CN104467669B - Lead-type electronic-part - Google Patents
Lead-type electronic-part Download PDFInfo
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- CN104467669B CN104467669B CN201410471723.XA CN201410471723A CN104467669B CN 104467669 B CN104467669 B CN 104467669B CN 201410471723 A CN201410471723 A CN 201410471723A CN 104467669 B CN104467669 B CN 104467669B
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- Prior art keywords
- gasket part
- electronic component
- resin
- gasket
- lead terminal
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- 239000000463 material Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 230000009931 harmful effect Effects 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 description 8
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The present invention provides a kind of lead-type electronic-part.The lead-type electronic-part has multiple lead terminals, electronic component, and the resin-encapsulated portion of a part and electronic component for the multiple lead terminals of covering, in one end of each of multiple lead terminals, it is connected with gasket part, each gasket part is configured to the plate with front and back, electronic component has the box body that surface is formed with external electrode, it is realized and is electrically connected and mechanical engagement by conductive bonding material between the front of each gasket part and the external electrode of electronic component, resin-encapsulated portion is to cover each gasket part, conductive bonding material, and the state of electronic component carries out resin seal, in two outer surfaces in resin-encapsulated portion, on the outer surface at the back side that facing away from each gasket part, it is set with marked area, only laser index carving is carried out in the marked area.The lead-type electronic-part can inhibit the harmful effect caused by the heat and vibration generated when laser index carving.
Description
Technical field
The present invention relates to electronic unit, especially a kind of lead-type electronic-part.
Background technology
As an example of lead-type electronic-part in the prior art, a kind of semiconductor electronic is disclosed in patent document 1
Component.In the electronic unit, lead terminal realizes mechanical engagement using conductive bonding materials such as solders, utilizes plain conductor reality
It is now electrically connected, also, resin material coating (that is, having resin-encapsulated portion) has been carried out to mould.In addition, disclosed in patent document 1
Lead-type electronic-part in, carried out laser index carving on an interarea in resin-encapsulated portion.
However, in patent document 1, undesirable heat affecting when to laser index carving suffered by lead-type electronic-part does not add
Any consideration.Thus, heat and vibration generated when laser is irradiated in marking are possible to pass to the lead end of inner containment
On son and electronic component, conductive bonding material is caused to melt again, to make contact performance reduce, also, electronic component sheet
In when being influenced by heat and vibration, electrology characteristic is possible to be deteriorated.
【Patent document 1】：Japanese Unexamined Patent Publication 60-129143 bulletins
Invention content
To solve the above-mentioned problems, the object of the present invention is to provide a kind of heat that can inhibit to generate when laser index carving
With the dysgenic lead-type electronic-part caused by vibration.
In order to achieve the above object, the present invention provides a kind of lead-type electronic-part, which has more
The resin envelope of a lead terminal, a part for electronic component and the multiple lead terminal of covering and the electronic component
Dress portion is connected with gasket part in one end of each of the multiple lead terminal, each gasket part be configured to have front and
The plate at the back side, the electronic component have the box body that surface is formed with external electrode, the front of each gasket part and institute
It states and electrical connection and mechanical engagement, the resin envelope is realized by conductive bonding material between the external electrode of electronic component
Dress portion carries out resin seal with the state for covering each gasket part, the conductive bonding material and the electronic component,
It is characterized in that：In two outer surfaces in the resin-encapsulated portion, on the outer surface at the back side that facing away from each gasket part,
It is set with marked area, only carries out laser index carving in the marked area.
Based on above structure, due in two outer surfaces in resin-encapsulated portion, facing away from each gasket part the back side (that is,
The face not engaged with electronic component) outer surface on be set with marked area, only the marked area carry out laser index carving, institute
Outer surface to carry out the resin-encapsulated portion of laser index carving engages material far from electronic component, and with electronic component and electric conductivity
Gasket part is separated between material.Thus, the heat and vibration generated when irradiating laser for marking is not easy to pass to the electronics of inner containment
On component and on conductive bonding material, so as to inhibit heat and vibration to electronic component and conductive bonding material
Harmful effect.
In addition, in the lead-type electronic-part of aforementioned present invention, preferably, gap is formed in the gasket part
Portion, from the thickness direction of the gasket part, the marked area and the space part in the resin-encapsulated portion are at least
It partially overlaps.
Based on the structure, other than with said effect, due to being formed with space part in gasket part, from the thickness of gasket part
Degree side looks up, and the marked area in resin-encapsulated portion is at least partly overlapped with space part, when electronic component is by resin-encapsulated portion
After encapsulation, resin of the space part by thermal conductivity less than gasket part material (metal) is filled, thus, it is irradiated to carry out marking
Laser caused by heat and vibration can be shielded by space part, to heat and vibrate the more difficult electronics for passing to inner containment
On component, also it is not easy to pass on lead terminal via gasket part.
As described above, harmful effect caused by the hot and vibration when present invention is due to that can inhibit laser index carving,
So being capable of providing the high lead-type electronic-part of reliability.
Description of the drawings
Fig. 1 is to indicate that the electronic unit involved by embodiments of the present invention is assembled into the knot of the state on circuit board
Structure schematic diagram.
Fig. 2 is the structural schematic diagram of the electronic unit involved by embodiments of the present invention.
Fig. 3 is the structural schematic diagram of the electronic component involved by embodiments of the present invention.
Fig. 4 is the sectional view in the L-L lines section in Fig. 2.
<Reference sign>
1 lead terminal
2 lead terminals
3 lead terminals
4 electronic components
41 external electrodes
42 external electrodes
43 external electrodes
44 external electrodes
5 resin-encapsulated portions
6 circuit boards
7 gasket part
72 incised notch portions
8 gasket part
9 gasket part
89 space parts
100 electronic units
Specific implementation mode
Hereinafter, being illustrated to the embodiment of the lead-type electronic-part of the present invention with reference to attached drawing.
Fig. 1 is the lead-type electronic-part (hreinafter referred to as electronic unit) indicated involved by embodiments of the present invention
100 are assembled into the structural schematic diagram of the state on circuit board 6.Here, electronic unit 100 is by solder (illustration omitted)
It is engaged with circuit board 6.It is formed on circuit board 6, wiring pattern (illustration omitted), through-hole 61, through-hole 62 and through-hole 63.
Each through-hole (61~63) is the through-hole for two interareas for penetrating circuit board 6, and coating is formed on respective inner wall and (saves sketch map
Show).
Fig. 2 is the structural schematic diagram of the electronic unit 100 involved by embodiments of the present invention.As shown in Fig. 2, the ministry of electronics industry
Part 100 has multiple pads portion (gasket part 7, gasket part 8 and gasket part 9) and respectively from gasket part 7, gasket part 8, gasket part
9 lead terminal 1, lead terminal 2, the lead terminals 3 extended to same direction (being Y-axis negative direction in present embodiment).Pad
Piece portion 7 is processed to one respectively with lead terminal 2, gasket part 9 with lead terminal 1, gasket part 8 with lead terminal 3
Pass through the structure that the two is integrally constituted by punch process etc.).In the respective installation of gasket part 7, gasket part 8, gasket part 9
(front i.e. described in the present invention, in present embodiment, mounting surface is that the X-Y being made of X-axis and the Y-axis vertical with X-axis is put down in face
Face on face) on electronic component 4 is installed.Gasket part 7, gasket part 8, gasket part 9 are engaged by electric conductivity such as solders respectively
Material H is electrically and mechanically engaged with the realization of electronic component 4.
In addition, in the present embodiment, in the both ends of lead terminal 1, the one end being connect with gasket part 7 is cardinal extremity, another
End is front end；In the both ends of lead terminal 2, the one end being connect with gasket part 8 is cardinal extremity, and the other end is front end；Lead terminal 3
In both ends, the one end being connect with gasket part 9 is cardinal extremity, and the other end is front end.In addition, in present embodiment, as lead terminal
The basic material of (1~3), using copper, 42 alloys (nickel alloy) etc., and in substrates coating such as the surface plated with nickel of the basic material
Later, silvering or gold plate etc. are further plated.
It is connect with electronic component 4 in addition, being configured to the gasket part 7 of plate, gasket part 8 and gasket part 9 and being configured in respectively
The position of conjunction and its peripheral part (position shown in the D0 of region).The width W1 of gasket part 7, the width W2 of gasket part 8, gasket part
9 width W3 is all higher than the width W0 of lead terminal (1~3).
In the electronic unit 100, electronic component 4, gasket part 7, gasket part 8 and gasket part 9 are by insulative resin institute
The resin-encapsulated portion 5 of composition has carried out resin seal.As resin material, constituted less than metal material using thermal coefficient
The epoxy resin resin material of lead terminal (1~3).Here, lead terminal 1, lead terminal 2, lead terminal 3 is respective
A part for base end side has also carried out resin seal by resin-encapsulated portion 5.In addition, in the present embodiment, resin-encapsulated portion 5
Shape is the cuboid for the front and back that outer surface is parallel to gasket part (7~9), but not limited to this, as long as can be to electronics
Component 4 and each gasket part (7~9) carry out resin seal, or other shapes.
Lead terminal 1, lead terminal 2, lead terminal 3 are sequentially adjacent to along X-axis positive direction.Lead terminal 1 is negative along Y-axis
Extend from gasket part 7 in direction；Lead terminal 2 extends along Y-axis negative direction from gasket part 8；Lead terminal 3 is along Y-axis negative direction
Extend from gasket part 9.That is, lead terminal 1, lead terminal 2, lead terminal 3 are respectively from gasket part 7, gasket part 8, gasket part 9
Extend to same direction (Y-axis negative direction).In addition, in the present embodiment, lead terminal 1 is drawing for input supply voltage
Line terminals；Lead terminal 2 is the ground terminal for ground connection；Lead terminal 3 is the lead terminal for output frequency signal.But
It is lead terminal 1, lead terminal 2, lead terminal 3 shown in present embodiment and gasket part 7, gasket part 8, gasket part 9
(extended state) only an example is combined, can be changed according to specification of electronic unit 100 etc..
In addition, though it is not shown, but the coating on the inner wall of through-hole 61, through-hole 62, through-hole 63 and lead terminal 1, lead
Electrical connection is realized by solder etc. respectively between terminal 2, lead terminal 3.
As electronic component 4, surface installing type electronic component can be used, for example, the piezoelectricity of surface installing type shakes
Dynamic device, crystal oscillator, quartz crystal, quartz filter or surface acoustic wave device etc..Using the electricity of these surface installing types
It, can be using the electronic component of surface installing type as the wire type ministry of electronics industry in the case that sub- component is as electronic component 4
Part is general, so as to reduce the cost of electronic unit.
In the present embodiment, as electronic component 4, to using the electronic component for having and being made of quartz crystal resonator element 54
Surface installing type crystal oscillator the case where illustrate.Fig. 3 is the electronics member indicated involved by embodiments of the present invention
The sectional view of one embodiment of device 4.The electronic component 4 includes box body 40.Box body 40 has by ceramic multi-layer baseplate structure
At insulating properties pedestal 34 and covering stepped ramp type recess portion 341 opening portion lid 24.
In electronic component 4, the position (outer peripheral edge portion) that is abutted against with pedestal 34 in lid 24 is by sealing with engaging material
Expect (illustration omitted) and be engaged on pedestal 34, by the engagement, 40 inside (empty room) of box body is hermetically sealed.
Lid 24 is made of conductive materials such as metals, and with the pad that is formed on earthy lead terminal 2
Piece portion 8 is electrically connected, and has the function of removing noise.In addition, being not limited to the material of electric conductivity, lid 24 can also be by insulation such as ceramics
Property material constitute.In addition, although not shown, but preferably, the wiring diagram between lid 24 and gasket part 8 by being formed on box body 40
Case or conducting wire etc. and realize electrical connection.
The upper surface (upside in figure) of pedestal 34 is provided with the stepped ramp type recess portion 341 as empty room.Stepped ramp type recess portion 341
Inside it is equipped with two sections of steps.The epimere step (the nearest stage portion in opening portion from stepped ramp type recess portion 341) of stepped ramp type recess portion 341
The quartz crystal resonator element 54 for being formed with a pair of exciting (illustration omitted) is installed on 342 table top.The end of quartz crystal resonator element 54
Portion is carry by least part of epimere step 342.
Multiple electrodes gasket (illustration omitted), quartz crystal resonator element 54 are provided on the epimere step 342 of stepped ramp type recess portion 341
Each excitation electrode engaged with multiple electrode pads by conductive bonding material 741 and conductive bonding material 742.Separately
Outside, in terms of section shown in Fig. 3, conductive bonding material 741 coincides with conductive bonding material 742, but in fact, conductive
Property grafting material 741 is located at the outside of paper；Conductive bonding material 742 is located at the inside of paper.In addition, being connect as electric conductivity
Resin bonding material, metal salient point or plating salient point etc. may be used in condensation material (741,742).
On the bottom surface of stepped ramp type recess portion 341 343, the integrated circuit component 64 comprising amplifying circuit is installed.Integrated electricity
Circuit component 64 has multiple external electrodes (illustration omitted).Multiple external electrodes of integrated circuit component 64 pass through multiple conducting wires 84
And it is multiple with being arranged on the hypomere step of stepped ramp type recess portion 341 (than epimere step 342 closer to the step of bottom surface 343) 344
Electrode pads (illustration omitted) difference line bonding.Line bonding is carried out alternatively, it is also possible to not use conducting wire 84, and uses metal salient point
Carry out flip-chip bonding (Flip Chip Bond ing).
In addition, electronic component 4 shown in Fig. 3 have the external electrode 41 as multiple external electrodes, external electrode 42,
External electrode 43 and external electrode 44 (with reference to Fig. 2).These external electrodes (41~44) are formed on the lower surface of pedestal 34
(surface of downside in Fig. 3).For example, external electrode 41 and the external electrode electricity to 64 input supply voltage of integrated circuit component
Connection；External electrode 42 is electrically connected with the external electrode of the output of control integrated circuit component 64；External electrode 43 with it is integrated
The earthy external electrode of circuit element 64 is electrically connected；External electrode 44 and the output signal of output integrated circuit component 64
External electrode is electrically connected.In addition, in terms of section shown in Fig. 3, external electrode 41 coincides with external electrode 42；External electrode 43
It coincides with external electrode 44, but in fact, external electrode 41 is located at the inboard of paper；External electrode 42 is located at the outer of paper
Side, external electrode 43 are located at the outside of paper；External electrode 44 is located at the inboard of paper.
At least the one of the excitation electrode for the quartz crystal resonator element 54 installed on the epimere step 342 of above-mentioned stepped ramp type recess portion 341
At least part of part and the external electrode for the integrated circuit component 64 installed on the hypomere step 343 of stepped ramp type recess portion 341
Between, electrical connection is realized according to the specification of electronic component 4.
In electronic unit 100 shown in Fig. 2, four external electrodes (41~44) of electronic component 4 are spaced from each other regulation
Compartment of terrain is symmetrically arranged on four angles on the mounting surface (front) of gasket part (7~9).In this case, pass through solder
The positive fixed engagement on the surface and gasket part 7 of equal conductive bonding materials H, external electrode 41 and external electrode 42；External electrical
The surface of pole 43 and the positive fixed engagement of gasket part 8；The surface of external electrode 44 and the positive fixed engagement of gasket part 9.
In the electronic unit 100 of present embodiment, in gasket part 7, the position that is engaged with external electrode 41 and with outside
Between the position that electrode 42 engages, it is formed with an incised notch portion 72.In addition, being bonded to the gasket part 8 of external electrode 43 and engaging
Between having the gasket part 9 of external electrode 44, it is formed with a space part 89.That is, incised notch portion 72 is cutting of being formed in gasket part 7
Mouthful；Space part 89 is the gap of gasket part 8 and gasket part 9 being spaced apart.
In electronic unit 100 shown in FIG. 1, electronic component 4 is normally opened (ON) state when in order to make supply voltage input,
The front of gasket part 7 is not only bonded to external electrode 41, is also bonded to external electrode 42, supply voltage is input to external electrical
Pole 42.But for the present invention, between the quantity of gasket part, the quantity of lead terminal and gasket part and external electrode
Connection status is not limited by example shown in Fig. 2, can carry out suitable change corresponding to the specification of electronic unit 100.
In addition, between gasket part 7 and external electrode 41 and external electrode 42, between gasket part 8 and external electrode 43, gasket part 9 with it is outer
It can not also be engaged with electric conductivity adhesives or using the FCB of au bump with solder between portion's electrode 44.In addition,
Electronic component 4 can also be, the structure that the back side of external electrode (41~44) is connected with the mounting surface of gasket part (7~9).
In the case, it is not by solder between the two but is connected by conducting wire.
In addition, each lead terminal (1~3) is as shown in Figure 2, thin space position is respectively included (in Fig. 2 shown in the D1 of region
Position), diagonal portion (position shown in the D2 of region in Fig. 2) and wide spacing position (position shown in the D3 of region in Fig. 2).Respectively
Thin space portion is located at cardinal extremity (close to gasket part 7~9) side of respective lead terminal, and mutual spacing is relatively narrow.Each width spacing
Portion is located at the front end side of respective lead terminal, and mutual spacing is wider than the spacing between each thin space portion.In thin space portion
Link diagonal portion between wide spacing portion.In electronic unit 100 shown in Fig. 1, in order to make the spacing in each wide spacing portion become
Width, the diagonal portion of lead terminal 1 and the diagonal portion of lead terminal 3 are tilted to the direction left each other respectively.
In addition, the spacing between each lead terminal (1~3) is (in X-direction, between lead terminal 1 and lead terminal 2
The size at the interval between interval, lead terminal 2 and lead terminal 3) it can be according to the electronics member installed in gasket part (7~9)
The specification (for example, size of shape, external electrode etc.) of device 4, the specification of circuit board 6 (for example, through-hole 61 and through-hole 62,
Interval etc. between through-hole 62 and through-hole 63) carry out suitable setting.
As shown in Figure 1, the surface of the outside of the electronic unit 100 with above structure has carried out laser index carving M1 (that is, mark
It is carved with the word of " K ", " D ", " S ").Specifically, as shown in Figure 4, two in the resin-encapsulated portion 5 of electronic unit 4
In outer surface, using the face of the front that facing away from each gasket part (7~9) (mounting surface for being equipped with electronic component 4) as appearance
Face 51；Using the face in the back side that facing away from gasket part (7~9) (face for not installing electronic component 4) as outer surface 52, then only exist
Marked area M is set on outer surface 52.Laser irradiation only is carried out to marked area M, to the surface in resin-encapsulated portion 5
It is toasted to form laser index carving M1.As laser, for example, may be used carbon dioxide gas volumetric laser, semiconductor laser or
YAG laser etc..
Based on present embodiment, due at the back side that facing away from each gasket part (7~9) (that is, not installing electronic component 4
Face) outer surface 52 on be set with marked area M, only laser index carving is carried out in marked area M, so carrying out laser index carving
Resin-encapsulated portion outer surface 52 far from electronic component 4, and with the interval of electronic component 4 and conductive bonding material H
There is gasket part (7~9).Thus, heat and vibration generated when laser is irradiated in marking are not easy to pass to inner containment
On electronic component 4 and the conductive bonding material H that gasket part (7~9) and electronic component 4 are bonded together, thus,
Harmful effect caused by the heat generated when can inhibit with laser index carving M1 and vibration provides reliability higher wire type electricity
Subassembly 100.
In addition, as described above, the incised notch portion 72 and space part as space part are formed in gasket part (7~9)
89.Specifically, be formed with the incised notch portion 72 of an incision-like in gasket part 7, between gasket part 8 and gasket part 9 there are
The space part 89 of one strip.As shown in Fig. 2, incised notch portion 72 and space part 89 are in the X direction along same linear extension.From gasket
It is seen on the thickness direction in portion (7~9), the marked area M and incised notch portion 72 and space part 89 in resin-encapsulated portion 5 are at least partly heavy
It closes.In other words, as shown in Figure 4, if setting from the marked area M on the outer surface 52 in resin-encapsulated portion 5 along Z axis negative direction
The penetrating region T of outer surface 51 is extended to, then the region that penetrating region T is included with the part that gasket part (7~9) coincides
T2 is the incised notch portion 72 and space part 89 as space part.
In general, compared with lead terminal made of metal (1~3), the thermal coefficient of resin material is relatively low.It is close by resin
After envelope, as the heat conduction system for being only filled with thermal conductivity ratio gasket part (7~9) in the incised notch portion 72 and space part 89 of space part
The smaller sealing resin of number, thus the thermal conductivity of space part reduces.Therefore, when irradiating laser for marking it is generated heat and shake
Kinetic energy is by space part (incised notch portion 72 and space part 89 that are filled with resin) shielding.As a result, heat and vibrating more difficult passes to
On electronic component 4 and gasket part (7~9) of inner containment etc..
In the present embodiment, show the area of space part (being filled with resin Tou Over region T2) than marked area M
The smaller example of area, but space part (Tou Over region T2 can also be made) area be equal to or more than the face of marked area M
Product, in this way, heat and vibration caused by the laser of irradiation are easier to be shielded when carrying out marking.
More than, by the above embodiment, the present invention is described as an example, but the present invention is not the embodiment
It is limited, various changes can be carried out within the spirit and scope of the present invention.
The present invention is suitable as the various surface mounting electronic members of lead-type electronic-part.
Claims (1)
1. a kind of lead-type electronic-part has multiple lead terminals, electronic component and the multiple lead terminal of covering
The resin-encapsulated portion of a part of and described electronic component is connected with pad in one end of each of the multiple lead terminal
Piece portion, each gasket part are configured to the plate with front and back, and there is the electronic component surface to be formed with external electrical
The box body of pole, each gasket part it is positive between the external electrode of the electronic component by conductive bonding material
Realize electrical connection and mechanical engagement, the resin-encapsulated portion is to cover each gasket part, the conductive bonding material and institute
The state for stating electronic component carries out resin seal, it is characterised in that:
In two outer surfaces in the resin-encapsulated portion, on the outer surface at the back side that facing away from each gasket part, it is set with
Marked area only carries out laser index carving in the marked area,
It is formed in the gasket part of the lead terminal between the position that multiple external electrodes in electronic component engage
There is no the space part of gasket part,
From the thickness direction of the gasket part, the marked area and the space part in the resin-encapsulated portion are at least
It partially overlaps.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013197900 | 2013-09-25 | ||
| JP2013-197900 | 2013-09-25 | ||
| JP2014-137981 | 2014-07-03 | ||
| JP2014137981A JP6314704B2 (en) | 2013-09-25 | 2014-07-03 | Lead-type electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104467669A CN104467669A (en) | 2015-03-25 |
| CN104467669B true CN104467669B (en) | 2018-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410471723.XA Active CN104467669B (en) | 2013-09-25 | 2014-09-16 | Lead-type electronic-part |
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| Country | Link |
|---|---|
| CN (1) | CN104467669B (en) |
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| CN1220776A (en) * | 1997-03-24 | 1999-06-23 | 精工爱普生株式会社 | Substrate for semiconductor device, lead frame, semiconductor device and method for manufacturing the same, circuit board and electronic equipment |
| CN1625805A (en) * | 2002-02-06 | 2005-06-08 | 揖斐电株式会社 | Board for mounting semiconductor chip and manufacturing method and semiconductor module |
| JP2006156674A (en) * | 2004-11-29 | 2006-06-15 | Asahi Kasei Electronics Co Ltd | Semiconductor device and its manufacturing method |
| JP2011029403A (en) * | 2009-07-24 | 2011-02-10 | Daishinku Corp | Lead frame and lead type electronic component |
-
2014
- 2014-09-16 CN CN201410471723.XA patent/CN104467669B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02130947A (en) * | 1988-11-11 | 1990-05-18 | Mitsubishi Electric Corp | Semiconductor device |
| CN1220776A (en) * | 1997-03-24 | 1999-06-23 | 精工爱普生株式会社 | Substrate for semiconductor device, lead frame, semiconductor device and method for manufacturing the same, circuit board and electronic equipment |
| CN1625805A (en) * | 2002-02-06 | 2005-06-08 | 揖斐电株式会社 | Board for mounting semiconductor chip and manufacturing method and semiconductor module |
| JP2006156674A (en) * | 2004-11-29 | 2006-06-15 | Asahi Kasei Electronics Co Ltd | Semiconductor device and its manufacturing method |
| JP2011029403A (en) * | 2009-07-24 | 2011-02-10 | Daishinku Corp | Lead frame and lead type electronic component |
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| CN104467669A (en) | 2015-03-25 |
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