CN103509489B - A kind of low-temperature hot melt adhesive - Google Patents
A kind of low-temperature hot melt adhesive Download PDFInfo
- Publication number
- CN103509489B CN103509489B CN201310401046.XA CN201310401046A CN103509489B CN 103509489 B CN103509489 B CN 103509489B CN 201310401046 A CN201310401046 A CN 201310401046A CN 103509489 B CN103509489 B CN 103509489B
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- China
- Prior art keywords
- add
- low
- hot melt
- melt adhesive
- raw material
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004831 Hot glue Substances 0.000 title claims abstract description 14
- 239000002994 raw material Substances 0.000 claims abstract description 13
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 claims abstract description 8
- 235000019837 monoammonium phosphate Nutrition 0.000 claims abstract description 8
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 7
- 229920001577 copolymer Polymers 0.000 claims abstract description 7
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000004743 Polypropylene Substances 0.000 claims abstract description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 4
- -1 polypropylene Polymers 0.000 claims abstract description 4
- 229920001155 polypropylene Polymers 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- MPPQGYCZBNURDG-UHFFFAOYSA-N 2-propionyl-6-dimethylaminonaphthalene Chemical compound C1=C(N(C)C)C=CC2=CC(C(=O)CC)=CC=C21 MPPQGYCZBNURDG-UHFFFAOYSA-N 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 150000003505 terpenes Chemical class 0.000 claims description 6
- 235000007586 terpenes Nutrition 0.000 claims description 6
- BJZYYSAMLOBSDY-QMMMGPOBSA-N (2s)-2-butoxybutan-1-ol Chemical compound CCCCO[C@@H](CC)CO BJZYYSAMLOBSDY-QMMMGPOBSA-N 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of low-temperature hot melt adhesive, it is made up of the raw material of following weight parts: metallocene ethylene-octene copolymer 40-50, ethylene-ethyl acrylate copolymer 40-50, rosin 6-10, maleic anhydride inoculated polypropylene 6-10, BHT 1-2, Isooctyl acrylate monomer 2-3, atoleine 3-4, ammonium dihydrogen phosphate (ADP) 0.2-0.3, tackifier 7-8; PUR prepared by the present invention has good peel strength and workability in low temperature environment, has good caking property, sealing and stability, and technique is simple, and cost is low.
Description
Technical field
The present invention relates generally to a kind of PUR powder, relates in particular to a kind of low-temperature hot melt adhesive.
Background technology
PUR is a kind of plastic adhesive, and in certain temperature range, its physical state changes with temperature change, and chemical characteristic is constant, and it is nonpoisonous and tasteless, belongs to environmental-protecting chemical product.
Summary of the invention
The object of the invention is just to provide a kind of low-temperature hot melt adhesive.
The present invention is achieved by the following technical solutions:
A kind of low-temperature hot melt adhesive, it is made up of the raw material of following weight parts:
Metallocene ethylene-octene copolymer 40-50, ethylene-ethyl acrylate copolymer 40-50, rosin 6-10, maleic anhydride inoculated polypropylene 6-10, BHT 1-2, Isooctyl acrylate monomer 2-3, atoleine 3-4, ammonium dihydrogen phosphate (ADP) 0.2-0.3, tackifier 7-8;
Described tackifier are made up of the raw material of following weight parts:
Terpene resin 30-40, C5 Petropols 20-30, prodan 3-5, silane resin acceptor kh-550 1-2, ZPT 0.2-0.3, PLA 2-3, PTMG 1-2;
Above-mentioned terpene resin and C5 Petropols Hybrid Heating are arrived to 100-150 DEG C, add prodan, insulated and stirred 10-15 minute, reduction temperature is 70-75 DEG C, add ZPT, fully mix, reduction temperature is 60-65 DEG C, adds silane resin acceptor kh-550,600-800 rev/min of dispersed with stirring 4-6 minute, add the each raw material of residue, fully mix, obtain described tackifier.
A preparation method for low-temperature hot melt adhesive, comprises the following steps:
(1) above-mentioned metallocene ethylene-octene copolymer, ethylene-ethyl acrylate copolymer, rosin, BHT, Isooctyl acrylate monomer, atoleine Hybrid Heating are arrived to 130-200 DEG C, insulated and stirred 30-40 minute;
(2) add tackifier, at 150-200 DEG C, continue insulated and stirred 10-15 minute, add the each raw material of residue, after fully mixing, make film or particle, obtain described low-temperature hot melt adhesive.
Advantage of the present invention is:
PUR prepared by the present invention has good peel strength and workability in low temperature environment, has good caking property, sealing and stability, and technique is simple, and cost is low.
Detailed description of the invention
Embodiment 1
A kind of low-temperature hot melt adhesive, it by following weight parts (kilogram) raw material form:
Metallocene ethylene-octene copolymer 50, ethylene-ethyl acrylate copolymer 50, rosin 10, maleic anhydride inoculated polypropylene 7, BHT 2, Isooctyl acrylate monomer 3, atoleine 3, ammonium dihydrogen phosphate (ADP) 0.3, tackifier 7;
Described tackifier are made up of the raw material of following weight parts:
Terpene resin 40, C5 Petropols 30, prodan 5, silane resin acceptor kh-550 1, ZPT 0.3, PLA 2-3, PTMG 1;
By above-mentioned terpene resin and C5 Petropols Hybrid Heating to 100 DEG C, add prodan, insulated and stirred 15 minutes, reducing temperature is 75 DEG C, add ZPT, fully mix, reducing temperature is 65 DEG C, adds silane resin acceptor kh-550,800 revs/min of dispersed with stirring 6 minutes, add the each raw material of residue, fully mix, obtain described tackifier.
A preparation method for low-temperature hot melt adhesive, comprises the following steps:
(1) by above-mentioned metallocene ethylene-octene copolymer, ethylene-ethyl acrylate copolymer, rosin, BHT, Isooctyl acrylate monomer, atoleine Hybrid Heating to 160 DEG C, insulated and stirred 40 minutes;
(2) add tackifier, at 200 DEG C, continue insulated and stirred 15 minutes, add the each raw material of residue, after fully mixing, make film or particle, obtain described low-temperature hot melt adhesive.
Performance test:
23 DEG C to PE adhesive strength N/cm(>=70): 105;
23 DEG C to epoxy primer steel adhesive strength N/cm(>=70): 104.
Claims (1)
1. a low-temperature hot melt adhesive, is characterized in that what it was made up of the raw material of following weight parts:
Metallocene ethylene-octene copolymer 40-50, ethylene-ethyl acrylate copolymer 40-50, rosin 6-10, maleic anhydride inoculated polypropylene 6-10, BHT 1-2, Isooctyl acrylate monomer 2-3, atoleine 3-4, ammonium dihydrogen phosphate (ADP) 0.2-0.3, tackifier 7-8;
Described tackifier are made up of the raw material of following weight parts:
Terpene resin 30-40, C5 Petropols 20-30, prodan 3-5, silane resin acceptor kh-550 1-2, ZPT 0.2-0.3, PLA 2-3, PTMG 1-2;
Above-mentioned terpene resin and C5 Petropols Hybrid Heating are arrived to 100-150 DEG C, add prodan, insulated and stirred 10-15 minute, reduction temperature is 70-75 DEG C, add ZPT, fully mix, reduction temperature is 60-65 DEG C, adds silane resin acceptor kh-550,600-800 rev/min of dispersed with stirring 4-6 minute, add the each raw material of residue, fully mix, obtain described tackifier;
The preparation method of described low-temperature hot melt adhesive comprises the following steps:
(1) above-mentioned metallocene ethylene-octene copolymer, ethylene-ethyl acrylate copolymer, rosin, BHT, Isooctyl acrylate monomer, atoleine Hybrid Heating are arrived to 130-200 DEG C, insulated and stirred 30-40 minute;
(2) add tackifier, at 150-200 DEG C, continue insulated and stirred 10-15 minute, add the each raw material of residue, after fully mixing, make film or particle, obtain described low-temperature hot melt adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310401046.XA CN103509489B (en) | 2013-09-06 | 2013-09-06 | A kind of low-temperature hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310401046.XA CN103509489B (en) | 2013-09-06 | 2013-09-06 | A kind of low-temperature hot melt adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103509489A CN103509489A (en) | 2014-01-15 |
| CN103509489B true CN103509489B (en) | 2016-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310401046.XA Expired - Fee Related CN103509489B (en) | 2013-09-06 | 2013-09-06 | A kind of low-temperature hot melt adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103509489B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111909637A (en) * | 2020-06-24 | 2020-11-10 | 杭州可靠护理用品股份有限公司 | Low-temperature hot melt adhesive for processing paper diapers and processing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559078A (en) * | 2011-12-28 | 2012-07-11 | 广州鹿山新材料股份有限公司 | Hot melt adhesive membrane for bonding bi-metallic composite plate and preparing method thereof |
| CN103045111A (en) * | 2012-12-25 | 2013-04-17 | 广州鹿山新材料股份有限公司 | Polyester hot melt adhesive for bonding polar polymer with metal |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8197947B2 (en) * | 2009-12-01 | 2012-06-12 | Equistar Chemicals, Lp | Adhesive compositions |
| JP5789382B2 (en) * | 2011-02-25 | 2015-10-07 | ヘンケルジャパン株式会社 | Hot melt adhesive |
| ES2553653T3 (en) * | 2011-04-08 | 2015-12-10 | Bostik, Inc. | Hot melt adhesive based on polyolefin containing a solid plasticizer |
| JP5850682B2 (en) * | 2011-09-16 | 2016-02-03 | ヘンケルジャパン株式会社 | Hot melt adhesive |
-
2013
- 2013-09-06 CN CN201310401046.XA patent/CN103509489B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559078A (en) * | 2011-12-28 | 2012-07-11 | 广州鹿山新材料股份有限公司 | Hot melt adhesive membrane for bonding bi-metallic composite plate and preparing method thereof |
| CN103045111A (en) * | 2012-12-25 | 2013-04-17 | 广州鹿山新材料股份有限公司 | Polyester hot melt adhesive for bonding polar polymer with metal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103509489A (en) | 2014-01-15 |
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| C06 | Publication | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20160510 Address after: 241200 Anhui city of Wuhu province Fanchang County Economic and Technological Development Zone Beisi entrepreneurial Science Park Patentee after: Fanchang Beisi Productivity Promotion Center Co., Ltd. Address before: 241200 Anhui city of Wuhu province Fanchang County Economic Development Zone Science and technology park business times thinking Patentee before: Wuhu City Zheng Tong Electric Appliance Equipment Co., Ltd |
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| CB03 | Change of inventor or designer information |
Inventor after: Liu Haifeng Inventor before: Wu Shunbao |
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| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180425 Address after: 510000 Guangzhou, Liwan District, Guangdong Province, South China Street, Hailong Road, 36, Mount Huang Gang hill, 8 two. Patentee after: Guangzhou Ke BondA Plastic Co., Ltd. Address before: 241200 Anhui County Wuhu City Fanchang County Economic and Technological Development Zone Bi Si pioneering science and Technology Park Patentee before: Fanchang Beisi Productivity Promotion Center Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20190906 |
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| CF01 | Termination of patent right due to non-payment of annual fee |