CN103105084B - The composition structure of heat pipe and capillary structure thereof - Google Patents
The composition structure of heat pipe and capillary structure thereof Download PDFInfo
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- CN103105084B CN103105084B CN201110354422.5A CN201110354422A CN103105084B CN 103105084 B CN103105084 B CN 103105084B CN 201110354422 A CN201110354422 A CN 201110354422A CN 103105084 B CN103105084 B CN 103105084B
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Abstract
The present invention is the composition structure of a kind of heat pipe and capillary structure thereof, heat pipe comprises heat pipe body, capillary structure and working fluid, heat pipe body has internal face, capillary structure is combined on internal face, capillary structure comprises the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights, the particle diameter of the first capillary powder is less than the particle diameter of the second capillary powder, working fluid is filled in heat pipe body, wherein, first capillary powder and the second capillary powder Homogeneous phase mixing, and sintering is in heat pipe inner wall face, the task performance that heat pipe reaches maximum can be made accordingly, to remove the heat energy that electronic component produces fast.
Description
Technical field
The present invention is relevant with heat pipe structure, relates to a kind of capillary tissue structure of heat pipe especially.
Background technology
General heat pipe (Heat pipe) is made up of copper pipe, capillary structure (capillary wick) and the working fluid (working fluid) be sealed in pipe.Its occupation mode is the surface heating end of heat pipe being attached at heat-generating electronic elements, when heating end inside working fluid absorb heat and vaporize time vapour pressure can be made to increase gradually, and towards pressure low colling end flowing to form vapor stream; On the other hand, when steam regelation can become liquid form after colling end release heat, heating end is back to again, the action gone round and begun again by the working fluid of inside heat pipe, promptly to be removed fast by the heat energy that electronic component produces via capillary structure.
But, because electronic installation now requires day by day frivolous in order to carrying, therefore also need frivolous and lightweight with it for the heat pipe that dispels the heat, therefore, how to utilize frivolous heat pipe, make it reach maximum task performance, be the research motivation of inventor.
Hold, service behaviour due to heat pipe can be subject to the impact of capillary pressure difference and backflow resistance two factor, this two factor changes along with the pore size of capillary structure, when hole is less, its capillary pressure difference is larger, coagulating liq can be ordered about to enter in capillary structure and to reflux to evaporation ends, but, when capillary porosity is less, frictional force and the viscous force of the backflow of its hydraulic fluid increase, namely hydraulic fluid backflow resistance increases, and causes hydraulic fluid back-flow velocity slow, easily makes heat pipe in evaporation ends generation dry combustion method phenomenon; In like manner, when capillary porosity is larger, although hydraulic fluid is subject to less backflow resistance, the capillary pressure difference that coagulating liq is sucked in capillary structure reduces, and reduces hydraulic fluid capacity of returns, heat pipe also can be made in evaporation ends generation dry combustion method phenomenon.
Summary of the invention
An object of the present invention, is the composition structure providing a kind of heat pipe capillary structure, can makes the task performance that heat pipe reaches maximum, to remove the heat energy that electronic component produces fast.
In order to reach above-mentioned object, the present invention is a kind of composition structure of heat pipe capillary structure, comprise one first capillary powder and one second capillary powder, first capillary powder diameter is below 100 sieve meshes, and the first capillary powder accounts for 30 percentage by weights of capillary structure, and the second capillary powder diameter is between 80 sieve mesh to 100 sieve meshes, second capillary powder accounts for 70 percentage by weights of capillary structure, wherein, the first capillary powder and the second capillary powder Homogeneous phase mixing, and sintering is at the internal face of heat pipe.
In order to reach above-mentioned object, the present invention is a kind of composition structure of heat pipe capillary structure, comprise the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights, the particle diameter of this first capillary powder is less than the particle diameter of the second capillary powder, this the first capillary powder and this second capillary powder Homogeneous phase mixing, and sintering is at the internal face of heat pipe.
In order to reach above-mentioned object, the present invention is a kind of heat pipe, comprise heat pipe body, capillary structure and working fluid, heat pipe body has an internal face, capillary structure is combined on internal face, capillary structure comprises the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights, the particle diameter of the first capillary powder is less than the particle diameter of the second capillary powder, and the first capillary powder and the second capillary powder Homogeneous phase mixing, and sintering is at the internal face of heat pipe, working fluid is filled in heat pipe body, and infiltrates between capillary structure.
Another object of the present invention, be the composition structure that a kind of heat pipe capillary structure is provided, its the first capillary powder accounts for 30 percentage by weights of capillary structure, second capillary powder diameter is then about 70 percentage by weights, ratio according to this, under most economical cost viewpoint, the task performance that heat pipe reaches best can be made.
Compared to known technology, capillary structure of the present invention comprises the first capillary powder (fine powder) and the second capillary powder (meal), form according to certain particle size and percentage by weight (the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights) Homogeneous phase mixing, under this ratio, suitable pore size can be formed between first capillary powder and the second capillary powder, preferably balance to obtain under two kinds of factors of capillary pressure and backflow resistance, make the task performance that working fluid (heat pipe) reaches best; Moreover, because the task performance of heat pipe is not along with the percentage by weight of the second capillary powder is directly proportional, when the percentage by weight of the second capillary powder is higher than 70 percentage by weight, the task performance of heat pipe does not improve along with the raising of the percentage by weight of the second capillary powder, but the cost of heat pipe is increased on the contrary, therefore, the present invention under most economical cost viewpoint, can make the task performance that heat pipe reaches best.
Accompanying drawing explanation
Fig. 1 is the Pou Shi Tu ﹔ of heat pipe of the present invention
Fig. 2 is the Fang large Shi Yi Tu ﹔ of capillary structure of the present invention
Fig. 3 is the comparison diagram of the radiating effect of heat pipe of the present invention and other heat pipes.
Main element symbol description:
1 heat pipe
10 heat pipe body 11 internal face 20 capillary structure 21 first capillary powder
22 second capillary powder 30 working fluids.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the invention will be further described, can better understand the present invention and can be implemented, but illustrated embodiment is not as a limitation of the invention to make those skilled in the art.
Please refer to Fig. 1 and Fig. 2, be respectively the sectional view of heat pipe of the present invention and the enlarged diagram of capillary structure; Heat pipe 1 of the present invention comprises a heat pipe body 10, capillary structure 20 and working fluid 30.This capillary structure 20 is combined on the internal face 11 of this heat pipe body 10, and this working fluid 30 is filled in this heat pipe body 10.
This heat pipe body 10 is made by the good material of thermal conductivity, and as aluminium, copper etc., and the internal face of this heat pipe body 10 is pasted with capillary structure 20, and this working fluid 30 injects in this heat pipe body 10, and infiltrate between capillary structure 20.
In the present embodiment, the unit of this capillary structure 20 is " sieve mesh " (mesh, sieve mesh, screen mesh), the i.e. number of sieve aperture that has of sieve unit are, also can be called for short " order ", the sieve mesh of the multiplex standard screen of industry represents the particle size of the powder by standard sieve, sieve mesh is less, represents that particle diameter is larger.
This capillary structure 20 comprises one first capillary powder 21 and one second capillary powder 22.The particle diameter of this first capillary powder 21 is less than the particle diameter of the second capillary powder 22.This first capillary powder 21 and this second capillary powder 22 Homogeneous phase mixing, and sintering is at the internal face 11 of this heat pipe body 10.Preferably, this capillary structure 20 comprises the second capillary powder 22 of the first capillary powder 21 and 70 percentage by weight of 30 percentage by weights.
Illustrate in greater detail the composition structure of this capillary structure 20.The particle diameter (fine powder) below 100 sieve meshes of this first capillary powder 10, and this first capillary powder 21 accounts for 30 percentage by weights of this capillary structure 20, in addition, the particle diameter of this second capillary powder 22 is between 80 sieve mesh to 100 sieve meshes (meal), and this second capillary powder 22 accounts for 70 percentage by weights of this capillary structure 20.
This first capillary powder 21 and this second capillary powder 22 are identical material, and in the present embodiment, this first capillary powder 21 and the second capillary powder 22 are all copper powder.
Continue referring to Fig. 3, it is the comparison diagram of the radiating effect of heat pipe of the present invention and other heat pipes; In figure, straight line A, B, C represent heat pipe A, heat pipe B and heat pipe C respectively and carry out for different wattage light fixture rear measured Temperature numerical of dispelling the heat, wherein, heat pipe A, heat pipe B and the heat pipe C heat pipe for being made up of the first capillary powder 21 and the second capillary powder 22 of Different Weight percentage.Straight line A is heat pipe A of the present invention, and this heat pipe A comprises the second capillary powder 22 of the first capillary powder 21 and 70 percentage by weight of 30 percentage by weights; Moreover this heat pipe B comprises the second capillary powder 22 of the first capillary powder 21 and 55 percentage by weight of 45 percentage by weights; This heat pipe C then comprises the second capillary powder 22 of the first capillary powder 21 and 45 percentage by weight of 55 percentage by weights.
As can be seen from Figure 3, the lamp temperatures that straight line A is lower measured by under the light fixture of different wattage, display uses heat pipe A of the present invention can obviously have preferably radiating effect, that is, at identical conditions, the composition structure of the capillary structure 20 of heat pipe A can reach maximum task performance to other heat pipes.
The above embodiment is only that protection scope of the present invention is not limited thereto in order to absolutely prove the preferred embodiment that the present invention lifts.The equivalent alternative or conversion that those skilled in the art do on basis of the present invention, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (6)
1. a composition structure for heat pipe capillary structure, is characterized in that, comprising:
One first capillary powder, its particle diameter is below 100 sieve meshes, and this first capillary powder accounts for 30 percentage by weights of described capillary structure; And
One second capillary powder, its particle diameter is between 80 sieve mesh to 100 sieve meshes, and this second capillary powder accounts for 70 percentage by weights of described capillary structure;
Wherein, this first capillary powder and this second capillary powder Homogeneous phase mixing, and sintering is at the internal face of described heat pipe.
2. the composition structure of heat pipe capillary structure as claimed in claim 1, it is characterized in that, this first capillary powder and this second capillary powder are identical material.
3. the composition structure of heat pipe capillary structure as claimed in claim 2, it is characterized in that, this first capillary powder and this second capillary powder are copper powder.
4. a heat pipe, is characterized in that, comprises:
One heat pipe body, has an internal face;
One capillary structure, be combined on this internal face, this capillary structure comprises the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights, the particle diameter of this first capillary powder is less than the particle diameter of the second capillary powder, the particle diameter of this first capillary powder is below 100 sieve meshes, the particle diameter of this second capillary powder is between 80 sieve mesh to 100 sieve meshes, and this first capillary powder and this second capillary powder Homogeneous phase mixing, and sintering is at this internal face; And
One working fluid, fills in this heat pipe body, and infiltrates between capillary structure.
5. heat pipe as claimed in claim 4, it is characterized in that, this first capillary powder and the second capillary powder are identical material.
6. heat pipe as claimed in claim 5, it is characterized in that, this first capillary powder and the second capillary powder are copper powder.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110354422.5A CN103105084B (en) | 2011-11-10 | 2011-11-10 | The composition structure of heat pipe and capillary structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110354422.5A CN103105084B (en) | 2011-11-10 | 2011-11-10 | The composition structure of heat pipe and capillary structure thereof |
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| CN103105084A CN103105084A (en) | 2013-05-15 |
| CN103105084B true CN103105084B (en) | 2015-08-12 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111761050B (en) * | 2019-04-01 | 2022-06-03 | 广州力及热管理科技有限公司 | Method for manufacturing capillary structure by using metal slurry |
| CN111531165A (en) * | 2020-05-12 | 2020-08-14 | 江苏集萃先进金属材料研究所有限公司 | Copper paste for ultrathin phase-change heat dissipation module |
| CN112484545A (en) * | 2020-12-01 | 2021-03-12 | 奇鋐科技股份有限公司 | Thin two-phase flow device |
| US11732974B2 (en) | 2021-01-06 | 2023-08-22 | Asia Vital Components Co., Ltd. | Thin-type two-phase fluid device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2773601Y (en) * | 2005-02-17 | 2006-04-19 | 徐惠群 | Multi-layer capillary tissue of hot pipe |
| CN1808044A (en) * | 2005-01-22 | 2006-07-26 | 富准精密工业(深圳)有限公司 | Sintering type heat pipe and manufacturing method thereof |
| CN1961191A (en) * | 2004-04-21 | 2007-05-09 | 热力公司 | Heat transfer device and method of making same |
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- 2011-11-10 CN CN201110354422.5A patent/CN103105084B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1961191A (en) * | 2004-04-21 | 2007-05-09 | 热力公司 | Heat transfer device and method of making same |
| CN1808044A (en) * | 2005-01-22 | 2006-07-26 | 富准精密工业(深圳)有限公司 | Sintering type heat pipe and manufacturing method thereof |
| CN2773601Y (en) * | 2005-02-17 | 2006-04-19 | 徐惠群 | Multi-layer capillary tissue of hot pipe |
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| CN103105084A (en) | 2013-05-15 |
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