CN108723615B - Micropore laser processing method and system based on laser pulse overlapping rate control - Google Patents
Micropore laser processing method and system based on laser pulse overlapping rate control Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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Abstract
The invention relates to a micropore laser processing method and system based on laser pulse overlapping rate control, the method calculates the pulse frequency output by a laser at the position corresponding to a scanning track by inputting a scanning track and a pulse synchronous signal into an overlapping rate control algorithm, then controls a high-speed shutter switch of the laser to adjust the pulse frequency output by the laser to match with the scanning track in real time, combines laser repetition frequency control and laser scanning movement, finally achieves the purpose of controlling the pulse overlapping rate in the scanning movement process of a light beam scanning module in real time, can realize accurate control of the punching process, and improves the processing quality.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a micropore laser processing method and system based on laser pulse overlapping rate control.
Background
Ultrafast lasers are pulsed lasers with pulse widths shorter than 10ps, mainly short picosecond and femtosecond lasers, and the time scale is shorter than the time required for relaxation energy of laser-emitted electrons to a lattice, so that the interaction of light and substances presents a characteristic which is significantly different from that of normal light excitation. The interaction of the femtosecond laser and the substance has the characteristics of rapidness (short acting time), strong (high transient power) and precision (small volume of an acting area due to nonlinearity and high processing resolution). Micro-nano processing can be performed according to this characteristic because the nonlinear interaction of the ultrafast laser and the substance can exceed the optical diffraction limit. When the ultra-fast laser is used for micro-nano processing, the method mainly comprises micro-hole processing, high-precision etching, high-precision cutting and the like, and the main implementation means is to control the action point and the action angle of the laser on the surface of a material by utilizing refraction of an optical wedge or reflection of a lens and combining with a related optical principle and by controlling the high-speed movement of the related optical wedge or lens, so that the required processing requirement is finally realized.
In the existing laser processing process, laser pulse output and scanning movement cannot be combined, particularly in the application occasion of precision processing, as the beam scanning system belongs to an inertial system, under the condition of high-speed complex movement, constant linear speed scanning movement cannot be achieved, therefore, when laser pulse output and scanning speed cannot be matched, the laser processing method can cause high pulse overlapping rate of areas with low speed, large action energy, low pulse overlapping rate of areas with high speed and small action energy, and finally causes uneven energy distribution in a processing area, and influences the final processing quality, particularly the processing quality of blind holes. When machining a workpiece with a facing wall, such uneven distribution of machining energy produces a difference in the topography of the hole bottom that causes the central region of the hole bottom to have penetrated the workpiece and the bottom edge (near the hole wall portion) of the hole still has a thick portion to be machined, as shown in fig. 1. The subsequent hole making process can cause damage to the surface wall of the processed hole, and the overall processing quality of the workpiece is affected.
Disclosure of Invention
The embodiment of the invention provides a micropore laser processing method and system based on laser pulse overlapping rate control, which are used for solving the technical problems that energy distribution in a processing area is uneven and final processing quality is affected due to the fact that laser pulse overlapping rate control and laser scanning movement cannot be combined in the existing laser micropore processing, and inclined holes can be processed through pulse modulation.
According to one aspect of the embodiment of the invention, a micro-hole laser processing method based on laser pulse overlapping rate control comprises the following steps:
s1, determining processing technological parameters according to micropore parameters to be processed;
S2, converting a processing position coordinate system of the workpiece to be processed into a coordinate system of a processing system;
S3, carrying out micropore scanning processing according to the selected processing technological parameters and drilling coordinates under the processing system coordinate system;
The step S3 further comprises the following steps:
S31, monitoring and acquiring a scanning track of the light beam scanning module in real time, and extracting a pulse synchronous signal of the laser;
S32, inputting the scanning track and the pulse synchronous signal into an overlap ratio control algorithm to obtain pulse frequency which corresponds to the scanning track and is output by the laser;
And S33, controlling a high-speed shutter switch to adjust the pulse frequency output by the laser in real time according to the pulse overlapping rate at the scanning track.
Further, the step S31 further includes the following steps:
And detecting the reflected light beam in the micropore scanning process by a position detection module to obtain a scanning track and a real-time scanning position of the light beam.
Further, when the central axis of the machined hole forms an inclined angle with the surface of the workpiece, the step S3 further includes the following specific steps:
J1. Taking a layer with the highest height in a horizontal processing plane which does not contain a non-processing area as an interface of the workpiece to be processed;
J2. Controlling the high-speed shutter switch to adjust the pulse frequency of the laser to 0 when the scanning track enters a non-processing area in each layer of the horizontal processing plane above the interface; after the scanning track enters the processing area, controlling the high-speed shutter switch to adjust the pulse frequency of the laser to normally output;
J3. and recovering the scanning processing layer by layer at and below the interface layer.
Further, in each horizontal processing plane of the step S3, the scanning mode is an equally-spaced increment spiral scanning mode.
Further, in step S1, the micropore parameters include pore diameter, pore spacing, pore space position parameters, and pore number; the processing technological parameters comprise laser power, frequency, pulse overlapping rate and scanning track;
the step S2 is preceded by the following steps: self-checking and zeroing of the drilling device, preheating of a laser, zeroing of a light beam scanning module and zeroing of a machine tool platform; fixing a workpiece to be processed, and adjusting the workpiece to a horizontal position;
The step S3 further comprises the following steps: and the scanned micropores of the workpiece to be processed reach the micropore parameters, and the micropore scanning processing is finished.
According to one aspect of an embodiment of the present invention, a micro-hole laser processing system based on laser pulse overlap rate control includes:
the laser is used for generating a pulse laser beam and adjusting laser parameters of the generated pulse laser beam;
the beam scanning module is used for controlling the scanning movement and the incidence angle of the incident pulse laser beam;
the focusing module is used for focusing and emitting the pulse laser beam output by the beam scanning module;
A high-speed shutter switch for modulating an incident pulsed laser beam to change the pulse frequency output by the laser;
The controller is electrically connected to the laser, the high-speed shutter switch and the light beam scanning module, and is configured to monitor and acquire a scanning track of the light beam scanning module and also acquire a pulse synchronization signal through the laser; the controller calculates the pulse frequency output by the laser at the position corresponding to the scanning track through an overlapping rate control algorithm, and controls the high-speed shutter switch of the laser to adjust the pulse frequency output by the laser to match with the scanning track in real time so as to control the pulse overlapping rate in the scanning movement process of the light beam scanning module in real time.
Further, the micro-hole laser processing system further comprises:
The position detection module is electrically connected with the controller, and is used for acquiring light beam movement information through a spectroscope arranged in the light path of the focusing module and the workpiece to be processed and detecting the light beam scanning position in the scanning movement process of the light beam scanning module in real time;
The controller is configured to monitor and acquire a scanning track of the light beam scanning module, acquire a laser pulse synchronous signal of the laser and a light beam scanning position in the scanning movement process of the light beam scanning module detected by the position detection module, calculate pulse frequency output by the laser at a corresponding scanning track through an overlapping rate control algorithm, control a high-speed shutter switch of the laser to adjust the pulse frequency output by the laser in real time to match with the scanning track, and control the pulse overlapping rate in the scanning movement process of the light beam scanning module in real time.
Further, the micro-hole laser processing system further comprises:
The beam splitting module is arranged in the optical paths of the laser and the high-speed shutter switch and is used for splitting the pulse laser beam incident by the laser into a first pulse laser beam and a second pulse laser beam;
the pulse monitoring module is used for receiving the second pulse laser beam reflected by the beam splitting module, monitoring the pulse laser beam output by the laser and acquiring the pulse frequency;
The controller is electrically connected to the pulse monitoring module, and is configured to monitor and acquire a scanning track of the light beam scanning module, acquire the pulse frequency output by the laser monitored by the pulse monitoring module, calculate the pulse frequency output by the laser at the corresponding scanning track through an overlapping rate control algorithm, and control the high-speed shutter switch to adjust the pulse frequency output by the laser in real time to match with the scanning track so as to control the pulse overlapping rate in the scanning movement process of the light beam scanning module in real time.
Further, the micro-hole laser processing system further comprises: and the optical path transmission module is configured in the optical paths of the high-speed shutter switch and the optical beam scanning module and is used for guiding the pulse laser beam output by the laser to the optical beam scanning module.
Further, the micro-hole laser processing system further comprises: the upper computer is electrically connected to the controller and used for providing a human-computer interaction interface and carrying out two-way communication with the controller.
In the embodiment of the invention, the controller monitors and acquires the scanning track of the light beam scanning module, acquires the laser pulse synchronous signal of the laser, calculates the pulse frequency output by the laser at the position corresponding to the scanning track through the overlapping rate control algorithm, controls the high-speed shutter switch of the laser to adjust the pulse frequency output by the laser in real time to match with the scanning track, combines laser repetition frequency control and laser scanning movement, finally achieves the purpose of controlling the pulse overlapping rate in the scanning movement process of the light beam scanning module in real time, and can realize the accurate control of the hole making process by accurately controlling the number of pulses used on the surface of a material and the energy and the action time of each pulse, thereby improving the processing quality.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic side view of a prior art laser drilling process hole bottom topography;
FIG. 2 is a flow chart of a laser processing method based on laser pulse overlap rate control according to the present invention;
FIG. 3 (a) is a schematic diagram of a prior art helical scan trajectory;
FIG. 3 (b) is a graph of equidistant incremental helical scan trajectories;
FIG. 4 is a schematic side view of the hole bottom topography of the laser machining method of the present invention when hole making is performed using a prior art helical scan pattern;
FIG. 5 is a schematic drawing of a process employing an equally spaced incremental helical scan pattern in accordance with the present invention;
FIG. 6 is a schematic diagram of an embodiment of a laser processing system based on laser pulse overlap rate control of the present invention;
FIG. 7 is a schematic diagram of another embodiment of a laser processing system based on laser pulse overlap rate control according to the present invention;
fig. 8 is a schematic diagram of laser pulse overlap rate control.
Detailed Description
In order to make the person skilled in the art better understand the solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to fig. 1 to 8 of the present invention. It will be apparent that the described embodiments are merely some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention belongs to the field of ultrafast laser design and processing application, and particularly relates to a micropore laser processing method and system based on laser pulse overlapping rate control. Ultrafast lasers are pulsed lasers with extremely narrow single pulse widths up to the femtosecond level and extremely high single pulse powers up to several gigawatts. The ultrafast laser repetition frequency refers to the number of laser output pulses within 1 second, and the current common laser repetition frequency range is about 100-1000 KHz. The laser beam scanning pulse overlap ratio refers to the overlap ratio between the adjacent two laser pulse action regions during the beam scanning.
Example 1
As shown in fig. 2, the invention provides a laser micro-hole processing method based on laser pulse overlapping rate control, which comprises the following steps:
And determining processing technological parameters including laser power, frequency, pulse overlapping rate, scanning speed, scanning track and the like according to micropore parameters such as aperture, hole spacing, hole space position parameters, hole number and the like to be processed.
Self-checking and zeroing of the drilling device, zeroing of a preheating and light beam scanning module of the laser and zeroing of a machine tool platform; fixing a workpiece to be processed, and adjusting the workpiece to a horizontal position; determining a coordinate system of the machining position, and converting the coordinate system into a coordinate of a machining system according to the conversion relation; and starting micropore scanning processing according to the selected processing technological parameters and the drilling coordinates under a processing system coordinate system, and processing by adopting a spiral line scanning mode.
And acquiring and monitoring a scanning track of the light beam scanning module, and acquiring a pulse synchronous signal of the laser.
In this step, the real-time acquisition and monitoring of the scanning track of the light beam scanning module can be completed by the position detection module, and can also be obtained by calculation of a track algorithm. The track algorithm is an algorithm for obtaining a real-time position track based on input calculation of optical system parameters such as focal length of a focusing lens, optical wedge angle of a scanning module and spot diameter.
As shown in fig. 6 and 7, in one embodiment, the position detection module 34 is a CCD element coupled to the controller 50 that cooperates with a beam splitter 32 disposed below the focusing mirror 40. The reflected beam in process is reflected to the position detection module 34 through the beam splitter 32, and the position detection module 34 inputs the collected data to the controller 50 for processing, so that a scanning track and a real-time scanning position of the beam can be obtained.
The scan trajectory of the beam scanning module 30 and the pulse synchronization signal of the laser 10 are input to the controller 50, and the controller 50 outputs corresponding control signals to the high-speed shutter switch 16 according to the overlap rate control algorithm, so that the matched pulse frequencies are output at the corresponding scan trajectories to control the machining region and the non-machining region ranges in the scan trajectories. The overlap ratio algorithm is an algorithm for calculating the input position track parameter and the pulse frequency of the laser to obtain the pulse frequency which is required to be output by the laser at the corresponding scanning track.
The controller 50 monitors the real-time track position during processing, and adjusts the pulse overlap ratio according to the actual processing conditions to perform laser processing in the processing area, so as to avoid injuring the non-processing area by mistake.
And when the micropores reach the preset pore parameters, closing the procedure, and ending the micropore processing.
Further, in the existing laser micro-hole processing method, a spiral scanning form as shown in fig. 3 (a) is often adopted:
The pitch between the coils of the spiral line is gradually reduced, and the spiral line is in the form of a spiral line with sparse middle and dense periphery. As shown in fig. 4, laser Kong Guocheng is performed in the spiral line scanning mode, the pulse frequency of the laser in the outer ring region of the spiral is far higher than that in the inner ring region, and the micropores are easy to form an M-shaped bottom morphology.
The method is characterized in that the pulse frequency modulation can solve the problem of overlapping rate in the tangential direction of a motion scanning track, so that energy balance application is realized, and in the normal direction of the motion track, the phenomenon of high removal rate at the outer side of the bottom surface is caused to a certain extent because of the phenomenon of low inner side and high outer side due to the density characteristic of a scanning spiral line. For the high removal at the center, this is due to the fact that there is also a certain degree of energy concentration at the center point, resulting in a high removal of the center area.
In order to solve the above technical problem, the scanning mode of the present application adopts an equidistant increment spiral scanning mode, as shown in fig. 3 (b). I.e. a scan pattern in which the turns of the spiral are equally spaced. In the scanning mode, the processing energy distribution in the normal direction and the tangential direction is more uniform, the effective control of the overlapping rate and the lap rate in the scanning process can be realized, the distribution of the laser power on the processing bottom surface is further optimized, and the bottom surface flat-pushing processing is better realized, as shown in fig. 5.
In the case of a machining hole with a central axis at an oblique angle to the workpiece surface, only a portion of the material in the same machining plane can be removed for machining, i.e. the same machining plane contains both machining and non-machining areas, as a result of the initial machining stage. In the material-free portion of the machining plane, the laser beam may pass directly through and damage the workpiece area below the machining plane, causing machining defects.
In this case, the workpiece to be machined is divided into two parts, with the horizontal machining plane having exactly the plane of the removable material, i.e. the one layer of the horizontal machining plane which does not contain non-machining areas and has the highest height, being the interface for the workpiece to be machined. Above the interface, because each layer of horizontal processing plane has a non-processing area without material removal and a processing area with material removal, the processing method based on pulse overlap rate control according to the invention can control the laser to not work (adjust pulse frequency to 0) when the scanning track enters the non-processing area, and resume work (adjust pulse frequency to normal state) after the scanning track enters the processing area. And round hole processing is carried out below the interface by adopting a layer-by-layer scanning mode.
Specifically, after the completion of the predetermined processing preparation work, the scanning processing is started. The pulse frequency is modulated by default to an output of zero by the high speed shutter switch.
Monitoring the position state of a laser processing beam, and adjusting a modulation module to be in a normal working state only when the processing beam enters a material area to be removed (processing area), wherein pulse modulation processing which is the same as the processing method is started at the moment;
when the processing light beam leaves the material area (processing area) to be removed, the output is modulated to be zero through a modulation module;
The normal layer-by-layer scanning processing mode is changed after the processing is scanned to the interface.
Example 2
As shown in fig. 6, the present invention further provides a micro-hole laser processing system based on laser pulse overlapping rate control, which includes:
A laser 10 for generating a pulse laser beam and performing laser parameter adjustment on the generated pulse laser beam;
the high-speed shutter switch 16, the high-speed shutter switch 16 can realize the high-speed switch of the laser, and unlike the common mechanical switch, it mainly utilizes electro-optic and acousto-optic effects to realize the output control of the laser pulse, it includes but is not limited to electro-optic modulator, electro-optic Q-switch, acousto-optic modulator, acousto-optic deflector, acousto-optic Q-switch, etc.;
The beam scanning module 30 is used for controlling the scanning motion and the incidence angle of the incident pulse laser beam;
A focusing mirror 40;
The controller 50 is electrically connected to the laser 10 and the beam scanning module 30, and the high-speed shutter switch 16, respectively. The controller 50 is configured to monitor and acquire the scan trajectory of the beam scanning module and the laser pulse synchronization signal, and output a corresponding pulse control signal to the high-speed shutter switch 16.
In the embodiment of the invention, the controller 50 monitors and acquires the scanning track of the beam scanning module 30, acquires the laser pulse synchronization signal of the laser 10, calculates the pulse frequency of the laser 10 at the position corresponding to the scanning track through the overlapping rate control algorithm, controls the high-speed shutter switch 16 of the laser 10 to adjust the pulse frequency of the laser 10 to match with the scanning track in real time, combines laser repetition frequency control and laser scanning movement, finally achieves the purpose of controlling the pulse overlapping rate in the scanning movement process of the beam scanning module 30 in real time, and can realize the accurate control of the punching process by accurately controlling the number of pulses used on the surface of the material and the energy and the action time of each pulse, thereby improving the processing quality.
Preferably, the micro-hole laser processing system further comprises:
Beam splitter 32 and position detection module 34. Position detection module 34 is electrically connected to controller 50 for detecting in real time the scanning position of the light beam during the scanning movement of light beam scanning module 30, which specifically includes but is not limited to a PSD sensor, CCD, etc. A beam splitter 32 is arranged below the focusing mirror 40, and the processing reflected light is reflected to a position detection module 34 through the beam splitter 32, so that a real-time scanning position can be obtained through monitoring of the position detection module 34, and the pulse overlapping rate of the position can be obtained through processing of overlapping rate control algorithm in the controller 50; the controller 50 sends control signals to the high speed shutter 16 to achieve the desired control result.
Preferably, as shown in fig. 7, in the case where the laser 10 does not provide the synchronization pulse signal, the micro-hole laser processing system may further include:
the beam splitting module 12, which may be configured as a beam splitting lens, is disposed on the outgoing optical path of the laser, and is configured to split the pulse laser beam incident by the laser into a first pulse laser beam and a second pulse laser beam, where the first pulse laser beam is a monitoring beam, and the second pulse laser beam is a processing beam;
a pulse monitoring module 14 electrically connected to the controller 50 for monitoring the incident first pulse laser beam and obtaining the pulse frequency of the laser 10, including but not limited to a PIN photodiode, an MSM ultrafast laser detector, etc.;
The controller 50 is further configured to monitor and acquire a scanning track of the beam scanning module, and acquire the pulse frequency of the laser 10 monitored by the pulse monitoring module 14, calculate the pulse frequency of the laser 10 at the corresponding scanning track through an overlap rate control algorithm, and control the high-speed shutter switch 16 to adjust the pulse frequency of the laser 10 in real time to match the scanning track, so as to control the pulse overlap rate of the beam scanning module 30 during the scanning motion in real time.
Preferably, the micro-hole laser processing system further comprises: the optical path transmission module 20 is configured to condition and guide the laser light output by the laser 10 to the beam scanning module 30.
Preferably, the micro-hole laser processing system further comprises: the upper computer 60 is used for providing a man-machine interaction interface and performing two-way communication with the controller 50.
The following describes the micro-pore laser processing system in detail by using a specific embodiment, and the technical scheme adopted by the invention is as follows:
Aiming at the real-time control of the laser output repetition frequency, the invention designs a high-performance controller 50 which can realize the real-time detection of the internal output repetition frequency signal of the laser 10 and the real-time detection of the state of the light beam scanning module 30 or the motion platform, and control the high-speed shutter switch 16 of the laser 10 by combining the output repetition frequency control parameters set by the upper computer 60 and utilizing the pulse sequence modulation technology, thereby realizing the control of the specific laser pulse output and finally achieving the purpose of controlling the pulse overlapping rate in the processing scanning process in real time.
Aiming at the application occasions such as micropore rotary cutting scanning, precise cutting, blind hole blind groove processing and the like which have requirements on pulse overlapping rate and energy distribution, on the basis of realizing the real-time control of the output repetition frequency of the laser 10, the micropore processing system designed by the invention can realize the detection of the real-time scanning track of the beam scanning module 30, realize the accurate output of specific pulses with specific energy at specific moment by utilizing an overlapping rate control algorithm operated in the controller 50, complete the matching of scanning movement and laser pulse output and finally realize the bottom surface flat pushing processing in the laser micropore processing process.
For a laser 10 that provides a pulse synchronized output with a high speed shutter control signal, the principle of pulse train modulation is as follows: the controller monitors the laser pulse synchronous signal output by the laser in real time and corresponding to the set repetition frequency, and refers to the output repetition frequency parameter requirement set by the upper computer 60, and controls the high-speed shutter switch 16 to further control the corresponding pulse output, thereby realizing the requirement on specific laser pulse output and finally achieving the purpose of controlling the laser output repetition frequency. With this technique, only the pulse output state inside the laser 10 is changed, and the internal parameter setting of the laser 10 is not changed, so that there is no influence on the single pulse performance.
In other embodiments, as shown in fig. 8, for the laser 10 that does not provide the synchronous pulse output and the high-speed shutter control signal, since the laser itself does not provide the pulse synchronous signal corresponding to the internal set repetition frequency, the device mainly relies on the output pulse signal monitored by the external pulse monitoring module 14 as a reference, and a beam splitting monitoring optical path and a pulse monitoring module are disposed in the optical path, and the beam splitting module 12 splits the beam emitted from the laser 10 to the pulse monitoring module 14. The pulse monitoring module 14 monitors the monitoring beam to obtain a pulse signal of the laser 10, and inputs the signal to the controller 50. The controller 50 performs pulse sequence modulation processing in combination with the output repetition frequency set by the upper computer 60, and finally controls the high-speed shutter switch 16 to realize the whole pulse sequence modulation and output repetition frequency control function. Again, this approach does not change the monopulse performance parameters.
In the application occasion of micropore rotary-cut scanning, the pulse sequence modulation technology is utilized to realize the control of the pulse sequence overlapping rate in the scanning process, and the control principle is shown in figure 8. Because the beam scanning module has certain inertia, in the spiral line scanning process shown in fig. 3 (a), constant linear velocity scanning cannot be realized, and a constant angular velocity scanning mode is adopted in actual machining, in the mode, if the output repetition frequency of the laser cannot be changed according to the real-time scanning position, the center pulse overlapping rate of the machining surface is necessarily high, the edge overlapping rate is low, and as shown in fig. 1, the material removal amount at the center of the machining bottom surface is finally large and the edge removal amount is small in the machining process.
The invention utilizes pulse sequence modulation technology, monitors the monitoring light beam through the pulse monitoring module 14 to obtain the pulse signal of the laser, and the real-time light beam position fed back by the position detecting module 34, calculates the pulse frequency of the laser at the corresponding scanning track in real time by utilizing an internal high-speed algorithm, controls the laser pulse frequency to be matched with the real-time scanning position, finally realizes the overlapping rate control of the laser pulse on the processing surface, optimizes the average distribution of the laser power of the processing surface, and improves the processing quality of micro-hole processing, especially blind holes and blind grooves.
The invention mainly aims to solve the defects that blind hole machining quality is low and a workpiece is damaged on the surface wall due to uneven machining energy distribution in the existing micropore machining process, and particularly designs a micropore laser machining method and device based on laser pulse overlapping rate control so as to realize high-quality machining capability.
Compared with the prior art, the invention has the beneficial effects that:
1. The laser output repetition frequency real-time control can be realized, and the control precision can be specific to a specific pulse.
2. The invention does not influence the single pulse performance parameter when changing the laser output repetition frequency.
3. The invention can modulate the output heavy frequency of the laser in real time according to the real-time state of motion and the technological parameters, and realize the uniform distribution of processing energy at the bottom of the hole.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
In the foregoing embodiments of the present invention, the descriptions of the embodiments are emphasized, and for a portion of this disclosure that is not described in detail in this embodiment, reference is made to the related descriptions of other embodiments.
In the several embodiments provided in the present application, it should be understood that the disclosed technology may be implemented in other manners. The above-described embodiments of the apparatus are merely exemplary, and the division of units may be a logic function division, and there may be another division manner in actual implementation, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interfaces, units or modules, or may be in electrical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (8)
1. A micropore laser processing method based on laser pulse overlap rate control comprises the following steps:
s1, determining processing technological parameters according to micropore parameters to be processed;
S2, converting a processing position coordinate system of the workpiece to be processed into a coordinate system of a processing system;
S3, carrying out micropore scanning processing according to the selected processing technological parameters and drilling coordinates under the processing system coordinate system;
The method is characterized in that the step S3 also comprises the following steps:
S31, monitoring and acquiring a scanning track of the light beam scanning module in real time, and extracting a pulse synchronous signal of the laser;
S32, inputting the scanning track and the pulse synchronous signal into an overlap ratio control algorithm to obtain pulse frequency which corresponds to the scanning track and is output by the laser;
s33, controlling a high-speed shutter switch according to the pulse overlapping rate at the scanning track to adjust the pulse frequency output by the laser in real time;
When the central axis of the machining hole forms an inclined angle with the surface of the workpiece, the step S3 further comprises the following specific steps:
J1. Taking a layer with the highest height in a horizontal processing plane which does not contain a non-processing area as an interface of the workpiece to be processed;
J2. Controlling the high-speed shutter switch to adjust the pulse frequency of the laser to 0 when the scanning track enters a non-processing area in each layer of the horizontal processing plane above the interface; after the scanning track enters the processing area, controlling the high-speed shutter switch to adjust the pulse frequency of the laser to normally output;
J3. recovering the scanning processing layer by layer at the interface layer and below the interface layer;
In each layer of horizontal processing plane in the step S3, the scanning mode adopts an equidistant increment spiral scanning mode;
The overlap ratio control algorithm is an algorithm for calculating the input position track parameter and the laser pulse frequency to obtain the pulse frequency which is required to be output by the laser at the corresponding scanning track.
2. The micro-hole laser processing method according to claim 1, wherein the step S31 further comprises the steps of:
And detecting the reflected light beam in the micropore scanning process by a position detection module to obtain a scanning track and a real-time scanning position of the light beam.
3. The micro-hole laser processing method according to claim 1, wherein in the step S1, the micro-hole parameters include a hole diameter, a hole pitch, a hole space position parameter, and a hole number; the processing technological parameters comprise laser power, frequency, pulse overlapping rate and scanning track;
the step S2 is preceded by the following steps: self-checking and zeroing of the drilling device, preheating of a laser, zeroing of a light beam scanning module and zeroing of a machine tool platform; fixing a workpiece to be processed, and adjusting the workpiece to a horizontal position;
The step S3 further comprises the following steps: and the scanned micropores of the workpiece to be processed reach the micropore parameters, and the micropore scanning processing is finished.
4. A micro-hole laser processing system based on laser pulse overlap rate control employing the micro-hole laser processing method according to any one of claims 1 to 3, characterized by comprising:
the laser is used for generating a pulse laser beam and adjusting laser parameters of the generated pulse laser beam;
the beam scanning module is used for controlling the scanning movement and the incidence angle of the incident pulse laser beam;
the focusing module is used for focusing and emitting the pulse laser beam output by the beam scanning module;
A high-speed shutter switch for modulating an incident pulsed laser beam to change the pulse frequency output by the laser;
The controller is electrically connected to the laser, the high-speed shutter switch and the light beam scanning module, and is configured to monitor and acquire a scanning track of the light beam scanning module and also acquire a pulse synchronization signal through the laser; the controller calculates the pulse frequency output by the laser at the position corresponding to the scanning track through an overlapping rate control algorithm, and controls the high-speed shutter switch of the laser to adjust the pulse frequency output by the laser to match with the scanning track in real time so as to control the pulse overlapping rate in the scanning movement process of the light beam scanning module in real time.
5. The micro-porous laser machining system of claim 4, further comprising:
the position detection module is electrically connected with the controller, acquires light beam movement information through a spectroscope arranged in a light path of the focusing module and a workpiece to be processed, and is used for detecting a light beam scanning position in the scanning movement process of the light beam scanning module in real time;
The controller is configured to monitor and acquire a scanning track of the light beam scanning module, acquire a laser pulse synchronous signal of the laser and a light beam scanning position in the scanning movement process of the light beam scanning module detected by the position detection module, calculate pulse output frequency output by the laser at a corresponding scanning track through an overlapping rate control algorithm, control a high-speed shutter switch of the laser to adjust the pulse output frequency output by the laser in real time to match with the scanning track, and control the overlapping rate of the laser pulses in the scanning movement process of the light beam scanning module in real time.
6. The micro-porous laser machining system of claim 4, further comprising:
The beam splitting module is arranged in the optical paths of the laser and the high-speed shutter switch and is used for splitting the pulse laser beam incident by the laser into a first pulse laser beam and a second pulse laser beam;
the pulse monitoring module is used for receiving the second pulse laser beam reflected by the beam splitting module, monitoring the pulse laser beam output by the laser and acquiring the pulse frequency;
The controller is electrically connected to the pulse monitoring module, and is configured to monitor and acquire a scanning track of the light beam scanning module, acquire the pulse frequency output by the laser monitored by the pulse monitoring module, calculate the pulse frequency output by the laser at the corresponding scanning track through an overlapping rate control algorithm, and control the high-speed shutter switch to adjust the pulse frequency output by the laser in real time to match with the scanning track so as to control the pulse overlapping rate in the scanning movement process of the light beam scanning module in real time.
7. The micro-porous laser machining system of claim 4, further comprising: and the optical path transmission module is configured in the optical paths of the high-speed shutter switch and the optical beam scanning module and is used for guiding the pulse laser beam output by the laser to the optical beam scanning module.
8. The micro-porous laser machining system of claim 4, further comprising: the upper computer is electrically connected to the controller and used for providing a human-computer interaction interface and carrying out two-way communication with the controller.
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| CN111001941B (en) * | 2019-12-26 | 2021-12-21 | 武汉华工激光工程有限责任公司 | Laser drilling method |
| CN111805099B (en) * | 2020-06-22 | 2022-02-22 | 西安中科微精光子制造科技有限公司 | Laser scanning device and scanning method based on regional modulation technology |
| CN114367751B (en) * | 2020-10-14 | 2024-10-18 | 大族激光科技产业集团股份有限公司 | Laser drilling method, device, equipment and medium for glass ceramic |
| US20220234142A1 (en) * | 2021-01-28 | 2022-07-28 | General Electric Company | Laser ablation seal slot machining |
| CN113523541B (en) * | 2021-06-30 | 2023-06-16 | 南方科技大学 | Laser scanning synchronous stopping method and device |
| CN113828932A (en) * | 2021-10-20 | 2021-12-24 | 广东中科微精光子制造科技有限公司 | Surface high-integrity micropore machining method and system based on laser hole making |
| CN115008000A (en) * | 2022-06-12 | 2022-09-06 | 吉林大学 | Laser welding method of Nd-YAG (yttrium aluminum garnet) of magnesium alloy sheet based on pulse overlapping rate and preheating combined regulation |
| CN115156725B (en) * | 2022-07-25 | 2024-10-22 | 西安中科微精光子科技股份有限公司 | Etching forming method based on laser scanning strategy |
| CN116441765B (en) * | 2023-03-24 | 2024-04-05 | 中国科学院西安光学精密机械研究所 | Straight round hole laser processing spiral line track planning method |
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