CN108864975B - Degumming method - Google Patents
Degumming method Download PDFInfo
- Publication number
- CN108864975B CN108864975B CN201810845929.2A CN201810845929A CN108864975B CN 108864975 B CN108864975 B CN 108864975B CN 201810845929 A CN201810845929 A CN 201810845929A CN 108864975 B CN108864975 B CN 108864975B
- Authority
- CN
- China
- Prior art keywords
- film
- visbreaking
- adhesive
- residual
- degumming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims abstract description 13
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 48
- 239000007787 solid Substances 0.000 claims description 31
- 229920001971 elastomer Polymers 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 239000012948 isocyanate Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 claims description 3
- 229920000800 acrylic rubber Polymers 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 40
- 239000000853 adhesive Substances 0.000 description 33
- 230000001070 adhesive effect Effects 0.000 description 33
- 239000012790 adhesive layer Substances 0.000 description 11
- 239000002313 adhesive film Substances 0.000 description 9
- 230000000181 anti-adherent effect Effects 0.000 description 9
- 150000002513 isocyanates Chemical class 0.000 description 9
- 239000003522 acrylic cement Substances 0.000 description 8
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 7
- 238000010030 laminating Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000004800 polyvinyl chloride Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- -1 abbreviated as HMPP) Chemical compound 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a degumming method. The degumming method comprises the following steps: A) attaching the UV anti-sticking film to the surface to be degummed; B) irradiating the UV light-reducing film with UV light, and subsequently removing the UV light-reducing film; wherein the UV visbreaking film has a 180 DEG peel strength of 7-15N/25mm prior to the UV irradiation. The degumming method of the invention can remove the residual on the surface of the pasted material with high efficiency, convenience and low risk, and has good degumming effect and low residual rate of residual gum.
Description
Technical Field
The invention relates to a degumming method, in particular to a degumming method by using a UV visbreaking film.
Background
With the rapid development of the adhesive industry, the anti-adhesive film has been widely applied to the surface protection of semiconductors, lithium batteries and various modules. The UV anti-adhesive film is a special adhesive tape which has high peel strength in use and can rapidly lose adhesiveness after being irradiated by UV light, and the UV anti-adhesive film usually plays a role in protecting and supporting through adhesive fixation in the process of processing a wafer material.
In scientific research and actual production, the phenomena of surface residual gum, degumming and the like inevitably occur, and how to remove the residual gum efficiently and environmentally becomes a problem which is more and more concerned by people. At present, most of methods for removing residual gum on the surface of an object to be pasted and degumming in the industry are to wipe off the residual gum on the surface of the object to be pasted by using an organic solvent, and the residual gum is wiped off by using the organic solvent, so that the surface of the object to be pasted is easy to damage due to risks of corroding the surface of the object to be pasted and the like.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
The invention aims to provide a degumming method which is simple to operate, can remove residues on the surface of a pasted object efficiently, conveniently and at low risk, and has good degumming effect and low residual rate of residual gum.
The degumming method provided by the invention comprises the following steps:
A) attaching the UV anti-sticking film to the surface to be degummed;
B) irradiating the UV light-reducing film with UV light, and subsequently removing the UV light-reducing film;
wherein the UV visbreaking film has a 180 DEG peel strength of 7-15N/25mm prior to the UV irradiation.
The degumming method is mainly used for removing residual UV glue (hereinafter referred to as residual glue) on the surface of the base material; it is understood that the surface to be degummed is a surface having a residual gum or a surface to be degummed on a substrate. The composition of the substrate and the residual UV glue are not strictly limited, and the substrate can be, for example, quad flat non-leaded package (QFN), Printed Circuit Board (PCB), stainless steel (SUS), GLASS (GLASS), and the like.
The degumming method of the invention is carried out by adopting the UV visbreaking film with 180-degree peel strength of 7-15N/25 mm. If the 180 DEG peel strength is too large (more than 15N/25mm), although the adhesive force is strong, residual glue is easy to form; if the peel strength is too small (less than 7N/25mm), the residual adhesive is not easily removed.
The degumming method of the invention is carried out by adopting the UV visbreaking film with proper 180-degree peel strength; before UV irradiation, the adhesive can be well attached to the surface to be degummed, after UV irradiation, the peeling strength of the UV adhesive reducing film can be obviously reduced, and meanwhile, the residual adhesive is subjected to secondary curing and is attached to the UV adhesive reducing film, so that the residual adhesive on the surface to be degummed can be well removed when the UV adhesive reducing film is removed.
In the present invention, the UV vis-breaking film has a conventional structure; specifically, the UV anti-adhesive film may include, for example, a substrate layer, a UV anti-adhesive layer, and a release film layer, which are sequentially attached. Preferably, the adhesive layer of the UV adhesive reducing film of the present invention may use an adhesive layer having a small TG value.
In a specific embodiment of the invention, the UV anti-adhesive film comprises an adhesive layer (i.e., a UV anti-adhesive layer), wherein the adhesive layer comprises virgin rubber, a photoinitiator and a curing agent; wherein the dosage of the photoinitiator is 1-3% of the solid content of the virgin rubber. Namely, the dosage of the photoinitiator is 1-3% of the virgin rubber based on 100% of solid content.
Further, the photoinitiator may be selected from at least one of TPO (i.e., 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide), MBF (i.e., methyl benzoylformate), photoinitiator 1173 (i.e., 2-hydroxy-2-methyl-1-phenyl-1-propanone, abbreviated as HMPP), and photoinitiator 184 (i.e., 1-hydroxycyclohexylphenylketone, abbreviated as HCPK).
The adhesive layer containing the photoinitiator can ensure that the UV adhesive film has proper 180-degree peeling strength after UV irradiation, thereby being easy to peel.
In the specific scheme of the invention, the dosage of the curing agent is 0.2-0.8% of the solid content of the virgin rubber; namely, the dosage of the curing agent is 0.2-0.8% of the solid content of the virgin rubber by 100% of the solid content. Further, the curing agent may be an isocyanate curing agent.
The adhesive layer containing the curing agent can ensure that the UV adhesive reducing film has proper 180-degree peel strength before UV irradiation, so that the residual adhesive on the surface to be degummed can be well removed.
In the present invention, the raw gum may be generally used in the conventional components in the art, and for example, acryl gum and the like may be used as the raw gum.
In addition, it is understood that the UV anti-adhesive film further includes a substrate layer, and the material of the substrate layer is selected from polyvinyl chloride (PVC), Polyolefin (PO), ethylene-vinyl acetate copolymer (EVA), and the like.
The substrate layer can be well attached to the surface to be degummed, and the removal rate of the residual gum is improved.
The thickness of each layer of the UV visbreaking film is not strictly limited, wherein: the thickness of the base material layer may be, for example, about 100 μm; the thickness of the UV vis-breaking adhesive layer may be, for example, about 20 μm; the thickness of the release film layer may be, for example, about 38 μm.
In the present invention, step a) may comprise:
pasting the UV anti-sticking film on the surface to be degummed;
and pressing the surface to be degummed which is pasted with the UV degummed film.
The pressure application method and conditions are not limited, and the UV anti-adhesive film can be attached to the surface of the residual adhesive to facilitate the degumming, and for example, the pressure application can be performed by a method of applying pressure by a weight, applying pressure by air pressure, or the like.
The invention does not strictly limit the UV irradiation conditions; wherein the UV irradiation dose is more than 200mJ/cm2Namely, the peeling strength of the UV adhesive reducing film can be remarkably reduced, so that the residual adhesive on the surface to be degummed can be well removed when the UV adhesive reducing film is removed, and the removal rate of the residual adhesive is high.
In the present invention, the 180 DEG peel strength of the UV pressure-sensitive adhesive film before the UV irradiation is less than 1N/25mm, preferably 0.2N/25mm or less, and more preferably 0.1N/25mm or less.
The degumming method of the invention adopts the UV visbreaking film, and is particularly suitable for removing residual glue such as UV glue and the like on the surface of the base material; the peeling strength of the UV adhesive reducing film is proper, the UV adhesive reducing film can be well attached to a surface to be degummed, in addition, the peeling strength after UV irradiation can be remarkably reduced, the residual adhesive is subjected to two-stage curing and is attached to the UV adhesive reducing film, so that the residual adhesive on the surface to be degummed can be well removed when the UV adhesive reducing film is removed, and the residual adhesive removing rate is high.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The UV visbreaking film of this embodiment is including the substrate layer, the UV visbreaking glue film of laminating in proper order and from the type rete, and wherein the material of substrate layer is PVC, and the constitution of glue film is as follows:
acrylic adhesive (solid content about 40%): 100 parts of (A);
photoinitiator TPO: 0.8 part (namely 2 percent of the solid content of the virgin rubber);
isocyanate curing agent: 0.2 parts (i.e. 0.5% of the solids content of the virgin rubber).
The thickness of the base material layer is about 100 μm; the thickness of the UV visbreaking glue layer is about 20 mu m; the thickness of the release film layer is about 38 mu m.
The degumming method of the embodiment adopts the UV visbreaking film to carry out the residual UV glue on the surface of the SUS plate, and the degumming steps are as follows:
attaching the UV anti-sticking film on the surface to be degummed of the SUS plate with the UV residual glue, and applying pressure to the surface to be degummed with the UV anti-sticking film for about 5min to ensure that the UV anti-sticking film is fully attached to the surface of the residual glue; subsequently, 250mJ/cm was used2UV light with left and right irradiation dose irradiates the UV adhesive reducing film adhered on the surface of the adhered object to reduce the stripping force; and finally, removing the UV visbreaking film to finish the degumming operation.
The 180 DEG peel strength of the UV visbreaking film before and after irradiation was measured by GB/T2792-1998 method, and the condition of the residual gum after degumming was measured by a microscope (200/50/10 times magnification), and the results are shown in Table 1.
Example 2
The UV visbreaking film of this embodiment is including the substrate layer, the UV visbreaking glue film of laminating in proper order and from the type rete, and wherein the material of substrate layer is EVA, and the constitution of glue film is as follows:
acrylic adhesive (solid content about 40%): 100 parts of (A);
photoinitiator 1173: 1.2 parts (i.e. 3% of the solids content of the virgin rubber);
isocyanate curing agent: 0.32 parts (i.e. 0.8% of the solids content of the virgin rubber).
The thickness of the base material layer is about 100 μm; the thickness of the UV visbreaking glue layer is about 25 mu m; the thickness of the release film layer is about 50 μm.
The degumming method of the embodiment adopts the UV visbreaking film to carry out the residual UV glue on the surface of the glass plate, and the degumming steps are as follows:
pasting the UV anti-sticking film on the surface to be degummed of the glass plate with the UV residual glue, and applying pressure to the surface to be degummed pasted with the UV anti-sticking film for about 10min to ensure that the UV anti-sticking film is fully pasted on the surface of the residual glue; subsequently, 220mJ/cm was used2UV light with left and right irradiation dose irradiates the UV adhesive reducing film adhered on the surface of the adhered object to reduce the stripping force; and finally, removing the UV visbreaking film to finish the degumming operation.
The 180 DEG peel strength of the UV visbreaking film before and after irradiation was measured by GB/T2792-1998 method, and the condition of the residual gum after degumming was measured by a microscope (200/50/10 times magnification), and the results are shown in Table 1.
Example 3
The UV visbreaking film of this embodiment is including the substrate layer, the UV visbreaking glue film of laminating in proper order and from the type rete, and wherein the material of substrate layer is PVC, and the constitution of glue film is as follows:
acrylic adhesive (solid content about 40%): 100 parts of (A);
photoinitiator MBF: 0.4 part (i.e. 1% of the solids content of the virgin rubber);
isocyanate curing agent: 0.24 parts (i.e. 0.6% of the solids content of the virgin rubber).
The thickness of the base material layer is about 100 μm; the thickness of the UV visbreaking glue layer is about 22 mu m; the thickness of the release film layer is about 40 μm.
The degumming method of the embodiment adopts the UV visbreaking film to carry out the residual UV glue on the surface of the SUS plate, and the degumming steps are as follows:
attaching the UV anti-sticking film on the surface to be degummed of the SUS plate with the UV residual glue, and applying pressure to the surface to be degummed with the UV anti-sticking film for about 8min to ensure that the UV anti-sticking film is fully attached to the surface of the residual glue; subsequently, 300mJ/cm was used2UV light with left and right irradiation dose irradiates the UV adhesive reducing film adhered on the surface of the adhered object to reduce the stripping force; and finally, removing the UV visbreaking film to finish the degumming operation.
The 180 DEG peel strength of the UV visbreaking film before and after irradiation was measured by GB/T2792-1998 method, and the condition of the residual gum after degumming was measured by a microscope (200/50/10 times magnification), and the results are shown in Table 1.
Example 4
The UV visbreaking film of this embodiment is including the substrate layer, the UV visbreaking glue film of laminating in proper order and from type rete, and wherein the material of substrate layer is PO, and the constitution of glue film is as follows:
acrylic adhesive (solid content about 40%): 100 parts of (A);
photoinitiator 184: 0.6 part (namely 1.5 percent of the solid content of the virgin rubber);
isocyanate curing agent: 0.08 parts (i.e. 0.2% of the solids content of the virgin rubber).
The thickness of the base material layer is about 100 μm; the thickness of the UV visbreaking glue layer is about 20 mu m; the thickness of the release film layer is about 40 μm.
The degumming method of the embodiment adopts the UV visbreaking film to carry out the residual UV glue on the surface of the SUS plate, and the degumming steps are as follows:
attaching the UV anti-sticking film on the surface to be degummed of the SUS plate with the UV residual glue, and applying pressure to the surface to be degummed with the UV anti-sticking film for about 5min to ensure that the UV anti-sticking film is fully attached to the surface of the residual glue; subsequently, 280mJ/cm was used2UV light with left and right irradiation dose irradiates the UV adhesive reducing film adhered on the surface of the adhered object to reduce the stripping force; and finally, removing the UV visbreaking film to finish the degumming operation.
The 180 DEG peel strength of the UV visbreaking film before and after irradiation was measured by GB/T2792-1998 method, and the condition of the residual gum after degumming was measured by a microscope (200/50/10 times magnification), and the results are shown in Table 1.
Example 5
The UV visbreaking film of this embodiment is including the substrate layer, the UV visbreaking glue film of laminating in proper order and from the type rete, and wherein the material of substrate layer is PVC, and the constitution of glue film is as follows:
acrylic adhesive (solid content about 40%): 100 parts of (A);
photoinitiator TPO: 1.0 part (i.e. 2.5% of the solids content of the virgin rubber);
isocyanate curing agent: 0.16 parts (i.e. 0.4% of the solids content of the virgin rubber).
The thickness of the base material layer is about 100 μm; the thickness of the UV visbreaking glue layer is about 20 mu m; the thickness of the release film layer is about 38 mu m.
The degumming method of the embodiment adopts the UV visbreaking film to carry out the residual UV glue on the surface of the PCB board, and the degumming steps are as follows:
pasting the UV anti-sticking film on the surface to be degummed of the PCB with the UV residual glue, and applying pressure to the surface to be degummed pasted with the UV anti-sticking film for about 5min to ensure that the UV anti-sticking film is fully pasted on the surface of the residual glue; subsequently, 250mJ/cm was used2UV light with left and right irradiation dose irradiates the UV adhesive reducing film adhered on the surface of the adhered object to reduce the stripping force; and finally, removing the UV visbreaking film to finish the degumming operation.
The 180 DEG peel strength of the UV visbreaking film before and after irradiation was measured by GB/T2792-1998 method, and the condition of the residual gum after degumming was measured by a microscope (200/50/10 times magnification), and the results are shown in Table 1.
Example 6
The UV visbreaking film of this embodiment is including the substrate layer, the UV visbreaking glue film of laminating in proper order and from the type rete, and wherein the material of substrate layer is PVC, and the constitution of glue film is as follows:
acrylic adhesive (solid content about 40%): 100 parts of (A);
photoinitiator TPO: 0.8 part (namely 2 percent of the solid content of the virgin rubber);
isocyanate curing agent: 0.12 parts (i.e. 0.3% of the solids content of the virgin rubber).
The thickness of the base material layer is about 100 μm; the thickness of the UV visbreaking glue layer is about 20 mu m; the thickness of the release film layer is about 38 mu m.
The degumming method of the embodiment adopts the UV visbreaking film to carry out the residual UV glue on the surface of the QFN board, and the degumming steps are as follows:
attaching the UV anti-sticking film on the surface to be degummed of the QFN plate with the UV residual glue, and applying pressure to the surface to be degummed with the UV anti-sticking film for about 5min to ensure that the UV anti-sticking film is fully attached to the surface of the residual glue; subsequently, 250mJ/cm was used2UV light with left and right irradiation dose irradiates the UV adhesive reducing film adhered on the surface of the adhered object to reduce the stripping force; and finally, removing the UV visbreaking film to finish the degumming operation.
The 180 DEG peel strength of the UV visbreaking film before and after irradiation was measured by GB/T2792-1998 method, and the condition of the residual gum after degumming was measured by a microscope (200/50/10 times magnification), and the results are shown in Table 1.
Comparative example 1
The comparative example was the same as example 1 except that the composition of the adhesive layer in the UV vis-broken film was different from that in example 1.
Wherein, the composition of the glue layer in the UV adhesive reducing film of the comparison example is as follows:
acrylic adhesive (solid content about 40%): 100 parts of (A);
photoinitiator TPO: 0.8 part (namely 2 percent of the solid content of the virgin rubber);
isocyanate curing agent: 0.06 part (i.e. 0.15% of the solids content of the virgin rubber).
The 180 DEG peel strength of the UV visbreaking film before and after irradiation was measured by GB/T2792-1998 method, and the condition of the residual gum after degumming was measured by a microscope (200/50/10 times magnification), and the results are shown in Table 1.
Comparative example 2
The comparative example was the same as example 5 except that the composition of the adhesive layer in the UV tack-reducing film was different from that in example 5.
Wherein, the composition of the glue layer in the UV adhesive reducing film of the comparison example is as follows:
acrylic adhesive (solid content about 40%): 100 parts of (A);
photoinitiator TPO: 1.0 part (i.e. 2.5% of the solids content of the virgin rubber);
isocyanate curing agent: 0.8 part (i.e. 2% of the solids content of the virgin rubber).
The 180 DEG peel strength of the UV visbreaking film before and after irradiation was measured by GB/T2792-1998 method, and the condition of the residual gum after degumming was measured by a microscope (200/50/10 times magnification), and the results are shown in Table 1.
TABLE 1 peeling Strength and residual glue ratio test results of UV subtractive adhesive films
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (4)
1. A degumming method is characterized by comprising the following steps:
A) attaching the UV anti-sticking film to the surface to be degummed;
B) irradiating the UV light-reducing film with UV light, and subsequently removing the UV light-reducing film;
wherein the UV visbreaking film has a 180 DEG peel strength of 7-15N/25mm prior to the UV irradiation;
the UV visbreaking film comprises a glue layer, and the glue layer comprises virgin glue, a photoinitiator and a curing agent; wherein,
the dosage of the photoinitiator is 1-3% of the solid content of the virgin rubber;
the photoinitiator is at least one selected from TPO, MBF, a photoinitiator 1173 and a photoinitiator 184;
the dosage of the curing agent is 0.2-0.8% of the solid content of the virgin rubber;
the curing agent is an isocyanate curing agent;
the virgin rubber is acrylic rubber;
the UV visbreaking film further comprises a substrate layer, and the material of the substrate layer is selected from PVC, PO or EVA.
2. The degumming process according to claim 1, wherein step a) comprises:
pasting the UV anti-sticking film on the surface to be degummed;
and pressing the surface to be degummed which is pasted with the UV degummed film.
3. Degumming process according to claim 1, characterized in that the irradiation of the UV irradiation is more than 200mJ/cm2。
4. The degumming process according to claim 1, wherein the UV visbreaking film has a 180 ° peel strength of less than 1N/25mm before the UV irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810845929.2A CN108864975B (en) | 2018-07-27 | 2018-07-27 | Degumming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810845929.2A CN108864975B (en) | 2018-07-27 | 2018-07-27 | Degumming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108864975A CN108864975A (en) | 2018-11-23 |
| CN108864975B true CN108864975B (en) | 2020-11-10 |
Family
ID=64306218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810845929.2A Active CN108864975B (en) | 2018-07-27 | 2018-07-27 | Degumming method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108864975B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110330919A (en) * | 2019-07-03 | 2019-10-15 | 昆山博益鑫成高分子材料有限公司 | A kind of UV visbreaking glue |
| CN111234744A (en) * | 2020-03-16 | 2020-06-05 | 佛山市佳世达薄膜科技有限公司 | Efficient UV (ultraviolet) detackifying protective film and preparation method thereof |
| CN111693368A (en) * | 2020-06-15 | 2020-09-22 | 苏州高泰电子技术股份有限公司 | Test method for microscopic characterization performance of wafer cutting adhesive tape |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012024975A (en) * | 2010-07-21 | 2012-02-09 | Alliance Material Co Ltd | Process for producing flexible substrate, and double-sided tape used therefor |
| CN105778806A (en) * | 2016-03-18 | 2016-07-20 | 张家港康得新光电材料有限公司 | Heat-resistant UV visbreaking glue composition and UV visbreaking protective film |
| CN108192524A (en) * | 2018-02-02 | 2018-06-22 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings film and preparation method thereof |
| CN108276923A (en) * | 2018-02-02 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings composition, UV visbreaking films and preparation method thereof |
| CN108300336A (en) * | 2018-02-02 | 2018-07-20 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings composition, UV visbreaking films and preparation method thereof |
| CN108300352A (en) * | 2018-02-02 | 2018-07-20 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings composition of acid and alkali-resistance, UV visbreaking films and preparation method thereof |
-
2018
- 2018-07-27 CN CN201810845929.2A patent/CN108864975B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012024975A (en) * | 2010-07-21 | 2012-02-09 | Alliance Material Co Ltd | Process for producing flexible substrate, and double-sided tape used therefor |
| CN105778806A (en) * | 2016-03-18 | 2016-07-20 | 张家港康得新光电材料有限公司 | Heat-resistant UV visbreaking glue composition and UV visbreaking protective film |
| CN108192524A (en) * | 2018-02-02 | 2018-06-22 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings film and preparation method thereof |
| CN108276923A (en) * | 2018-02-02 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings composition, UV visbreaking films and preparation method thereof |
| CN108300336A (en) * | 2018-02-02 | 2018-07-20 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings composition, UV visbreaking films and preparation method thereof |
| CN108300352A (en) * | 2018-02-02 | 2018-07-20 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings composition of acid and alkali-resistance, UV visbreaking films and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| Adhesion performance of UV-cured semi-IPN structure acrylic pressure sensitive adhesives;Joo, HS等;《JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY》;20061231;第20卷(第14期);第1573-1594页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108864975A (en) | 2018-11-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108864975B (en) | Degumming method | |
| JP5607847B1 (en) | Adhesive tape for semiconductor processing | |
| US20150034238A1 (en) | Laminate body, method, and materials for temporary substrate support and support separation | |
| KR20130040591A (en) | Adhesive composition, dicing tape for semiconductor wafer and method and device for producing the same | |
| CN110591582A (en) | Process film production method for OLED module manufacturing process easy to tear off after UV and product thereof | |
| CN108546525A (en) | A kind of release film | |
| CN112341984B (en) | Low-energy UV-curable adhesive sticker composition and preparation method and application thereof | |
| CN114085312A (en) | High-temperature-resistant UV self-viscosity-reducing additive for acrylic resin, acrylic resin containing additive and high-temperature-resistant UV viscosity-reducing film | |
| JP6654825B2 (en) | Double-sided adhesive tape for semiconductor processing | |
| JP2019070094A (en) | Double-sided adhesive tape, and method of producing semiconductor device | |
| CN110724473A (en) | Preparation method of high-stripping ultraviolet-resistant mesh and wire composite PE single-sided adhesive tape | |
| KR20190001171A (en) | Semiconductor wafer protective film for dicing process and method of preparing the same | |
| JP2009116170A (en) | Pressure-sensitive adhesive tape for photomask protection | |
| CN208562224U (en) | A kind of release film | |
| CN207891298U (en) | Thermmohardening type compound adhesive tape | |
| JP7214303B2 (en) | thin support adhesive film | |
| JP4098597B2 (en) | Adhesive sheet for processing semiconductor wafer and method for processing semiconductor wafer using the same | |
| WO2022250129A1 (en) | Method for producing electronic device | |
| WO2022250131A1 (en) | Method for producing electronic device | |
| WO2022250130A1 (en) | Adhesive film for backgrinding, and method for manufacturing electronic device | |
| JP7214302B2 (en) | thin support adhesive film | |
| WO2022250128A1 (en) | Back grinding adhesive film and method for producing electronic device | |
| JPH08274059A (en) | Foreign substance removal adhesive tape for precision electronic component | |
| WO2022250137A1 (en) | Method for producing electronic device | |
| WO2022250138A1 (en) | Adhesive film for backgrinding and production method for electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |