CN107273878A - Fingerprint sensor, chip and the equipment that safety verification is carried out by fingerprint - Google Patents

Fingerprint sensor, chip and the equipment that safety verification is carried out by fingerprint Download PDF

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Publication number
CN107273878A
CN107273878A CN201710619878.7A CN201710619878A CN107273878A CN 107273878 A CN107273878 A CN 107273878A CN 201710619878 A CN201710619878 A CN 201710619878A CN 107273878 A CN107273878 A CN 107273878A
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CN
China
Prior art keywords
fingerprint
substrate
wafer
chip
voltage
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Pending
Application number
CN201710619878.7A
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Chinese (zh)
Inventor
戴�峰
杨伟文
谢勇辉
汪利
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Shenzhen Magic Information Technology Co Ltd
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Shenzhen Magic Information Technology Co Ltd
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Publication date
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Priority to CN201710619878.7A priority Critical patent/CN107273878A/en
Publication of CN107273878A publication Critical patent/CN107273878A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1306Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing

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  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

A kind of equipment that the present invention carries out safety verification suitable for fingerprint identification technology field there is provided fingerprint sensor, chip and by fingerprint, the fingerprint sensor includes:Substrate;The substrate includes:Pumping signal emission layer and pumping signal receiving layer, the voltage or curent change of fingerprint during for detecting that finger is touched;Wafer, the wafer is integrated with the substrate package, with least 1 road ADC and at least 1 road DAC, bit at least 8, for the voltage or curent change collection fingerprint image of the fingerprint detected according to the substrate.The fingerprint sensor that the present invention is provided, silicon chip is replaced using substrate, significantly reduces the cost of fingerprint sensor.

Description

Fingerprint sensor, chip and the equipment that safety verification is carried out by fingerprint
Technical field
The invention belongs to fingerprint identification technology field, more particularly to a kind of fingerprint sensor, chip and carried out by fingerprint The equipment of safety verification.
Background technology
In recent years, portable set is by people's extensive use, the personal information for the Large Copacity that is stored with these equipment or The information of other need for confidentiality of person, so these equipment are all provided with safeguard measure to protect the safety of these information.At these In safeguard measure, fingerprint recognition is widely used as a kind of higher safeguard procedures of reliability.
In the prior art, for fingerprint recognition circuit, each component is all disposed within silicon chip, so the face of silicon chip Product will at least be equal to the area of picking up fingerprint image needed for fingerprint sensor, but silicon chip manufacturing cost is very high, limitation The development of fingerprint Identification sensor.
The content of the invention
The embodiment of the present invention provides a kind of fingerprint sensor, it is intended to solve that fingerprint sensor cost is high in the prior art asks Topic.
The embodiment of the present invention is achieved in that a kind of fingerprint sensor, and the fingerprint sensor includes:
Substrate;
The substrate includes:
Pumping signal emission layer and pumping signal receiving layer, the voltage or electric current of fingerprint become during for detecting that finger is touched Change;
Wafer, the wafer is integrated with the substrate package, with least 1 road ADC and at least 1 road DAC, bit >=8 Position, for the voltage or curent change collection fingerprint image of the fingerprint detected according to the substrate.
Present invention also offers a kind of fingerprint chip, the fingerprint chip includes:
Substrate;
The substrate includes pumping signal emission layer and pumping signal receiving layer, the electricity of fingerprint during for detecting that finger is touched Pressure or curent change;
Wafer, the wafer is integrated with the substrate package, with least 1 road ADC and at least 1 road DAC, bit >=8 Position, for the voltage or curent change collection fingerprint image of the fingerprint detected according to the substrate;
The wafer includes MCU, and typing and comparison are carried out to the fingerprint image.
Present invention also offers a kind of equipment that safety verification is carried out by fingerprint, the equipment includes fingerprint chip;
The fingerprint chip includes:
Substrate;
The substrate includes pumping signal emission layer and pumping signal receiving layer, the electricity of fingerprint during for detecting that finger is touched Pressure or curent change;
Wafer, the wafer is integrated with the substrate package, with least 1 road ADC and at least 1 road DAC, bit >=8 Position, for the voltage or curent change collection fingerprint image of the fingerprint detected according to the substrate;
The wafer includes MCU, and typing and comparison are carried out to the fingerprint image.
The fingerprint sensor that the present invention is provided, the emission layer of setting signal and the receiving layer of signal are by finger on substrate The voltage or curent change of fingerprint are transferred to wafer during touch, and fill parallel operation ADC and digital-to-analogue conversion by the modulus on wafer Device DAC is handled signal, obtains the image of fingerprint.The fingerprint sensor that the present invention is provided, silicon substrate is replaced using substrate Piece, significantly reduces the cost of fingerprint sensor.
Brief description of the drawings
Fig. 1 is the structural representation of fingerprint sensor provided in an embodiment of the present invention;
Fig. 2 is the structural representation of substrate emission layer provided in an embodiment of the present invention and receiving layer;
Fig. 3 is the functional block diagram of fingerprint chip provided in an embodiment of the present invention;
Fig. 4 is the structural representation of the USB flash disk provided in an embodiment of the present invention with fingerprint chip.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
The fingerprint sensor that the present invention is provided, silicon chip is replaced using substrate, and detection fingerprint letter is provided on substrate Number signal emission layer and signal receiving layer, and signal is handled by the wafer on substrate, finally obtains fingerprint Image.Significantly reduce the cost of fingerprint sensor.
Implementing for the present invention is described in detail below in conjunction with specific embodiment.
As depicted in figs. 1 and 2, in the embodiment that the present invention is provided, the fingerprint sensor includes:
Substrate 1;
Substrate 1 includes:
Pumping signal emission layer and pumping signal receiving layer, the voltage or electric current of fingerprint become during for detecting that finger is touched Change;
Wafer 2, wafer 2 is packaged as a whole with substrate 1, with least 1 road ADC and at least 1 road DAC, bit >=8, uses Fingerprint image is gathered in the voltage or curent change of the fingerprint detected according to substrate 1.
In the present embodiment, when the fingerprint of finger is pressed against substrate, during the receiving layer collection pressing of the signal on substrate The change of voltage or electric current caused by fingerprint, and sent the signal collected to wafer by signal emission layer, and Parallel operation ADC and digital analog converter DAC is filled by the modulus on wafer to handle signal, obtains the image of fingerprint.The present invention The fingerprint sensor of offer, silicon chip is replaced using substrate, significantly reduces the cost of fingerprint sensor.
In the present embodiment, substrate can use pcb board, it would however also be possible to employ glass, ceramics or plastic or other material are made, base Plate is at least provided with four layers:Between signal receiving layer, signal emission layer, bus plane and bottom (public terminal GND), each layer mutually absolutely Edge.Signal receiving layer is provided with a plurality of TX lines, and signal emission layer is provided with a plurality of RX lines, and TX lines and RX lines are crisscross, forms many Many pixels (that is, crosspoint), each pixel has the electric capacity formed between TX lines and RX lines, user's pressing substrate When, the raised line of fingerprint is contacted with substrate, and siphons away the electric current of a very little from contact point, so as to cause the electricity with fingerprint tough The voltage or electric current of appearance can change, and the density that electric capacity is set is enough, after the electric signal that these electric capacity are produced is handled just Clearly fingerprint profile can be obtained.It may be appreciated TX lines and the line width and adjacent two TX lines of RX lines or adjacent two RX The definition of the line effect of distance fingerprint image of line, the smaller pixel of numerical value of selection is more intensive, and the fingerprint image taken is more clear Clear, same difficulty of processing is also bigger, so under the conditions of existing process technology, the line width of TX lines and RX lines in the present embodiment 20um can be used, the line spacing of adjacent two TX lines or adjacent two RX lines can use 50um.
In addition, ADC and DAC quantity is more, the processing to signal is faster, i.e. the identification to fingerprint is sensitiveer, it is preferred that At least provided with 4 road ADC and 4 road DAC on wafer, the processing speed of wafer is set to reach 50 milliseconds.In addition, wafer-process device Bit how many recognition effects that correspond to signal, bit digits are more, and the resolution ratio of processor is higher, to the recognition effect of signal It is better, it is preferred that bit >=8.In order to strengthen recognition effect, over-sampling can be used, the mode then averaged is come Process signal.
In the embodiment that the present invention is provided, substrate 1 is the material with certain dielectric constant, specifically, basic 1 is used for The face of fingerprint is gathered by being made with certain dielectric constant material, can cause on substrate during so as to finger contact substrate voltage or The change of electric current.
Further, since in actual use, fingerprint sensor is often disturbed by extraneous signal, such as forceful electric power factory, The interference signal of the generation such as magnetic field and vibrations, can influence the recognition effect of fingerprint sensor, so, the reality provided in the present invention Apply in example, wafer 2 includes noise filtering component, for filtering out the environmental disturbances signal during fingerprint image acquisition.Noise The filter assemblies component such as including filter capacitor, substrate is obtained after fingerprint signal, is first passed through noise filtering component and is filtered place Reason, then again by wafer-process, to obtain the fingerprint image become apparent from.
Present invention also offers a kind of fingerprint chip, the fingerprint chip includes:
Substrate;Substrate includes pumping signal emission layer and pumping signal receiving layer, fingerprint during for detecting that finger is touched Voltage or curent change;Wafer, the wafer is integrated with the substrate package, with least 1 road ADC and at least 1 road DAC, Bit >=8, for the voltage or curent change collection fingerprint image of the fingerprint detected according to substrate;The wafer is included There is MCU, typing and comparison are carried out to fingerprint image.
It should be understood that in the present embodiment, combination of the fingerprint chip equivalent to MCU and above-mentioned fingerprint sensor, i.e., MCU is arranged on the wafer of fingerprint sensor.Because fingerprint sensor by using substrate receives fingerprint signal, reduce Cost, so the cost for the fingerprint chip that the present invention is provided is thereby also reduced.
As shown in figure 3, in the present embodiment, fingerprint sensor obtains a finger print information, and changes after literary fingerprint image, can To be stored in fingerprint chip.In addition, the fingerprint image that fingerprint sensor is obtained can also be with the fingerprint image that is prestored in chip As being compared, and command adapted thereto can be produced according to comparison result.
Further, in the present embodiment, in order to ensure user information safety, MCU includes safe encrypted component, is used for Finger print data is encrypted, and exported after fingerprint comparison result is encrypted.Specific fingerprint sensor is being collected After fingerprint image, MCU will pass through corresponding algorithm and the fingerprint image be encrypted, and think if the fingerprint image is user The image to be prestored, then fingerprint image stored after encryption, when need with other fingerprint images progress contrast be that MCU can be adjusted The fingerprint image of the encryption is taken, then it is decrypted by corresponding algorithm, and the fingerprint image obtained with fingerprint sensor As carrying out matching contrast, the result of contrast also can MCU encryptions.
AES can use symmetric encipherment algorithm, such as:DES(Data Encryption Standard)、3DES (Triple DES), AES (Advanced Encryption Standard) etc., wherein DES be data encryption standards, speed compared with It hurry up, it is adaptable to encrypt the occasion of mass data;3DES is to be based on DES, and a block number is carried out three times according to three different keys Encryption, intensity is higher;AES is Advanced Encryption Standard, is follow-on AES standard, and speed is fast, and level of security is high.Certainly AES can also use rivest, shamir, adelman, such as:RSA Algorithm, DSA algorithms (Digital Signature Algorithm), ECC algorithm (Elliptic Curves Cryptography) etc..It is excellent in the embodiment that the present invention is provided The symmetrical aes algorithm of use of choosing, such as AES128, AES256.
Present invention also offers a kind of equipment that safety verification is carried out by fingerprint, the equipment includes fingerprint chip, referred to Line chip includes:
Substrate, substrate includes pumping signal emission layer and pumping signal receiving layer, fingerprint during for detecting that finger is touched Voltage or curent change;
Wafer, wafer is integrated with substrate package, with least 1 road ADC and at least 1 road DAC, bit >=8, is used for Voltage or curent change the collection fingerprint image of the fingerprint detected according to substrate;
Wafer includes MCU, and typing and comparison are carried out to fingerprint image.
It should be understood that the equipment provided by the present invention that can carry out safety verification by fingerprint has used above-described embodiment In fingerprint chip, make whole equipment safer by fingerprint chip, further, since above-mentioned fingerprint chip and existing fingerprint Chip is cheaper compared to cost, so, these have used the manufacturing cost of the equipment of above-mentioned fingerprint chip also to reduce.
As shown in figure 4, be a kind of USB flash disk with fingerprint chip for providing of the present invention, including USB flash disk body 3, and provided with U Fingerprint chip 4 on disk body 3, as shown in figure 3, for the first time in use, user can first register, i.e., by the fingerprint typing of oneself And be stored in fingerprint chip 4, the finger print information of certain storage is encrypted, and is needed progress to log in when user reuses and is recognized Card, i.e. USB flash disk will obtain the finger print information of user, and match comparing with the finger print information prestored, when matching is compared Successful, then user can use the USB flash disk (e.g., to check USB flash disk memory storage file content, file in USB flash disk storage is deleted, into USB flash disk Storage file etc.), if matching is unsuccessful, user can not use the USB flash disk.In addition to preventing fingerprint chip to be collided Damage, protective cover to be opened/closed is provided with fingerprint chip, to be protected to fingerprint chip.
Above-mentioned equipment can also be household electrical appliance, such as micro-wave oven, by fingerprint authentication it is possible to prevente effectively from child Use, guarantee has been safely provided for them.Certainly above-mentioned equipment can also be mobile phone, door lock etc., be tested by fingerprint Card makes these equipment safer, simultaneously because these equipment have used the fingerprint chip that above-described embodiment is provided, so this Old of a little equipment is also reduced.
In summary, the fingerprint sensor that the present invention is provided, silicon chip is replaced using substrate, and inspection is provided on substrate The signal emission layer and signal receiving layer of fingerprint signal are surveyed, and signal is handled by the wafer on substrate, finally Obtain fingerprint image.Significantly reduce the cost of fingerprint sensor.The fingerprint chip that the present invention is provided, has used above-mentioned finger Line sensor, cost is similarly obtained reduction.In addition present invention also offers a kind of equipment that safety verification is carried out by fingerprint, than Such as USB flash disk, door lock, household electrical appliance, by fingerprint authentication, make the use of these equipment safer, simultaneously because these equipment The fingerprint chip used is inexpensive fingerprint chip provided by the present invention, so, the totle drilling cost of these equipment is also dropped It is low.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.

Claims (14)

1. fingerprint sensor, it is characterised in that the fingerprint sensor includes:
Substrate;
The substrate includes:
Pumping signal emission layer and pumping signal receiving layer, the voltage or curent change of fingerprint during for detecting that finger is touched;
Wafer, the wafer is integrated with the substrate package, with least 1 road ADC and at least 1 road DAC, bit >=8, For the voltage or curent change collection fingerprint image of the fingerprint detected according to the substrate.
2. fingerprint sensor as claimed in claim 1, it is characterised in that the substrate is the material with certain dielectric constant Matter.
3. fingerprint sensor as claimed in claim 2, it is characterised in that the substrate is PCB, glass or ceramics.
4. fingerprint sensor as claimed in claim 1, it is characterised in that the wafer includes noise filtering component, is used for Filter out the environmental disturbances signal during fingerprint image acquisition.
5. a kind of fingerprint chip, it is characterised in that the fingerprint chip includes:
Substrate;
The substrate include pumping signal emission layer and pumping signal receiving layer, for detect finger touch when fingerprint voltage or Person's curent change;
Wafer, the wafer is integrated with the substrate package, with least 1 road ADC and at least 1 road DAC, bit >=8, For the voltage or curent change collection fingerprint image of the fingerprint detected according to the substrate;
The wafer includes MCU, and typing and comparison are carried out to the fingerprint image.
6. fingerprint chip as claimed in claim 5, it is characterised in that the substrate is the material with certain dielectric constant.
7. fingerprint chip as claimed in claim 6, it is characterised in that the substrate is PCB, glass or ceramics.
8. fingerprint chip as claimed in claim 5, it is characterised in that the wafer includes noise filtering component, for filtering Except the environmental disturbances signal during fingerprint image acquisition.
9. fingerprint chip as claimed in claim 5, it is characterised in that the MCU includes safe encrypted component, for referring to Line data are encrypted, and export after fingerprint comparison result is encrypted.
10. a kind of equipment that safety verification is carried out by fingerprint, it is characterised in that the equipment includes fingerprint chip;
The fingerprint chip includes:
Substrate;
The substrate include pumping signal emission layer and pumping signal receiving layer, for detect finger touch when fingerprint voltage or Person's curent change;
Wafer, the wafer is integrated with the substrate package, with least 1 road ADC and at least 1 road DAC, bit >=8, For the voltage or curent change collection fingerprint image of the fingerprint detected according to the substrate;
The wafer includes MCU, and typing and comparison are carried out to the fingerprint image.
11. fingerprint chip as claimed in claim 10, it is characterised in that the substrate is the material with certain dielectric constant Matter.
12. fingerprint chip as claimed in claim 11, it is characterised in that the substrate is PCB, glass or ceramics.
13. fingerprint chip as claimed in claim 10, it is characterised in that the wafer includes noise filtering component, is used for Filter out the environmental disturbances signal during fingerprint image acquisition.
14. fingerprint chip as claimed in claim 10, it is characterised in that the MCU includes safe encrypted component, for pair Finger print data is encrypted, and exports after fingerprint comparison result is encrypted.
CN201710619878.7A 2017-07-26 2017-07-26 Fingerprint sensor, chip and the equipment that safety verification is carried out by fingerprint Pending CN107273878A (en)

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CN201710619878.7A CN107273878A (en) 2017-07-26 2017-07-26 Fingerprint sensor, chip and the equipment that safety verification is carried out by fingerprint

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710619878.7A CN107273878A (en) 2017-07-26 2017-07-26 Fingerprint sensor, chip and the equipment that safety verification is carried out by fingerprint

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110427925A (en) * 2018-11-08 2019-11-08 Oppo广东移动通信有限公司 Fingerprint identification method and relevant apparatus
CN113030621A (en) * 2021-03-18 2021-06-25 江阴邦融微电子有限公司 Fingerprint sensor testing device with anti-interference function and testing method
CN117975512A (en) * 2024-03-29 2024-05-03 深圳市魔力信息技术有限公司 Fingerprint image matching method based on Transformer

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103870817A (en) * 2014-03-27 2014-06-18 成都费恩格尔微电子技术有限公司 Radio-frequency micro-capacitance fingerprint acquisition chip and method
CN104850830A (en) * 2015-05-06 2015-08-19 深圳市瑞福达液晶显示技术股份有限公司 Fingerprint recognition device for ITO glass
CN105335687A (en) * 2014-07-25 2016-02-17 中芯国际集成电路制造(上海)有限公司 Fingerprint identification chip and manufacturing method therefor
CN106326855A (en) * 2016-08-19 2017-01-11 京东方科技集团股份有限公司 Fingerprint acquisition method, fingerprint acquisition module, color-film substrate and display device
US20170046555A1 (en) * 2015-08-12 2017-02-16 Samsung Electronics Co., Ltd. Fingerprint sensor, electronic device having the same, and method of operating fingerprint sensor
CN106446780A (en) * 2016-08-29 2017-02-22 比亚迪股份有限公司 Fingerprint sensor and terminal device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103870817A (en) * 2014-03-27 2014-06-18 成都费恩格尔微电子技术有限公司 Radio-frequency micro-capacitance fingerprint acquisition chip and method
CN105335687A (en) * 2014-07-25 2016-02-17 中芯国际集成电路制造(上海)有限公司 Fingerprint identification chip and manufacturing method therefor
CN104850830A (en) * 2015-05-06 2015-08-19 深圳市瑞福达液晶显示技术股份有限公司 Fingerprint recognition device for ITO glass
US20170046555A1 (en) * 2015-08-12 2017-02-16 Samsung Electronics Co., Ltd. Fingerprint sensor, electronic device having the same, and method of operating fingerprint sensor
CN106326855A (en) * 2016-08-19 2017-01-11 京东方科技集团股份有限公司 Fingerprint acquisition method, fingerprint acquisition module, color-film substrate and display device
CN106446780A (en) * 2016-08-29 2017-02-22 比亚迪股份有限公司 Fingerprint sensor and terminal device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
张铎 编著: "《自动识别技术产品与应用》", 30 September 2009, 武汉:武汉大学出版社 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110427925A (en) * 2018-11-08 2019-11-08 Oppo广东移动通信有限公司 Fingerprint identification method and relevant apparatus
US11210489B2 (en) 2018-11-08 2021-12-28 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Method for fingerprint recognition and related devices
CN113030621A (en) * 2021-03-18 2021-06-25 江阴邦融微电子有限公司 Fingerprint sensor testing device with anti-interference function and testing method
CN113030621B (en) * 2021-03-18 2023-10-31 江阴邦融微电子有限公司 Fingerprint sensor testing device with anti-interference function and testing method
CN117975512A (en) * 2024-03-29 2024-05-03 深圳市魔力信息技术有限公司 Fingerprint image matching method based on Transformer
CN117975512B (en) * 2024-03-29 2024-06-11 深圳市魔力信息技术有限公司 Fingerprint image matching method based on Transformer

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