CN103606622A - LED integrated-type light source - Google Patents
LED integrated-type light source Download PDFInfo
- Publication number
- CN103606622A CN103606622A CN201310522289.9A CN201310522289A CN103606622A CN 103606622 A CN103606622 A CN 103606622A CN 201310522289 A CN201310522289 A CN 201310522289A CN 103606622 A CN103606622 A CN 103606622A
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- Prior art keywords
- light source
- led
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- heat
- chip
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000007598 dipping method Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000000926 separation method Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000005619 thermoelectricity Effects 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000005424 photoluminescence Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010034703 Perseveration Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED integrated-type light source including a packaging support. The packaging support includes a packaging substrate. The outer wall of the packaging support is provided with a groove. Strip-shaped heat-conducting bonding pads are arranged in the groove. A plurality of chip heat-conducting adhesives are arranged at the bottom face of the groove. LED chips are arranged on the chip heat-conducting adhesives. A leading-wire bonding-pad plate is arranged at each of the two ends in the groove. The LED chips are connected with the leading-wire bonding-pad plates through chip interconnecting wires. The leading-wire bonding-pad plates at the two ends form positive and negative poles of the LED integrated-type light source. The LED integrated-type light source adopts a thermoelectric separation method to arrange the leading-wire bonding-pad plates and the heat-conducting bonding pads, which are independent from each other so that heat energy generated by the LED chips can be transmitted out of the packaging substrate quickly and at the bottom face of the groove, the heat-conducting adhesives are adopted for fast heat conduction so that heat dissipation speed and heat dissipation effect of the LED light source are improved and a problem that the LED integrated-type light source is susceptible to luminance decrease is solved.
Description
Technical field
The present invention relates to a kind of illumination integrated optical source, specifically refer to a kind of LED integrated form light source, belong to semiconductor electronic lighting apparatus field.
Background technology
LED light source has become the indispensable equipment of normal lighting, nowadays from various indicator lights, street lamp, Colour lamp for fastival and holiday, is all extensively adopting LED illumination again to notebook, TV are backlight.
Existing LED light source is that LED chip is arranged on temperature-uniforming plate, temperature-uniforming plate is in a kind of internal volume that utilizes capillarity the molecule of heating power water to be sent to copper coin, to run into cold meeting go into water droplet, the perseveration so going round and beginning again reaches the function of heat conduction, some chips are gone up on samming version surface admittedly, with wiring board made of copper, put again, form chip and in the middle of copper wiring board, stamp loop of gold thread stroke, on copper circuit board, played fluorescent material glue etc. on this space cloth that still has living space after gold thread, but due to general LED support more complicated, relative cost is high, increased the weight of in process of production the cost of manufacturing enterprise, disadvantaged business enterprise long-run development and fast volume production, and this LED light source in use, LED light source directly need be fixed in to directly heat radiation on radiator by samming version, but owing to having minused the medium of support and heat conductive silica gel between LED chip and radiator, affected the useful life of LED heat radiation and light source.
Due to heat dissipation problem, many low-power LED Assembled lamps have all been selected by domestic main flow LED street lamp producer, that makees integrated packaging LED lamp only has several families both at home and abroad, at present various countries are on average for the heat dissipation technology of LED light source, the projects such as luminous intensity distribution is even and shockproof break through, and industry application material is when dispel the heat, often be confined to install heat abstractor additional in lamp outer casing or lampshade, as radiating fin, heat pipe, fan, circuit breaker etc., attempt makes LED heat phenomenon mitigation, yet, the best heat radiation result of general LED light fixture can only be maintained to 65-70 degree, and maintaining 3-6 month just may be because overheated generation light decay phenomenon.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency of the prior art, provide that a kind of radiating rate is fast, the LED integrated form light source of good heat dissipation effect, to solve the problem of the easy light decay of LED integrated form light source.
The object of the invention is to be achieved through the following technical solutions:
A kind of LED integrated form light source, comprise package support, this package support comprises base plate for packaging, described package support outer wall has groove, is provided with the thermal land of strip in described groove, and described groove floor is provided with plural chip heat-conducting glue, described chip heat-conducting glue is provided with LED chip, in described groove, two ends are respectively provided with a lead pad plate, and described LED chip is connected by chip interconnect line with lead pad plate, and the lead pad plate at two ends forms the both positive and negative polarity of LED integrated form light source.The present invention adopts the mode of thermoelectricity separation to split lead pad plate and thermal land, the two is separate, the heat that LED chip produces just can be delivered to outside base plate for packaging fast, and adopt chip heat-conducting glue quick conductive in groove floor, improve radiating rate and the radiating effect of LED light source, solved the problem of the easy light decay of LED integrated form light source.
Concrete, in the bottom surface of described base plate for packaging, be attached with radiating bottom plate.
The inwall of described groove is smooth high reflecting surface, and the bottom electrical of groove is coated with metal level.Groove floor is electroplated high reflecting metal layer, and groove inwall is smooth high reflecting surface, has improved the utilance to LED chip bright dipping, and then improves the luminous efficiency of LED integrated form light source.
In described groove, be filled with the fluorescent material glue-line that covers LED chip.Fluorescent material glue-line by different colours coordinates with LED chip, obtains high-brightness LED light source, and fluorescent material glue-line also makes that LED stability of photoluminescence is high, light decay reduces, and the life-span of light source is extended.
The present invention has the following advantages and beneficial effect compared to existing technology:
The present invention adopts the mode of thermoelectricity separation to split lead pad plate and thermal land, the two is separate, the heat that LED chip produces just can be delivered to outside base plate for packaging fast, and adopt chip heat-conducting glue quick conductive in groove floor, improve radiating rate and the radiating effect of LED light source, solved the problem of the easy light decay of LED integrated form light source.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED integrated form light source of the present invention.
Fig. 2 is the inner sectional structure schematic diagram of LED integrated form light source of the present invention.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited to this.
Embodiment
As shown in Fig. 1～2, the present embodiment provides a kind of LED integrated form light source, comprise package support, this package support comprises base plate for packaging 1, described package support outer wall has groove, in described groove, be provided with the thermal land 2 of strip, described groove 3 bottom surfaces are provided with plural chip heat-conducting glue 3, described chip heat-conducting glue 3 is provided with LED chip 4, in described groove, 3 two ends are respectively provided with a lead pad plate 5, described LED chip 4 is connected by chip interconnect line 6 with lead pad plate 5, between a plurality of LED chips, pass through chip interconnect line serial or parallel connection, the lead pad plate 5 at two ends forms the both positive and negative polarity of LED integrated form light source.The present invention adopts the mode of thermoelectricity separation to split lead pad plate and thermal land, the two is separate, the heat that LED chip produces just can be delivered to outside base plate for packaging fast, and adopt chip heat-conducting glue quick conductive in groove floor, improve radiating rate and the radiating effect of LED light source, solved the problem of the easy light decay of LED integrated form light source.
Concrete, in the bottom surface of described base plate for packaging, be attached with radiating bottom plate 7.Radiating bottom plate has thermal response rates faster, can absorb fast the heat that LED device produces, and LED device junction temperature is controlled in 60 ℃, thereby avoids LED device due to the overheated light decay phenomenon occurring, extends the useful life of LED device.
The inwall of described groove is smooth high reflecting surface, and the bottom electrical of groove is coated with metal level 8.Groove floor is electroplated high reflecting metal layer, and groove inwall is smooth high reflecting surface, has improved the utilance to LED chip bright dipping, and then improves the luminous efficiency of LED integrated form light source.
In described groove, be filled with the fluorescent material glue-line that covers LED chip.Fluorescent material glue-line by different colours coordinates with LED chip, obtains high-brightness LED light source, and fluorescent material glue-line also makes that LED stability of photoluminescence is high, light decay reduces, and the life-span of light source is extended.
Above-described embodiment is preferably execution mode of the present invention; but embodiments of the present invention are not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present invention and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection scope of the present invention.
Claims (4)
1. a LED integrated form light source, comprise package support, this package support comprises base plate for packaging, it is characterized in that, described package support outer wall has groove, in described groove, be provided with the thermal land of strip, described groove floor is provided with plural chip heat-conducting glue, described chip heat-conducting glue is provided with LED chip, in described groove, two ends are respectively provided with a lead pad plate, described LED chip is connected by chip interconnect line with lead pad plate, and the lead pad plate at two ends forms the both positive and negative polarity of LED integrated form light source.
2. LED integrated form light source according to claim 1, is characterized in that, in the bottom surface of described base plate for packaging, is attached with radiating bottom plate.
3. LED integrated form light source according to claim 2, is characterized in that, the inwall of described groove is smooth high reflecting surface, and the bottom electrical of groove is coated with metal level.Groove floor is electroplated high reflecting metal layer, and groove inwall is smooth high reflecting surface, has improved the utilance to LED chip bright dipping, and then improves the luminous efficiency of LED integrated form light source.
4. according to LED integrated form light source described in claim 1-3 any one, it is characterized in that, in described groove, be filled with the fluorescent material glue-line that covers LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310522289.9A CN103606622A (en) | 2013-10-29 | 2013-10-29 | LED integrated-type light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310522289.9A CN103606622A (en) | 2013-10-29 | 2013-10-29 | LED integrated-type light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103606622A true CN103606622A (en) | 2014-02-26 |
Family
ID=50124836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310522289.9A Pending CN103606622A (en) | 2013-10-29 | 2013-10-29 | LED integrated-type light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103606622A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202484A (en) * | 2015-09-04 | 2015-12-30 | 李欣澄 | LED composite full-spectrum light source capable of promoting plant growth |
| CN106683579A (en) * | 2016-12-01 | 2017-05-17 | 长沙信元电子科技有限公司 | Integrated LED display panel |
| CN108662452A (en) * | 2018-05-16 | 2018-10-16 | 木林森股份有限公司 | L ED lamp |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5278432A (en) * | 1992-08-27 | 1994-01-11 | Quantam Devices, Inc. | Apparatus for providing radiant energy |
| CN101707235A (en) * | 2009-11-26 | 2010-05-12 | 河北立德电子有限公司 | High temperature co-firing ceramic package high power integrated LED light source |
| CN102334202A (en) * | 2009-02-27 | 2012-01-25 | 东芝照明技术株式会社 | Light-emitting module and illumination apparatus |
-
2013
- 2013-10-29 CN CN201310522289.9A patent/CN103606622A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5278432A (en) * | 1992-08-27 | 1994-01-11 | Quantam Devices, Inc. | Apparatus for providing radiant energy |
| CN102334202A (en) * | 2009-02-27 | 2012-01-25 | 东芝照明技术株式会社 | Light-emitting module and illumination apparatus |
| CN101707235A (en) * | 2009-11-26 | 2010-05-12 | 河北立德电子有限公司 | High temperature co-firing ceramic package high power integrated LED light source |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202484A (en) * | 2015-09-04 | 2015-12-30 | 李欣澄 | LED composite full-spectrum light source capable of promoting plant growth |
| CN106683579A (en) * | 2016-12-01 | 2017-05-17 | 长沙信元电子科技有限公司 | Integrated LED display panel |
| CN108662452A (en) * | 2018-05-16 | 2018-10-16 | 木林森股份有限公司 | L ED lamp |
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Application publication date: 20140226 |
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| RJ01 | Rejection of invention patent application after publication |