CN106868562A - A kind of quantity-produced device of electrochemical deposition thin-film solar cells - Google Patents
A kind of quantity-produced device of electrochemical deposition thin-film solar cells Download PDFInfo
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- CN106868562A CN106868562A CN201611035299.XA CN201611035299A CN106868562A CN 106868562 A CN106868562 A CN 106868562A CN 201611035299 A CN201611035299 A CN 201611035299A CN 106868562 A CN106868562 A CN 106868562A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
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Abstract
The present invention provides a kind of quantity-produced device of electrochemical deposition thin-film solar cells, device includes transmitting device, electric deposition device and Electical connector, be fixed with electric deposition device needle electrode and needle electrode to electrode, needle electrode and to being not in contact with each other between electrode, the bottom surface of electric deposition device is conductive material, electrode is contacted with the bottom surface of electric deposition device, Electical connector is fixed on transmitting device, Electical connector includes that needle electrode makes electrical contact with area and makes electrical contact with area to electrode, needle electrode makes electrical contact with area and electrode electrical contact area is made electrical contact with the bottom surface of needle electrode and electric deposition device respectively, needle electrode makes electrical contact with area and to being insulated between electrode electrical contact area, and needle electrode makes electrical contact with area and to being connected with voltage source between electrode electrical contact area.Electric deposition device is combined with transmitting device, using Electical connector for electric deposition device provides voltage source, makes electric deposition device that electro-deposition is completed in the motion with transmitting device, realize continuous production.
Description
Technical field
The present invention relates to area of solar cell, and in particular to a kind of continuous life of electrochemical deposition thin-film solar cells
The device of product.
Background technology
Solar cell is also called " solar chip " or photocell, is direct by photoelectric effect or Photochemical effects
Luminous energy is changed into the device of electric energy.Wherein, based on the thin-film solar cells of photoelectric effect work.
Typically, thin-film solar cells is met and is placed upward to sunshine, is included successively from the bottom up:Lower encapsulated layer, certain bottom
Layer, dorsum electrode layer, back contact, absorbed layer, Window layer, upper contact layer and upper encapsulated layer etc..Chinese patent CN101807622A
A kind of method for preparing cadmium telluride diaphragm solar battery component is disclosed, it comprises the following steps:
First, in transparent conductive film glass(TCO)Upper deposition CdS films obtain " glass/TCO/CdS ";
Then, CdTe thin film is deposited on " glass/TCO/CdS " and obtains " glass/TCO/CdS/CdTe ";
Then, the heat treatment under chloride cadmium atmosphere is carried out to " glass/TCO/CdS/CdTe ";
Then, " glass/TCO/CdS/CdTe " after being heat-treated using laser grooving and scribing, it is laggard that " TCO/CdS/CdTe " is fallen in delineation
Row chemical attack makes cadmium telluride surface richness tellurium;
Then, low-temperature setting is filled on the indentation for delineating " TCO/CdS/CdTe " on " glass/TCO/CdS/CdTe "
Glue;
Then, back contact is deposited, back contact heat treatment is then carried out;
Then delineated near TCO/CdS/CdTe indentations using laser and fall CdS/CdTe/ back contacts;
Then, deposited metal dorsum electrode layer, then crosses out TCO/CdS/CdTe indentations and CdS/CdTe/ is carried on the back and connect using laser incising
CdS/CdTe/ back contacts/metal back electrode near contact layer indentation.
In the above-mentioned method for preparing solar cell module, deposition CdTe the step of be physical dry, such as near space liter
China, sputtering, vacuum evaporation etc..Physical dry usually requires that the environment in vacuum and/or high temperature is carried out, and the requirement to equipment is very
Height, and it is serious to the waste of material of cadmium element and tellurium element.Slave unit is put into for angle and environmental protection angle, above-mentioned system
The method manufacturing cost of standby CdTe thin film solar cell module is very high.
In order to solve the above-mentioned technical problem, american documentation literature US2011/0290641Al discloses a kind of fast electrochemical
The apparatus and method that sedimentation produces solar cell, american documentation literature US2012/0043215A1 discloses another electricity
The apparatus and method that chemical deposition produces solar cell.These electrochemical deposition methods, as solvent, are not required to usually using water
Vacuum and/or hot environment are wanted, the solution containing cadmium element and tellurium element can be recycled, and greatly reduce electrochemical deposition
Method prepares the manufacturing cost of CdTe thin film solar cell module.
But, the method that electrochemical deposition described in above-mentioned patent prepares CdTe thin film belongs to batch production, it is impossible to be applied to
Large-scale continuous production.But other steps of production CdTe thin film solar cell module belong to continuous production, result in
The method and other steps that electrochemical deposition prepares CdTe thin film are not easy matching.
The content of the invention
The present invention is in view of the shortcomings of the prior art, there is provided a kind of quantity-produced of electrochemical deposition thin-film solar cells
Device.
The present invention is achieved through the following technical solutions:A kind of the continuous of electrochemical deposition thin-film solar cells is provided
The device of production, described device includes transmitting device, electric deposition device and Electical connector, is fixed with the electric deposition device
Needle electrode and needle electrode to electrode, the needle electrode and described to being not in contact with each other between electrode, the electro-deposition dress
The bottom surface put is conductive material, and described that electrode is contacted with the bottom surface of the electric deposition device, the Electical connector is fixed on
On the transmitting device, the Electical connector includes that needle electrode makes electrical contact with area and area is made electrical contact with to electrode, the aciculiform electricity
Pole electrical contact area and electrode electrical contact area is made electrical contact with the bottom surface of the needle electrode and electric deposition device respectively, the aciculiform
Electrode make electrical contact with area and to electrode electrical contact area between insulate, and the needle electrode electrical contact area and to electrode electrical contact area it
Between be connected with voltage source.
In the device that the present invention is provided, electrode is contacted with the bottom surface of electric deposition device, the bottom surface of electric deposition device is to lead
Electric material makes, and the bottom surface of electric deposition device contacts with Electical connector to electrode electrical contact area, the aciculiform of Electical connector
Electrode electrical contact area contacted with the needle electrode in electric deposition device, when needle electrode make electrical contact with area and to electrode make electrical contact with area it
Between when connecting operating voltage, the needle electrode in needle electrode electrical contact area and the electric deposition device of Electical connector forms electricity and connects
Touch, electrical contact is formed with the bottom surface of electric deposition device to electrode electrical contact area, because the bottom surface of electric deposition device is conductive material,
The bottom surface of electric deposition device again with to electrode contact, therefore, electrode is made electrical contact with being formed to electrode contact area, such aciculiform electricity
Pole, to electronic loop can be formed between electrode and electrodeposit liquid, it would be desirable to the substrate of deposition film is positioned on needle electrode
Electro-deposition can be carried out.Needle electrode makes electrical contact with area and to insulating to prevent short circuit between electrode electrical contact area.
In the device that the present invention is provided, the front end of needle electrode can be bent into Z-type, make the top of needle electrode and have bullet
The elastic force of spring, as shown in fig. 11, the spring force being thusly-formed can make the top of needle electrode and need deposition film
Contact between substrate is good.
Preferably, the transmitting device includes two transmission belts being placed in parallel, and the Electical connector is fixed on two
Between transmission belt, and the top surface of the Electical connector is located in same level with the top surface of the transmission belt.
When Electical connector is fixed between two transmission belts, the width of electric deposition device is more than between two transmission belts
Distance, so that electric deposition device can be moved with transmission belt, Electical connector transfixion, the centre position of electric deposition device
Slipped over from Electical connector, needle electrode electrical contact area and to electrode electrical contact area respectively with needle electrode and electric deposition device
Bottom surface formed and slide electrical contact, the transmission speed of two transmission belts is identical, and electric deposition device is from one end of Electical connector
The time for moving to the other end is equal to the time of deposition thin film in electric deposition device.
Preferably, the bottom surface interval of the electric deposition device is fixed with "T"-shaped insulation board, and the insulation board includes transverse slat
And riser, the transverse slat is positioned at the top of the bottom surface of electric deposition device, and the riser is described perpendicular through the bottom surface of electric deposition device
The bottom of plate is provided with groove, and the needle electrode runs through the transverse slat and the riser and stretched out in the groove, the pin
Shape electrode to make electrical contact with and be provided with gap between area and the area to electrode electrical contact, and the needle electrode makes electrical contact with area and the groove
Interior needle electrode contact, it is described that electrode electrical contact area is contacted with the bottom surface of the electric deposition device.
In the "T"-shaped insulation board of bottom surface interval fixation of electric deposition device, the bottom of the riser of "T"-shaped insulation board is set
Interior groove is concaved towards, accordingly, the needle electrode of Electical connector makes electrical contact with area and to setting gap between electrode electrical contact area,
It is engaged at the top of the bottom of electric deposition device and Electical connector, the arm at groove two ends just sticks into needle electrode electrical contact area
And to electrode electrical contact area between gap in, reach needle electrode electrical contact area and to electrode electrical contact area between insulate effect
While fruit, spacing is formed to electric deposition device, it is to avoid electric deposition device sideslip on Electical connector.
Preferably, the side of the electric deposition device is provided with electrodeposit liquid entrance and electrodeposit liquid outlet.Electrodeposit liquid
Entrance and electrodeposit liquid outlet are respectively communicated with the liquid source of electrodeposit liquid, and transmission pump can be set on connecting pipeline to control electro-deposition
The flow direction of liquid and flow velocity etc..Material transfer rate can be improved so as to improve electro-deposition speed using the electric depositing solution of flowing
Rate.
Preferably, " O " type for preventing electrodeposit liquid from flowing out is fixed with the top of the lateral wall of the electric deposition device
Circle.The material of "O"-ring can use any elastic caoutchouc, for example, say Buna-N, Viton, Silicone, EPDM etc..
Reference electrode can be set in electric deposition device of the invention, and for current potential monitoring, reference electrode can be selected appoints
Where in electrodeposit liquid current potential stabilization material, for example say Cd, Ag/AgCl, SHE(Standard hydrogen electrode), SCE(Saturation calomel electricity
Pole)Deng.
Technical scheme provided in an embodiment of the present invention can include following beneficial effect:
The present invention provides a kind of quantity-produced device of electrochemical deposition thin-film solar cells, and described device includes that transmission is filled
Put, electric deposition device and Electical connector, be fixed with the electric deposition device needle electrode and needle electrode to electrode, institute
State needle electrode and described to being not in contact with each other between electrode, the bottom surface of the electric deposition device is conductive material, described to electrode
Bottom surface with the electric deposition device is contacted, and the Electical connector is fixed on the transmitting device, the Electical connector
Area being made electrical contact with including needle electrode and area being made electrical contact with to electrode, the needle electrode makes electrical contact with area and to electrode electrical contact area difference
Made electrical contact with the bottom surface of the needle electrode and electric deposition device, the needle electrode electrical contact area and to electrode electrical contact area it
Between insulate, and the needle electrode electrical contact area and to electrode electrical contact area between be connected with voltage source.The dress that the present invention is provided
In putting, electric deposition device is combined with transmitting device, using Electical connector for electric deposition device provides voltage source, makes electricity heavy
Product device completes the process of electrodeposited film in the motion with transmitting device, realizes continuous production.
Brief description of the drawings
For clearer the explanation embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it is clear that, to those skilled in the art, not
On the premise of paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the quantity-produced device of the first electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
Structural representation.
Fig. 2 is the quantity-produced device of the first electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
Electric deposition device structural representation.
Fig. 3 is the quantity-produced device of the first electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
Electical connector structural representation.
Fig. 4 is a kind of quantity-produced device of electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
The overlooking the structure diagram of Electical connector.
Fig. 5 is the quantity-produced device of second electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
Structural representation.
Fig. 6 is the quantity-produced device of second electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
Electric deposition device structural representation.
Fig. 7 is the partial enlarged drawing of I in Fig. 6.
Fig. 8 is the quantity-produced device of second electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
Electical connector structural representation.
Fig. 9 is the quantity-produced device of second electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
Electical connector and electric deposition device cooperation schematic diagram.
Figure 10 is the quantity-produced dress of second electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
The Electical connector and the schematic top plan view of transmitting device put.
Figure 11 is a kind of quantity-produced device of electrochemical deposition thin-film solar cells provided in an embodiment of the present invention
Needle electrode structural representation.
Shown in figure:Transmitting device 10, transmission belt 11, electric deposition device 20, needle electrode 21, to electrode 22, insulation board
23rd, transverse slat 231, riser 232, groove 233, electrodeposit liquid entrance 24, electrodeposit liquid outlet 25, the bottom surface 26 of electric deposition device,
Electical connector 30, needle electrode makes electrical contact with area 31, makes electrical contact with area 32, gap 33, substrate 40 to electrode.
Specific embodiment
In order that those skilled in the art more fully understand the technical scheme in the present invention, below in conjunction with of the invention real
The accompanying drawing in example is applied, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described implementation
Example is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, art technology
The every other embodiment that personnel are obtained under the premise of creative work is not made, should all belong to protection model of the invention
Enclose.
Referring to Fig. 1, a kind of continuous life of electrochemical deposition thin-film solar cells provided in an embodiment of the present invention is shown
The device of product.
As shown in Figure 1, described device includes transmitting device 10, electric deposition device 20 and Electical connector 30, the electricity
Be fixed with precipitation equipment 20 needle electrode 21 and needle electrode to electrode 22, the needle electrode 21 and described to electrode 22
Between be not in contact with each other, the bottom surface 26 of the electric deposition device is conductive material, described to electrode 22 and the electric deposition device 20
Bottom surface 26 contact, the Electical connector 30 is fixed on the transmitting device 10, the Electical connector 30 include aciculiform
Electrode makes electrical contact with area 11 and area 12 is made electrical contact with to electrode, and the needle electrode makes electrical contact with area 11 and electrode electrical contact area 12 is distinguished
Bottom surface 26 with the needle electrode 21 and electric deposition device makes electrical contact with, and the needle electrode makes electrical contact with area 11 and electrode electricity is connect
Insulation between area 12 is touched, and the needle electrode makes electrical contact with area 11 and to being connected with voltage source between electrode electrical contact area 12.
In the present embodiment, transmitting device 10 is transmission belt, and Electical connector 30 is fixed on transmitting device 10, and electrical contact
Device 30 has extension in the whole length of transmission belt, as shown in Figure 1 and Figure 4, the structure of electric deposition device as shown in Fig. 2
Needle electrode 21 is set perpendicular to the bottom surface 26 of electric deposition device, and electrode 22 is fixed on bottom surface 26, but to electrode 22 and pin
It is not in contact with each other between shape electrode 21, T-shape insulation board 23 is fixed with the bottom surface 26 of electric deposition device, the insulation board 23 includes
Transverse slat 231 and riser 232, the transverse slat 231 are located at the top of the bottom surface 26 of electric deposition device, and the riser 232 is heavy through electricity
The bottom surface 26 of product device, the needle electrode 21 runs through the transverse slat 231 and the riser 232;As shown in figure 3, electrical contact dress
Put 30 needle electrode electrical contact area 31 and to being provided with gap 33 between electrode electrical contact area 32, the needle electrode makes electrical contact with area
31 contact with the needle electrode 21 for stretching out insulation board 23, the bottom surface 26 that area 12 and the electric deposition device are made electrical contact with to electrode
Contact.Because the bottom surface 26 of electric deposition device is conductive material making, when needle electrode makes electrical contact with area 31 and electrode is made electrical contact with
When connecting operating voltage between area 32, the needle electrode in the needle electrode electrical contact area 31 of Electical connector and electric deposition device
21 form electrical contact, electrical contact are formed with the bottom surface 26 of electric deposition device to electrode electrical contact area 32, due to electric deposition device
Bottom surface 26 is conductive material, and the bottom surface 26 of electric deposition device contacts with to electrode 22 again, therefore, to electrode 22 with to electrode contact
Area 32 forms electrical contact, such needle electrode 21, to that can form electronic loop between electrode 22 and electrodeposit liquid, it would be desirable to heavy
The substrate of product film is positioned on needle electrode and can carry out electro-deposition.
In the present embodiment, electrodeposit liquid entrance 24 is respectively arranged with relative two side of the electric deposition device 20
25 are exported with electrodeposit liquid, electrodeposit liquid outlet 24 and entrance 25 are respectively communicated with the liquid source of electrodeposit liquid, the liquid source of electrodeposit liquid
Transmission pump is provided with the connecting line of electrodeposit liquid outlet 24 and entrance 25, for electrodeposit liquid to be pumped into electric deposition device
In.When using, the substrate 40 of deposition film will be needed to be positioned over the top of needle electrode 21 first, then by electrodeposit liquid entrance 24
Electrodeposit liquid is connected with outlet 25, then electric deposition device 20 is put to Electical connector 30, makes needle electrode 21 and aciculiform
Electrode electrical contact area 31 contacts, and the bottom surface 26 of electric deposition device contacts with to electrode electrical contact area 32, and is connect in needle electrode electricity
Touch area 31 and to being passed through operating voltage between electrode electrical contact area 32, make needle electrode 21, between electrode 22 and electrodeposit liquid
Electronic loop is formed, thus deposition film on the substrate 40, because Electical connector 30 is fixed in transmission belt, Electical connector
30 move with the motion of transmission belt, so that drive electric deposition device 20 to be moved with transmission belt, in the transmitting procedure of transmission belt
In can constantly on the Electical connector 30 in transmission belt place electric deposition device 20, such that it is able to constantly on substrate deposit
Film, reaches quantity-produced effect.
In the present embodiment, as a example by depositing CdTe on " glass/TCO/CdS ", " glass/TCO/CdS " is put into electricity
The top of the needle electrode 21 in precipitation equipment, pin electrode 21 is contacted with " glass/TCO/CdS ", and electric deposition device 20 is put
After Electical connector 30, cathode current is added on pin electrode 21, the main electrification occurred on " glass/TCO/CdS " negative electrode
Learning reaction is:
Cd2+ + HTeO2+ + 3H+ + 6e- à CdTe + 2H2O;
To on electrode anode occur electrochemical reaction be:
2H2O à O2 + 4H+ + 4e-;
Thus the CdTe in " glass/TCO/CdS " electro-deposition, forms " glass/TCO/CdS/CdTe ".
During production, the transmission speed of transmission belt is set, electric deposition device 20 is moved to the other end from one end of conveyer belt
Time be equal to " glass/TCO/CdS " on deposit target thickness CdTe thin film time, target thickness can be total by electro-deposition
Electricity(Coulomb)To control.When electric deposition device is transferred to the final position of transmission belt, electric deposition device is removed, take out life
" glass/TCO/CdS/CdTe " of output, dries up after washing remaining electrolyte, can be put into subsequent annealing step.Transmission belt is passed
Electric deposition device 20 continuously can be upwards placed during defeated, to reach continuous production.
In another embodiment of the present invention, as shown in Figure 10, the transmitting device 10 includes two and is placed in parallel
Transmission belt 11, the Electical connector 30 is fixed between two transmission belts 11, and Electical connector 30 does not connect mutually with transmission belt 11
Touch, and Electical connector 30 is static, the width of the electric deposition device 20 is more than the distance between two transmission belts 11, with
Electric deposition device 20 is set to be moved with the motion of transmission belt 11;The length of the Electical connector 30 is less than transmission belt
11 length, as shown in Fig. 5 and Figure 10;The top surface of the Electical connector 30 is located at same water with the top surface of the transmission belt 11
In plane.The structure of the electric deposition device 20 as shown in fig. 6, the bottom surface 26 of electric deposition device be spaced be fixed with it is "T"-shaped exhausted
Listrium 23, the structure of the insulation board 23 is as shown in fig. 7, comprises transverse slat 231 and riser 232, the transverse slat 231 is positioned at electro-deposition
The top of the bottom surface 26 of device, through the bottom surface 26 of electric deposition device, the bottom of the riser 232 is provided with recessed to the riser 232
Groove 233, the needle electrode 21 runs through the transverse slat 231 and the riser 232 and is stretched out at the groove 233;Such as Fig. 8 institutes
Show, gap 33 is provided between the needle electrode electrical contact area 31 and the area 32 to electrode electrical contact;As shown in figure 9, described
Needle electrode electrical contact area 31 contacted with the needle electrode 21 in the groove 233, it is described to electrode electrical contact area 12 with it is described
The bottom surface 26 of electric deposition device contacts, and the two side of the groove 233 sticks into the gap 33 respectively, makes the needle electrode
Position-limiting action is played to electric deposition device 20 while insulation between electrical contact area 31 and the area 32 to electrode electrical contact, it is to avoid
The sideslip in transmission belt 11 of electric deposition device 20.
In the present embodiment, electrodeposit liquid entrance 24 is again provided with the side of electric deposition device 20 and electrocasting/electrodeposition liquid enters
Mouth 25, the time that the electric deposition device 20 moves to the other end from one end of Electical connector 30 is equal in electric deposition device 20
Substrate 40 on deposit target thickness film time, the application method of the present embodiment is identical with above-described embodiment.
In other embodiments of the invention, the transmitting device 10 could be arranged to a transmission belt, the electrical contact
The needle electrode of device 30 makes electrical contact with area 31 and the both sides of the transmission belt, phase can be individually fixed in electrode electrical contact area 32
Answer, needle electrode 21 in electric deposition device 20 and a brush can be respectively communicated with to electrode 22, two brushes respectively with
Needle electrode makes electrical contact with area 31 and slides electrical contact to electrode electrical contact area 32, and needle electrode 21, right is made in the case of energization
Electrode 22 and electrodeposit liquid form loop so that electro-deposition can be carried out while electric deposition device 20 is moved in transmission belt,
Reach quantity-produced purpose.
Certainly, described above is also not limited to the example above, technical characteristic of the present invention without description can by or
Realized using prior art, will not be repeated here;Above example and accompanying drawing are merely to illustrate technical scheme not
It is limitation of the present invention, reference has preferred embodiment been described in detail to the present invention, the ordinary skill people of this area
Member should be appreciated that change, remodeling, the addition that those skilled in the art are made in essential scope of the invention
Or replace without departure from spirit of the invention, should also belong to claims of the invention.
Claims (4)
1. a kind of quantity-produced device of electrochemical deposition thin-film solar cells, it is characterised in that described device includes passing
Defeated device(10), electric deposition device(20)And Electical connector(30), the electric deposition device(20)Inside it is fixed with needle electrode
(21)With needle electrode to electrode(22), the needle electrode(21)With described to electrode(22)Between be not in contact with each other, it is described
The bottom surface of electric deposition device(26)It is conductive material, it is described to electrode(22)With the electric deposition device(20)Bottom surface(26)Connect
Touch, the Electical connector(30)It is fixed on the transmitting device(10)On, the Electical connector(30)Including needle electrode
Electrical contact area(11)Area is made electrical contact with to electrode(12), the needle electrode electrical contact area(11)Area is made electrical contact with to electrode(12)
Respectively with the needle electrode(21)With the bottom surface of electric deposition device(26)Electrical contact, the needle electrode makes electrical contact with area(11)With
Area is made electrical contact with to electrode(12)Between insulate, and the needle electrode electrical contact area(11)Area is made electrical contact with to electrode(12)Between
It is connected with voltage source.
2. the quantity-produced device of electrochemical deposition thin-film solar cells according to claim 1, it is characterised in that
The transmitting device(10)Including two transmission belts being placed in parallel(11), the Electical connector(30)It is fixed on two transmission
Band(11)Between, and the Electical connector(30)Top surface and the transmission belt(11)Top surface be located at same level on.
3. the quantity-produced device of electrochemical deposition thin-film solar cells according to claim 1 and 2, its feature exists
In the electric deposition device(20)Bottom surface interval be fixed with "T"-shaped insulation board(23), the insulation board(23)Including transverse slat
(231)And riser(232), the transverse slat(231)Positioned at the bottom surface of electric deposition device(26)Top, the riser(232)Pass through
Wear the bottom surface of electric deposition device(26), the riser(232)Bottom be provided with groove(233), the needle electrode(21)Run through
The transverse slat(231)With the riser(232)And in the groove(233)Place is stretched out, and the needle electrode makes electrical contact with area(31)
Area is made electrical contact with to electrode with described(32)Between be provided with gap(33), the needle electrode electrical contact area(31)With the groove
(233)Interior needle electrode(21)Contact, it is described that area is made electrical contact with to electrode(12)With the bottom surface of the electric deposition device(26)Connect
Touch.
4. the quantity-produced device of electrochemical deposition thin-film solar cells according to claim 3, it is characterised in that
The electric deposition device(20)Side be provided with electrodeposit liquid entrance(24)Exported with electrodeposit liquid(25).
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CN115110138A (en) * | 2022-06-29 | 2022-09-27 | 济南大学 | Continuous electroplating assembly line for cadmium telluride thin-film solar cell substrates |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001088954A2 (en) * | 2000-05-12 | 2001-11-22 | Nu Tool Inc. | Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing |
CN103026506A (en) * | 2010-05-25 | 2013-04-03 | 瑞而索乐公司 | Apparatus and methods for fast chemical electrodeposition for fabrication of solar cells |
CN104091854A (en) * | 2013-04-01 | 2014-10-08 | 北京恒基伟业投资发展有限公司 | Thin film solar cell production method and electrodeposition device thereof |
CN104603334A (en) * | 2012-04-25 | 2015-05-06 | 埃托特克德国有限公司 | Method and apparatus for electrolytically depositing deposition metal on workpiece |
CN104979182A (en) * | 2014-04-09 | 2015-10-14 | 赛米控电子股份有限公司 | Methods and apparatus for depositing metal layer on semiconductor device |
CN105206703A (en) * | 2014-05-26 | 2015-12-30 | 北京恒基伟业投资发展有限公司 | Production method of film solar cell and electro-deposition device thereof |
CN206188902U (en) * | 2016-11-23 | 2017-05-24 | 瑞尔太阳能投资有限公司 | Electrochemical deposition thin -film solar cell's continuous production's device |
-
2016
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001088954A2 (en) * | 2000-05-12 | 2001-11-22 | Nu Tool Inc. | Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing |
CN103026506A (en) * | 2010-05-25 | 2013-04-03 | 瑞而索乐公司 | Apparatus and methods for fast chemical electrodeposition for fabrication of solar cells |
CN104603334A (en) * | 2012-04-25 | 2015-05-06 | 埃托特克德国有限公司 | Method and apparatus for electrolytically depositing deposition metal on workpiece |
CN104091854A (en) * | 2013-04-01 | 2014-10-08 | 北京恒基伟业投资发展有限公司 | Thin film solar cell production method and electrodeposition device thereof |
CN104979182A (en) * | 2014-04-09 | 2015-10-14 | 赛米控电子股份有限公司 | Methods and apparatus for depositing metal layer on semiconductor device |
CN105206703A (en) * | 2014-05-26 | 2015-12-30 | 北京恒基伟业投资发展有限公司 | Production method of film solar cell and electro-deposition device thereof |
CN206188902U (en) * | 2016-11-23 | 2017-05-24 | 瑞尔太阳能投资有限公司 | Electrochemical deposition thin -film solar cell's continuous production's device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115110138A (en) * | 2022-06-29 | 2022-09-27 | 济南大学 | Continuous electroplating assembly line for cadmium telluride thin-film solar cell substrates |
CN115110138B (en) * | 2022-06-29 | 2023-05-26 | 济南大学 | Continuous electroplating assembly line of cadmium telluride thin film solar cell substrate |
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