CN106323062A - Heat pipe and preparation method thereof - Google Patents
Heat pipe and preparation method thereof Download PDFInfo
- Publication number
- CN106323062A CN106323062A CN201610770661.1A CN201610770661A CN106323062A CN 106323062 A CN106323062 A CN 106323062A CN 201610770661 A CN201610770661 A CN 201610770661A CN 106323062 A CN106323062 A CN 106323062A
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- Prior art keywords
- copper powder
- heat pipe
- pipe
- copper
- copper pipe
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a heat pipe and a preparation method thereof, and relates to the technical field of heat pipes. The heat pipe comprises a liquid suction core, and the liquid suction core is prepared from, by weight, 20-50% of water-atomized copper powder and 50-80% of foamy copper powder. The micro shape of the water-atomized copper powder is irregular, the oxygen content is low, the forming property is good, the process performance is stable, and the water-atomized copper power has fast capillary force. The foamy copper powder is a novel functional material formed by evenly distributing a large number of communicating or non-communicating holes in a copper substrate; and the electrical conductivity and the ductility of the foamy copper powder are good, the porosity is relatively high, and the heat-conducting property is good. By adjusting the ratio of the water-atomized copper powder to the foamy copper powder, the porosity and the moisture content of the prepared liquid suction core can be effectively controlled, and the prepared heat pipe can be made low in heat resistance and high in porosity and moisture content. Meanwhile, the preparation method of the heat pipe provided by the invention is simple in process and suitable for industrial heat pipe production.
Description
Technical field
The present invention relates to hot pipe technique field, particularly relate to a kind of heat pipe and preparation method thereof.
Background technology
In recent years, electronic technology development, along with life requirement is improved constantly by the mankind, electronic product updates
Speed is more and more faster.The volume that requirement small and exquisite, portable makes electronic product is more and more less, but the chip of electronic product is electric
Road becomes increasingly complex, and therefore, the heat dissipation problem of chip circuit annoyings running and the service life of machine always, and employing is commonly used
Heat dissipation metal cannot meet the cooling requirements of chip circuit.
First American national laboratory proposes the concept of heat pipe for the first time in field of aerospace technology, and heat pipe is a kind of new
The efficient heat conducting element of type, it can be with the biggest heat of the least area transmission, and heat conductivity is big, is the number of metal good conductor
Thousand times.General heat pipe is made up of shell, wick and end cap.Inside heat pipe is pumped into negative pressure state, is filled with suitable liquid (i.e.
Working medium), this boiling point of liquid is low, readily volatilized.Tube wall has wick, and it is made up of capillary-porous material.Heat pipe one end is for steaming
Sending out section (abbreviation hot junction), other one section is condensation segment (being called for short cold end), and when heat pipe evaporator section is heated, the liquid in capillary tube is fast
Speed evaporation, steam flows to the other end under slight pressure difference, and discharges heat, and regelation becomes liquid, and liquid is again along many
Porous materials flows to evaporator section by the effect of capillary force, and so circulation is more than, and heat is reached the other end by heat pipe one end.This circulation
Quickly carrying out, heat can be come by conduction continuously.
Wick is a part critically important in heat pipe composition, and the structure of wick directly affects properties of hot pipe, imbibition
The space of core is the most, and moisture content is the highest, and the heat of transmission is the most.But powerful heat pipes more of the prior art, former
Material consists of conventional atomized copper powder, and its porosity is low, and moisture content is low, it is impossible to effectively conduct heat.
Summary of the invention
For the deficiencies in the prior art, an object of the present invention is to provide a kind of heat pipe, and the thermal resistance of this heat pipe is low, hole
Gap rate is high, moisture content is high.
For reaching this purpose, the present invention by the following technical solutions:
A kind of heat pipe, including wick, by weight percentage, the raw material of preparing of described wick includes 20～50%
Water atomization copper powder and 50～the foam copper powder of 80%, wherein the micro-shape of water atomization copper powder is irregular, and oxygen content is low, becomes
Shape is good, and processing performance is stable, has quick capillary force, its percentage by weight can be 20%, 25%, 30%, 35%,
40%, 45%, 50%；Foam copper powder is a kind of novel merit being uniform-distribution with a large amount of UNICOM or not UNICOM's hole in Copper substrate
Energy material, its electric conductivity and ductility are good, it is important that it has higher porosity, and has good heat conductivity
Can, therefore can be as preferable heat sink material, it is preferable that its percentage by weight can be 50%, 55%, 60%, 65%,
70%, 75%, 80%；By the proportioning of regulation water atomization copper powder and foam copper powder, can to the porosity of the wick of preparation,
Moisture content control effectively.
Wherein, the particle diameter mesh number of described water atomization copper powder and described foam copper powder is 45～150 mesh, for example, 45 mesh,
50 mesh, 60 mesh, 70 mesh, 80 mesh, 90 mesh, 100 mesh, 110 mesh, 120 mesh, 130 mesh, 140 mesh, 150 mesh, select this mesh number scope
Water atomization copper powder and foam copper powder, it is simple to the filling of copper pipe.
The two of the purpose of the present invention are to provide the preparation method of a kind of heat pipe, and technique is simple, the heat pipe heat prepared
Hinder low, porosity is high, moisture content is high, heat-transfer effect is good, and this preparation method comprises the steps:
1) clean, copper pipe agent for carbon hydrogen detergent is cleaned, to remove the greasy dirt of copper pipe inwall；
2) filling out powder, the SMIS center bar of copper pipe is fixed, by weight percentage, by 20～50% water atomization copper powder and
50～80% foam copper powder mix homogeneously after insert in copper pipe；
3) sintering, the copper pipe after filling out powder is placed in sintering furnace sintering, takes out center bar；
4) welding end socket, carries out welding end socket by one end of the copper pipe after sintering；
5) annealing, makes annealing treatment the copper pipe after welding end socket, to remove welding stress；
6) fluid injection, injects working solution in the copper pipe after annealing；
7) evacuation, carries out evacuation process by the copper pipe after fluid injection；
8) solder tail, welds sealing by the other end of the copper pipe after evacuation；
9) shape, two ends are welded the end socket shaped process of good copper pipe and makes the shape of needs, prepare heat pipe.
Step 3) in, the temperature of described sintering is 930～980 DEG C.
Step 5) in, the temperature of described annealing is 300～400 DEG C.
Step 6) in, described working solution is the water of 1.5～3.5g.
Compared with prior art, the invention have the benefit that the heat pipe of the present invention, including wick, percentage by weight
Than meter, the raw material of preparing of described wick includes 20～the water atomization copper powder of 50% and 50～the foam copper powder of 80%, Qi Zhongshui
The micro-shape of atomized copper powder is irregular, and oxygen content is low, and formability is good, and processing performance is stable, has quick capillary force；
Foam copper powder is a kind of new function material being uniform-distribution with a large amount of UNICOM or not UNICOM's hole in Copper substrate, its electric conductivity
Good with ductility, there is higher porosity, and there is good heat conductivility；By regulation water atomization copper powder and bubble
The proportioning of foam copper powder, can control effectively to the porosity of wick of preparation, moisture content, the heat pipe making to prepare
Thermal resistance is low, porosity is high, moisture content is high；The preparation method technique of the heat pipe of the present invention is simple simultaneously, is suitable for industrialization heat pipe
Produce.
Detailed description of the invention
Technical scheme is further illustrated below by detailed description of the invention.
As no specific instructions, the various raw materials of the present invention are the most commercially available to be buied, or prepares according to the conventional method of this area
Obtain.
The preparation method using the present invention prepares heat pipe, and this preparation method comprises the steps:
1) clean, copper pipe agent for carbon hydrogen detergent is cleaned, to remove the greasy dirt of copper pipe inwall；
2) filling out powder, the SMIS center bar of copper pipe is fixed, by weight percentage, and the water atomization copper powder by 40% and 60%
Foam copper powder mix homogeneously after insert in copper pipe, wherein the particle diameter mesh number of water atomization copper powder and foam copper powder is 100 mesh；
3) sintering, the copper pipe after filling out powder is placed in sintering furnace sintering, and the temperature of sintering is 950 DEG C, takes out center bar；
4) welding end socket, carries out welding end socket by one end of the copper pipe after sintering；
5) annealing, makes annealing treatment the copper pipe after welding end socket, and the temperature of annealing is 350 DEG C and answers to remove welding
Power；
6) fluid injection, injects the water of 3g in the copper pipe after annealing；
7) evacuation, carries out evacuation process by the copper pipe after fluid injection；
8) solder tail, welds sealing by the other end of the copper pipe after evacuation；
9) shape, two ends are welded the end socket shaped process of good copper pipe and makes the shape of needs, prepare heat pipe.
Heat pipe to batch production is applied to the radiating tube of computer CPU, and wherein every batch takes ten groups of heat pipes opposite heat tube at random
Performance test, test result is shown in Table 1.
Using conventional atomized copper powder as the inserts of wick, prepare heat pipe as a comparison case, the heat to batch production
Pipe is applied to the radiating tube of computer CPU, and every batch takes ten groups of heat pipes opposite heat tube performance test at random, and test result is shown in Table 2.
Table 1
Table 2
Wherein, Th is the temperature of CPU, and T1 is the temperature of heat pipe and CPU contact position, and T2 is the temperature of heat pipe heat radiation end, T1-
T2 embodies the heat transfer of heat pipe, heat-conducting effect, and R is thermal resistance, by the data of Tables 1 and 2 it can be seen that prepared by the method for the present invention
Heat pipe for heat pipe prepared by atomized copper powder conventional in comparative example, porosity is high, and water content is big, and heat-transfer effect is good,
Rapid heat dissipation, significantly reduces the temperature of thermal source CPU.The preparation method technique of the heat pipe of the present invention is simple, is suitable for industry heat-transformation
The production of pipe.
Applicant states, the present invention illustrates detailed process equipment and the technological process of the present invention by above-described embodiment,
But the invention is not limited in above-mentioned detailed process equipment and technological process, i.e. do not mean that the present invention have to rely on above-mentioned in detail
Process equipment and technological process could be implemented.Person of ordinary skill in the field it will be clearly understood that any improvement in the present invention,
The equivalence of raw material each to product of the present invention is replaced and the interpolation of auxiliary element, concrete way choice etc., all falls within the present invention's
Within the scope of protection domain and disclosure.
Claims (6)
1. a heat pipe, including wick, it is characterised in that by weight percentage, and the raw material of preparing of described wick includes
20～the water atomization copper powder of 50% and 50～the foam copper powder of 80%.
Heat pipe the most according to claim 1, it is characterised in that described water atomization copper powder and the particle diameter mesh of described foam copper powder
Number is 45～150 mesh.
3. the preparation method of a heat pipe as claimed in claim 1, it is characterised in that comprise the steps:
1) clean, copper pipe agent for carbon hydrogen detergent is cleaned, to remove the greasy dirt of copper pipe inwall；
2) filling out powder, the SMIS center bar of copper pipe is fixed, by weight percentage, by 20～the water atomization copper powder of 50% and 50～
Insert in copper pipe after the foam copper powder mix homogeneously of 80%；
3) sintering, the copper pipe after filling out powder is placed in sintering furnace sintering, takes out center bar；
4) welding end socket, carries out welding end socket by one end of the copper pipe after sintering；
5) annealing, makes annealing treatment the copper pipe after welding end socket, to remove welding stress；
6) fluid injection, injects working solution in the copper pipe after annealing；
7) evacuation, carries out evacuation process by the copper pipe after fluid injection；
8) solder tail, welds sealing by the other end of the copper pipe after evacuation；
9) shape, two ends are welded the end socket shaped process of good copper pipe and makes the shape of needs, prepare heat pipe.
Preparation method the most according to claim 3, it is characterised in that step 3) in, the temperature of described sintering be 930～
980℃。
Preparation method the most according to claim 3, it is characterised in that step 5) in, the temperature of described annealing be 300～
400℃。
Preparation method the most according to claim 3, it is characterised in that step 6) in, described working solution is 1.5～3.5g
Water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610770661.1A CN106323062A (en) | 2016-08-31 | 2016-08-31 | Heat pipe and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610770661.1A CN106323062A (en) | 2016-08-31 | 2016-08-31 | Heat pipe and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106323062A true CN106323062A (en) | 2017-01-11 |
Family
ID=57788336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610770661.1A Pending CN106323062A (en) | 2016-08-31 | 2016-08-31 | Heat pipe and preparation method thereof |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114131016A (en) * | 2021-12-01 | 2022-03-04 | 联德电子科技(常熟)有限公司 | Method for processing coreless rod sintered heat pipe |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060225282A1 (en) * | 2005-04-08 | 2006-10-12 | Asustek Computer Inc. | Manufacturing method of heat pipe |
| CN101799249A (en) * | 2009-12-12 | 2010-08-11 | 中山伟强科技有限公司 | Method for manufacturing heat pipe |
| CN101848629A (en) * | 2010-03-31 | 2010-09-29 | 华南理工大学 | Soaking plate of foam metal and copper powder compounded capillary structure |
| CN102554241A (en) * | 2012-01-12 | 2012-07-11 | 昆山德泰新材料科技有限公司 | Method for preparing foam conglomerated copper powder |
| CN102901390A (en) * | 2012-10-25 | 2013-01-30 | 山东大学 | Composite capillary core with differential thermal coefficients for loop heat pipe and preparation method of composite capillary core |
| CN104368805A (en) * | 2014-09-16 | 2015-02-25 | 湖南省天心博力科技有限公司 | Method for producing composite copper powder for ultrathin heat pipe |
-
2016
- 2016-08-31 CN CN201610770661.1A patent/CN106323062A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060225282A1 (en) * | 2005-04-08 | 2006-10-12 | Asustek Computer Inc. | Manufacturing method of heat pipe |
| CN101799249A (en) * | 2009-12-12 | 2010-08-11 | 中山伟强科技有限公司 | Method for manufacturing heat pipe |
| CN101848629A (en) * | 2010-03-31 | 2010-09-29 | 华南理工大学 | Soaking plate of foam metal and copper powder compounded capillary structure |
| CN102554241A (en) * | 2012-01-12 | 2012-07-11 | 昆山德泰新材料科技有限公司 | Method for preparing foam conglomerated copper powder |
| CN102901390A (en) * | 2012-10-25 | 2013-01-30 | 山东大学 | Composite capillary core with differential thermal coefficients for loop heat pipe and preparation method of composite capillary core |
| CN104368805A (en) * | 2014-09-16 | 2015-02-25 | 湖南省天心博力科技有限公司 | Method for producing composite copper powder for ultrathin heat pipe |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114131016A (en) * | 2021-12-01 | 2022-03-04 | 联德电子科技(常熟)有限公司 | Method for processing coreless rod sintered heat pipe |
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Application publication date: 20170111 |
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