CN102593106A - Protective device for preventing packaged sample from being damaged by static electricity - Google Patents
Protective device for preventing packaged sample from being damaged by static electricity Download PDFInfo
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- CN102593106A CN102593106A CN2012100473881A CN201210047388A CN102593106A CN 102593106 A CN102593106 A CN 102593106A CN 2012100473881 A CN2012100473881 A CN 2012100473881A CN 201210047388 A CN201210047388 A CN 201210047388A CN 102593106 A CN102593106 A CN 102593106A
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- protective device
- upper shield
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- static electricity
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Abstract
The invention discloses a protective device for preventing a packaged sample from being damaged by static electricity. The protective device comprises a sleeve cover, wherein an open pore is formed in the center of the sleeve cover, two sides of the sleeve cover are downwards bent to form sleeve feet, and the sleeve cover is used for covering the upper surface of a packaging base. According to the protective device for preventing the packaged sample from being damaged by the static electricity, the generation of static electricity in a detected sample is effectively inhibited; and meanwhile, the static electricity generated in the packaging process can be safely introduced outside the packaging substrate, thus the detected sample in a package can be prevented from being damaged by static electricity discharge, and the yield of the packaged sample is increased.
Description
Technical field
The present invention relates to a kind of protective device, relate in particular to and a kind ofly be used to prevent that packaged sample is by the protective device of electrostatic damage.
Background technology
Rapid emerge current of high technology industries such as electronics, communication, Aero-Space, especially electronic product such as electronic instruments and equipment miniaturization day by day, multi-functional and intelligent.High density integrated circuit has become electronics industry to not conforming to the device that lacks in the above-mentioned requirements.This device has that distance between centers of tracks is short, line is thin, integrated level is high, fast operation, low-power and the high characteristics of input impedance.Thereby cause this type device more and more responsive to static.
In China, because of the loss that static causes also very serious.People have fully recognized the harm that static brings for electronic device; And depend on grasp and understand the relevance of static and environmental condition and the rule that static takes place, taked the control of in process of production static being eliminated.But, at present at sample, in the process of test for device reliability experiment usefulness; Do not require electrostatic discharge protective circuit, in encapsulation and follow-up preservation, using, the destruction that all is easy to receive static; Cause the sample fails rate too high, seriously increase the cost and the reliability of reliability testing.
As shown in Figure 1, when static directly contacts the sample 1 of experiment usefulness, having no under the situation of protection the static can only be, thereby damaging sample 1 through sample 1 conduction to be tested.
Summary of the invention
Disclosure of the Invention a kind ofly be used to prevent that packaged sample is by the protective device of electrostatic damage.When in order to solve in the prior art device reliability test, in encapsulation and follow-up preservation, use, the destruction that all is easy to receive static causes the sample fails rate too high, seriously increases the cost and the reliability of reliability testing.
For realizing above-mentioned purpose, the technical scheme that invention is adopted is:
A kind ofly be used to prevent that packaged sample from by the protective device of electrostatic damage, comprising: comprise a upper shield, wherein, said upper shield center is provided with perforate, and said upper shield both sides turn down downwards and form the cover pin, and said upper shield is used to be covered in the upper surface of encapsulation base.
Above-mentioned protective device, wherein, said encapsulation base upper surface is provided with chip, and said chip is aimed in said perforate in vertical direction, and the planar dimension area of said perforate is greater than said area of chip.
Above-mentioned protective device, wherein, the both sides of said encapsulation base are provided with vertically downward the pin that extends, and the cover pin of said upper shield both sides is used to be clipped in the outside of the pin of said encapsulation base both sides.
Above-mentioned protective device, wherein, upper shield is made up of electric conducting material.
Above-mentioned protective device wherein, when said upper shield is covered in the top of encapsulation base, is bonded to the lead-in wire of the metal pad utilization on the said chip on the pin pad on the encapsulation base upper surface through said perforate
A kind ofly among the present invention be used to prevent packaged sample by the protective device of electrostatic damage, having adopted as above, scheme has following effect:
1, suppresses the generation of static in the sample effectively;
2, can draw outside the base plate for packaging simultaneously, thereby make sample in the encapsulation can avoid the destruction of static discharge, with the rate of good of raising encapsulating products to the electrostatic safety ground that in encapsulation process, is produced.
Description of drawings
Through the detailed description that reading is done non-limiting example with reference to following accompanying drawing, the further feature of invention, it is more obvious that purpose and advantage will become.
The sketch map of Fig. 1 for conducting during static contact measured test agent under the regular situation;
Fig. 2 is used to prevent that for a kind of packaged sample is by the upper shield sketch map of the protective device of electrostatic damage;
Fig. 3 is used to prevent that for a kind of packaged sample is by the pedestal sketch map of the protective device of electrostatic damage;
Fig. 4 is used to prevent that for a kind of packaged sample is by the sketch map of the protective device of electrostatic damage
The sketch map of conduction static when Fig. 5 is static contact protection device.
Reference diagram preface: sample 1, encapsulation base 2, chip 3, pin 4, upper shield 5, cover pin 6, perforate 7.
Embodiment
For technological means that invention is realized, create characteristic, reach purpose and effect and be easy to understand and understand that following combinations specifically illustrates, and further sets forth the present invention.
Like Fig. 2, shown in 3, in specific embodiment of the present invention, a kind ofly be used to prevent that packaged sample is by the protective device of electrostatic damage; Comprise: a upper shield 5, wherein, the center of upper shield 5 is provided with perforate 7; Upper shield 5 both sides turn down downwards and form cover pin 6, and upper shield 5 is used to be covered in the upper surface of encapsulation base 2.Further, the center of the upper surface in this encapsulation base 2 is provided with chip 3, and the both sides of encapsulation base 2 are erect downwards and are equipped with many pins 4, and the spacing between each pin 4 equates.
Further, 5 of upper shields be provided with perforate 7 in vertical direction in alignment with pedestal on the position of chip 3, the planar dimension area of perforate 7 greater than chip 3 area, above upper shield 5 is covered in encapsulation base 2 time, chip 3 exposes from perforate 7.Further; In specific embodiment of the present invention; After above being covered in encapsulation base 2 when upper shield 5; Through perforate 7 metal pad on the chip 3 (signal or electrode terminal are metal pad I/O PAD) is utilized on the pin pad on lead-in wire (WIRE) bonding (Bonding) to the encapsulation base upper surface (the pin pad is to be electrically connected on the pin that is positioned at the encapsulation base both sides in fact).
Further, after upper shield 5 was covered in encapsulation base 2, the cover pin 6 of upper shield 5 both sides was used to be clipped in the outside of the pin of encapsulation base both sides, further, cover pin 6 is covered in pedestal and is connected with the junction of pin 4 and with pin 4,
Further, when upper shield 5 is covered in the top of encapsulation base 2, the lead-in wire of the metal pad utilization on the chip 3 is bonded to (not shown) on the pin pad on encapsulation base 2 upper surfaces through perforate 7.
Like Fig. 4, shown in 5, in specific embodiment of the present invention, after pedestal is loaded onto upper shield 5; If generation static, then static can preferentially contact upper shield 5, and static is passed to the pin 4 that is connected by upper shield 5; Thereby the destruction that the direct ground connection of static avoids specimen before test, to receive static, further, finish encapsulation when pedestal after; Just will cover cover 5 and be placed on the encapsulation base 2, again metal pad and pin pad in the chip 3 in the perforate 7 carried out routing, carry out the upper plate operation afterwards; Before getting into testing process, taking off lid cover 5, encapsulation base 2 is tested.
In sum, invent and a kind ofly be used to prevent that packaged sample from by the protective device of electrostatic damage, suppressing the generation of static in the sample effectively; Can draw outside the base plate for packaging simultaneously, thereby make sample in the encapsulation can avoid the destruction of static discharge, with the rate of good of raising encapsulating products the electrostatic safety ground that in encapsulation process, is produced.
More than to the invention specific embodiment be described.It will be appreciated that invention is not limited to above-mentioned specific implementations, equipment of wherein not describing in detail to the greatest extent and structure are construed as with the common mode in this area to be implemented; Those skilled in the art can make various distortion or modification within the scope of the claims, and this does not influence the essence of an invention content.
Claims (5)
1. one kind is used to prevent that packaged sample from by the protective device of electrostatic damage, comprising a upper shield, it is characterized in that said upper shield center is provided with perforate, and said upper shield both sides turn down downwards and form the cover pin, and said upper shield is used to be covered in the upper surface of encapsulation base.
2. protective device according to claim 1 is characterized in that, said encapsulation base upper surface is provided with chip, and said chip is aimed in said perforate in vertical direction, and the planar dimension area of said perforate is greater than said area of chip.
3. protective device according to claim 1 is characterized in that, the both sides of said encapsulation base are provided with vertically downward the pin that extends, and the cover pin of said upper shield both sides is used to be clipped in the outside of the pin of said encapsulation base both sides.
4. protective device according to claim 1 is characterized in that upper shield is made up of electric conducting material.
5. protective device according to claim 1 is characterized in that, when said upper shield is covered in the top of encapsulation base, through said perforate the lead-in wire of the metal pad utilization on the said chip is bonded on the pin pad on the encapsulation base upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100473881A CN102593106A (en) | 2012-02-28 | 2012-02-28 | Protective device for preventing packaged sample from being damaged by static electricity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100473881A CN102593106A (en) | 2012-02-28 | 2012-02-28 | Protective device for preventing packaged sample from being damaged by static electricity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102593106A true CN102593106A (en) | 2012-07-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100473881A Pending CN102593106A (en) | 2012-02-28 | 2012-02-28 | Protective device for preventing packaged sample from being damaged by static electricity |
Country Status (1)
| Country | Link |
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| CN (1) | CN102593106A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104443840A (en) * | 2014-10-15 | 2015-03-25 | 苏州速腾电子科技有限公司 | Locating piece fixture for chip storage and transportation jig |
| CN106549006A (en) * | 2016-10-26 | 2017-03-29 | 上海华力微电子有限公司 | Electrostatic discharge protection circuit and test installation method for package level reliability testing |
| CN114639671A (en) * | 2022-02-28 | 2022-06-17 | 广东汇芯半导体有限公司 | ESD protection module and ESD protection assembly |
| CN116435219A (en) * | 2023-04-03 | 2023-07-14 | 津日科技(无锡)有限公司 | Chip packaging device capable of preventing static damage |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2065795U (en) * | 1989-10-11 | 1990-11-14 | 孙万杰 | Static electricity proof device for mos ic |
| TW463360B (en) * | 1998-07-16 | 2001-11-11 | Winbond Electronics Corp | Electrostatic protection structure of chip |
| CN1713380A (en) * | 2004-06-25 | 2005-12-28 | 台湾积体电路制造股份有限公司 | Electrostatic discharge (ESD) protection for integrated circuit packages |
| US20100001394A1 (en) * | 2008-07-03 | 2010-01-07 | Promos Technologies Inc. | Chip package with esd protection structure |
-
2012
- 2012-02-28 CN CN2012100473881A patent/CN102593106A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2065795U (en) * | 1989-10-11 | 1990-11-14 | 孙万杰 | Static electricity proof device for mos ic |
| TW463360B (en) * | 1998-07-16 | 2001-11-11 | Winbond Electronics Corp | Electrostatic protection structure of chip |
| CN1713380A (en) * | 2004-06-25 | 2005-12-28 | 台湾积体电路制造股份有限公司 | Electrostatic discharge (ESD) protection for integrated circuit packages |
| US20100001394A1 (en) * | 2008-07-03 | 2010-01-07 | Promos Technologies Inc. | Chip package with esd protection structure |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104443840A (en) * | 2014-10-15 | 2015-03-25 | 苏州速腾电子科技有限公司 | Locating piece fixture for chip storage and transportation jig |
| CN106549006A (en) * | 2016-10-26 | 2017-03-29 | 上海华力微电子有限公司 | Electrostatic discharge protection circuit and test installation method for package level reliability testing |
| CN106549006B (en) * | 2016-10-26 | 2019-12-24 | 上海华力微电子有限公司 | Electrostatic protection circuit for package-level reliability test and test installation method |
| CN114639671A (en) * | 2022-02-28 | 2022-06-17 | 广东汇芯半导体有限公司 | ESD protection module and ESD protection assembly |
| CN116435219A (en) * | 2023-04-03 | 2023-07-14 | 津日科技(无锡)有限公司 | Chip packaging device capable of preventing static damage |
| CN116435219B (en) * | 2023-04-03 | 2024-04-12 | 津日科技(无锡)有限公司 | Chip packaging device capable of preventing static damage |
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Application publication date: 20120718 |