CN104681654A - 一种双n层结构非晶硅太阳能电池及其制备方法 - Google Patents
一种双n层结构非晶硅太阳能电池及其制备方法 Download PDFInfo
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- 229910021417 amorphous silicon Inorganic materials 0.000 title claims abstract description 130
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000011521 glass Substances 0.000 claims abstract description 23
- 238000006243 chemical reaction Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 72
- 239000007789 gas Substances 0.000 claims description 54
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 48
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 47
- 229910000077 silane Inorganic materials 0.000 claims description 47
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 36
- 239000011787 zinc oxide Substances 0.000 claims description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 35
- 229910052710 silicon Inorganic materials 0.000 claims description 35
- 239000010703 silicon Substances 0.000 claims description 35
- 239000013078 crystal Substances 0.000 claims description 34
- 238000004062 sedimentation Methods 0.000 claims description 26
- 238000004544 sputter deposition Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 24
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 24
- 239000001257 hydrogen Substances 0.000 claims description 21
- 229910052739 hydrogen Inorganic materials 0.000 claims description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 20
- 239000004411 aluminium Substances 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 17
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 13
- 229910000085 borane Inorganic materials 0.000 claims description 12
- 229910052786 argon Inorganic materials 0.000 claims description 11
- 150000002431 hydrogen Chemical class 0.000 claims description 11
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 8
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 8
- 208000012826 adjustment disease Diseases 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract description 112
- 239000000758 substrate Substances 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 7
- 239000002355 dual-layer Substances 0.000 abstract 2
- 239000010408 film Substances 0.000 description 86
- 229960001296 zinc oxide Drugs 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000011160 research Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- KRQUFUKTQHISJB-YYADALCUSA-N 2-[(E)-N-[2-(4-chlorophenoxy)propoxy]-C-propylcarbonimidoyl]-3-hydroxy-5-(thian-3-yl)cyclohex-2-en-1-one Chemical compound CCC\C(=N/OCC(C)OC1=CC=C(Cl)C=C1)C1=C(O)CC(CC1=O)C1CCCSC1 KRQUFUKTQHISJB-YYADALCUSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
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Abstract
本发明公开了一种双n层结构非晶硅太阳能电池,包括玻璃基体,依次设置在玻璃基体上的透明导电膜、P型非晶硅层、缓冲层、非晶硅本征层i层、双层n型非晶硅层、背反射层和背电极,所述的双层n型非晶硅层是由轻掺杂n型非晶硅层与重掺杂n型非晶硅层两层构成的双n层结构。该双n层结构非晶硅太阳能电池具有较高的电流密度和光电转换效率。本发明还公开了上述双n层结构非晶硅太阳能电池的制备方法,该制备方法工艺简洁、不需要增加新的设备投资成本。
Description
技术领域
本发明属于非晶硅太阳能电池技术领域,具体涉及一种双n层结构非晶硅太阳能电池及其制备方法。
背景技术
随着煤炭、石油等不可再生能源的日益枯竭,世界经济对新能源的需求使太阳能电池技术得到了迅猛的发展,太阳能电池通过把太阳光光能转换成电能,是一种可再生的洁净能源技术。
目前市场上工业化生产以单晶硅和多晶硅太阳电池为主,单晶硅的电池效率为18.5%,多晶硅电池效率为16.7%左右。但目前这两种电池存在所需要的硅材料的短缺以及硅材料制备过程存在环境污染等问题,而非晶硅薄膜太阳电池具有耗材少、制备简单、环境友好、成本低等优势,使得近年来科研、高校和企业单位纷纷将非晶硅太阳能电池作为研发主方向。
在保持成本不显著提高的条件下,晶体硅电池的效率很难进一步提高。目前市场上的非晶硅电池光电效率大约是8%,具有大幅度的提升空间。因此,研究人员一直在探索提升非晶硅电池效率的新工艺新方法。
非晶硅太阳能电池的结构以p-i-n型为主,这种非晶硅太阳能电池的结构层包括制备太阳能电池的基体、导电薄膜、PIN型非晶硅薄膜以及背电极等。目前非晶硅太阳能电池存在的主要问题是如何提高转化效率和降低光致衰退效应,现有技术中,对P型非晶硅薄膜和I型非晶硅薄膜的界面处理技术较多。2014年,南开大学张晓丹教授等在Solar Energy Materials&Solar Cells专业期刊上发表了研究论文《Improvement in performance of hydrogenated amorphous silicon solar cells withhydrogenated intrinsic amorphous silicon oxide p/i buffer layers》,报道了他们在p/i之间SiOx作为缓冲层制备的单节非晶硅太阳能电池效率达到10.64%,多节太阳能电池效率达到12.24%,但其电流密度最高只有12.58mA/cm2。这是由于导电薄膜呈现弱N型,与P型非晶硅薄膜形成反向的PN结,造成太阳能电池的电流、电压等损失,如何解决这一问题有待于做更深入的研究。
目前,不管市面上销售的还是研究机构研发的非晶硅电池,均采用单n层薄膜电池结构的形式,该单n层薄膜被均匀掺杂,在均匀单一掺杂的半导体中不存在内建电场或内建电场极弱,不利于太阳能电池内部载流子的收集从而增强光电流,提高太阳能电池转换效率。
发明内容
本发明的目的在于提供一种双n层结构非晶硅太阳能电池,该双n层结构非晶硅太阳能电池具有较高的电流密度和光电转换效率。
本发明的目的还在于提供上述双n层结构非晶硅太阳能电池的制备方法,该制备方法工艺简洁、不需要增加新的设备投资成本。
本发明的第一个目的是通过以下技术方案来实现的:一种双n层结构非晶硅太阳能电池,包括玻璃基体,依次设置在玻璃基体上的透明导电膜、P型非晶硅层、缓冲层、非晶硅本征层i层、双层n型非晶硅层、背反射层和背电极,其特征是:所述的双层n型非晶硅层是由轻掺杂n型非晶硅层与重掺杂n型非晶硅层两层构成的双n层结构。
本发明所述的透明导电膜优选为具有绒面结构的SnO2:F薄膜;所述的P型非晶硅层优选为p-a-SiC:H薄膜;所述的缓冲层优选为a-SiC:H薄膜;所述的非晶硅本征层i层优选为i-a-Si:H薄膜;所述的轻掺杂n型非晶硅层优选为轻掺杂n-a-Si:H薄膜;所述的重掺杂n型非晶硅层优选为重掺杂n-a-Si:H薄膜;所述的背反射层优选为氧化锌掺铝ZnO:Al薄膜;所述的背电极优选为银电极。
本发明所述的p-a-SiC:H-薄膜的膜厚优选为10~30nm;所述的a-SiC:H薄膜的膜厚优选为10~20nm;所述的i-a-Si:H薄膜的膜厚优选为400~540nm;所述的轻掺杂n-a-Si:H薄膜的膜厚优选为40~60nm;所述的重掺杂n-a-Si:H薄膜的膜厚优选为10~20nm;所述的氧化锌掺铝ZnO:Al薄膜的厚度优选为60~80nm;所述的银电极的厚度优选为150~300nm。
本发明所述的p-a-SiC:H薄膜、a-SiC:H薄膜、i-a-Si:H薄膜、轻掺杂n-a-Si:H薄膜和重掺杂n-a-Si:H薄膜优选采用PECVD方式制成。
本发明所述的氧化锌掺铝ZnO:Al薄膜和银电极优选通过磁控溅射方式制备获得。
本发明的第二个目的是通过以下技术方案来实现的:上述的双n层结构非晶硅太阳能电池的制备方法,含以下步骤:
(1)装片:在玻璃基体上设置透明导电膜即具有绒面结构的SnO2:F薄膜,置于PECVD系统的真空室中;
(2)沉积P型非晶硅层p-a-SiC:H薄膜:将设有SnO2:F薄膜的玻璃基体即FTO(掺氟氧化锡)衬底温度加热至240~280℃,真空室真空度抽至3.0×10-7~3.0×10-6Torr,通入硅烷、甲烷、硼烷和氢气,调节反应气压为0.6~0.8Torr,放电功率为70~150mW/cm2,沉积时间为20~60秒,制得P型非晶硅层p-a-SiC:H薄膜;
(3)沉积缓冲层a-SiC:H薄膜:将衬底(设有P型非晶硅层p-a-SiC:H薄膜和FTO的玻璃基体)温度加热至240~280℃,真空室真空度抽至3.0×10-7~3.0×10-6Torr,通入硅烷、甲烷和氢气,调节反应气压为0.6~0.8Torr,放电功率为70~150mW/cm2,起辉光时关闭甲烷气体,沉积时间为0.5~1分钟,制得缓冲层a-SiC:H薄膜;
(4)沉积非晶硅本征层i层i-a-Si:H薄膜:将衬底(沉积有上述3种薄膜的玻璃基体)温度加热至240~280℃,真空室真空度抽至3.0×10-7~3.0×10-6Torr,通入硅烷和氢气,调节反应气压为0.6~0.8Torr,放电功率为70~150mW/cm2,沉积时间为20~25分钟,制得非晶硅本征层i层i-a-Si:H薄膜;
(5)沉积轻掺杂n型非晶硅层轻掺杂n-a-Si:H薄膜:将衬底(沉积有上述4种薄膜的玻璃基体)温度加热至240~280℃,真空室真空度抽至3.0×10-7Torr~3.0×10-6Torr,通入硅烷、磷烷和氢气,其中硅烷占气体总流量的10~15%,磷烷与硅烷的体积流量比为1~6:1,氢气的体积流量为硅烷和磷烷总体积流量的2~4倍(即氢气的稀释比为2~4),反应气压为0.4~0.6Torr,放电功率为70~150MW/cm2,沉积时间为2~3分钟,制得轻掺杂n型非晶硅层轻掺杂n-a-Si:H薄膜;
(6)沉积重掺杂n型非晶硅层重掺杂n-a-Si:H薄膜:将衬底(即设有上述5种薄膜的玻璃基体)温度加热至240~280℃,真空室真空度抽至3.0×10-7Torr~3.0×10-6Torr,通入硅烷、磷烷和氢气,其中硅烷占气体总流量的3~15%,磷烷与硅烷的体积流量比为4~12:1,氢气的体积流量为硅烷和磷烷总体积流量的2~4倍(即氢气的稀释比为2~4),反应气压为0.4~0.6Torr,放电功率为70~150mW/cm2,沉积时间为10~60秒,制得重掺杂n型非晶硅层重掺杂n-a-Si:H薄膜;
(7)采用磁控溅射法制备背反射层氧化锌掺铝ZnO:Al薄膜:将真空室抽至3.0×10-7Torr~3.0×10-6Torr,采用铝的质量百分含量为1~2%的氧化锌陶瓷作为靶材,反应气体为氧气,溅射气体为氩气,溅射压力为4~6mTorr,溅射功率为200W,溅射温度为200℃,溅射时间为15~20分钟,在衬底(即设有上述6种薄膜的玻璃基体)上制得背反射层氧化锌掺铝ZnO:Al薄膜;
(8)采用磁控溅射法制备背电极:靶材为金属银,溅射气体为氩气,溅射压力为4mTorr,溅射功率为200W,溅射时间为5~10分钟,在衬底(即设有上述7种薄膜的玻璃基体)上制得银电极。
在上述的双n层结构非晶硅太阳能电池的制备方法中:
步骤(1)中所述的玻璃基体在设置具有绒面结构的SnO2:F薄膜前,先采用半导体清洗工艺处理。
本发明步骤(1)中PECVD系统先经过预抽真空处理。
步骤(2)中所述的硼烷的体积浓度([B2H6]/[B2H6+H2])为2~4%,步骤(6)~步骤(6)中所述的磷烷的体积浓度为([PH3]/[PH3+H2])为0.5~1%。
步骤(2)中硅烷占气体总流量的3.0~5.0%,甲烷与硅烷的体积流量比为1.0~1.5:1,硼烷与硅烷的体积流量比为0.7~1:1,氢气的体积流量为硅烷、甲烷和硼烷总体积流量的11~15倍;步骤(3)中硅烷占气体总流量的3.0~5.0%,甲烷与硅烷的体积流量比为1.0~1.5:1,氢气的体积流量为与甲烷和硅烷总体积流量的11~16倍;步骤(4)中硅烷占气体总流量的10~15%。
本发明步骤(5)~(6)中的双层n型非晶硅层是由通过调节磷烷浓度沉积轻掺杂n-a-Si:H薄膜和重掺杂n-a-Si:H薄膜构成。
步骤(7)中氩气和氧气的体积流量比为80~90:1。
步骤(8)中氩气流量为16~18sccm。
本发明中采用的PECVD优选为具有至少一个单腔室的PECVD系统和具有至少一个真空室的磁控溅射系统,所需工艺气体有高纯硅烷SiH4、高纯氢气H2、浓度(BC=[B2H6]/[B2H6+H2])优选为2%硼烷B2H6,浓度(PC=[PH3]/[PH3+H2]优选为0.5%磷烷PH3,高纯甲烷CH4。
本发明具有如下优点:
(1)本发明中的n型非晶硅层为轻掺杂n型非晶硅层与重掺杂n型非晶硅层构成的双n层结构,这样的双n层结构电池与传统单n层结构非晶硅电池相比,可以形成较强的内电场,可以减少光生少子的复合损失,提高少数载流子的收集率,明显增加短路电流,提高太阳能电池的转化效率;
(2)与背反射层接触的重掺杂n层,掺杂浓度高,电阻率低,可以减少电极的接触电阻,增加电极对光生载流子的收集效率;
(3)本发明中的双n层结构非晶硅太阳能电池的制备方法,这种方法简洁、不需增加新的设备改造成本,制备的双n层结构的非晶硅电池具有更高的光电转换效率,双n层非晶硅电池效率可达到10.97%;
(4)本发明中的双n层结构也适用于由其构成的双节或多节叠层非晶硅太阳能电池。
附图说明
图1中是本发明中双n层非晶硅太阳能电池的结构示意图。
其中:1代表设置在玻璃基体上的透明导电膜,2代表p型非晶硅层,3代表缓冲层,4代表本征i层,5代表双层n型非晶硅,6代表背反射层,7代表背电极,8代表轻掺杂n型非晶硅,9代表重掺杂n型非晶硅。
具体实施方式
实施例1
本实施例提供的双n层结构非晶硅太阳能电池,包括玻璃基体,依次设置在玻璃基体上的透明导电膜1、P型非晶硅层2、缓冲层3、非晶硅本征层i层4、双层n型非晶硅层5、背反射层6和背电极7,该双层n型非晶硅层是由轻掺杂n型非晶硅层与重掺杂n型非晶硅层两层构成的双n层结构。
其中透明导电膜为具有绒面结构的SnO2:F薄膜;P型非晶硅层为p-a-SiC:H;缓冲层为a-SiC:H薄膜;非晶硅本征层i层为i-a-Si:H薄膜;轻掺杂n型非晶硅层为轻掺杂n-a-Si:H薄膜;重掺杂n型非晶硅层为重掺杂n-a-Si:H薄膜;背反射层为氧化锌掺铝ZnO:Al薄膜;背电极为银电极。
p-a-SiC:H薄膜的膜厚为10~30nm;a-SiC:H薄膜的膜厚为10~20nm;i-a-Si:H薄膜的膜厚为400~540nm;轻掺杂n-a-Si:H薄膜的膜厚为40~60nm;重掺杂n-a-Si:H薄膜的膜厚为10~20nm;氧化锌掺铝ZnO:Al薄膜的厚度为60~80nm;银电极的厚度为150~300nm。
其中p-a-SiC:H、a-SiC:H薄膜、i-a-Si:H薄膜、轻掺杂n-a-Si:H薄膜和重掺杂n-a-Si:H薄膜采用PECVD方式制成。
其中氧化锌掺铝ZnO:Al薄膜和银电极通过磁控溅射方式制备获得。
该双n层结构非晶硅太阳能电池的制备方法,含以下步骤:
(1)装片:将用半导体清洗工艺处理过的玻璃基体具有绒面结构的SnO2:F薄膜,通过预抽真空腔放入PECVD系统沉积真空腔;
(2)沉积窗口层P型非晶硅层:真空腔真空度抽至3.0×10-6Torr,FTO衬底温度加热至260℃,通入硅烷气体流量为4.5sccm、甲烷气体流量为4.5sccm、硼烷气体流量为3.2sccm、氢气气体流量为138sccm,匀气8分钟,反应气压为0.6Torr,放电功率为80mW/cm2,沉积时间为28秒,此为窗口层p层,厚度约为10nm,其中硼烷的体积浓度([B2H6]/[B2H6+H2])为2%;
(3)沉积缓冲层SiC层:真空腔真空度抽至3.0×10-6Torr,衬底温度加热至260℃,通入硅烷气体流量为4.5sccm、甲烷气体流量为4.5sccm、氢气气体流量为138sccm,匀气8分钟,反应气压为0.6Torr,放电功率为80mW/cm2,起辉光的同时关闭甲烷气体流量,沉积时间为32秒,此为缓冲层SiC层,厚度约为12nm;
(4)沉积本征层i层:真空腔真空度抽至3.0×10-6Torr,衬底温度加热至260℃,通入硅烷气体流量为15sccm、氢气气体流量为135sccm,匀气8分钟,反应气压为0.6Torr,放电功率为80mW/cm2,沉积时间为20分钟,此为本征层i层,厚度约为430nm;
(5)沉积第1层n层:真空腔真空度抽至3.0×10-6Torr,衬底温度加热至260℃,通入硅烷气体流量为15sccm、磷烷气体流量为30sccm,氢气气体流量为105sccm,匀气8分钟,反应气压为0.4Torr,放电功率为80mW/cm2,沉积时间为2.5分钟,此为轻掺杂n层,厚度约为44nm,其中磷烷的体积浓度为([PH3]/[PH3+H2])为0.5%;
(6)沉积第2层n层:真空腔真空度抽至3.0×10-6Torr,衬底温度加热至260℃,通入硅烷气体流量为10sccm、磷烷气体流量为40sccm,氢气气体流量为100sccm,匀气8分钟,反应气压为0.4Torr,放电功率为80mW/cm2,沉积时间为10秒钟,此为重掺杂n层,厚度约为10nm,其中磷烷的体积浓度为([PH3]/[PH3+H2])为0.5%;
(7)溅射背反射层:将制备完双n层非晶硅电池从PECVD系统取出,放入磁控溅射系统真空腔,真空腔抽至3.0×10-6Torr,溅射靶材用直径3.0英寸,厚度0.25英寸,纯度为99.99%的铝含量为2wt%氧化锌陶瓷靶,反应气体为纯度99.99%的高纯氧气O2,溅射气体为纯度99.999%的氩气Ar,溅射参数为:溅射压力4mTorr、溅射功率200W、溅射温度200℃,Ar:O2比为18sccm:0.2sccm,溅射时间20分钟,此为AZO薄膜背反射层,厚度约为80nm;
(8)溅射背电极:溅射靶材用直径3.0英寸,厚度0.25英寸,纯度为99.99%的金属银靶,溅射气体为纯度99.999%的氩气Ar,溅射参数为:溅射压力4mTorr、溅射功率200W、Ar流量为18sccm,溅射时间为10分钟,此为银背电极,厚度约为300nm,最后获得电池。
在AM1.5G模拟太阳光测试的光伏性能如表1所示,其性能比同等条件下制备的传统单n层非晶硅电池(p层沉积时间28秒,约10nm;缓冲层沉积时间32秒,约为12nm;本征i层沉积时间20分钟,约430nm;轻掺杂单n层沉积时间2.5分钟,约为54nm)的光电转换效率相对高13%。
表1本实施例AM1.5G模拟太阳光测试的光伏性能
实施例2
本实施例提供的双n层结构非晶硅太阳能电池,包括玻璃基体,依次设置在玻璃基体上的透明导电膜、P型非晶硅层、缓冲层、非晶硅本征层i层、双层n型非晶硅层、背反射层和背电极,该双层n型非晶硅层是由轻掺杂n型非晶硅层与重掺杂n型非晶硅层两层构成的双n层结构。
其中透明导电膜为具有绒面结构的SnO2:F薄膜;P型非晶硅层为p-a-SiC:H薄膜;缓冲层为a-SiC:H薄膜;非晶硅本征层i层为i-a-Si:H薄膜;轻掺杂n型非晶硅层为轻掺杂n-a-Si:H薄膜;重掺杂n型非晶硅层为重掺杂n-a-Si:H薄膜;背反射层为氧化锌掺铝ZnO:Al薄膜;背电极为银电极。
p-a-Si:H薄膜的膜厚为10~30nm;a-SiC:H薄膜的膜厚为10~20nm;i-a-Si:H薄膜的膜厚为400~540nm;轻掺杂n-a-Si:H薄膜的膜厚为40~60nm;重掺杂n-a-Si:H薄膜的膜厚为10~20nm;氧化锌掺铝ZnO:Al薄膜的厚度为60~80nm;银电极的厚度为150~300nm。
其中p-a-SiC:H薄膜、a-SiC:H薄膜、i-a-Si:H薄膜、轻掺杂n-a-Si:H薄膜和重掺杂n-a-Si:H薄膜采用PECVD方式制成。
其中氧化锌掺铝ZnO:Al薄膜和银电极通过磁控溅射方式制备获得。
该双n层结构非晶硅太阳能电池的制备方法与实施例1不同的是,改变步骤(6),变化掺杂浓度,亦即真空腔真空度抽至3.0×10-6Torr,衬底温度加热至260℃,通入硅烷气体流量为5sccm、磷烷气体流量为45sccm,氢气气体流量为100sccm,匀气8分钟,反应气压为0.4Torr,放电功率为80mW/cm2,沉积时间为10秒钟。
在AM1.5G模拟太阳光测试的光伏性能如表2所示,其性能比同等条件下制备的传统单n层非晶硅电池的光电转换效率相对高6.9%。
表2本实施例AM1.5G模拟太阳光测试的光伏性能
实施例3
本实施例提供的双n层结构非晶硅太阳能电池同实施例1。
该双n层结构非晶硅太阳能电池的制备方法同实施例1不同的是:改变步骤5)和步骤6),变化这两步的沉积时间,亦即
步骤(5)真空腔真空度抽至3.0×10-6Torr,衬底温度加热至260℃,通入硅烷气体流量为15sccm、磷烷气体流量为30sccm,氢气气体流量为105sccm,匀气8分钟,反应气压为0.4Torr,放电功率为80mW/cm2,沉积时间为2分钟25秒;
步骤(6)真空腔真空度抽至3.0×10-6Torr,衬底温度加热至260℃,通入硅烷气体流量为10sccm、磷烷气体流量为40sccm,氢气气体流量为100sccm,匀气8分钟,反应气压为0.4Torr,放电功率为80mW/cm2,沉积时间为15秒。
在AM1.5G模拟太阳光测试的光伏性能如表3所示,其性能比同等条件下制备的传统单n层非晶硅电池的光电转换效率相对高10.2%。
表3本实施例AM1.5G模拟太阳光测试的光伏性能
实施例4
与实施例1不同的是,步骤(2)~(6)各衬底加热温度为240℃,步骤(2)~(7)真空室真空度抽至3.0×10-7Torr,步骤(2)中硼烷的体积浓度([B2H6]/[B2H6+H2])为2%,步骤(5)~步骤(6)中磷烷的体积浓度为([PH3]/[PH3+H2])为1%。
实施例5
与实施例2不同的是,步骤(2)~(6)各衬底加热温度为280℃,步骤(2)~(7)真空室真空度抽至1.0×10-6Torr。
实施例6
与实施例3不同的是,步骤(2)~(4)中反应气压为0.8Torr,放电功率为100mW/cm2,步骤(2)中沉积时间为60秒,步骤(3)中沉积时间为50秒,步骤(4)中沉积时间为25分钟。
实施例7
与实施例1不同的是,步骤(7)中真空室抽至3.0×10-7Torr,采用铝的质量百分含量为1%的氧化锌陶瓷作为靶材,溅射时间为15分钟,溅射压力为6mTorr,Ar:O2比为16sccm:0.2sccm;步骤(8)中溅射时间为10分钟。
上面列举一部分具体实施例对本发明进行说明,有必要在此指出的是以上具体实施例只用于对本发明作进一步说明,不代表对本发明保护范围的限制如步骤(2)~(6)中各气体的流量、真空室真空度、沉积时间、放电功率等都可以在本发明所要求的范围内进行适当的选择。其他人根据本发明做出的一些非本质的修改和调整仍属于本发明的保护范围。
Claims (10)
1.一种双n层结构非晶硅太阳能电池,包括玻璃基体,依次设置在玻璃基体上的透明导电膜、P型非晶硅层、缓冲层、非晶硅本征层i层、双层n型非晶硅层、背反射层和背电极,其特征是:所述的双层n型非晶硅层是由轻掺杂n型非晶硅层与重掺杂n型非晶硅层两层构成的双n层结构。
2.根据权利要求1所述的双n层结构非晶硅太阳能电池,其特征是:所述的透明导电膜为具有绒面结构的SnO2:F薄膜;所述的P型非晶硅层为p-a-SiC:H薄膜;所述的缓冲层为a-SiC:H薄膜;所述的非晶硅本征层i层为i-a-Si:H薄膜;所述的轻掺杂n型非晶硅层为轻掺杂n-a-Si:H薄膜;所述的重掺杂n型非晶硅层为重掺杂n-a-Si:H薄膜;所述的背反射层为氧化锌掺铝ZnO:Al薄膜;所述的背电极为银电极。
3.根据权利要求2所述的双n层结构非晶硅太阳能电池,其特征是:所述的p-a-SiC:H薄膜的膜厚为10~30nm;所述的a-SiC:H薄膜的膜厚为10~20nm;所述的i-a-Si:H薄膜的膜厚为400~540nm;所述的轻掺杂n-a-Si:H薄膜的膜厚为40~60nm;所述的重掺杂n-a-Si:H薄膜的膜厚为10~20nm;所述的氧化锌掺铝ZnO:Al薄膜的厚度为60~80nm;所述的银电极的厚度为150~300nm。
4.根据权利要求2或3所述的双n层结构非晶硅太阳能电池,其特征是:所述的p-a-SiC:H薄膜、a-SiC:H薄膜、i-a-Si:H薄膜、轻掺杂n-a-Si:H薄膜和重掺杂n-a-Si:H薄膜采用PECVD方式制成。
5.根据权利要求4所述的双n层结构非晶硅太阳能电池,其特征是:所述的氧化锌掺铝ZnO:Al薄膜和银电极通过磁控溅射方式制备获得。
6.权利要求1-5任一项所述的双n层结构非晶硅太阳能电池的制备方法,其特征是含以下步骤:
(1)装片:在玻璃基体上设置透明导电膜即具有绒面结构的SnO2:F薄膜,置于PECVD系统的真空室中;
(2)沉积P型非晶硅层p-a-SiC:H薄膜:将设有SnO2:F薄膜的玻璃基体即衬底温度加热至240~280℃,真空室真空度抽至3.0×10-7Torr~3.0×10-6Torr,通入硅烷、甲烷、硼烷和氢气,调节反应气压为0.6~0.8Torr,放电功率为70~150mW/cm2,沉积时间为20~60秒,制得P型非晶硅层p-a-SiC:H薄膜;
(3)沉积缓冲层a-SiC:H薄膜:将衬底温度加热至240~280℃,真空室真空度抽至3.0×10-7Torr~3.0×10-6Torr,通入硅烷、甲烷和氢气,调节反应气压为0.6~0.8Torr,放电功率为70~150mW/cm2,起辉光时关闭甲烷气体,沉积时间为0.5~1分钟,制得缓冲层a-SiC:H薄膜;
(4)沉积非晶硅本征层i层i-a-Si:H薄膜:将衬底温度加热至240~280℃,真空室真空度抽至3.0×10-7Torr~3.0×10-6Torr,通入硅烷和氢气,调节反应气压为0.6~0.8Torr,放电功率为70~150mW/cm2,沉积时间为20~25分钟,制得非晶硅本征层i层i-a-Si:H薄膜;
(5)沉积轻掺杂n型非晶硅层轻掺杂n-a-Si:H薄膜:将衬底温度加热至240~280℃,真空室真空度抽至3.0×10-7Torr~3.0×10-6Torr,通入硅烷、磷烷和氢气,其中硅烷占气体总流量的10~15%,磷烷与硅烷的体积流量比为1~6:1,氢气的体积流量为硅烷和磷烷总体积流量的2~4倍,反应气压为0.4~0.6Torr,放电功率为70~150mW/cm2,沉积时间为2~3分钟,制得轻掺杂n型非晶硅层轻掺杂n-a-Si:H薄膜;
(6)沉积重掺杂n型非晶硅层重掺杂n-a-Si:H薄膜:将衬底温度加热至240~280℃,真空室真空度抽至3.0×10-7Torr~3.0×10-6Torr,通入硅烷、磷烷和氢气,其中硅烷占气体总流量的3~15%,磷烷与硅烷的体积流量比为4~12:1,氢气的体积流量为硅烷和磷烷总体积流量的2~4倍,反应气压为0.4~0.6Torr,放电功率为70~150mW/cm2,沉积时间为10~60秒,制得重掺杂n型非晶硅层重掺杂n-a-Si:H薄膜;
(7)采用磁控溅射法制备背反射层氧化锌掺铝ZnO:Al薄膜:将真空室抽至3.0×10-7Torr~3.0×10-6Torr,采用铝的质量百分含量为1~2%的氧化锌陶瓷作为靶材,反应气体为氧气,溅射气体为氩气,溅射压力为4~6mTorr,溅射功率为200W,溅射温度为200℃,溅射时间为15~20分钟,制得背反射层氧化锌掺铝ZnO:Al薄膜;
(8)采用磁控溅射法制备背电极:靶材为金属银,溅射气体为氩气,溅射压力为4~6mTorr,溅射功率为200W,溅射时间为5~10分钟,制得银电极。
7.根据权利要求6所述的双n层结构非晶硅太阳能电池的制备方法,其特征是:步骤(2)中所述的硼烷的体积浓度([B2H6]/[B2H6+H2])为2%~4%,步骤(5)~步骤(6)中所述的磷烷的体积浓度为([PH3]/[PH3+H2])为0.5%~1%。
8.根据权利要求6所述的双n层结构非晶硅太阳能电池的制备方法,其特征是:步骤(2)中硅烷占气体总流量的3.0~5.0%,甲烷与硅烷的体积流量比为1.0~1.5:1,硼烷与硅烷的体积流量比为0.7~1:1,氢气的体积流量为硅烷、甲烷和硼烷总体积流量的11~15倍;步骤(3)中硅烷占气体总流量的3.0~5.0%,甲烷与硅烷的体积流量比为1.0~1.5:1,氢气的体积流量为与甲烷和硅烷总体积流量的11~16倍;步骤(4)中硅烷占气体总流量的10~15%。
9.根据权利要求6所述的双n层结构非晶硅太阳能电池的制备方法,其特征是:步骤(7)中氩气和氧气的体积流量比为80~90:1。
10.根据权利要求6所述的双n层结构非晶硅太阳能电池的制备方法,其特征是:步骤(8)中氩气流量为16~18sccm。
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