CN103781324A - Heat radiation device and electronic device - Google Patents
Heat radiation device and electronic device Download PDFInfo
- Publication number
- CN103781324A CN103781324A CN201210405776.2A CN201210405776A CN103781324A CN 103781324 A CN103781324 A CN 103781324A CN 201210405776 A CN201210405776 A CN 201210405776A CN 103781324 A CN103781324 A CN 103781324A
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- radiator
- heat
- electronic installation
- thermal source
- wears
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Abstract
The invention discloses a heat radiation device which can be applied to an electronic device. The electronic device comprises a circuit board with a heat source. The heat radiation device comprises a first radiator, a second radiator, a penetration piece, at least one air inlet, an air outlet, and an airflow channel located between the air inlets and the air outlet, wherein the first radiator is fixed on the heat source, and the heat source is located in the airflow channel; the second radiator is provided with a plurality of heat radiation fins arranged in parallel and arranged on the first radiator; heat generated by the heat source can be transferred to the heat radiation fins on the second radiator via the first radiator; the penetration piece penetrates between the first radiator and the second radiator, the second radiator is pivoted via the penetration piece and can rotate relatively to the first radiator; and when the second radiator rotates to the working position, directions of the heat radiation fins are consistent with the airflow direction of the airflow channel.
Description
Technical field
The invention relates to a kind of heat abstractor and electronic installation, and relate to especially a kind of heat abstractor and the electronic installation that uses this heat abstractor with Rotatable radiator.
Background technology
Server is the core computer of serving each computer in network system, and the function such as disk and print service that can provide network user to need also can supply each user side every resource in share web environment each other simultaneously.
Along with science and technology is showing improvement or progress day by day, the handled data volume of server and arithmetic speed constantly improve, and the heating power of the electronic component of server inside is risen.In order to prevent electronic component overheated, cause electronic component that temporary or permanent inefficacy occurs, server must have enough heat dissipations.Generally speaking, in server, common heat abstractor is radiator.First, radiator is attached on the thermal source of circuit board, it is for example central processing unit (Central Processing Unit, CPU) or image processor (Graphic Processing Unit, GPU) etc.Then, radiator conducts after the heat absorption of thermal source by heat, then heat radiator being absorbed by cooling blast is taken away fast.But in the time that the direction of cooling blast and the direction of radiator have deviation, the radiating effect of radiator just can not be brought into play preferably radiating effect.
Summary of the invention
The invention provides a kind of heat abstractor, its radiator can be rotated, to have preferably radiating efficiency.
The invention provides a kind of electronic installation, its radiator can be rotated, to have preferably radiating efficiency.
The present invention proposes a kind of heat abstractor, is applicable to an electronic installation.Electronic installation comprises that one has the circuit board of thermal source.Heat abstractor comprises that one first radiator, one second radiator, wear part, at least one air inlet, an air outlet and be positioned at air inlet and air outlet.The first radiator is fixed on thermal source, and thermal source is positioned at gas channel.The second radiator has the multi-disc radiating fin being arranged in parallel, and is arranged on the first radiator and with the first radiator and contacts.The heat that thermal source produces can be by the radiating fin of the first heat sink to the second radiator.Wear part and wear between the first radiator and the second radiator, wherein the second radiator is pivoted via wearing part, and can rotate with respect to the first radiator.In the time that the second radiator turns to a service position, the direction of radiating fin is consistent with the airflow direction of gas channel.
In one embodiment of this invention, the above-mentioned part that wears has a tightening state or the solid state of a solution.In the time wearing part in tightening state, the first radiator locks mutually with the relative position of the second radiator.When wearing part in the time separating solid state, the second radiator can rotate with respect to the first radiator.
In one embodiment of this invention, the above-mentioned part that wears has more a disassembly status.In the time wearing part in disassembly status, the second radiator can be unloaded from electronic installation.
In one embodiment of this invention, heat abstractor more comprises a flexible heat-conducting layer, it is disposed between the first radiator and the second radiator and is full of the space between the first radiator and the second radiator, and wherein flexible heat-conducting layer can be heat-conducting cream, thermal grease or cooling pad.
The present invention also proposes a kind of electronic installation, comprises that one has circuit board and a heat abstractor of thermal source.Heat abstractor comprises that one first radiator, one second radiator, wear part, at least one air inlet, an air outlet and the gas channel between air inlet and air outlet.The first radiator is fixed on thermal source, and thermal source is positioned at gas channel.The second radiator has the multi-disc radiating fin being arranged in parallel, and the second radiator is arranged on the first radiator and is in contact with it.The heat that thermal source produces can be by the radiating fin of the first heat sink to the second radiator.Wear part and wear between the first radiator and the second radiator, wherein the second radiator is pivoted via wearing part, and can rotate with respect to the first radiator.In the time that the second radiator turns to a service position, the direction of radiating fin is consistent with the airflow direction of gas channel.
In one embodiment of this invention, the above-mentioned part that wears has a tightening state or the solid state of a solution.In the time wearing part in tightening state, the first radiator locks mutually with the relative position of the second radiator.When wearing part in the time separating solid state, the second radiator can rotate with respect to the first radiator.
In an embodiment of the present invention, the above-mentioned part that wears has more a disassembly status.In the time wearing part in disassembly status, the second radiator can be unloaded from electronic installation.
In one embodiment of this invention, above-mentioned heat abstractor more comprises a flexible heat-conducting layer, it is disposed between the first radiator and the second radiator and is full of the space between the first radiator and the second radiator, and wherein flexible heat-conducting layer is heat-conducting cream, thermal grease or cooling pad.。
Based on above-mentioned, the second radiator of the present invention can rotate with respect to the first radiator by wearing part.Therefore, heat abstractor is applicable to the occasion of different airflow directions, so that heat abstractor has preferably radiating efficiency.By this, the electronic installation of applying this heat abstractor can have preferably radiating efficiency, and can be applied to the electronic installation of different type of machines, to reduce the production cost of electronic installation.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the electronic installation of one embodiment of the invention.
Fig. 2 is that the first radiator of Fig. 1 is in the schematic diagram in when rotation.
Fig. 3 is the stereogram of the heat abstractor of Fig. 2.
[main element symbol description]
1: electronic installation
10: circuit board
12: thermal source
20: wind scooper
100: heat abstractor
110: the first radiators
120: the second radiators
122: radiating fin
122a: passage
130: wear part
142: air inlet
144: air outlet
146: gas channel
150: flexible heat-conducting layer
D1: flow direction
D2: bearing of trend
F: cooling blast
Embodiment
Fig. 1 is the schematic diagram of the electronic installation of one embodiment of the invention.Fig. 2 be Fig. 1 the second radiator in rotate time schematic diagram.Fig. 3 is the stereogram of the heat abstractor of Fig. 2.Please refer to Fig. 1, Fig. 2 and Fig. 3, in the present embodiment, electronic installation 1 is for example a server, and it comprises that one has circuit board 10 and a heat abstractor 100 of thermal source 12.It should be noted that, for making view succinct, Fig. 1, Fig. 2 and Fig. 3 omit cabinet and the inner electronic component thereof of electronic installation 1.
In addition, the circuit board 10 of the present embodiment can be the motherboard being assembled in server, and thermal source 12 is for example central processing unit (CPU) or image processor (GPU) on motherboard.After heat abstractor 100 is arranged on thermal source 12, heat abstractor 100 first adsorbs the heat of thermal source 12 with heat exchange pattern, and cooling blast f brings to the external world in thermal convection mode by the heat of being adsorbed of heat abstractor 100 more rapidly.It should be noted that, for making view clear, the heat abstractor 100 clipped elements of Fig. 3.
Hold above-mentionedly, heat abstractor 100 comprises that one first radiator 110, one second radiator 120, wear part 130, at least one air inlet 142, an air outlet 144 and the gas channel 146 between air inlet 142 and air outlet 144.The first radiator 110 is fixed on thermal source 12, and thermal source 12 is positioned at gas channel 146.The second radiator 120 has the multi-disc radiating fin 122 being arranged in parallel, and multiple passage 122a is between these radiating fins 122.The second radiator 120 is arranged on the first radiator 110 and with the first radiator 110 and contacts.The heat that thermal source 12 produces can be passed on the radiating fin 122 of the second radiator 120 by the first radiator 110.Wear part 130 and wear between the first radiator 110 and the second radiator 120, wherein the second radiator 120 can be pivoted via wearing part 130, and the second radiator 120 can be rotated with respect to the first radiator 110.
Particularly, the air inlet 142 of the present embodiment, air outlet 144 can be installed on the scope surrounding on circuit board 10 and be formed by a wind scooper 20 with gas channel 146, but the present invention is not as limit.Accordingly, air inlet 142 can be guided cooling blast f and be entered to gas channel 146 and flow to air outlet 144 along a flow direction d1, and wherein cooling blast f can be by fan (not illustrating) or outside air and produced.In the time that the second radiator 110 turns to a service position, the bearing of trend d2 of radiating fin 122 is consistent with the flow direction d1 of cooling blast f that is positioned at gas channel 146.
Say further, the part 130 that wears of the present embodiment is for example a screw (screw) or a pin (pin), and wears part 130 and be embedded in the second radiator 120 and be fixed on the first radiator 110.Therefore, wear and penetrate part 130 and there is a tightening state or and separate solid state.When wearing while penetrating part 130 in tightening state, the relative position locking (as shown in Figure 1) of the first radiator 110 and the second radiator 120.Otherwise, penetrate part 130 in the time separating solid state when wearing, the second radiator 120 can rotate (as shown in Figure 2) with respect to the first radiator 110.In other words, the second radiator 120 can be rotated as rotating shaft using the central shaft that wears part 130.
In the time that the heat of thermal source 12 is conducted and is passed to radiating fin 122 by the first radiator 110 and the second radiator 120, because the second radiator 120 can rotate with respect to the first radiator 110, therefore the angle of the bearing of trend d2 of these radiating fins 122 of capable of regulating and the flow direction d1 of cooling blast f, so that the bearing of trend d2 of these radiating fins 122 can be parallel to the flow direction d1 of cooling blast f.In other words, these passages 122a can be parallel with the flow direction d1 of cooling blast f.By this, the heat energy on the second radiator 120 is pulled away rapidly, to improve the radiating efficiency of thermal source 12.Therefore, heat abstractor 100 has preferably radiating effect.In addition,, because the second radiator 120 can be rotated by wearing part 130, therefore can be applicable to the electronic installation of different type of machines.Configuration, can make heat abstractor 100 have the advantage of sharing part by this, and then can reduce the production cost of the electronic installation 1 of this heat abstractor 100 of application.
In addition, first radiator 110 of the present embodiment and the second radiator 120 cover thermal source 12 in the orthographic projection of circuit board 10.Therefore, can make the thermal source 12 of circuit board 10 there is larger heat transfer area, contribute to accelerate the radiating rate of thermal source 12.
In addition, wear part 130 also can move apart in the first radiator 110 and the second radiator 120.In detail, wear and penetrate part 130 and more can there is a disassembly status.When wearing while penetrating part 130 in disassembly status, the second radiator 120 can separate with the first radiator 110, and unloading from electronic installation 1.Therefore, after wearing and penetrating part 130 and separate on the second radiator 120, and the second radiator 120 is separated with the first radiator 110.By this, can be convenient to maintenance personal detects or changes.
Please refer to Fig. 3, heat abstractor 100 more comprises a flexible heat-conducting layer 150, and it is for example heat-conducting cream, thermal grease or cooling pad.Flexible heat-conducting layer 150 is configured between the first radiator 110 and the second radiator 120 and is full of the space between the first radiator 110 and the second radiator 120.Adsorb after the heat of thermal source 12 at the first radiator 110, flexible heat-conducting layer 150 can conduct to heat the second radiator 120 fast.By this, also can improve the radiating effect of heat abstractor 100.
In sum, the second radiator of the present invention can rotate with respect to the first radiator by wearing part.By this, can make the bearing of trend of radiating fin of the second radiator and the flow direction of cooling blast consistent, so that heat abstractor has preferably radiating effect.In addition, heat abstractor can be applicable in the electronic installation of different type of machines, can make heat abstractor have the advantage of sharing part, and then can reduce the production cost of electronic installation.In addition, heat abstractor more can comprise flexible heat-conducting layer, also contributes to improve radiating efficiency.
Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; under any, in technical field, have and conventionally know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on accompanying claim.
Claims (10)
1. a heat abstractor, is applicable to an electronic installation, and this electronic installation comprises a circuit board with thermal source, and this heat abstractor comprises:
One first radiator, is fixed on this thermal source;
One second radiator, has the multi-disc radiating fin being arranged in parallel, and is arranged on this first radiator and with this first radiator and contacts, and the heat that this thermal source produces can be by this first heat sink to those radiating fins of this second radiator;
One wears part, wears between this first radiator and this second radiator, and wherein this second radiator wears part and is pivoted via this, and can rotate with respect to the first radiator; And
At least one air inlet, an air outlet and the gas channel between this air inlet and this air outlet, this thermal source is positioned at this gas channel,
Wherein, when this second radiator turns to a service position, the direction of those radiating fins is consistent with the airflow direction of this gas channel.
2. heat abstractor as claimed in claim 1, is characterized in that, this wears part and has a tightening state or the solid state of a solution, and in the time that this wears part in this tightening state, this first radiator locks mutually with the relative position of this second radiator; And
In the time that this wears part in the solid state of this solution, this second radiator can rotate with respect to this first radiator.
3. heat abstractor as claimed in claim 2, is characterized in that, this wears part and has more a disassembly status, and in the time that this wears part in this disassembly status, this second radiator can be unloaded from this electronic installation.
4. heat abstractor as claimed in claim 1, is characterized in that, more comprises a flexible heat-conducting layer, is disposed between this first radiator and this second radiator and is full of the space between this first radiator and this second radiator.
5. heat abstractor as claimed in claim 4, is characterized in that, this flexibility heat-conducting layer is heat-conducting cream, thermal grease or cooling pad.
6. an electronic installation, comprises
One circuit board, has a thermal source;
At least one air inlet, an air outlet and the gas channel between this air inlet and this air outlet, this thermal source is positioned at this gas channel;
One first radiator, is fixed on this thermal source;
One second radiator, has the multiple radiating fins that are arranged in parallel, and is arranged on this first radiator and with this first radiator and contacts, and the heat that this thermal source produces can be by this first heat sink to those radiating fins of this second radiator; And
One wears part, wears between this first radiator and this second radiator, and wherein this second radiator wears part and is pivoted via this, and can rotate with respect to the first radiator,
Wherein, when this second radiator turns to a service position, the direction of those radiating fins is consistent with the airflow direction of this place's gas channel.
7. electronic installation as claimed in claim 6, is characterized in that, this wears part and has a tightening state or the solid state of a solution, and in the time that this wears part in this tightening state, this first radiator locks mutually with the relative position of this second radiator; And
In the time that this wears part in the solid state of this solution, this second radiator can rotate with respect to this first radiator.
8. electronic installation as claimed in claim 7, is characterized in that, this wears part and has more a disassembly status, and in the time that this wears part in this disassembly status, this second radiator can be unloaded from this electronic installation.
9. electronic installation as claimed in claim 6, is characterized in that, more comprises a flexible heat-conducting layer, is disposed between this first radiator and this second radiator and is full of the space between this first radiator and this second radiator.
10. electronic installation as claimed in claim 9, is characterized in that, this flexibility heat-conducting layer is heat-conducting cream, thermal grease or cooling pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210405776.2A CN103781324A (en) | 2012-10-22 | 2012-10-22 | Heat radiation device and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210405776.2A CN103781324A (en) | 2012-10-22 | 2012-10-22 | Heat radiation device and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103781324A true CN103781324A (en) | 2014-05-07 |
Family
ID=50572979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210405776.2A Pending CN103781324A (en) | 2012-10-22 | 2012-10-22 | Heat radiation device and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103781324A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130138262A1 (en) * | 2011-11-28 | 2013-05-30 | International Business Machines Corporation | Heat sink with orientable fins |
| CN113701251A (en) * | 2021-08-30 | 2021-11-26 | 青岛海信日立空调系统有限公司 | Air conditioner |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02265186A (en) * | 1989-04-03 | 1990-10-29 | Mitsubishi Electric Corp | Ic socket with heat sink |
| CN2594987Y (en) * | 2003-01-06 | 2003-12-24 | 威盛电子股份有限公司 | Passive radiator with variable flow direction |
| US6735082B2 (en) * | 2002-08-14 | 2004-05-11 | Agilent Technologies, Inc. | Heatsink with improved heat dissipation capability |
| CN1732566A (en) * | 2002-11-15 | 2006-02-08 | 塞勒斯蒂卡国际公司 | System and method for mounting a heat sink |
| CN101424965A (en) * | 2007-11-02 | 2009-05-06 | 英业达股份有限公司 | Radiator structure |
| CN201555483U (en) * | 2009-11-05 | 2010-08-18 | 纬创资通股份有限公司 | Radiator and radiating fins thereof |
| CN102143672A (en) * | 2010-10-14 | 2011-08-03 | 华为技术有限公司 | Wind guide module and liquid cooling unit |
-
2012
- 2012-10-22 CN CN201210405776.2A patent/CN103781324A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02265186A (en) * | 1989-04-03 | 1990-10-29 | Mitsubishi Electric Corp | Ic socket with heat sink |
| US6735082B2 (en) * | 2002-08-14 | 2004-05-11 | Agilent Technologies, Inc. | Heatsink with improved heat dissipation capability |
| CN1732566A (en) * | 2002-11-15 | 2006-02-08 | 塞勒斯蒂卡国际公司 | System and method for mounting a heat sink |
| CN2594987Y (en) * | 2003-01-06 | 2003-12-24 | 威盛电子股份有限公司 | Passive radiator with variable flow direction |
| CN101424965A (en) * | 2007-11-02 | 2009-05-06 | 英业达股份有限公司 | Radiator structure |
| CN201555483U (en) * | 2009-11-05 | 2010-08-18 | 纬创资通股份有限公司 | Radiator and radiating fins thereof |
| CN102143672A (en) * | 2010-10-14 | 2011-08-03 | 华为技术有限公司 | Wind guide module and liquid cooling unit |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130138262A1 (en) * | 2011-11-28 | 2013-05-30 | International Business Machines Corporation | Heat sink with orientable fins |
| US9507391B2 (en) * | 2011-11-28 | 2016-11-29 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Heat sink with orientable fins |
| CN113701251A (en) * | 2021-08-30 | 2021-11-26 | 青岛海信日立空调系统有限公司 | Air conditioner |
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Application publication date: 20140507 |