noted that the mating structure is capable of increasing voice output, increases bandwidth and reduce acoustic attenuation, to subtract The small reflection to the issued signal of detected object, since piezoelectric structure is different from the acoustic impedance of detected object, or even difference It is larger, will cause the massive losses of acoustic wave energy, therefore, it is necessary in piezoelectric structure be arranged mating structure as transition, it is described The acoustic impedance of mating structure is between piezoelectric structure and detected object, to reduce the loss of acoustic wave energy；When piezoelectricity knot When acoustic impedance between structure and detected object differs smaller, the mating structure can be single layer matching layer, when piezoelectric structure and quilt When acoustic impedance difference between detecting object is larger, then multi-layer Matched layer transition is needed, i.e., the described mating structure is multi-layer Matched layer.
Optionally, the matching layer is made of insulating materials, or is constructed from a material that be electrically conducting.
Specifically, the matching layer includes multiple and piezoelectricity array element size when the matching layer is constructed from a material that be electrically conducting Identical matching layer unit, the matching layer unit and piezoelectricity array element correspond, and match between layer unit filled with position The first insulation system between the piezoelectricity array element is also equipped with the first insulation system between that is, described matching layer unit.It needs It is noted that matching layer unit can independently form, and it can also be simultaneously with piezoelectricity array element, conductive unit is formed simultaneously, thus Save technique.
When the matching layer is made of insulating materials, without cutting the matching layer, a whole covering institute can be used as State piezoelectric structure.
On the basis of the above embodiments, continue as shown in Fig. 2, the ultrasonic transducer further includes being located at the matching to tie Acoustic lens 700 on structure 600, the acoustic lens 700 are used to focus the sound wave of the piezoelectricity array element transmitting, and then reach ultrasound and change The focusing effect of energy device.
Based on any of the above embodiments, in one embodiment of the invention, as shown in figure 3, with the piezoelectricity Structure 100 includes the A piezoelectricity rows of array elements along first direction X, right for each piezoelectricity rows of array elements has B piezoelectricity array element 110 The structure of ultrasonic transducer is illustrated, the first groove 210 with a Y in a second direction of A in the back structure 200, institute State the first groove 210 first surface and second surface of the Y through the back structure 200 in a second direction, the first conductive structure 300 are detachably connected with the back structure 200, and the first conductive structure 300 includes A flexible circuit board, each flexible wires Road plate includes B conducting wire 311, and A flexible circuit board is inserted into one by one in A the first grooves 210 of the back structure 200, The flexible circuit board and first groove 210 correspond, and make one end of each flexible circuit board and the back structure 200 first surface is concordant, and the other end stretches out from the second surface, and the piezoelectric structure 100 passes through the second conductive structure It is covered on the first surface of the back structure 200, and the corresponding flexible circuit board of a piezoelectricity rows of array elements, each flexibility Conducting wire 311 in wiring board is electrically connected with the one-to-one correspondence of piezoelectricity array element 110 in piezoelectricity rows of array elements, in the piezoelectricity array element 110 Between be provided with the first insulation system, and be disposed on side of the piezoelectric structure 100 away from the back structure 200 Distribution structure 600 and acoustic lens.
The ultrasonic transducer provided in the embodiment of the present invention, by be arranged in back structure it is multiple in a second direction Through the first groove of the back structure, and first groove and the piezoelectricity rows of array elements correspond；With the backing The first conductive structure that structure is detachably connected includes multiple flexible circuit board, the flexible circuit board and first groove one One is corresponding, and when first conductive structure and the back structure are fixed together, the flexible circuit board is located at described the In one groove, the flexible circuit board has a plurality of conducting wire in a second direction, the conducting wire and institute in said first direction Piezoelectricity array element one-to-one correspondence is stated, positioned at the lower section of the piezoelectricity array element, for being electrically connected with the piezoelectricity array element, to realize institute There is the conducting wire electrical connection that piezoelectricity array element is corresponding, the signal transmission of all piezoelectricity array elements is completed, without individually to each A piezoelectricity array element carries out conducting wire connection, and then optimizes the wiring technique of the piezoelectricity array element of two dimensional array ultrasound energy converter, simplifies The complexity of the wiring technique of piezoelectricity array element, reduces the preparation expense of ultrasonic transducer, meets showing for ultrasonic transducer When demand.
Further, ultrasonic transducer provided by the embodiment of the present invention, without individually being led to each piezoelectricity array element Wire bonding makes the pad in two neighboring piezoelectricity array element be in contact so as to avoid since each piezoelectricity array element is undersized, And cause the problem of short circuit.
In addition, the back structure in the present invention can provide for the conducting wire in flexible circuit board and accurately connect with piezoelectricity array element Position is connect, and the useless sound wave at the piezoelectric patches back side can be absorbed when ultrasonic transducer works simultaneously, it is super to greatly improve two-dimensional array The quality of sonic transducer.
In addition, the first conductive structure is detachably connected with the back structure in the present invention, is arranged in back structure One groove is arranged in a one-to-one correspondence by the flexible circuit board and first groove, so that leading included by flexible circuit board Line is electrically connected with piezoelectricity array element one-to-one correspondence, i.e., the described back structure can fix flexible circuit board, will without mold Flexible circuit board is fixed in advance, and therefore, this kind of back structure is applicable to various different frequencies and various sizes of super The demand of sonic transducer, it is applied widely.
Ultrasonic transducer provided by the embodiment of the present invention can be used for observing heart, provide human heart 3 dimensional drawing Picture, moreover, it is finer to apply also for the observation mankind, volume organ structure less than normal, and corresponding three-dimensional image is provided.
Correspondingly, the present invention also provides a kind of for making the production side of the ultrasonic transducer in any of the above-described embodiment Method, as shown in figure 4, the production method includes:
S10: cutting piezoelectric patches forms piezoelectric structure, the piezoelectric structure includes multiple piezoelectricity array elements along first direction Row, each piezoelectricity rows of array elements includes at least one piezoelectricity array element.
Optionally, the distance between adjacent rows piezoelectricity rows of array elements is equal, i.e., the described piezoelectricity rows of array elements be it is evenly arranged, And piezoelectricity array element included by each piezoelectricity rows of array elements be also it is evenly arranged, i.e., between two piezoelectricity array elements of arbitrary neighborhood away from From equal.
In one embodiment of the invention, the predetermined angle can be 90 °, i.e. third direction and first direction hangs down Directly, in other embodiments of the invention, the predetermined angle can also be other angles, arbitrarily set with specific reference to actual needs It sets, the present invention is to this and is not specifically limited.
Optionally, each piezoelectricity rows of array elements includes multiple piezoelectricity array elements, the number of the piezoelectricity array element in each piezoelectricity rows of array elements Measure identical, also, the piezoelectricity array element in the quantity of the piezoelectricity rows of array elements in the piezoelectric structure and each piezoelectricity rows of array elements Quantity it is equal, with the processing program of the simplification piezoelectric structure, and guarantee each piezoelectricity array element in the piezoelectric structure Height is consistent.Meanwhile so that in single piezoelectricity array element less than 10-1Mm-scale and have huge array element quantity when, by each Conducting wire is possibly realized in the success of piezoelectricity array element and independent connection.Specifically, the size and shape of each piezoelectricity array element is all the same, The shape of piezoelectricity array element can be to be rectangular or round, and the present invention to this and without limitation, specifically depends on the circumstances.
Optionally, the piezoelectric structure can be made of piezoelectric ceramics, piezoelectric monocrystal or piezo-electricity composite material, specifically, The piezo-electricity composite material is 1-3 type piezo-electricity composite material, and in other embodiments of the present invention, the piezoelectric structure can also be by Other satisfactory piezoelectric materials are made, and the present invention to this and without limitation, specifically depends on the circumstances.It should be noted that 1-3 type piezo-electricity composite material has the characteristics such as low-density, high sensitivity.It should be noted that the size of piezoelectric structure is by surpassing The quantity of the frequency of sonic transducer and piezoelectricity array element determines.
Specifically, in one embodiment of the invention, deviating from the one of the back structure positioned at the piezoelectric structure Side is vapor-deposited with first electrode structure, and the first electrode structure is public electrode structure, and the first electrode structure includes multiple First electrode unit, the first electrode unit and the piezoelectric unit correspond, it should be noted that the first electrode The corresponding piezoelectricity array element of unit it is equal in magnitude, positioned at the corresponding piezoelectricity array element deviate from the backing knot Structure side is located at the surface of the corresponding piezoelectricity array element, and two first electrode units of arbitrary neighborhood The distance between the distance between corresponding two neighboring piezoelectricity array element it is equal.
Specifically, in one embodiment of the invention, positioned at the piezoelectric structure close to the one of the back structure Side is vapor-deposited with second electrode structure.The second electrode structure includes multiple second electrode units, the second electrode unit with The piezoelectric unit corresponds, it should be noted that the corresponding piezoelectricity array element of the second electrode unit it is big It is small equal, positioned at the corresponding piezoelectricity array element close to the back structure side, that is, it is located at the corresponding pressure The underface of electric array element, and the corresponding two neighboring pressure of the distance between two described second electrode units of arbitrary neighborhood The distance between electric array element is equal.
It should be noted that the first electrode unit, the piezoelectricity array element and the second electrode unit are simultaneously It is formed, specific production method: when forming multiple first electrode units and second electrode unit, being needed first the two of piezoelectric patches Side (i.e. in a second direction on two surfaces) plating top electrode, i.e., plate first electrode in the side of piezoelectric patches, the other side plates Second electrode is finally cut in the entirety formed to first electrode, piezoelectric patches and second electrode three, forms multiple first Electrode unit, multiple piezoelectricity array elements and multiple second electrode units.
It should be noted that do not allow to the piezoelectric patches the case where polarizing to prevent subsequent technique condition, therefore, Cut piezoelectric patches before, need first on piezoelectric patches first electrode and second electrode polarize, make the piezoelectric patches have pressure Electrical property, in other embodiments of the invention, the raw material of the piezoelectric patches are polarized, and before cutting piezoelectric patches, also To on piezoelectric patches first electrode and second electrode polarize, so as to ensure that the piezoelectric property of the piezoelectric patches (is realized The ability that mechanical energy and electric energy mutually convert) it is maximized.
Optionally, the size of the piezoelectricity array element and thickness depend on frequency required for ultrasonic transducer and acoustics ginseng Number, specifically, when frequency required for the ultrasonic transducer is 0.1MHz-1000MHz, including endpoint value, the piezoelectricity battle array The number of member can be any number, and the size value range of the piezoelectricity array element is 1 μm2-1cm2, including endpoint value；The piezoelectricity 1 μm of -1cm of Thickness range of array element.It should be noted that the parameters,acoustic of the ultrasonic transducer is by piezoelectric ceramics former material The material included attribute of institute and the polarization of producer later period are determined with processing technology.
Optionally, the value range of the number of the piezoelectricity array element is 4-100000000, including endpoint value, the present invention couple This and without limitation, depending on actual conditions.
S20: cutting back sheet forms back structure, and the back structure is located at the lower section of the piezoelectric structure, the back There is the first groove in a second direction in lining structure, first groove runs through the back structure along the second direction, The first direction is vertical with the second direction, and the back structure is recessed with multiple described first on the third direction Slot, first groove and the piezoelectricity rows of array elements correspond, positioned at the lower section of the piezoelectricity rows of array elements, the third direction It is vertical with the second direction, and with the first direction at predetermined angle.
It before cutting the back sheet, needs first to prepare back sheet, need, the back sheet is insulation backing Layer, when the back sheet prepare material be common material when, the method for preparing the back sheet then uses centrifugal method, In, common material can be the mixture with low-viscosity epoxy resin glue and tungsten powder；In other embodiments, when the back When preparing material and can select other common materials of lining, preparation method then uses the common forming method of reality, wherein Common material can be the mixture with low-viscosity epoxy resin glue and bismuth oxide, and common material can also be other Mixture, the present invention to this and without limitation, specifically depends on the circumstances.It should be noted that the above two material of preparing The difference is that the difference of the absorbability to acoustic wave energy.
And for the back structure of same material, the thickness of the back structure is bigger, the corresponding backing knot The volume of structure will be bigger, but can be better to the assimilation effect of repercussions, and the thickness of the back structure is smaller, corresponding described The volume of back structure will be smaller, but will be poorer to the assimilation effect of repercussions, for above situation, in order to obtain smaller body Long-pending back structure, while it being also able to satisfy the requirement of the existing assimilation effect to repercussions, the thickness of the back structure can be set The value range of degree is 0.1mm-10cm, including endpoint value.
S30: the first conductive structure is inserted in first conductive structure, wherein first conductive structure includes more A flexible circuit board, the flexible circuit board and first groove correspond, when first conductive structure and the back When lining structure is fixed together, the flexible circuit board is located in first groove, and the flexible circuit board is described first There is a plurality of conducting wire in a second direction, the conducting wire and the piezoelectricity array element correspond, and are located at the piezoelectricity battle array on direction The lower section of member, for being electrically connected with the piezoelectricity array element, the third direction and the first direction are at predetermined angle.
It should be noted that it includes: by the flexible circuitry that the first conductive structure, which is inserted in first conductive structure, Plate is inserted into one by one in the first groove of back structure.
Based on any of the above embodiments, in one embodiment of the invention, two neighboring first groove The distance between it is equal with the distance between the two neighboring piezoelectricity rows of array elements corresponding to it so that being each located at first Flexible circuit board in groove is identical as the contact position of the piezoelectricity rows of array elements.It should be noted that two neighboring described The distance between one groove refers to the distance between the central axis of two neighboring first groove；The two neighboring piezoelectricity The distance between rows of array elements refers to the distance between the central axis of two neighboring piezoelectricity rows of array elements.
On the basis of the above embodiments, in one embodiment of the invention, between the two neighboring conducting wire away from From with its corresponding to the distance between two neighboring piezoelectricity array element center variation and change, and two neighboring institute State the distance between conducting wire with its corresponding to the distance between two neighboring piezoelectricity array element center it is always consistent, can Choosing, the distance between two neighboring described conducting wire with its corresponding to the distance between two neighboring piezoelectricity array element center It is equal so that each conducting wire with its corresponding to piezoelectricity array element link position it is essentially identical.
It should be noted that the distance between two neighboring described conducting wire should not be too large, it is also unsuitable too small, if adjacent two The distance between a conducting wire is excessive, can make the volume mistake with the piezoelectric structure of the piezoelectricity array element of same number and size Greatly, and then it is unfavorable for obtaining the ultrasonic transducer of smaller size smaller, if, too small, the meeting of the distance between two neighboring described conducting wire The conducting wire for needing smaller diameter size that is, to the more demanding of conducting wire, and then improves the cost of manufacture of ultrasonic transducer, because This, in embodiments of the present invention, the value range of the distance between two neighboring described conducting wire is 10nm-10mm, including endpoint Value.
In other embodiments of the invention, the ultrasonic transducer further includes being located at back structure far from piezoelectric structure one The integrated circuit board of side, the integrated circuit board are used to fix one end that flexible circuit board stretches out back structure second surface, make The single wire obtained in each flexible circuit board is controllable, to control each piezoelectricity array element；In addition, the integrated circuit board is also For being electrically connected with imaging system, the imaging system on every conducting wire for will be transferred at the signal of the imaging system Reason obtains 3-D image.
Specifically, the back structure has the first surface and second surface being oppositely arranged along the second direction, institute First surface is stated close to the piezoelectric structure, the second surface far from the piezoelectric structure, described flexible circuit board one end with The first surface is concordant, and for being electrically connected with the piezoelectricity array element, the other end stretches out from the second surface, the flexibility The other end of wiring board stretches out from the second surface, for being welded on integrated circuit board, forms multiple solder joints, wherein The number of the solder joint and the number of conducting wire are identical, so that the single wire in each flexible circuit board is controllable, to control Each piezoelectricity array element.Moreover, the ultrasonic transducer further includes the printed circuit board positioned at back structure second surface, wherein institute The other end for stating flexible circuit board stretches out the lower surface for extending to printed circuit board from the second surface, for being welded on product On circuit board body, multiple solder joints are formed, so that the single wire in each flexible circuit board is controllable, to control each piezoelectricity Array element.
Based on any of the above embodiments, in one embodiment of the invention, further include, in the piezoelectric structure It forms the second conductive layer between the back structure, cuts second conductive layer, form the second conductive structure, described second Conductive structure includes multiple conductive units, and the conductive unit and the piezoelectricity array element correspond, and is located at the piezoelectricity array element Lower section, the piezoelectricity array element is electrically connected by the conductive unit with the conducting wire.It should be noted that the conductive unit The corresponding piezoelectricity array element it is equal in magnitude, positioned at the underface of the corresponding piezoelectricity array element, and any phase The distance between the corresponding two neighboring piezoelectricity array element of the distance between two adjacent conductive units is equal.
Optionally, second conductive layer is conducting resinl, i.e., the conductive unit in described second conductive structure is by conduction Glue composition, not only can by the piezoelectric structure all piezoelectricity array elements and back structure bonding fit together, but also can The corresponding piezoelectricity array element of all conducting wires to be electrically connected.
It should be noted that the multiple conductive unit can independently form, can also be formed simultaneously with piezoelectric structure, from And technique is saved, specifically, the cutting second conductive layer, comprising: first cut to the piezoelectric patches, then to being located at Second conductive layer below the piezoelectric patches is cut, or is carried out simultaneously to the piezoelectric patches and second conductive layer Cutting.
On the basis of the above embodiments, in one embodiment of the invention, further include, between the piezoelectricity array element Cutting gap in fill insulant, form the first insulation system, first insulation system is made of sound insulation decoupling material, String acoustic jamming for fixing between the piezoelectricity array element, and the adjacent piezoelectricity array element of reduction.
When specific production, in one embodiment of the invention, when forming multiple conductive units, first in back structure The second conductive layer is arranged in first surface, and piezoelectric patches is then formed on the second conductive layer, finally to the piezoelectric patches and described The entirety that both second conductive layers are formed is cut together, and filling sound insulation decoupling material (the i.e. first insulation knot in cutting gap Structure), to reduce interfering with each other between each piezoelectricity array element.
When specific production, in another embodiment of the present invention, when forming multiple conductive units, first in back structure First surface be arranged the second conductive layer, then form piezoelectric patches on the second conductive layer, then the piezoelectric patches cut It cuts, forms piezoelectric structure, finally the second conductive layer is being cut again along the cutting gap in piezoelectric structure, formation has With the conductive unit of piezoelectricity array element corresponding size and position, and in cutting gap filling sound insulation decoupling material (i.e. first insulation Structure), to reduce interfering with each other between each piezoelectricity array element.
It on the basis of the above embodiments, in one embodiment of the invention, further include deviating from institute in the piezoelectric patches The side for stating back structure forms mating structure, and the mating structure includes single layer matching layer or multi-layer Matched layer.
It should be noted that the mating structure is capable of increasing voice output, increases bandwidth and reduce acoustic attenuation, to subtract The small reflection to the issued signal of detected object, since piezoelectric structure is different from the acoustic impedance of detected object, or even difference It is larger, will cause the massive losses of acoustic wave energy, therefore, it is necessary in piezoelectric structure be arranged mating structure as transition, it is described The acoustic impedance of mating structure is between piezoelectric structure and detected object, to reduce the loss of acoustic wave energy；When piezoelectricity knot When acoustic impedance between structure and detected object differs smaller, the mating structure can be single layer matching layer, when piezoelectric structure and quilt When acoustic impedance difference between detecting object is larger, then multi-layer Matched layer transition is needed, i.e., the described mating structure is multi-layer Matched layer.
Optionally, the matching layer is made of insulating materials, or is constructed from a material that be electrically conducting.
When the matching layer is constructed from a material that be electrically conducting, cuts the matching layer and form the multiple and piezoelectricity array element size Identical matching layer unit, the matching layer unit and the piezoelectricity array element correspond, and between the matching layer unit Filled with the first insulation system between the piezoelectricity array element.Optionally, when the matching layer is constructed from a material that be electrically conducting, Cut the matching layer include: first the matching layer is cut, then to be located at the matching layer below the piezoelectric patches It is cut, is finally cut to second conductive layer being located at below the piezoelectric patches, or to the matching layer, institute It states piezoelectric patches and second conductive layer while being cut, to save technique, and the filling sound insulation decoupling in cutting gap Material (i.e. the first insulation system), to reduce interfering with each other between each piezoelectricity array element.
When specific production, in one embodiment of the invention, when forming multiple matching layer units, first by piezoelectric patches with Back structure is fitted and connected by the second conductive layer, then the matching layer being constructed from a material that be electrically conducting is bonded in piezoelectric patches away from backing knot The side of structure, the entirety finally formed to the matching layer, the piezoelectric patches and the second conductive layer three are cut together, and Sound insulation decoupling material is filled to cutting gap, to reduce interfering with each other between each piezoelectricity array element.
When the matching layer is made of insulating materials, without cutting the matching layer, a whole covering institute can be used as State piezoelectric structure.
It on the basis of the above embodiments, further include that acoustic lens is formed in the mating structure, the acoustic lens is used for The sound wave of the piezoelectricity array element transmitting is focused, and then reaches the focusing effect of ultrasonic transducer.
In production method provided by the embodiment of the present invention, cutting back structure makes it have multiple edges on third direction Second direction runs through the first groove of the back structure, and the piezoelectricity rows of array elements in first groove and piezoelectric structure is one by one It is corresponding；It include multiple flexible circuit board with the first conductive structure that the back structure is detachably connected, by the flexible circuitry Plate is inserted into first groove, corresponds its described flexible circuit board and first groove, when the described first conductive knot When structure and the back structure are fixed together, the flexible circuit board is located in first groove, the flexible circuit board There is a plurality of conducting wire in a second direction in said first direction, the conducting wire and the piezoelectricity array element correspond, is located at The lower section of the piezoelectricity array element, for being electrically connected with the piezoelectricity array element, to realize the corresponding conducting wire electricity of piezoelectricity array element Connection completes the signal transmission of all piezoelectricity array elements, without individually carrying out conducting wire connection to each piezoelectricity array element, in turn The wiring technique for optimizing the piezoelectricity array element of two dimensional array ultrasound energy converter simplifies the complexity of the wiring technique of piezoelectricity array element Degree, reduces the preparation expense of ultrasonic transducer.
Further, ultrasonic transducer provided by the embodiment of the present invention, without individually being led to each piezoelectricity array element Wire bonding makes the pad in two neighboring piezoelectricity array element be in contact so as to avoid since each piezoelectricity array element is undersized, And cause the problem of short circuit.
In addition, can be flexible circuit board using back structure obtained by production method provided in an embodiment of the present invention In conducting wire provide with piezoelectricity array element accurately link position, and the piezoelectric patches back side can be absorbed when ultrasonic transducer works simultaneously Useless sound wave, greatly improve the quality of two dimensional array ultrasound energy converter.
In addition, the first conductive structure is detachably connected with the back structure in the present invention, it is cut into back structure First groove is arranged in a one-to-one correspondence, so that included by flexible circuit board by the flexible circuit board and first groove Conducting wire is electrically connected with piezoelectricity array element one-to-one correspondence, i.e., the described back structure can fix flexible circuit board, without mold Flexible circuit board is fixed in advance, therefore, this kind of back structure is applicable to various different frequencies and various sizes of The demand of ultrasonic transducer, it is applied widely.
Various pieces are described in a progressive manner in this specification, and what each some importance illustrated is and other parts Difference, same and similar part may refer to each other between various pieces.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to embodiment illustrated herein, and is to fit to consistent with the principles and novel features disclosed in this article Widest scope.

Claims (19)

1. a kind of ultrasonic transducer characterized by comprising
Piezoelectric structure, the piezoelectric structure include multiple piezoelectricity rows of array elements along first direction, and each piezoelectricity rows of array elements includes extremely Few piezoelectricity array element；
Back structure, the back structure are located at below the piezoelectric structure, have in a second direction in the back structure First groove, first groove run through the back structure, the first direction and the second party along the second direction To vertical, the back structure has multiple first grooves, first groove and the piezoelectricity battle array on third direction First row corresponds, and positioned at the lower section of the piezoelectricity rows of array elements, the third direction is vertical with the second direction, and with it is described First direction is at predetermined angle；
First conductive structure is detachably connected with the back structure, and first conductive structure includes multiple flexible circuit board, The flexible circuit board and first groove correspond, when first conductive structure and the back structure are fixed on one When rising, the flexible circuit board is located in first groove, and the flexible circuit board has a plurality of in said first direction Conducting wire in a second direction, the conducting wire and the piezoelectricity array element correspond, positioned at the lower section of the piezoelectricity array element, for The piezoelectricity array element electrical connection.
2. ultrasonic transducer according to claim 1, which is characterized in that the distance between two neighboring described first groove It is equal with the distance between the two neighboring piezoelectricity rows of array elements corresponding to it.
3. ultrasonic transducer according to claim 2, which is characterized in that the distance between two neighboring described conducting wire and its The distance between corresponding two neighboring piezoelectricity array element center is equal.
4. ultrasonic transducer according to claim 1-3, which is characterized in that the back structure has along described The first surface and second surface that second direction is oppositely arranged, the first surface is close to the piezoelectric structure, second table Far from the piezoelectric structure, described flexible circuit board one end is concordant with the first surface in face, and the other end is from the second surface Place is stretched out.
5. ultrasonic transducer according to claim 4, which is characterized in that further include being located at the piezoelectric structure and the back The second conductive structure between lining structure, second conductive structure include multiple conductive units, the conductive unit with it is described Piezoelectricity array element corresponds, and positioned at the lower section of the piezoelectricity array element, the piezoelectricity array element is led by the conductive unit with described Line electrical connection.
6. ultrasonic transducer according to claim 5, which is characterized in that further include between the piezoelectricity array element One insulation system, first insulation system are made of sound insulation decoupling material, for fixing the piezoelectricity array element, and reduction phase String acoustic jamming between the adjacent piezoelectricity array element.
7. ultrasonic transducer according to claim 6, which is characterized in that further include being located at the piezoelectric structure away from described The mating structure of back structure side, the mating structure include single layer matching layer or multi-layer Matched layer.
8. ultrasonic transducer according to claim 7, which is characterized in that the matching layer is made of insulating materials, or by Conductive material is constituted,
When the matching layer is constructed from a material that be electrically conducting, the matching layer includes multiple matching layers identical with piezoelectricity array element size Unit, the matching layer unit and piezoelectricity array element correspond, and filled with positioned at the pressure between the matching layer unit The first insulation system between electric array element.
9. ultrasonic transducer according to claim 7, which is characterized in that further include that sound in the mating structure is saturating Mirror, the acoustic lens are used to focus the sound wave of the piezoelectricity array element transmitting.
10. a kind of production method of ultrasonic transducer characterized by comprising
Piezoelectric patches is cut, forms piezoelectric structure, the piezoelectric structure includes multiple piezoelectricity rows of array elements along first direction, each pressure Electric rows of array elements includes at least one piezoelectricity array element；
Back sheet is cut, back structure is formed, the back structure is located at the lower section of the piezoelectric structure, in the back structure With the first groove in a second direction, first groove along the second direction run through the back structure, described first Direction is vertical with the second direction, and the back structure has multiple first grooves on the third direction, described First groove and the piezoelectricity rows of array elements correspond, positioned at the lower section of the piezoelectricity rows of array elements, the third direction with it is described Second direction is vertical, and with the first direction at predetermined angle；
First conductive structure is inserted in first conductive structure, wherein first conductive structure includes multiple flexible wires Road plate, the flexible circuit board and first groove correspond, when first conductive structure and the back structure are solid When being scheduled on together, the flexible circuit board is located in first groove, and the flexible circuit board has in said first direction There is an a plurality of conducting wire in a second direction, the conducting wire and the piezoelectricity array element correspond, positioned at the lower section of the piezoelectricity array element, For being electrically connected with the piezoelectricity array element.
11. manufacturing method according to claim 10, which is characterized in that the distance between two neighboring described first groove It is equal with the distance between the two neighboring piezoelectricity rows of array elements corresponding to it.
12. production method according to claim 11, which is characterized in that the distance between two neighboring described conducting wire and its The distance between corresponding two neighboring piezoelectricity array element center is equal.
13. the described in any item production methods of 0-12 according to claim 1, which is characterized in that the back structure has along institute State the first surface and second surface that second direction is oppositely arranged, the first surface is close to the piezoelectric structure, and described second Far from the piezoelectric structure, described flexible circuit board one end is concordant with the first surface on surface, and the other end is from second table It is stretched out at face.
14. production method according to claim 13, which is characterized in that further include, in the piezoelectric patches and the backing The second conductive layer is formed between structure, cuts second conductive layer, forms the second conductive structure, the second conductive structure packet Multiple conductive units are included, the conductive unit and the piezoelectricity array element correspond, described positioned at the lower section of the piezoelectricity array element Piezoelectricity array element is electrically connected by the conductive unit with the conducting wire.
15. production method according to claim 14, which is characterized in that the cutting second conductive layer forms the Two conductive structures, comprising: first the piezoelectric patches is cut, then to second conductive layer being located at below the piezoelectric patches It is cut, or the piezoelectric patches and second conductive layer is cut simultaneously.
16. manufacturing method according to claim 15, which is characterized in that further include cutting between the piezoelectricity array element Fill insulant in slot gap, forms the first insulation system, and first insulation system is made of sound insulation decoupling material, is used for The fixed piezoelectricity array element, and reduce the string acoustic jamming between the adjacent piezoelectricity array element.
17. production method according to claim 16, which is characterized in that further include deviating from the back in the piezoelectric patches The side of lining structure forms mating structure, and the mating structure includes single layer matching layer or multi-layer Matched layer.
18. production method according to claim 17, which is characterized in that the matching layer is made of insulating materials, or by Conductive material is constituted,
When the matching layer is constructed from a material that be electrically conducting, cut the matching layer formed it is multiple identical as the piezoelectricity array element size Matching layer unit, the matching layer unit and the piezoelectricity array element correspond, and fill between the matching layer unit Have the first insulation system between the piezoelectricity array element, the cutting matching layer include: first to the matching layer into Row cutting, then the piezoelectric patches being located at below the matching layer is cut, finally to below the piezoelectric patches Second conductive layer cut, or to the matching layer, the piezoelectric patches and second conductive layer simultaneously cut It cuts.
19. production method according to claim 18, which is characterized in that further include the formation sound in the mating structure Lens, the acoustic lens are used to focus the sound wave of the piezoelectricity array element transmitting.
CN201910339051.XA 2019-04-25 2019-04-25 Ultrasonic transducer and preparation method thereof Active CN110026329B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910339051.XA CN110026329B (en) 2019-04-25 2019-04-25 Ultrasonic transducer and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910339051.XA CN110026329B (en) 2019-04-25 2019-04-25 Ultrasonic transducer and preparation method thereof

Publications (2)

Publication Number Publication Date
CN110026329A true CN110026329A (en) 2019-07-19
CN110026329B CN110026329B (en) 2021-08-31

Family

ID=67240189

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910339051.XA Active CN110026329B (en) 2019-04-25 2019-04-25 Ultrasonic transducer and preparation method thereof

Country Status (1)

Country Link
CN (1) CN110026329B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110475188A (en) * 2019-07-30 2019-11-19 吕舒晗 A kind of flexible piezoelectric energy converter and system
CN110721891A (en) * 2019-10-29 2020-01-24 深圳市索诺瑞科技有限公司 Ultrasonic transducer processing method
CN111359861A (en) * 2020-01-15 2020-07-03 中国科学院微电子研究所 Ultrasonic transducer array
CN113042348A (en) * 2021-03-29 2021-06-29 聚融医疗科技(杭州)有限公司 Ultrasonic transducer and preparation method thereof
CN114101018A (en) * 2021-11-25 2022-03-01 福州大学 Metamaterial acoustic lens phased array transducer and method for improving focus sound pressure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030085635A1 (en) * 2000-11-15 2003-05-08 Richard Davidsen Multidimensional ultrasonic transducer arrays
US6640634B2 (en) * 2000-03-31 2003-11-04 Kabushiki Kaisha Toshiba Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus
US20090034370A1 (en) * 2007-08-03 2009-02-05 Xiaocong Guo Diagnostic ultrasound transducer
EP2266712A1 (en) * 2009-06-23 2010-12-29 Medison Co., Ltd. Transducer for ultrasonic diagnosis device and method for manufacturing the same
CN105411623A (en) * 2015-12-25 2016-03-23 中国科学院深圳先进技术研究院 Two-dimensional area array ultrasonic transducer and manufacturing method thereof
CN107638195A (en) * 2017-09-28 2018-01-30 深圳市华琥技术有限公司 Flexible PCB ultrasonic transducer and EUS

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6640634B2 (en) * 2000-03-31 2003-11-04 Kabushiki Kaisha Toshiba Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus
US20030085635A1 (en) * 2000-11-15 2003-05-08 Richard Davidsen Multidimensional ultrasonic transducer arrays
US20090034370A1 (en) * 2007-08-03 2009-02-05 Xiaocong Guo Diagnostic ultrasound transducer
EP2266712A1 (en) * 2009-06-23 2010-12-29 Medison Co., Ltd. Transducer for ultrasonic diagnosis device and method for manufacturing the same
CN105411623A (en) * 2015-12-25 2016-03-23 中国科学院深圳先进技术研究院 Two-dimensional area array ultrasonic transducer and manufacturing method thereof
CN107638195A (en) * 2017-09-28 2018-01-30 深圳市华琥技术有限公司 Flexible PCB ultrasonic transducer and EUS

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110475188A (en) * 2019-07-30 2019-11-19 吕舒晗 A kind of flexible piezoelectric energy converter and system
CN110721891A (en) * 2019-10-29 2020-01-24 深圳市索诺瑞科技有限公司 Ultrasonic transducer processing method
CN110721891B (en) * 2019-10-29 2021-11-05 深圳市索诺瑞科技有限公司 Ultrasonic transducer processing method
CN111359861A (en) * 2020-01-15 2020-07-03 中国科学院微电子研究所 Ultrasonic transducer array
CN113042348A (en) * 2021-03-29 2021-06-29 聚融医疗科技(杭州)有限公司 Ultrasonic transducer and preparation method thereof
CN113042348B (en) * 2021-03-29 2022-02-22 聚融医疗科技(杭州)有限公司 Ultrasonic transducer and preparation method thereof
CN114101018A (en) * 2021-11-25 2022-03-01 福州大学 Metamaterial acoustic lens phased array transducer and method for improving focus sound pressure

Also Published As

Publication number Publication date
CN110026329B (en) 2021-08-31

Similar Documents

Publication Publication Date Title
CN110026329A (en) Ultrasonic transducer and preparation method thereof
CN105596027B (en) Two dimensional array ultrasound energy converter based on 3-D supersonic imaging and preparation method thereof
CN103946996B (en) The method of ultrasonic transducer and manufacture ultrasonic transducer
JP4869257B2 (en) Ultrasonic transducer array
CN105411623A (en) Two-dimensional area array ultrasonic transducer and manufacturing method thereof
US7103960B2 (en) Method for providing a backing member for an acoustic transducer array
US20030085635A1 (en) Multidimensional ultrasonic transducer arrays
US6640634B2 (en) Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus
US5704105A (en) Method of manufacturing multilayer array ultrasonic transducers
US20040048470A1 (en) Interconnection devices for ultrasonic matrix array transducers
CN101380627A (en) Ultrasonic probe and ultrasonic imaging apparatus
CN105127082A (en) Ultrasonic transducer and manufacturing method thereof
CN103371850A (en) Ultrasonic transducer, ultrasonic probe, and ultrasound image diagnosis apparatus
CN207271582U (en) The ultrasonic array probe and its ultrasonic transducer and ultrasonic image-forming system of more array elements
JP2009130611A (en) Ultrasonic probe, ultrasonic diagnostic device, and method of manufacturing ultrasonic probe
CN105640588B (en) The extensive ultrasonic plane array of deep brain stimulation and neuromodulation probe and preparation method thereof
JP3288815B2 (en) 2D array ultrasonic probe
CN103041978A (en) Focusing ultrasonic transducer and producing method thereof
CN106824735A (en) A kind of two dimensional array ultrasound probe and preparation method thereof
JP6023581B2 (en) Ultrasonic vibrator unit and manufacturing method thereof
JP2004363746A (en) Ultrasonic probe and its manufacturing method
JP2005027752A (en) Piezoelectric vibrator, manufacturing method of piezoelectric vibrator, ultrasonic probe, and ultrasonic diagnostic apparatus
KR102093248B1 (en) Ultrasound prove array and fabrication method of thereof
KR20200081768A (en) Ultrasonic probe
Ratsimandresy et al. A 3 MHz two dimensional array based on piezocomposite for medical imaging

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant