CN105773365B - Compound grinding machine and grinding method - Google Patents

Compound grinding machine and grinding method Download PDF

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Publication number
CN105773365B
CN105773365B CN201511022241.7A CN201511022241A CN105773365B CN 105773365 B CN105773365 B CN 105773365B CN 201511022241 A CN201511022241 A CN 201511022241A CN 105773365 B CN105773365 B CN 105773365B
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CN
China
Prior art keywords
workpiece
grinding
grinding wheel
spindle
rotation axis
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Expired - Fee Related
Application number
CN201511022241.7A
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Chinese (zh)
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CN105773365A (en
Inventor
赖经昌史
安藤善昭
竹岛雅之
小林久修
近藤隆
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JTEKT Corp
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JTEKT Corp
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Publication of CN105773365A publication Critical patent/CN105773365A/en
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Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/01—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor for combined grinding of surfaces of revolution and of adjacent plane surfaces on work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B25/00—Grinding machines of universal type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/025—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work involving indexable work supporting means carrying several work pieces to be operated on in succession
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
    • B24B5/047—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally of workpieces turning about a vertical axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/06—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces internally
    • B24B5/08—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces internally involving a vertical tool spindle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/12—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces both externally and internally with several grinding wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/35—Accessories
    • B24B5/355—Feeding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

The present invention relates to compound grinding machine and grinding method.Compound grinding machine is configured with the rotation center of Workpiece holding device (61,62,63,64) on the circumference centered on the rotation axis of rotary table (5).The compound grinding machine has: column (3a, 3b, 3c), retreats along the direction orthogonal with rotation axis；Grinding wheel stand (4a, 4b, 4c) is configured at column and retreats along the direction parallel with rotation axis；And grinding wheel (9a, 9b), it is configured at grinding wheel stand and is rotated around the grinding wheel spindle parallel with rotation axis.The workpiece (W) that end face is held in Workpiece holding device in such a way that the center at the center of grinding part and working-spindle is consistent is moved successively by the rotation of rotary table (5), and executes multiple grinding process to grind to inner peripheral surface, the outer peripheral surface of workpiece.

Description

Compound grinding machine and grinding method
Technical field
The present invention relates to keeping multiple workpiece in rotary table, and using multiple grinding wheels according to each rotary work The rotation of platform and the compound grinding machine and grinding method for promoting process and grinding work-piece.
Background technique
In the case where being ground using workpiece of multiple processes to the grinding part for having the surfaces of revolution, while multiple Workpiece side is successively transferred between grinding machine to grind it.
In addition, there are following technologies in the plane lapping of chip: having the rotation work that upper surface keeps multiple chips Make platform and be opposed to multiple grinding devices of configuration with rotary table, is successively fed using the rotation of rotary table Chip, and defined process is processed using each dismembyator.Referring to Japanese Unexamined Patent Publication 2012-240186 bulletin.
In the case where being ground when successively transferring workpiece between multiple grinding machines to each process, due in each work It installed in sequence, remove workpiece, so the holding position of workpiece is different in each process, can probably precision be made to reduce.
Summary of the invention
One of the objects of the present invention is to provide a kind of are able to maintain to have the workpiece of the grinding part of the surfaces of revolution unchangeably Implement the compound grinding machine and grinding method of multiple grinding process.
Compound grinding machine as a form of the invention has:
Rotary table；
Multiple work spindle platforms, above-mentioned multiple work spindle platforms have working-spindle, and above-mentioned working-spindle has and conduct The parallel rotary shaft of the rotation axis of the rotation center of above-mentioned rotary table, multiple work spindle platform is so that above-mentioned work Mode of the center configuration of main shaft on the circumference centered on above-mentioned rotation axis is set to above-mentioned rotary table；
Workpiece holding device is set to the end of above-mentioned working-spindle；
Multiple columns are retreated along the direction orthogonal with above-mentioned rotation axis；
Multiple grinding wheel stands are configured at above-mentioned column and retreat along the direction parallel with above-mentioned rotation axis；
Grinding wheel is configured at multiple above-mentioned grinding wheel stands and rotates around the grinding wheel spindle parallel with above-mentioned rotation axis；
Working piece positioning device determines the holding position of the workpiece kept by above-mentioned Workpiece holding device；And
Control device, to above-mentioned rotary table, above-mentioned work spindle platform, above-mentioned column, above-mentioned grinding wheel stand, above-mentioned Grinding wheel and above-mentioned Working piece positioning device are controlled, so that being made by the rotation of above-mentioned rotary table by above-mentioned work The workpiece that part holding meanss are kept successively is moved to the abrasion site of above-mentioned grinding wheel, and then using multiple above-mentioned grinding wheels to the work Part is ground.
Above-mentioned compound grinding machine is directed to the workpiece for having the surfaces of revolution that is, grinding part, so that the grind section of the above-mentioned surfaces of revolution The center of position and the consistent mode in center of above-mentioned working-spindle keep above-mentioned workpiece, and side makes above-mentioned workpiece rotation lateral dominance Above-mentioned grinding part is ground with above-mentioned grinding wheel.
According to the compound grinding machine of above-mentioned form, following compound grinding machine may be implemented: the work department of the surfaces of revolution can be will be provided with The workpiece of position is held in Workpiece holding device and is allowed to rotate, and moves it successively by the rotation of rotary table, and It is ground in multiple processes in the state of keeping workpiece.
In the compound grinding machine of above-mentioned form, also may be constructed are as follows: above-mentioned workpiece have the outer peripheral surface of cylinder with it is flat Side in the case where, above-mentioned Workpiece holding device keeps the above-mentioned side of above-mentioned workpiece.
According to the compound grinding machine of above-mentioned form, due to keeping the flat side of cylindric workpiece, it is possible to realize Even if diameter of work changes, the compound grinding machine that can be also kept using same Workpiece holding device.
It in the compound grinding machine of above-mentioned form, also may be constructed are as follows: above-mentioned Working piece positioning device carries out in the following manner The positioning of above-mentioned workpiece, that is, will be provided with the base of parallel with above-mentioned rotation axis and cross one another two planes that is, datum level Quasi-component is positioned to: the center from above-mentioned working-spindle on the direction orthogonal with above-mentioned rotation axis to two said references The distance in face, it is equal with the radius of the outer peripheral surface of the cylinder of above-mentioned workpiece, and make the outer peripheral surface and composition of the cylinder of above-mentioned workpiece Two plane contacts in said reference face.
According to the compound grinding machine of above-mentioned form, following compound grinding machine may be implemented: by being positioned to reference component from work The center for making main shaft is equal with the radius of the outer peripheral surface of the cylinder of workpiece to the distance of two datum levels, so that even if workpiece is straight Diameter variation, also can by make workpiece center and main shaft rotation center it is consistent in a manner of kept.
In the compound grinding machine of above-mentioned form, be also configured to above-mentioned Workpiece holding device and attracted using magnetic force on State the above-mentioned side of workpiece.
According to the compound grinding machine of above-mentioned form, due to attracting and keeping the flat of cylindric workpiece using magnetic force Side, so can be realized the installation for being easy to carry out workpiece, the compound grinding machine removed.
Detailed description of the invention
Fig. 1 is the integrally-built skeleton diagram for indicating the compound grinding machine of present embodiment.
Fig. 2 is the top view of the rotary table of present embodiment.
Fig. 3 is the A-A cross-sectional view of Fig. 2.
Fig. 4 is the figure for indicating the grinding state of each process.
Fig. 5 A is the process chart for indicating grinding process.
Fig. 5 B is the process chart for indicating grinding process.
Specific embodiment
By the way that embodiment is described referring to the drawings, above and other feature and advantage of the invention can become It obtains clearer, wherein identical label is marked to identical element.
Hereinafter, based on the compound grinding machine for grinding the outer ring of bearing as workpiece, to embodiments of the present invention It is illustrated.
As shown in Figure 1, compound grinding machine 1 has bed 2, and having on bed 2 can be around vertical C axis (rotation axis) The rotary table 5 of rotation.In addition, have on bed 2 it is orthogonal and horizontal with C axis, can along Xa axis direction move back and forth Column 3a, can along Xb axis direction move back and forth column 3b and can along Xc axis direction move back and forth column 3c.? The side of each column has grinding wheel stand 4a that is parallel with C axis, can retreating along Za axis direction, can retreat along Zb axis direction Grinding wheel stand 4b and can along Zc axis direction retreat grinding wheel stand 4c.Grinding wheel stand 4a rotatably supports grinding wheel 9a, Grinding wheel stand 4b rotatably supports grinding wheel 9b, and grinding wheel 9a, 9b are rotated by grinding wheel spindle rotation motor (illustration omitted) to be driven. Grinding wheel stand 4c keeps grinding wheel 9c.
As shown in Fig. 2, partially there are four works for configuration on the same circumference centered on C axis in rotary table 5 Part holding meanss 61,62,63,64.Specifically, as shown in figure 3, work spindle platform 81 is fixed in rotary table 5 Face.Work spindle platform 81 has the work for being rotatably supported and being driven by motor rotation (not shown) by spindle main body 811 Make main shaft 812.The axis of rotation of the working-spindle 812 of work spindle platform 81 is parallel with C axis and is partially configured at C axis Centered on same circumference on.Workpiece holding device 61 is held in the upper end of working-spindle 812, thus Workpiece holding device 61 Rotation center be also partially configured on the same circumference centered on C axis.Workpiece holding device 61 utilizes magnetic force by workpiece End face is attracted to be kept.In order to facilitate expression, Workpiece holding device 61, work spindle platform are illustrated only in Fig. 3 81, spindle main body 811 and working-spindle 812.The composition of Workpiece holding device 62,63,64 and 61 phase of Workpiece holding device Together, thus illustration omitted.
As shown in Figure 1, being configured on the bed 2 opposed with the allocation position of column in a manner of clamping rotary table 5 Working piece positioning device 7.Working piece positioning device 7 have the positioning body 71 for being fixed on bed 2 and be supported on positioning body 71 from And the reference component 72 that can be retreated on straight line.As shown in Fig. 2, reference component 72 have it is parallel with C axis, i.e. with work lead The axis of axis 812 is parallel and datum level 72a, 72b of cross one another plane.Here, by opposed datum level 72a and 72b Angulation is as intersecting angle, and the straight line that intersecting angle is halved is as m.So that the advance and retreat direction of reference component 72 For straight line m direction and make straight line m and to be indexed into the Workpiece holding device 61,62,63,64 of Working piece positioning device 7 nearby The consistent mode of rotation center, configuration rotary table 5 and Working piece positioning device 7.Have as a result, at the same with datum level 72a, The center of the workpiece W of the outer peripheral surface of the surfaces of revolution of 72b contact is located on straight line m, therefore, passes through half of the outer peripheral surface with workpiece W Diameter accordingly adjusts the advance and retreat position of reference component 72, can make center and the Workpiece holding device 61,62,63,64 of workpiece W Rotation center it is consistent.That is, the periphery of distance and workpiece W from the rotation center of working-spindle 812 to datum level 72a, 72b The radius in face is equal.
The compound grinding machine 1 has control device 30, the structure of the function as control device 30, have column 3a, X-axis control unit 31 that the feeding of 3b, 3c are controlled, the Z axis control unit that the feeding of grinding wheel stand 4a, 4b, 4c are controlled 32, the C axis control unit 33 that is controlled to the rotation of rotary table 5 keeps filling to the rotation of work spindle platform 81 and workpiece Set spindle control part 34 that 61,62,63,64 attraction controlled, the advance and retreat to the reference component 72 of Working piece positioning device 7 The location control portion 35 that is controlled, the grinding wheel spindle control unit 36 that the rotation of grinding wheel 9a, 9b are controlled, record data, journey Record portion 37 of sequence etc..
Control device 30 controls each device based on preset control data, so as to implement multiple grinding works Sequence.
Hereinafter, being based on Fig. 4, Fig. 5 A and Fig. 5 B, the outer diameter grinding of the bearing outer ring as workpiece, orbital plane are ground Mill and the process of orbital plane microstoning are illustrated.
As shown in the state A of Fig. 4, rotary table 5 is positioned at Workpiece holding device 61 and Working piece positioning device 7 is right The state for the position set is set as original state, and the rotation position of rotary table 5 at this time is set as C=0.
Firstly, workpiece W1 is installed on Workpiece holding device 61.Specifically, workpiece W1 is moved in Working piece positioning device 7 The position advanced of reference component 72, and contact the outer peripheral surface of workpiece W1 simultaneously with datum level 72a, 72b, in the state It is lower that workpiece is attracted and is held in Workpiece holding device 61 using magnetic force.Later, reference component 72 is retreated.It can be by operation Person carries out workpiece W and moves in, moves out, or carry-in/carry-away device can be used also to carry out the moving in of workpiece W, move out (S1).Rotary table 5 is set to rotate to the right 90 degree, to make the rotation position C=90 of rotary table 5.As a result, such as Fig. 4 State B shown in, workpiece W1 is indexed into the position opposed with grinding wheel 9a, and Workpiece holding device 62 is indexed into and workpiece positioning fills Set 7 opposed positions (S2).Implement the outer diameter grinding process of workpiece W1.Specifically, rotating workpiece W1 and grinding wheel 9a In the state of, controlled in a manner of making the periphery face contact of grinding wheel 9a and workpiece W1 based on outer diameter polish process column 3a and The feeding of grinding wheel stand 4a.After defined grinding, grinding wheel 9a is made to retreat (S3) to position of readiness.Concurrently with step S3 Workpiece W2 is installed on Workpiece holding device 62 (S4).
Rotary table 5 is set to rotate to the right 90 degree, to make the rotation position C=180 of rotary table 5.As a result, such as Shown in the state C of Fig. 4, workpiece W1 is indexed into the position opposed with grinding wheel 9b 30, and workpiece W2 is indexed into the position opposed with grinding wheel 9a It sets, Workpiece holding device 63 is indexed into the position opposed with Working piece positioning device 7 (S5).The outer diameter for implementing workpiece W2 grinds work Sequence (S6).Implement the orbital plane grinding process of workpiece W1.Specifically, in the state of rotating workpiece W1 and grinding wheel 9b, with The mode for making the track face contact of the inner circumferential of grinding wheel 9b and workpiece W1, column 3b and sand are controlled based on orbital plane polish process The feeding of wheel seat 4b.After defined grinding, grinding wheel 9b is made to retreat (S7) to position of readiness.With step S6, step S7 Workpiece W3 is concurrently installed on Workpiece holding device 63 (S8).Rotary table 5 is set to rotate to the right 90 degree, to make to rotate The rotation position of workbench 5 is C=270.As a result, as shown in the state D of Fig. 4, workpiece W1 is indexed into the position opposed with grinding wheel 9c It sets, workpiece W2 is indexed into the position opposed with grinding wheel 9b, and workpiece W3 is indexed into the position opposed with grinding wheel 9a, and workpiece keeps dress It sets 64 and is indexed into the position opposed with Working piece positioning device 7 (S9).
Implement the outer diameter grinding process (S10) of workpiece W3.Implement the orbital plane grinding process (S11) of workpiece W2.Implement work The orbital plane microstoning process of part W1.Specifically, make workpiece W1 rotate in the state of so that static grinding wheel 9c with The mode of the track face contact of the inner circumferential of workpiece W1 controls column 3c's and grinding wheel stand 4c based on orbital plane microstoning program Feeding.After defined microstoning, grinding wheel 9c is made to retreat (S12) to position of readiness.With step S10, step S11, Workpiece W4 is concurrently installed on Workpiece holding device 64 (S13) by step S12.Rotary table 5 is set to rotate to the right 90 degree, from And make the rotation position C=360 of rotary table 5.As a result, as shown in the state E of Fig. 4, workpiece W1 is indexed into and workpiece The opposed position of positioning device 7, workpiece W2 are indexed into the position opposed with grinding wheel 9c, and workpiece W3 is indexed into opposed with grinding wheel 9b Position, workpiece W4 is indexed into the position opposed with grinding wheel 9a (S14).
Implement the outer diameter grinding process (S15) of workpiece W4.Implement the orbital plane grinding process (S16) of workpiece W3.Implement work The orbital plane microstoning process (S17) of part W2.Concurrently workpiece W1 is removed with step S15, step S16, step S17, it Workpiece W5 is installed on Workpiece holding device 61 (S18) afterwards.Rotary table 5 is set to rotate to the left 270 degree, to make to rotate work The rotation position for making platform 5 is C=90.As a result, as shown in the state F of Fig. 4, workpiece W2 is indexed into opposed with Working piece positioning device 7 Position, workpiece W3 is indexed into the position opposed with grinding wheel 9c, and workpiece W4 is indexed into the position opposed with grinding wheel 9b, workpiece W5 It is indexed into the position opposed with grinding wheel 9a (S19).
Implement the outer diameter grinding process (S20) of workpiece W5.Implement the orbital plane grinding process (S21) of workpiece W4.Implement work The orbital plane microstoning process (S22) of part W3.Concurrently workpiece W2 is removed with step S20, step S21, step S22, it Workpiece W6 is installed on Workpiece holding device 62 (S23) afterwards.Rotary table 5 is set to rotate to the right 90 degree, to make to rotate work The rotation position for making platform 5 is C=180.As a result, as shown in the state G of Fig. 4, workpiece W3 is indexed into right with Working piece positioning device 7 The position set, workpiece W4 are indexed into the position opposed with grinding wheel 9c, and workpiece W5 is indexed into the position opposed with grinding wheel 9b, workpiece W6 is indexed into the position opposed with grinding wheel 9a (S24).
Implement the outer diameter grinding process (S25) of workpiece W6.Implement the orbital plane grinding process (S26) of workpiece W5.Implement work The orbital plane microstoning process (S27) of part W4.Concurrently workpiece W3 is removed with step S25, step S26, step S27, it Workpiece W7 is installed on Workpiece holding device 63 (S28) afterwards.Rotary table 5 is set to rotate to the right 90 degree, to make to rotate work The rotation position for making platform 5 is C=270.As a result, as shown in the state H of Fig. 4, workpiece W4 is indexed into right with Working piece positioning device 7 The position set, workpiece W5 are indexed into the position opposed with grinding wheel 9c, and workpiece W6 is indexed into the position opposed with grinding wheel 9b, workpiece W7 is indexed into the position opposed with grinding wheel 9a (S29).
Implement the outer diameter grinding process (S30) of workpiece W7.Implement the orbital plane grinding process (S31) of workpiece W6.Implement work The orbital plane microstoning process (S32) of part W7.Concurrently workpiece W4 is removed with step S30, step S31, step S32, it Workpiece W8 is installed on Workpiece holding device 64 (S33) afterwards.
Also, in the case where continuing to continuously run, after removing the later workpiece of workpiece W5 and workpiece W9 being installed Workpiece, and repeat step S19~step S33, to continuously implement multiple grinding.
More than, if using the grinding method of the present embodiment, in the state that workpiece is installed on Working piece positioning device, It can be from the outer peripheral surface attrition process of initial process to the orbital plane microstoning of final process, since midway is without workpiece Installation, remove, so the positional shift of workpiece will not occur in each process.Therefore, the phase for the machined surface that each process is taken Position precision is improved.
In the above-described embodiment, on rotary table 5 by four Workpiece holding devices 61,62,63,64 partially Configuration on the same circumference, but the number of Workpiece holding device can be desired number, in addition can not also partially into Row configuration.
In addition, Workpiece holding device attracts workpiece using magnetic force, but is available with vacuum suction and is attracted, It can be with frozen liquid by Workpiece holding device together with work piece.

Claims (3)

1. a kind of compound grinding machine, which is characterized in that have:
Rotary table；
Multiple work spindle platforms, have working-spindle, and the working-spindle has and the rotation as the rotary table The parallel rotary shaft of the rotation axis at center, the multiple work spindle platform is with the center configuration of the working-spindle with described The mode on circumference centered on rotation axis is set to the rotary table；
Workpiece holding device is set to the end of the working-spindle；
Multiple columns, the multiple column are retreated along the direction orthogonal with the rotation axis；
Multiple grinding wheel stands, the multiple grinding wheel stand are configured at the column and retreat along the direction parallel with the rotation axis；
Grinding wheel is configured at multiple grinding wheel stands and rotates around the grinding wheel spindle parallel with the rotation axis；Workpiece positioning dress It sets, determines the holding position of the workpiece kept by the Workpiece holding device；And control device, to the rotary work Platform, the work spindle platform, the column, the grinding wheel stand, the grinding wheel and the Working piece positioning device are controlled, So that making the workpiece kept by the Workpiece holding device successively to the grinding wheel by the rotation of the rotary table Abrasion site it is mobile, and then the workpiece is ground using multiple grinding wheels,
For the workpiece for having the surfaces of revolution that is, grinding part,
By make the surfaces of revolution grinding part center and the working-spindle center it is consistent in a manner of keep the workpiece, And while grind the workpiece rotation lateral dominance to the grinding part with the grinding wheel,
In the case where the workpiece has the outer peripheral surface of cylinder with flat side, the Workpiece holding device keeps the work The side of part,
The Working piece positioning device carries out the positioning of the workpiece in the following manner, that is, will be provided with flat with the rotation axis The reference component of capable and cross one another two planes that is, datum level is positioned to: on the direction orthogonal with the rotation axis Radius phase from the center of the working-spindle to the distance of two datum levels, with the outer peripheral surface of the cylinder of the workpiece Deng, and make the outer peripheral surface of the cylinder of the workpiece and constitute described two plane contacts of the datum level.
2. compound grinding machine according to claim 1, which is characterized in that
The Workpiece holding device attracts the side of the workpiece using magnetic force.
3. a kind of grinding method, which is characterized in that
Carry out lap using compound grinding machine described in as claimed in claim 1 or 22 for the workpiece of the grinding part of the surfaces of revolution.
CN201511022241.7A 2015-01-08 2015-12-30 Compound grinding machine and grinding method Expired - Fee Related CN105773365B (en)

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JP2015002482A JP6459524B2 (en) 2015-01-08 2015-01-08 Composite grinding machine and grinding method

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