CN102573272A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN102573272A CN102573272A CN2010105988902A CN201010598890A CN102573272A CN 102573272 A CN102573272 A CN 102573272A CN 2010105988902 A CN2010105988902 A CN 2010105988902A CN 201010598890 A CN201010598890 A CN 201010598890A CN 102573272 A CN102573272 A CN 102573272A
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- CN
- China
- Prior art keywords
- signal transmission
- differential signal
- circuit board
- printed circuit
- difference signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structure Of Printed Boards (AREA)
Abstract
A printed circuit board comprises a first signal layer and a second signal layer. A first pair of difference signal transmission lines are arranged on the first signal layer; a second pair of difference signal transmission lines are arranged on the second signal layer; the first pair of difference signal transmission lines comprise a first positive pole difference signal transmission line and a negative pole difference signal transmission line; the second pair of the difference signal transmission lines comprise a second positive pole difference signal transmission line and a second negative pole difference signal transmission line; the first positive pole difference signal transmission line is electrically connected with the second negative pole difference signal transmission line via a first through-hole; the first negative difference signal transmission line is electrically connected with the second positive difference transmission line via a second through-hole; and the central line of the first and the second through-holes form an acute angle with the surface of the printed circuit board. By adopting the printed circuit board provided by the invention, the wiring workload of the difference signal transmission line is lowered.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB).
Background technology
In order to connect the cabling between the different layers, usually perforation can be set between each layer of printed circuit board (PCB), the perforation 1 all with each layer vertical (referring to Fig. 1) of design at present between two-layer.When the differential signal on the circuit board being carried out polarity exchange wiring; Usually the mode of taking is exactly that a pair of differential signal line 3 on the signals layer is connected to the differential signal line 2 on another signals layer through this perforation 1; The positive level differential signal line 31 that is about to this signals layer is connected to the negative pole differential signal line 22 of another signals layer through a perforation 1 wherein; The negative level differential signal line 32 of this signals layer is connected to the anodal differential signal line 21 of another signals layer through another perforation 1; But this mode usually in order to satisfy the isometric demand of differential signal line, the situation like Fig. 1 demonstration occurs, and promptly wherein a differential signal line 21 needs curved shape wiring so that differential signal line 21 is isometric with another differential signal line 22; So not only increase the workload of wiring, also influenced the quality of signal transmission.
Summary of the invention
In view of foregoing, be necessary to provide a kind of printed circuit board (PCB) with inclination perforation.
A kind of printed circuit board (PCB); Comprise one first signals layer and a secondary signal layer; Said first signals layer is provided with one first pair of differential signal transmission; Said secondary signal layer is provided with one second pair of differential signal transmission; Said first pair of differential signal transmission comprises one first anodal differential signal transmission and one first negative pole differential signal transmission; Said second pair of differential signal transmission comprises one second anodal differential signal transmission and one second negative pole differential signal transmission; The said first anodal differential signal transmission is electrical connected through one first perforation and the said second negative pole differential signal transmission, and the said first negative pole differential signal transmission is electrical connected through one second perforation and the said second anodal differential signal transmission, all is an acute angle between the center line of said first and second perforation and the surface of said printed circuit board (PCB).
First and second perforation in the above-mentioned printed circuit board (PCB) and center line be an acute angle with the surface of said printed circuit board (PCB) respectively, thereby avoid occurring the curved shape wiring of one of a pair of differential signal transmission, reduced the workload of wiring.
Description of drawings
Combine preferred embodiments that the present invention is described in further detail with reference to the accompanying drawings:
Fig. 1 carries out the sketch map that polarity is exchanged wiring for differential signal on the existing printed circuit board (PCB).
Fig. 2 is the sketch map of printed circuit board (PCB) preferred embodiments of the present invention.
Fig. 3 is the schematic cross-section of printed circuit board (PCB) preferred embodiments of the present invention.
The main element symbol description
Anodal differential signal line 21,31
Negative pole differential signal line 22,32
First pair of differential signal transmission 12
The first anodal differential signal transmission 122
The first negative pole differential signal transmission 124
Second pair of differential signal transmission 32
The second anodal differential signal transmission 322
The second negative pole differential signal transmission 324
Printed circuit board (PCB) 100
Embodiment
Please refer to Fig. 2, the preferred embodiments of printed circuit board (PCB) 100 of the present invention comprises first signals layer 10, secondary signal layer 30 and is arranged at the dielectric layer 20 between this first and second signals layer 10 and 30.This first signals layer 10 is provided with first pair of differential signal transmission 12.This secondary signal layer 30 is provided with second pair of differential signal transmission 32.Said first pair of differential signal transmission 12 comprises one first anodal differential signal transmission 122 and one first negative pole differential signal transmission 124.Said second differential signal transmission 32 comprises one second anodal differential signal transmission 322 and one second negative pole differential signal transmission 324.The said first anodal differential signal transmission 122 is electrical connected with the said second negative pole differential signal transmission 324 through one first perforation 40.The said first negative pole differential signal transmission 124 is electrical connected with the said second anodal differential signal transmission 322 through one second perforation 50, and promptly said first pair of differential signal transmission 12 exchanged wiring with said second pair of differential signal transmission 32 for polarity.
Please in the lump with reference to figure 3, the center line 42 of said first perforation 40 and said printed circuit board (PCB) 100 to the surface between become one first acute angle, theta.Be one second acute angle (not shown) between the surface of the center line of said second perforation 50 and said printed circuit board (PCB) 100.Line between first and second perforation 40 and 50 on the said secondary signal layer 30 in the upright projection on said first signals layer 10 perpendicular to first and second perforation 40 on said first signals layer 10 and 50 line.
Printed circuit board (PCB) 100 of the present invention is electrical connected through said first perforation 40 the said first anodal differential signal transmission 122 when differential signal being carried out polarity exchange wiring with the said second negative pole differential signal transmission 324; The said first negative pole differential signal transmission 124 is electrical connected with the said second anodal differential signal transmission 322 through said second perforation 50; And the center line 42 and 52 of said first and second perforation 40 and 50 is respectively and be said first and second acute angle between the surface of said printed circuit board (PCB) 100, and the line between first and second perforation 40 and 50 on the said secondary signal layer 30 in the upright projection on said first signals layer 10 perpendicular to first and second perforation 40 on said first signals layer 10 and 50 line.Avoid occurring curved shape wiring one of in a pair of differential signal transmission has been reduced the workload of wiring.
Claims (2)
1. printed circuit board (PCB); Comprise one first signals layer and a secondary signal layer; Said first signals layer is provided with one first pair of differential signal transmission; Said secondary signal layer is provided with one second pair of differential signal transmission; Said first pair of differential signal transmission comprises one first anodal differential signal transmission and one first negative pole differential signal transmission; Said second pair of differential signal transmission comprises one second anodal differential signal transmission and one second negative pole differential signal transmission; The said first anodal differential signal transmission is electrical connected through one first perforation and the said second negative pole differential signal transmission, and the said first negative pole differential signal transmission is electrical connected through one second perforation and the said second anodal differential signal transmission, all is an acute angle between the center line of said first and second perforation and the surface of said printed circuit board (PCB).
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that: the line between first and second perforation on the said secondary signal layer in the upright projection on said first signals layer perpendicular to the line between first and second perforation on said first signals layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105988902A CN102573272A (en) | 2010-12-21 | 2010-12-21 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105988902A CN102573272A (en) | 2010-12-21 | 2010-12-21 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102573272A true CN102573272A (en) | 2012-07-11 |
Family
ID=46417385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105988902A Pending CN102573272A (en) | 2010-12-21 | 2010-12-21 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102573272A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188266A (en) * | 2015-08-27 | 2015-12-23 | 浪潮电子信息产业股份有限公司 | Dual-mode high-speed signal line three-dimensional wiring method |
| CN106572588A (en) * | 2015-10-09 | 2017-04-19 | 鸿富锦精密工业(武汉)有限公司 | Printed circuit board |
| CN107864561A (en) * | 2017-11-10 | 2018-03-30 | 郑州云海信息技术有限公司 | A kind of method that coiling compensates in new via through holes |
| CN108401363A (en) * | 2017-02-07 | 2018-08-14 | 扬智科技股份有限公司 | Board structure of circuit |
| CN108770189A (en) * | 2018-07-12 | 2018-11-06 | 合肥联宝信息技术有限公司 | A kind of differential lines method for winding |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050251777A1 (en) * | 2004-05-05 | 2005-11-10 | International Business Machines Corporation | Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias |
| TW200913817A (en) * | 2007-09-04 | 2009-03-16 | Inventec Corp | System of designing through-hole region for differential signal line and method of the same |
| US7705246B1 (en) * | 2007-12-28 | 2010-04-27 | Emc Corporation | Compact differential signal via structure |
-
2010
- 2010-12-21 CN CN2010105988902A patent/CN102573272A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050251777A1 (en) * | 2004-05-05 | 2005-11-10 | International Business Machines Corporation | Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias |
| TW200913817A (en) * | 2007-09-04 | 2009-03-16 | Inventec Corp | System of designing through-hole region for differential signal line and method of the same |
| US7705246B1 (en) * | 2007-12-28 | 2010-04-27 | Emc Corporation | Compact differential signal via structure |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188266A (en) * | 2015-08-27 | 2015-12-23 | 浪潮电子信息产业股份有限公司 | Dual-mode high-speed signal line three-dimensional wiring method |
| CN106572588A (en) * | 2015-10-09 | 2017-04-19 | 鸿富锦精密工业(武汉)有限公司 | Printed circuit board |
| CN108401363A (en) * | 2017-02-07 | 2018-08-14 | 扬智科技股份有限公司 | Board structure of circuit |
| CN107864561A (en) * | 2017-11-10 | 2018-03-30 | 郑州云海信息技术有限公司 | A kind of method that coiling compensates in new via through holes |
| CN107864561B (en) * | 2017-11-10 | 2020-01-31 | 苏州浪潮智能科技有限公司 | Method for compensating winding in via through holes |
| CN108770189A (en) * | 2018-07-12 | 2018-11-06 | 合肥联宝信息技术有限公司 | A kind of differential lines method for winding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |