CN104346006A - Capacitive screen, manufacturing method thereof and equipment with same - Google Patents
Capacitive screen, manufacturing method thereof and equipment with same Download PDFInfo
- Publication number
- CN104346006A CN104346006A CN201310330302.0A CN201310330302A CN104346006A CN 104346006 A CN104346006 A CN 104346006A CN 201310330302 A CN201310330302 A CN 201310330302A CN 104346006 A CN104346006 A CN 104346006A
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- cabling
- ito film
- glass plate
- conduction element
- capacitance plate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
The invention discloses a capacitive screen, a manufacturing method thereof and equipment with the same. The capacitive screen comprises a glass plate, an ITO (indium tin oxide) film, multiple first routing lines and multiple second routing lines, the ITO film is arranged on the glass plate, the first routing lines are arranged on the ITO film, at least one of the second routing lines comprises a first portion and a second portion, the first portions are arranged on the ITO film, the second portions are arranged on the glass plate, the first portions of the second routing lines are connected with the second portions, and other portions of the second routing lines are arranged on the glass plate. The capacitive screen has the advantages of low manufacturing cost, small width of a frame occupied by the routing lines and the like.
Description
Technical field
The present invention relates to a kind of capacitance plate and manufacture method thereof, also relate to a kind of equipment with this capacitance plate.
Background technology
The cabling of the edge of existing capacitance plate is all etched by silver slurry silk-screen or metal-plated rete (MoAlMo) gold-tinted and obtained.But silver slurry silk-screen exists live width and the larger defect of distance between centers of tracks, cannot be applied on passage is more, frame requirement is narrower capacitance plate.There is the high defect of cost in the etching of metal-plated rete gold-tinted.
Summary of the invention
The present invention is intended at least to solve one of technical matters existed in prior art.For this reason, one object of the present invention is to propose a kind of capacitance plate.
Another object of the present invention is the manufacture method proposing a kind of described capacitance plate.
Another object of the present invention is to propose a kind of equipment with described capacitance plate.
To achieve these goals, embodiment according to a first aspect of the present invention proposes a kind of capacitance plate, and described capacitance plate comprises: glass plate; Ito film, described ito film is established on the glass plates; Multiple first cabling, multiple described first cabling is located in described ito film; With multiple second cabling, at least one in multiple described second cabling comprises Part I and Part II, described Part I is located in described ito film, described Part II is established on the glass plates, the described Part I of described second cabling is connected with described Part II, and the remainder in multiple described second cabling is established on the glass plates.
According to the capacitance plate of the embodiment of the present invention by being located in described ito film by the described Part I of at least one in multiple described second cabling, thus the white space relative with the cabling district of described glass plate in described ito film can be utilized.That is, the described Part I of at least one in multiple described second cabling is located in the white space relative with the cabling district of described glass plate in described ito film, thus the overall width (at least the overall width of described second cabling on described glass plate can be reduced half) of the second cabling on described glass plate can be reduced, the border width that multiple described second cabling takies can be reduced thus.And, from another perspective, the border width that can take at multiple described second cabling of maintenance is constant, utilize lower-cost method (such as silver slurry silk-screen) to manufacture multiple described second cabling.Therefore, the advantage such as the border width have low cost of manufacture according to the capacitance plate of the embodiment of the present invention, being taken by cabling is little.
In addition, following additional technical characteristic can also be had according to the capacitance plate of the embodiment of the present invention:
According to one embodiment of present invention, each described second cabling comprises Part I and Part II, the described Part I of each described second cabling is located in described ito film and described Part II is established on the glass plates, and wherein the described Part I of each described second cabling is connected with described Part II.The border width that multiple second cabling 400 takies can be reduced thus further.
According to one embodiment of present invention, the described Part I of each described second cabling is connected by conduction element with described Part II.Being located at the part in described ito film and establishing part on the glass plates to link together more easily, stably of described second cabling can be made thus, thus the structure of described capacitance plate can be made more stable, reasonable.
According to one embodiment of present invention, described conduction element is made up of anisotropic conductive.Being located at the part in described ito film and establishing part on the glass plates to link together more easily, stably of described second cabling can be made thus.
According to one embodiment of present invention, each described first cabling is silk-screen silver slurry cabling, and each described second cabling is silk-screen silver slurry cabling.The manufacturing cost of described capacitance plate can be reduced thus further.
According to one embodiment of present invention, each described first cabling is emitter cabling, and each described second cabling is receiving pole cabling.
Embodiment according to a second aspect of the present invention proposes a kind of manufacture method of capacitance plate described according to a first aspect of the present invention, and described manufacture method comprises the following steps:
Prepare described glass plate and described ito film;
Multiple described first cabling is printed in described ito film;
The Part I of at least one in multiple described second cabling to be printed in described ito film and Part II is printed on the glass plates, and the described Part I of described second cabling is connected with described Part II, the remainder in multiple described second cabling is printed on the glass plates; With
Described glass plate and described ito film are combined.
Manufacture described capacitance plate by utilizing according to the manufacture method of the embodiment of the present invention, thus the manufacturing cost of described capacitance plate can be reduced, reduce the border width taken by cabling.
According to one embodiment of present invention, described manufacture method comprises the following steps:
Glass plate supplied materials is provided, then successively ITO plated film and ITO is carried out to described glass plate supplied materials and be etched with and obtain described glass plate;
Ito film supplied materials is provided, then successively described ito film supplied materials is shunk and ITO is etched with and obtains described ito film;
Silk-screen silver lumps and conduction element in described ito film, laser-induced thermal etching is carried out to described silver-colored lumps, with at least one described Part I described in obtaining in multiple described first cabling and multiple described second cabling, at least one the described Part I described in multiple described second cabling is connected with conduction element;
Remainder at least one described Part II described on the glass plates in silk-screen conduction element, multiple described second cabling that is connected with conduction element and multiple described second cabling; With
Described ito film and described glass plate are fit together, and the conduction element in described ito film is connected with the conduction element on described glass plate.
The manufacturing cost of described capacitance plate can be reduced thus further.
Embodiment according to a third aspect of the present invention proposes a kind of equipment, and described equipment comprises capacitance plate described according to a first aspect of the present invention.
The advantage such as the border width have low cost of manufacture according to the equipment of the embodiment of the present invention thus, being taken by cabling is little.
According to one embodiment of present invention, described equipment is mobile phone.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the structural representation of capacitance plate according to an embodiment of the invention;
Fig. 2 is the cut-open view along A-A direction of Fig. 1;
Fig. 3 is the structural representation of capacitance plate according to another embodiment of the invention;
Fig. 4 is the cut-open view along B-B direction of Fig. 3;
Fig. 5 is the process flow diagram of the manufacture method of capacitance plate according to the embodiment of the present invention.
Embodiment
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In describing the invention, except as otherwise noted, the implication of " multiple " is two or more.
In describing the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, concrete condition above-mentioned term concrete meaning in the present invention can be understood.
Below with reference to Fig. 1-Fig. 4, the capacitance plate 10 according to the embodiment of the present invention is described.As Figure 1-Figure 4, glass plate 100, ito film 200, multiple first cabling 300 and multiple second cabling 400 is comprised according to the capacitance plate 10 of the embodiment of the present invention.
Ito film 200 is located on glass plate 100.Multiple first cabling 300 is located in ito film 200.At least one in multiple second cabling 400 comprises Part I 410 and Part II 420, and Part I 410 is located in ito film 200, and Part II 420 is located on glass plate 100, and the Part I 410 of the second cabling 400 is connected with Part II 420.In other words, for to be located in ito film 200 and the second cabling 400 on glass plate 100 (namely in multiple second cabling 400 described at least one) simultaneously, the Part I 410 of one of them the second cabling 400 is connected with the Part II 420 of this second cabling 400.Remainder in multiple second cabling 400 is located on glass plate 100.
Capacitance plate 10 according to the embodiment of the present invention passes through the Part I 410 of at least one in multiple second cabling 400 to be located in ito film 200, thus can utilize the white space relative with the cabling district of glass plate 100 in ito film 200.That is, the Part I 410 of at least one in multiple second cabling 400 is located in the white space relative with the cabling district of glass plate 100 in ito film 200, thus the overall width (at least the overall width of the second cabling 400 on glass plate 100 can be reduced half) of the second cabling 400 on glass plate 100 can be reduced, the border width that multiple second cabling 400 takies can be reduced thus.And, from another perspective, the border width that can take at multiple second cabling 400 of maintenance is constant, utilize lower-cost method (such as silver slurry silk-screen) to manufacture multiple second cabling 400.Therefore, the advantage such as the border width have low cost of manufacture according to the capacitance plate 10 of the embodiment of the present invention, being taken by cabling is little.
In order to be described " Part I 410 of at least one in multiple second cabling 400 is located in ito film 200 and at least one Part II 420 described in multiple second cabling 400 is located on glass plate 100 " better, below for a specific example.Such as, the second cabling 400 can be ten, and each second cabling 400 can comprise Part I 410 and Part II 420.Wherein, six the second cablings 400 are all located on glass plate 100, and the Part I 410 of other four the second cablings 400 can be located in ito film 200, and the Part II 420 of these four the second cablings 400 can be located on glass plate 100.And the Part I 410 of each in these four the second cablings 400 can be connected with the Part II 420 of this second cabling 400.
First cabling 300 and the second cabling 400 can be lower but cause live width and the larger method manufacture of distance between centers of tracks with cost.
Particularly, each first cabling 300 can be silk-screen silver slurry cabling, and each second cabling 400 can be silk-screen silver slurry cabling.The manufacturing cost of capacitance plate 10 can be reduced thus further.
Each first cabling 300 can be emitter cabling, and each second cabling 400 can be receiving pole cabling.
Glass plate 100 can be provided with the first ITO layer 110, ito film 200 can be provided with the second ITO layer 210.
As shown in Figure 3 and Figure 4, in some embodiments of the invention, each second cabling 400 can comprise Part I 410 and Part II 420, the Part I 410 of each second cabling 400 can be located in ito film 200, and the Part II 420 of each second cabling 400 can be located on glass plate 100.Wherein, the Part I 410 of each second cabling 400 can be connected with Part II 420.The border width that multiple second cabling 400 takies can be reduced thus further.
In order to better to " Part I 410 of each second cabling 400 can be located in ito film 200, and the Part II 420 of each second cabling 400 can be located on glass plate 100.Wherein, the Part I 410 of each second cabling 400 can be connected with Part II 420 " be described, below for a specific example.Such as, the second cabling 400 can be ten, and each second cabling 400 can comprise Part I 410 and Part II 420.Wherein, the Part I 410 of these ten the second cablings 400 can be located in ito film 200, and the Part II 420 of these ten the second cablings 400 can be located on glass plate 100.And the Part I 410 of each in these ten the second cablings 400 can be connected with the Part II 420 of this second cabling 400.
As shown in figures 1 and 3, in one embodiment of the invention, for the second cabling 400 be arranged in glass plate 100 and ito film 200, the Part I 410 of each second cabling 400 can be connected by conduction element 500 with the Part II 420 of this second cabling 400.In other words, being located at the part in ito film 200 and can being connected by conduction element 500 with the part be located on glass plate 100 of this second cabling 400 of each second cabling 400.The part be located in ito film 200 of the second cabling 400 can be made thus to link together more easily, stably with the part be located on glass plate 100, thus the structure of capacitance plate 10 can be made more stable, reasonable.
Advantageously, conduction element 500 can be made up of anisotropic conductive (ACP).The part be located in ito film 200 of the second cabling 400 can be made thus to link together more easily, stably with the part be located on glass plate 100.
Conduction element 500 can be multiple, and the quantity of conduction element 500 can equal the quantity of the second cabling 400 be located in ito film 200.Wherein, being located at the part in ito film 200 and can being connected by a conduction element 500 with the part be located on glass plate 100 of this second cabling 400 of second cabling 400.
Below with reference to Fig. 1-Fig. 5, the manufacture method according to the capacitance plate 10 of the embodiment of the present invention is described.As Figure 1-Figure 5, comprise the following steps according to the manufacture method of the capacitance plate 10 of the embodiment of the present invention:
Prepare glass plate 100 and ito film 200;
Multiple first cabling 300 is printed in ito film 200;
The Part I 410 of at least one in multiple second cabling 400 is printed in ito film 200, and the Part II 420 of at least one described in multiple second cabling 400 is printed on glass plate 100, and the Part I 410 of at least one described in multiple second cabling 400 is connected with Part II 420, the remainder in multiple second cabling 400 is printed on glass plate 100.In other words, the part in ito film 200 that is located at of the second cabling 400 is connected with the part be located on glass plate 100 of this second cabling 400.
Glass plate 100 and ito film 200 are combined.
Manufacture capacitance plate 10 by utilizing according to the manufacture method of the embodiment of the present invention, thus the manufacturing cost of capacitance plate 10 can be reduced, reduce the border width taken by cabling.
Glass plate 100 can utilize known method manufacture.Particularly, following method can be utilized to manufacture glass plate 100: provide glass plate supplied materials, then successively ITO plated film and ITO be carried out to described glass plate supplied materials and be etched with and obtain glass plate 100.In addition, silk-screen decorative layer can also be made on described glass plate supplied materials.
Ito film 200 can utilize known method manufacture.Particularly, following method can be utilized to manufacture ito film 200: provide ito film supplied materials, then successively described ito film supplied materials to be shunk and ITO is etched with and obtains ito film 200.
Then can in ito film 200 silk-screen silver lumps and conduction element 500, laser-induced thermal etching is carried out to described silver-colored lumps, with at least one Part I 410 described in obtaining in multiple first cabling 300 and multiple second cabling 400, at least one the Part I 410 described in multiple second cabling 400 is connected with conduction element 500.That is, the part be located in ito film 200 of each second cabling 400 can be connected with a conduction element 500.
On glass plate 100 in silk-screen conduction element 500, multiple second cablings 400 of being connected with conduction element 500 described in remainder at least one Part II 420 and multiple second cabling 400.In other words, the part be located on glass plate 100 of described each second cabling 400 at least one in multiple second cabling 400 can be connected with a conduction element 500.
Ito film 200 and glass plate 100 are fit together, and the conduction element 500 in ito film 200 is connected with the conduction element 500 on glass plate 100.At least one the part be located in ito film 200 described in multiple second cabling 400 can be made thus to be connected with the part be located on glass plate 100.
Particularly, known method can be utilized ito film 200 and glass plate 100 to be fit together.
Present invention also offers a kind of equipment, comprise the capacitance plate 10 according to above-described embodiment according to the equipment of the embodiment of the present invention.The advantage such as the border width have low cost of manufacture according to the equipment of the embodiment of the present invention thus, being taken by cabling is little.
Particularly, described equipment can be mobile phone.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " illustrative examples ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and describe embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple change, amendment, replacement and modification to these embodiments when not departing from principle of the present invention and aim, scope of the present invention is by claim and equivalents thereof.
Claims (10)
1. a capacitance plate, is characterized in that, comprising:
Glass plate;
Ito film, described ito film is established on the glass plates;
Multiple first cabling, multiple described first cabling is located in described ito film; With
Multiple second cabling, at least one in multiple described second cabling comprises Part I and Part II, described Part I is located in described ito film, described Part II is established on the glass plates, the described Part I of described second cabling is connected with described Part II, and the remainder in multiple described second cabling is established on the glass plates.
2. capacitance plate according to claim 1, it is characterized in that, each described second cabling comprises Part I and Part II, the described Part I of each described second cabling is located in described ito film and described Part II is established on the glass plates, and wherein the described Part I of each described second cabling is connected with described Part II.
3. capacitance plate according to claim 2, is characterized in that, the described Part I of each described second cabling is connected by conduction element with described Part II.
4. capacitance plate according to claim 3, is characterized in that, described conduction element is made up of anisotropic conductive.
5. capacitance plate according to claim 1, is characterized in that, each described first cabling is silk-screen silver slurry cabling, and each described second cabling is silk-screen silver slurry cabling.
6. capacitance plate according to claim 1, is characterized in that, each described first cabling is emitter cabling, and each described second cabling is receiving pole cabling.
7. a manufacture method for the capacitance plate according to any one of claim 1-6, is characterized in that, comprises the following steps:
Prepare described glass plate and described ito film;
Multiple described first cabling is printed in described ito film;
The Part I of at least one in multiple described second cabling to be printed in described ito film and Part II is printed on the glass plates, and the described Part I of described second cabling is connected with described Part II, the remainder in multiple described second cabling is printed on the glass plates; With
Described glass plate and described ito film are combined.
8. manufacture method according to claim 7, is characterized in that, comprises the following steps:
Glass plate supplied materials is provided, then successively ITO plated film and ITO is carried out to described glass plate supplied materials and be etched with and obtain described glass plate;
Ito film supplied materials is provided, then successively described ito film supplied materials is shunk and ITO is etched with and obtains described ito film;
Silk-screen silver lumps and conduction element in described ito film, laser-induced thermal etching is carried out to described silver-colored lumps, with at least one described Part I described in obtaining in multiple described first cabling and multiple described second cabling, at least one the described Part I described in multiple described second cabling is connected with conduction element;
Remainder at least one described Part II described on the glass plates in silk-screen conduction element, multiple described second cabling that is connected with conduction element and multiple described second cabling; With
Described ito film and described glass plate are fit together, and the conduction element in described ito film is connected with the conduction element on described glass plate.
9. an equipment, is characterized in that, comprises the capacitance plate according to any one of claim 1-6.
10. equipment according to claim 9, is characterized in that, described equipment is mobile phone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310330302.0A CN104346006B (en) | 2013-07-31 | 2013-07-31 | Capacitance plate and its manufacturing method and the equipment with the capacitance plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310330302.0A CN104346006B (en) | 2013-07-31 | 2013-07-31 | Capacitance plate and its manufacturing method and the equipment with the capacitance plate |
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| Publication Number | Publication Date |
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| CN104346006A true CN104346006A (en) | 2015-02-11 |
| CN104346006B CN104346006B (en) | 2018-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310330302.0A Active CN104346006B (en) | 2013-07-31 | 2013-07-31 | Capacitance plate and its manufacturing method and the equipment with the capacitance plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107219957A (en) * | 2017-06-20 | 2017-09-29 | 厦门天马微电子有限公司 | A kind of array base palte and display panel |
| WO2020227978A1 (en) * | 2019-05-15 | 2020-11-19 | 深圳市柔宇科技有限公司 | Electronic device and manufacturing method for electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096533A (en) * | 2009-12-15 | 2011-06-15 | 索尼公司 | Electrostatic capacitance-type input device, method of testing electrostatic capacitance-type input device, and driving device for electrostatic capacitance-type input device |
| US20120218219A1 (en) * | 2011-02-28 | 2012-08-30 | Rappoport Benjamin M | Displays with minimized borders |
| CN102929576A (en) * | 2011-08-11 | 2013-02-13 | 乐金显示有限公司 | Display device integrated with touch panel |
| CN202795287U (en) * | 2012-04-17 | 2013-03-13 | 厦门市宝龙达光电技术有限公司 | Touch screen with narrow frame |
| CN203038254U (en) * | 2012-12-30 | 2013-07-03 | 金龙机电（东莞）有限公司 | Touch screen with narrow frame |
-
2013
- 2013-07-31 CN CN201310330302.0A patent/CN104346006B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096533A (en) * | 2009-12-15 | 2011-06-15 | 索尼公司 | Electrostatic capacitance-type input device, method of testing electrostatic capacitance-type input device, and driving device for electrostatic capacitance-type input device |
| US20120218219A1 (en) * | 2011-02-28 | 2012-08-30 | Rappoport Benjamin M | Displays with minimized borders |
| CN102929576A (en) * | 2011-08-11 | 2013-02-13 | 乐金显示有限公司 | Display device integrated with touch panel |
| CN202795287U (en) * | 2012-04-17 | 2013-03-13 | 厦门市宝龙达光电技术有限公司 | Touch screen with narrow frame |
| CN203038254U (en) * | 2012-12-30 | 2013-07-03 | 金龙机电（东莞）有限公司 | Touch screen with narrow frame |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107219957A (en) * | 2017-06-20 | 2017-09-29 | 厦门天马微电子有限公司 | A kind of array base palte and display panel |
| CN107219957B (en) * | 2017-06-20 | 2020-08-18 | 厦门天马微电子有限公司 | Array substrate and display panel |
| WO2020227978A1 (en) * | 2019-05-15 | 2020-11-19 | 深圳市柔宇科技有限公司 | Electronic device and manufacturing method for electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104346006B (en) | 2018-06-15 |
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Effective date of registration: 20150908 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Applicant after: Shenzhen BYD Electronic Component Co., Ltd. Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009 Applicant before: Biyadi Co., Ltd. |
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Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
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