CN107899871A - A kind of AB glue bonder and AB glue adhesion technique - Google Patents
A kind of AB glue bonder and AB glue adhesion technique Download PDFInfo
- Publication number
- CN107899871A CN107899871A CN201711321660.XA CN201711321660A CN107899871A CN 107899871 A CN107899871 A CN 107899871A CN 201711321660 A CN201711321660 A CN 201711321660A CN 107899871 A CN107899871 A CN 107899871A
- Authority
- CN
- China
- Prior art keywords
- glue
- workpiece
- dispensing
- bonding
- dispenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 118
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000004033 plastic Substances 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims description 28
- 239000006260 foam Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 230000007423 decrease Effects 0.000 abstract description 5
- 238000007711 solidification Methods 0.000 abstract description 4
- 230000008023 solidification Effects 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 10
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 208000010138 Diastema Diseases 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 238000005842 biochemical reaction Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 210000000475 diastema Anatomy 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The present invention discloses a kind of AB glue bonder, including point glue equipment, and dispensing stent is set in support platform, sets horizontal slide rail on dispensing stent, dispenser is moved by driving device in horizontal slide rail；The vertical driver of control gum outlet vertical lifting is set on dispenser；Set in dispenser it is spiral go out plastic pipe, go out the input end connection glue mixer of plastic pipe, AB glue mixed in the glue mixer after from going out in plastic pipe to flow out；Cooling device is set on dispenser, cooling device makes the glue temperature for entering plastic pipe be maintained at 2~5 DEG C, when glue chemically reacts after mixing, in order to delay the speed of chemical reaction, glue is set to be maintained at higher viscosity, the present invention is controlled by way of the temperature for reducing glue, ensures that the viscosity in glue flow process will not decline, so as to ensure the bonding strength after glue solidification.Present invention also offers a kind of AB glue adhesion technique, it can be achieved that identical technique effect.
Description
Technical field
The present invention relates to technical field of mechanical processing, further relates to a kind of AB glue bonder.In addition, the present invention is also
It is related to a kind of AB glue adhesion technique.
Background technology
Notebook, tablet computer product at present, mostly using the two-in-one form of tablet, computer, are connected by wireless WiFi
Network, metal shell shielded signal are connect, therefore usually leaves plastic portions and receives wireless signal, is glued between plastic parts and metalwork
Fixation is connect, is generally divided into encapsulated and dispensing, the pulling capacity that dispensing generally requires to reach 25kg is not fallen off, and to bonding appearance requirement
It is higher.Easily occur coming off during dispensing, excessive glue, the problems such as bound site segment difference is excessive, bound site gap is excessive.
Whether dispenser is to come off during products with adhesive or the key of excessive glue, after AB glue mixes in mixing tube during dispensing
Outflow, AB glue is once mixing to react, and gradually solidification, viscous force of the glue in pipe begin to decline at normal temperatures, glue
Water is unable to reach highest adhesive strength when reaching on workpiece.
For those skilled in the art, the adhesive strength of metalwork and plastic parts how is improved, is to need at present
The technical problem of solution.
The content of the invention
The present invention provides a kind of AB glue bonder, glue is kept viscosity during flowing, so that it is strong to improve connection
Degree, concrete scheme are as follows：
A kind of AB glue bonder, including point glue equipment, the point glue equipment include support platform, in the support platform
Dispensing stent is set, horizontal slide rail is set on the dispensing stent, makees mobile back and forth horizontally, the dispensing for being oriented to dispenser
The vertical driver of control gum outlet vertical lifting is set on machine；Set in the dispenser it is spiral go out plastic pipe, it is described
Go out plastic pipe connection glue mixer, AB glue mixed in the glue mixer after from it is described go out plastic pipe in flow out；It is described
Cooling device is set on dispenser, and the glue temperature that the cooling device makes to go out plastic pipe described in is maintained at 2~5 DEG C.
Alternatively, the dispensing base for being used to support dispensing workpiece, the shape of the dispensing base are set in the support platform
Shape is bonded with the upper surface matching of dispensing workpiece.
Alternatively, pressing device is further included, the pressing device includes the pressing stent being arranged in the support platform,
The profiling base being used to support is set in the support platform, and the profiling base supports the dispensing workpiece bonded and glues at the same time
Workpiece is closed, and is bonded completely with the bottom surface of dispensing workpiece and bonding workpiece；Set on the pressing stent and pass through vertical lifting
The pressure head that device drives, the pressure head cooperate with the profiling base and crimp dispensing workpiece and bonding workpiece.
Alternatively, the shape of the pressure head is bonded completely with the upper surface of dispensing workpiece and bonding workpiece；And the pressure
Head is copper, it is heated by heating unit.
The present invention also provides a kind of AB glue adhesion technique, including：
Dispensing workpiece is positioned on point glue equipment, and the AB glue mixed glue solution for keeping the temperature at 2~5 DEG C is applied and is attached to a little
On glue workpiece；
Dispensing workpiece is transferred on pressing device from point glue equipment, and places bonding workpiece, makes the dispensing work bonded
Part and bonding workpiece are bonded by profiling base to be supported；
By the pressure head and the profiling base engagement of the pressing device with dispensing workpiece and bonding workpiece pressing is solid
It is fixed.
Alternatively, before being pressed by the pressure head, the pressure head is heated, makes it to dispensing workpiece and bonding workpiece heat conduction.
Alternatively, AB glue mixed glue solution is applied after being attached to dispensing workpiece, foam cushion is mounted on dispensing workpiece, so that dispensing
Workpiece is flushed with bonding the outer surface of workpiece.
Alternatively, AB glue mixed glue solution is applied before being attached to dispensing workpiece, first carrying out laser carving to dispensing workpiece removes oxidation
Layer.
The present invention provides a kind of AB glue bonder, including point glue equipment, point glue equipment includes support platform, and support is flat
Dispensing stent is set on platform, horizontal slide rail is set on dispensing stent, makees horizontal reciprocating movement for being oriented to dispenser, dispenser leads to
Over-driving device moves in horizontal slide rail；The vertical driver of control gum outlet vertical lifting is set on dispenser, passes through horizontal stroke
The location of gum outlet is adjusted to slide and vertical driver；Set in dispenser it is spiral go out plastic pipe, go out plastic pipe
Input end connection glue mixer, AB glue mixed in the glue mixer after from going out in plastic pipe to flow out；On dispenser
Cooling device is set, and cooling device makes the glue temperature for entering plastic pipe be maintained at 2~5 DEG C, when glue is sent out after mixing
Biochemical reaction, in order to delay the speed of chemical reaction, makes glue be maintained at higher viscosity, the present invention is by reducing glue
The mode of temperature is controlled, and ensures that the viscosity in glue flow process will not decline, so as to ensure the connection after glue solidification
Intensity.
Present invention also offers a kind of AB glue adhesion technique, it can be achieved that identical technique effect.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of schematic diagram of concrete structure of point glue equipment provided by the invention；
Fig. 2A is the structure diagram of dispensing workpiece；
Fig. 2 B are the structure diagram of bonding workpiece；
Fig. 2 C are dispensing workpiece and bond the structure chart that workpiece mutually assembles；
Fig. 3 is the structure diagram of pressing device；
Fig. 4 is the flow chart of AB glue adhesion technique of the present invention；
Fig. 5 is the schematic diagram that foam is mounted on dispensing workpiece.
Figure includes：
Support platform 1, dispensing stent 2, dispenser 3, pressing stent 4, profiling base 5, pressure head 6.
Embodiment
The present invention core be to provide a kind of AB glue bonder, make glue flow during keep viscosity so that
Improve bonding strength.
In order to make those skilled in the art more fully understand technical scheme, below in conjunction with attached drawing and specifically
Embodiment, to the present invention AB glue bonder and AB glue adhesion technique explanation is described in detail.
AB glue bonder includes point glue equipment and pressing device, as shown in Figure 1, being point glue equipment provided by the invention
A kind of concrete structure schematic diagram, point glue equipment include support platform 1, play the role of support, support platform by support platform 1
1 is the agent structure of single unit system；Dispensing stent 2 is set in support platform 1, and dispensing stent 2 is used to support spacing dispenser 3；
Dispensing stent 2 can use gantry frame structure, set horizontal slide rail on dispensing stent 2, horizontal slide rail plays the role of guiding, is used for
It is oriented to dispenser 3 and makees horizontal reciprocating movement, dispenser 3 can be driven by lateral driver device, be moved in horizontal slide rail, can be adopted
The mode rotated with motor driving roller is moved；The vertical driver of control gum outlet vertical lifting is set on dispenser 3, can be
The forms such as telescoping cylinder, make dispensing mouth align needs position for dispensing glue exactly, for place workpiece supporting structure can along hang down
Directly in horizontal slide rail direction move, so as to dispensing into space arbitrary position.
Set in dispenser 3 it is spiral go out plastic pipe, go out plastic pipe connection glue mixer, AB glue needs to first pass through mixed
Just it can be used after conjunction, AB glue mixes in glue mixer, then is flowed out from going out in plastic pipe, and AB glue is opened once viscosity after mixing
Begin to decline, low temperature environment can slow down the speed of viscosity decline, therefore the present invention sets cooling device, cooling dress on dispenser 3
Putting makes the glue temperature for entering plastic pipe be maintained at 2~5 DEG C, and glue remains at during being flowed in going out plastic pipe
At relatively low temperature, the viscosity of glue farthest ensure that, improve the structural strength after workpiece bonding.
Usually, dispensing workpiece is aluminum alloy materials, and bonding workpiece is plastic part, is as shown in Figure 2 A the knot of dispensing workpiece
Structure schematic diagram, Fig. 2 B are the structure diagram of bonding workpiece, and Fig. 2 C are dispensing workpiece and bond the structure chart that workpiece mutually assembles,
A represents dispensing workpiece in figure, and B represents bonding workpiece.The dispensing base for being used to support dispensing workpiece is set in support platform 1,
Al-alloy parts are supported by dispensing base during dispensing, and the shape of dispensing base is bonded with the upper surface matching of dispensing workpiece, can
Stable support is provided dispensing workpiece, smears glue more uniform.
Further, present invention additionally comprises pressing device, as shown in figure 3, the structure diagram for pressing device；Pressing dress
The pressing stent 4 including being arranged in support platform 1 is put, and the profiling base 5 being used to support is set in support platform 1, is imitated
Shape base 5 is located at the surface of support platform 1；Profiling base 5 supports the dispensing workpiece bonded and bonding workpiece at the same time, also
It is the gap face profiling base 5 said dispensing workpiece and bond workpiece contact；The shape of 5 upper surface of profiling base and dispensing workpiece
Identical with the underside shape of both bonding workpiece, profiling base 5 can be bonded completely with the bottom surface of dispensing workpiece and bonding workpiece；
The pressure head 6 driven by vertical lifting device is set on pressing stent 4, and pressure head 6 cooperates dispensing workpiece with profiling base 5
With bonding workpiece crimping.Pressure head 6 is located at the surface of profiling base 5, and pressure head 6 can move down the upper surface with workpiece,
Upper, Al-alloy parts and plastic part are laminated pressure head 6 by profiling base 5 under, by pressure, treat that glue solidifies latter two work
Part is just fixed to one.Because profiling base 5 employs imitated structure, namely upper surface shape and two glued workpiece
Shape is identical, therefore can provide workpiece more preferable supporting role, and the lower section of workpiece is almost without hanging part, everywhere
It can be subject to uniform pressure, adhering state is reached best.
Further, the shape of pressure head 6 is bonded completely with the upper surface of dispensing workpiece and bonding workpiece in the present invention, can be risen
To the effect identical with profiling base 5.Pressure head 6 is copper material, it is heated by heating unit, profiling base 5 can use
Bakelite is made, set-up mode that also can be identical with 6 use of pressure head.Workpiece heat is accelerated by pressure head 6 during pressing
The process of glue solidification, improves processing speed.Present invention eliminates the pressing magnet in traditional structure, the influence of non-magnet can be
The bonding of lid of bursting at the seams is adjusted optimally.
In addition, present invention also offers a kind of AB glue adhesion technique, as shown in figure 4, being AB glue adhesion technique of the present invention
Flow chart；Dispensing workpiece, be positioned on point glue equipment by S1, and the AB glue mixed glue solution for keeping the temperature at 2~5 DEG C is applied and is attached to
On dispensing workpiece；Mixed AB glue is set to keep higher viscosity at low temperature；Dispensing workpiece, be transferred to by S2 from point glue equipment
On pressing device, and bonding workpiece is placed, the dispensing workpiece for making to be bonded and bonding workpiece are bonded support by profiling base 5；It is imitative
Shape base 5 is bonded completely with the underside shape of workpiece, can provide workpiece uniform and stable support force；S3, pass through pressing
The pressure head 6 of device coordinates with profiling base 5 dispensing workpiece and bonding workpiece pressing to be fixed.
Means the process employs low temperature keep viscosity of the glue in flow process, while are provided by profiling base
Uniform support force, avoids reserving diastema, so that the effect of pressing is more preferable, can obtain structural strength height, seam is everywhere
The bonded structure being completely embedded.
More specifically, before being pressed by pressure head 6, heating pressure head 6, makes it to dispensing workpiece and bonding workpiece heat conduction.Pressure head 6
It is made of the material of good heat conduction effect, such as copper, heating unit is set at pressure head 6, pressure head 6 can be made by way of electric heating
Heating, when pressing, transfer heat to workpiece, and glue can quickly condense fixation, and two workpiece are fixed as one.
AB glue mixed glue solution is applied after being attached to dispensing workpiece, foam cushion is mounted in the inner surface of dispensing workpiece, such as Fig. 5 institutes
Show, be the schematic diagram that foam is mounted on dispensing workpiece, C represents foam in figure；Foam material is softer, can compressive deformation, to bonding
Workpiece provides support, so that dispensing workpiece is flushed with bonding the outer surface of workpiece, appearance is more preferable.
In order to further lift the connection effect of glue, AB glue mixed glue solution is applied before being attached to dispensing workpiece, first to point
Glue workpiece carries out laser carving and removes removing oxide layer, glue is directly contacted the metal body of workpiece, can reach more preferable fixed effect.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle, can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, this hair
It is bright to be not intended to be limited to the embodiments shown herein, and be to fit to and the principles and novel features disclosed herein phase
Consistent most wide scope.
Claims (8)
1. a kind of AB glue bonder, it is characterised in that including point glue equipment, the point glue equipment includes support platform (1), institute
State and dispensing stent (2) is set in support platform (1), horizontal slide rail is set on the dispensing stent (2), for being oriented to dispenser
(3) mobile back and forth horizontally, the vertical driver of setting control gum outlet vertical lifting on the dispenser (3) is made；The dispensing
Set in machine (3) it is spiral go out plastic pipe, it is described go out plastic pipe connection glue mixer, AB glue is in the glue mixer
After mixing from it is described go out plastic pipe in flow out；Cooling device is set on the dispenser (3), and the cooling device makes to enter described
The glue temperature for going out plastic pipe is maintained at 2~5 DEG C.
2. AB glue bonder according to claim 1, it is characterised in that set on the support platform (1) and be used for branch
The dispensing base of support point glue workpiece, the shape of the dispensing base are bonded with the upper surface matching of dispensing workpiece.
3. AB glue bonder according to claim 2, it is characterised in that further include pressing device, the pressing device
Including the pressing stent (4) being arranged in the support platform (1), the profiling being used to support is set on the support platform (1)
Base (5), the profiling base (5) while the dispensing workpiece that is bonded of support and bonding workpiece, and with dispensing workpiece and gluing
The bottom surface for closing workpiece is bonded completely；The pressure head (6) driven by vertical lifting device is set on the pressing stent (4), it is described
Pressure head (6) cooperates with the profiling base (5) and crimps dispensing workpiece and bonding workpiece.
4. AB glue bonder according to claim 3, it is characterised in that the shape of the pressure head (6) and dispensing workpiece
It is bonded completely with the upper surface of bonding workpiece；And the pressure head (6) is copper, it is heated by heating unit.
A kind of 5. AB glue adhesion technique, it is characterised in that including：
Dispensing workpiece is positioned on point glue equipment, and the AB glue mixed glue solution for keeping the temperature at 2~5 DEG C applies and is attached to dispensing work
On part；
Dispensing workpiece is transferred on pressing device from point glue equipment, and places bonding workpiece, make the dispensing workpiece that is bonded and
Bond workpiece and support is bonded by profiling base (5)；
Coordinated by the pressure head (6) of the pressing device with the profiling base (5) dispensing workpiece and bonding workpiece to be pressed
It is fixed.
6. AB glue adhesion technique according to claim 5, it is characterised in that before being pressed by the pressure head (6), heat institute
Pressure head (6) is stated, makes it to dispensing workpiece and bonding workpiece heat conduction.
7. AB glue adhesion technique according to claim 6, it is characterised in that AB glue mixed glue solution is applied and is attached to dispensing workpiece
Afterwards, foam cushion is mounted on dispensing workpiece, so that dispensing workpiece is flushed with bonding the outer surface of workpiece.
8. AB glue adhesion technique according to claim 7, it is characterised in that AB glue mixed glue solution is applied and is attached to dispensing workpiece
Before, laser carving first is carried out to dispensing workpiece and removes removing oxide layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711321660.XA CN107899871A (en) | 2017-12-12 | 2017-12-12 | A kind of AB glue bonder and AB glue adhesion technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711321660.XA CN107899871A (en) | 2017-12-12 | 2017-12-12 | A kind of AB glue bonder and AB glue adhesion technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107899871A true CN107899871A (en) | 2018-04-13 |
Family
ID=61865589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711321660.XA Pending CN107899871A (en) | 2017-12-12 | 2017-12-12 | A kind of AB glue bonder and AB glue adhesion technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107899871A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0679445A2 (en) * | 1994-04-29 | 1995-11-02 | Nordson Corporation | Thermal barrier for hot glue adhesive dispenser |
| US5518768A (en) * | 1995-02-03 | 1996-05-21 | Nd Industries, Inc. | Method and apparatus for making retaining elements |
| CN1857906A (en) * | 2005-05-08 | 2006-11-08 | 华硕电脑股份有限公司 | Adhesive method for metal piece and plastic piece and adhered machine casing thereof |
| CN201997442U (en) * | 2011-04-19 | 2011-10-05 | 卢柳均 | Special dispensing machine for glue A and glue B |
| CN202238508U (en) * | 2011-08-30 | 2012-05-30 | 王弋 | Glue dispensing device for AB glue |
| CN202752173U (en) * | 2012-07-17 | 2013-02-27 | 苏州市星光精密机械有限公司 | AB glue mixing tube cooling device |
| CN104084329A (en) * | 2014-07-16 | 2014-10-08 | 青岛大学 | AB glue dispensing device based on electrostatic spraying principle |
| CN105583124A (en) * | 2016-03-18 | 2016-05-18 | 昆山市祥云隆精密设备有限公司 | Ab glue dispensing device |
| CN106799339A (en) * | 2017-03-15 | 2017-06-06 | 镇江力点锚固有限公司 | A kind of AB glue points adhesive dispenser |
| CN107442360A (en) * | 2017-09-26 | 2017-12-08 | 苏州卓兆自动化科技有限公司 | A kind of point gum machine with refrigerating function |
-
2017
- 2017-12-12 CN CN201711321660.XA patent/CN107899871A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0679445A2 (en) * | 1994-04-29 | 1995-11-02 | Nordson Corporation | Thermal barrier for hot glue adhesive dispenser |
| US5518768A (en) * | 1995-02-03 | 1996-05-21 | Nd Industries, Inc. | Method and apparatus for making retaining elements |
| CN1857906A (en) * | 2005-05-08 | 2006-11-08 | 华硕电脑股份有限公司 | Adhesive method for metal piece and plastic piece and adhered machine casing thereof |
| CN201997442U (en) * | 2011-04-19 | 2011-10-05 | 卢柳均 | Special dispensing machine for glue A and glue B |
| CN202238508U (en) * | 2011-08-30 | 2012-05-30 | 王弋 | Glue dispensing device for AB glue |
| CN202752173U (en) * | 2012-07-17 | 2013-02-27 | 苏州市星光精密机械有限公司 | AB glue mixing tube cooling device |
| CN104084329A (en) * | 2014-07-16 | 2014-10-08 | 青岛大学 | AB glue dispensing device based on electrostatic spraying principle |
| CN105583124A (en) * | 2016-03-18 | 2016-05-18 | 昆山市祥云隆精密设备有限公司 | Ab glue dispensing device |
| CN106799339A (en) * | 2017-03-15 | 2017-06-06 | 镇江力点锚固有限公司 | A kind of AB glue points adhesive dispenser |
| CN107442360A (en) * | 2017-09-26 | 2017-12-08 | 苏州卓兆自动化科技有限公司 | A kind of point gum machine with refrigerating function |
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Application publication date: 20180413 |