CN107567189A - A kind of method for improving pcb board indigo plant glue ink sealing of hole - Google Patents
A kind of method for improving pcb board indigo plant glue ink sealing of hole Download PDFInfo
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- CN107567189A CN107567189A CN201710775294.9A CN201710775294A CN107567189A CN 107567189 A CN107567189 A CN 107567189A CN 201710775294 A CN201710775294 A CN 201710775294A CN 107567189 A CN107567189 A CN 107567189A
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- pcb board
- glue ink
- indigo plant
- gong
- fiberboard
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Abstract
The present invention relates to a kind of method for improving pcb board indigo plant glue ink sealing of hole, comprise the following steps：Gong band is made, the position for needing silk-screen indigo plant glue ink with reference to pcb board surface makes gong band；Fiberboard is chosen, plate technique is carried out out to the fiberboard with reference to pcb board size；Using gong band, fiberboard gong is gone out into dead slot；The good fiberboard of gong and grenadine are bonded by adhesive tape, glue, and dried；By screen frame on screen printing table；At the back side of pcb board, aperture is blocked more than 3.0mm through holes by High temperature-resistanadhesive adhesive tape；The NPTH holes on pcb board are chosen as positioning hole, are fixed on by pilot pin on screen printing table；The silk-screen indigo plant glue ink on pcb board；Pcb board is dried；Tear tape, complete.Blue glue ink and the blue glue ink integrated molding on pcb board surface in the through hole of large aperture, blue glue ink fracture is less prone to when tearing blue glue ink, the situation of blue glue ink is remained in hole, production efficiency is greatly improved, good quality guarantee is also provided to SMT.
Description
Technical field
The present invention relates to PCB manufacture fields, more particularly to a kind of method for improving pcb board indigo plant glue ink sealing of hole.
Background technology
For there is a pcb board of blue glue ink, the macropore in customer requirement plate（dia>3.0mm）It is also required to blue glue ink envelope
Hole, go to print blue glue ink according to normal way, cause blue glue ink can not sealing of hole, and the production board that client takes away is tearing blue glue
It is broken when ink, blue glue ink is remained in hole, SMT is influenceed, need to go after the blue glue ink in hole is got rid of to go again manually
SMT, consume very much manpower and materials.
The content of the invention
To achieve the above object, the present invention adopts the following technical scheme that：A kind of side for improving pcb board indigo plant glue ink sealing of hole
Method, it is characterised in that comprise the following steps：
S1：Gong band is made, the position for needing silk-screen indigo plant glue ink with reference to pcb board surface makes gong band；
S2：Plate is opened, fiberboard is chosen, plate technique is carried out out to the fiberboard with reference to pcb board size；
S3：Gong plate, using the gong band made in S1 steps, fiberboard gong is gone out into dead slot；
S4：Half tone is made, the good fiberboard of gong and grenadine are bonded by adhesive tape, glue, and dried；
S5：Half tone is set up, by screen frame on screen printing table；
S6：Sealing of hole, at the back side of pcb board, aperture is blocked more than 3.0mm through holes by High temperature-resistanadhesive adhesive tape；
S7：Determine pcb board, choose the NPTH holes on pcb board as positioning hole, be fixed on by pilot pin on screen printing table；
S8：Silk-screen, the silk-screen indigo plant glue ink on pcb board；
S9：Drying, pcb board is dried；
S10：Tear tape, complete.
The present invention operation principle be：The position for needing to print blue glue ink is fabricated to gong band, 3 need to be selected when making gong band
Pcb board hole site is as anchor point.
Take 0.5mm fiberboard to carry out sawing sheet, fiberboard is cut according to the size of pcb board, edge planer is used after cutting
The burr at fiber edges of boards edge and burr are polished off.Substitute the aluminium flake of conventional production and application using fiberboard, fiberboard it is hard
Degree is better than aluminium flake, does not allow after gong sky yielding.
Above-mentioned fiberboard is transferred load into gong machine, transfers ready-made gong band, it would be desirable to the position of silk-screen indigo plant glue ink on pcb board
It is empty to put the gong on fiberboard.
The edge of the good fiberboard of gong is fixed on grenadine with adhesive tape, the cementing at the opposite longitudinal side edge of grenadine, to increase
The adhesion of strong grenadine and fiberboard.The grenadine of fiberboard central region is sliced off into exposed fiber plate surface, the net that will be fabricated to
Version, which is placed in the room of constant temperature and humidity, dries.
By screen frame to screen printing table surface, the height of half tone is adjusted away from table top 8-10mm, it is ensured that the tension force of half tone is not less than
22 newton.
Choose the NPTH holes on pcb board surface（Bore dia is more than or equal to 2.0mm）As positioning hole, determining for appropriate size is chosen
Position pin, pilot pin is fixed on table top, being adjacent to adhesive tape, which ensures that pilot pin does not loosen, rocks.It will need to print blue glue on pcb board
The region internal orifice dimension of ink is more than 3.0mm through hole back side pasted with high temperature-resistant adhesive tape.The most bottom heat resisting temperature of High temperature-resistanadhesive adhesive tape is
266 DEG C, in silk-screen indigo plant glue ink, blue glue ink can be seeped into the back side out of excessive hole so that blue glue ink can not sealing of hole.Patch
Pcb board after good adhesive tape is fixed on table top by pilot pin, and blue glue ink is poured on half tone, the angle of scraper is adjusted to
45 °, silk-screen indigo plant glue ink is carried out to pcb board.During blue glue ink is printed, pay attention to checking whether blue glue ink has macropore
Seal, and blue glue ink can not be seeped into side and need on the PAD of tin, and pcb board is put into above thousand layer frames after the completion of silk-screen, noted
Meaning should not be overlapping and maintained a certain distance, and thousand layer frames is put into baking sheet in oven, 160 DEG C of baking sheet temperature, the baking sheet time 40 divides
Clock.Need to tear the High temperature-resistanadhesive adhesive tape at the back side after having baked.
Blue glue ink and the blue glue ink integrated molding on pcb board surface in the through hole of large aperture, when tearing blue glue ink
Blue glue ink fracture is less prone to, the situation of blue glue ink is remained in hole, production efficiency is greatly improved, also SMT is provided very
Good quality guarantee.
Further, in the S1 steps, 3 holes on pcb board is chosen and carry out gong band making as reference coordinates point.
Further, in the S2 steps, selection fiberboard thickness is 0.5mm.
Further, in the S2 steps, carry out removing burr technique after plate is opened.
Further, in the S5 steps, half tone is arranged to 8-10mm away from table surface height, and the tension force of half tone is more than 22N.
Further, in the S6 steps, the most bottom bearing temperature of High temperature-resistanadhesive adhesive tape is 266 DEG C.
Further, in the S8 steps, silk-screen cutting-tool angle is arranged to 45 °.
Further, in the S9 steps, drying temperature is 160 DEG C, drying time 40min.
Beneficial effects of the present invention are：Blue glue ink in the through hole of large aperture is integrated with the blue glue ink on pcb board surface
Shaping, blue glue ink fracture is less prone to when tearing blue glue ink, the situation of blue glue ink is remained in hole, greatly improves production effect
Rate, good quality guarantee is also provided to SMT.
Embodiment
The method for a kind of improvement pcb board indigo plant glue ink sealing of hole that one embodiment of the invention provides, it is characterised in that including such as
Lower step：
S1：Gong band is made, the position for needing silk-screen indigo plant glue ink with reference to pcb board surface makes gong band；
S2：Plate is opened, fiberboard is chosen, plate technique is carried out out to the fiberboard with reference to pcb board size；
S3：Gong plate, using the gong band made in S1 steps, fiberboard gong is gone out into dead slot；
S4：Half tone is made, the good fiberboard of gong and grenadine are bonded by adhesive tape, glue, and dried；
S5：Half tone is set up, by screen frame on screen printing table；
S6：Sealing of hole, at the back side of pcb board, aperture is blocked more than 3.0mm through holes by High temperature-resistanadhesive adhesive tape；
S7：Determine pcb board, choose the NPTH holes on pcb board as positioning hole, be fixed on by pilot pin on screen printing table；
S8：Silk-screen, the silk-screen indigo plant glue ink on pcb board；
S9：Drying, pcb board is dried；
S10：Tear tape, complete.
The position for needing to print blue glue ink is fabricated to gong band, 3 pcb board hole sites need to be selected when making gong band as positioning
Point.
Take 0.5mm fiberboard to carry out sawing sheet, fiberboard is cut according to the size of pcb board, edge planer is used after cutting
The burr at fiber edges of boards edge and burr are polished off.Substitute the aluminium flake of conventional production and application using fiberboard, fiberboard it is hard
Degree is better than aluminium flake, does not allow after gong sky yielding.
Above-mentioned fiberboard is transferred load into gong machine, transfers ready-made gong band, it would be desirable to the position of silk-screen indigo plant glue ink on pcb board
It is empty to put the gong on fiberboard.
The edge of the good fiberboard of gong is fixed on grenadine with adhesive tape, the cementing at the opposite longitudinal side edge of grenadine, to increase
The adhesion of strong grenadine and fiberboard.The grenadine of fiberboard central region is sliced off into exposed fiber plate surface, the net that will be fabricated to
Version, which is placed in the room of constant temperature and humidity, dries.
By screen frame to screen printing table surface, the height of half tone is adjusted away from table top 8-10mm, it is ensured that the tension force of half tone is not less than
22 newton.
Choose the NPTH holes on pcb board surface（Bore dia is more than or equal to 2.0mm）As positioning hole, determining for appropriate size is chosen
Position pin, pilot pin is fixed on table top, being adjacent to adhesive tape, which ensures that pilot pin does not loosen, rocks.It will need to print blue glue on pcb board
The region internal orifice dimension of ink is more than 3.0mm through hole back side pasted with high temperature-resistant adhesive tape.The most bottom heat resisting temperature of High temperature-resistanadhesive adhesive tape is
266 DEG C, in silk-screen indigo plant glue ink, blue glue ink can be seeped into the back side out of excessive hole so that blue glue ink can not sealing of hole.Patch
Pcb board after good adhesive tape is fixed on table top by pilot pin, and blue glue ink is poured on half tone, the angle of scraper is adjusted to
45 °, silk-screen indigo plant glue ink is carried out to pcb board.During blue glue ink is printed, pay attention to checking whether blue glue ink has macropore
Seal, and blue glue ink can not be seeped into side and need on the PAD of tin, and pcb board is put into above thousand layer frames after the completion of silk-screen, noted
Meaning should not be overlapping and maintained a certain distance, and thousand layer frames is put into baking sheet in oven, 160 DEG C of baking sheet temperature, the baking sheet time 40 divides
Clock.Need to tear the High temperature-resistanadhesive adhesive tape at the back side after having baked.
Blue glue ink and the blue glue ink integrated molding on pcb board surface in the through hole of large aperture, when tearing blue glue ink
Blue glue ink fracture is less prone to, the situation of blue glue ink is remained in hole, production efficiency is greatly improved, also SMT is provided very
Good quality guarantee.
Further, in the S1 steps, 3 holes on pcb board is chosen and carry out gong band making as reference coordinates point.
Further, in the S2 steps, selection fiberboard thickness is 0.5mm.
Further, in the S2 steps, carry out removing burr technique after plate is opened.
Further, in the S5 steps, half tone is arranged to 8-10mm away from table surface height, and the tension force of half tone is more than 22N.
Further, in the S6 steps, the most bottom bearing temperature of High temperature-resistanadhesive adhesive tape is 266 DEG C.
Further, in the S8 steps, silk-screen cutting-tool angle is arranged to 45 °.
Further, in the S9 steps, drying temperature is 160 DEG C, drying time 40min.
Blue glue ink and the blue glue ink integrated molding on pcb board surface in the through hole of large aperture, when tearing blue glue ink
Blue glue ink fracture is less prone to, the situation of blue glue ink is remained in hole, production efficiency is greatly improved, also SMT is provided very
Good quality guarantee.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
- A kind of 1. method for improving pcb board indigo plant glue ink sealing of hole, it is characterised in that comprise the following steps：S1：Gong band is made, the position for needing silk-screen indigo plant glue ink with reference to pcb board surface makes gong band；S2：Plate is opened, fiberboard is chosen, plate technique is carried out out to the fiberboard with reference to pcb board size；S3：Gong plate, using the gong band made in S1 steps, fiberboard gong is gone out into dead slot；S4：Half tone is made, the good fiberboard of gong and grenadine are bonded by adhesive tape, glue, and dried；S5：Half tone is set up, by screen frame on screen printing table；S6：Sealing of hole, at the back side of pcb board, aperture is blocked more than 3.0mm through holes by High temperature-resistanadhesive adhesive tape；S7：Determine pcb board, choose the NPTH holes on pcb board as positioning hole, be fixed on by pilot pin on screen printing table；S8：Silk-screen, the silk-screen indigo plant glue ink on pcb board；S9：Drying, pcb board is dried；S10：Tear tape, complete.
- 2. improve the method for pcb board indigo plant glue ink sealing of hole according to claim 1, it is characterised in that：In the S1 steps, choosing 3 holes on pcb board are taken to carry out gong band making as reference coordinates point.
- 3. improve the method for pcb board indigo plant glue ink sealing of hole according to claim 1, it is characterised in that：In the S2 steps, choosing It is 0.5mm to take fiberboard thickness.
- 4. improve the method for pcb board indigo plant glue ink sealing of hole according to claim 1, it is characterised in that：In the S2 steps, Carry out removing burr technique after opening plate.
- 5. improve the method for pcb board indigo plant glue ink sealing of hole according to claim 1, it is characterised in that：In the S5 steps, net Version is arranged to 8-10mm away from table surface height, and the tension force of half tone is more than 22N.
- 6. improve the method for pcb board indigo plant glue ink sealing of hole according to claim 1, it is characterised in that：It is resistance in the S6 steps The most bottom bearing temperature of high temperature gummed tape is 266 DEG C.
- 7. improve the method for pcb board indigo plant glue ink sealing of hole according to claim 1, it is characterised in that：In the S8 steps, silk Print cutting-tool angle is arranged to 45 °.
- 8. improve the method for pcb board indigo plant glue ink sealing of hole according to claim 1, it is characterised in that：In the S9 steps, dry Dry temperature is 160 DEG C, drying time 40min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710775294.9A CN107567189A (en) | 2017-08-31 | 2017-08-31 | A kind of method for improving pcb board indigo plant glue ink sealing of hole |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710775294.9A CN107567189A (en) | 2017-08-31 | 2017-08-31 | A kind of method for improving pcb board indigo plant glue ink sealing of hole |
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| CN107567189A true CN107567189A (en) | 2018-01-09 |
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| CN201710775294.9A Pending CN107567189A (en) | 2017-08-31 | 2017-08-31 | A kind of method for improving pcb board indigo plant glue ink sealing of hole |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110402028A (en) * | 2019-07-18 | 2019-11-01 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing RRU board of communication base station |
| CN110446355A (en) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | A kind of LED lamp bead package board filling holes with resin technique |
| CN111642073A (en) * | 2020-05-28 | 2020-09-08 | 深圳市博敏电子有限公司 | Manufacturing method of stepped trough plate |
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| CN201904977U (en) * | 2010-12-27 | 2011-07-20 | 深圳市翔宇电路有限公司 | Blue glue printing device for PCB print |
| CN202944008U (en) * | 2012-12-23 | 2013-05-22 | 胜宏科技（惠州）股份有限公司 | Screen printing plate for printing peelable blue gel |
| CN105050330A (en) * | 2015-07-02 | 2015-11-11 | 江门崇达电路技术有限公司 | Method for manufacturing thickened silk printing plate and method for silk printing blue gel by using thickened silk printing plate |
| CN106211587A (en) * | 2016-08-15 | 2016-12-07 | 建业科技电子（惠州）有限公司 | A kind of blue glue making plug holes of pcb board |
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2017
- 2017-08-31 CN CN201710775294.9A patent/CN107567189A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6453811B1 (en) * | 1995-07-12 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Printing method and printing apparatus |
| CN201904977U (en) * | 2010-12-27 | 2011-07-20 | 深圳市翔宇电路有限公司 | Blue glue printing device for PCB print |
| CN202944008U (en) * | 2012-12-23 | 2013-05-22 | 胜宏科技（惠州）股份有限公司 | Screen printing plate for printing peelable blue gel |
| CN105050330A (en) * | 2015-07-02 | 2015-11-11 | 江门崇达电路技术有限公司 | Method for manufacturing thickened silk printing plate and method for silk printing blue gel by using thickened silk printing plate |
| CN106211587A (en) * | 2016-08-15 | 2016-12-07 | 建业科技电子（惠州）有限公司 | A kind of blue glue making plug holes of pcb board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110402028A (en) * | 2019-07-18 | 2019-11-01 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing RRU board of communication base station |
| CN110446355A (en) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | A kind of LED lamp bead package board filling holes with resin technique |
| CN111642073A (en) * | 2020-05-28 | 2020-09-08 | 深圳市博敏电子有限公司 | Manufacturing method of stepped trough plate |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180109 |
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| RJ01 | Rejection of invention patent application after publication |