CN102306695A - Ceramic-layer-plated base for LED (light emitting diode) light source single-cup module - Google Patents
Ceramic-layer-plated base for LED (light emitting diode) light source single-cup module Download PDFInfo
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- CN102306695A CN102306695A CN201110266636A CN201110266636A CN102306695A CN 102306695 A CN102306695 A CN 102306695A CN 201110266636 A CN201110266636 A CN 201110266636A CN 201110266636 A CN201110266636 A CN 201110266636A CN 102306695 A CN102306695 A CN 102306695A
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Abstract
The invention provides a ceramic-layer-plated base for an LED (light emitting diode) light source single-cup module, wherein the base comprises a base plate and a light reflection cup arranged on the base plate. The ceramic-layer-plated base is characterized in that a ceramic layer is plated on the light emitting surface for mounting an LED on the light reflection cup, wherein the whiteness of the ceramic layer is greater than or equal to 70, more preferably greater than or equal to 85, and most preferably greater than or equal to 88; and the base plate and the light reflection cup are integrated, or the light reflection cup is bonded and fixed on the base plate, wherein a small groove which extends into the side wall of the light reflection cup and is used for mounting a circuit board is further arranged on the base plate. According to the invention, the manufacturing procedures of a light reflection layer on a traditional LED metal base can be reduced, not only is the production technology simplified, the production cost is saved greatly, and mass industrial production is benefited; simultaneously, the base can be produced directly by adopting a prefabrication way; furthermore, because the light extraction efficiency of the LED chip is improved greatly after the whiteness of the emission surface of the light reflection cup of the base is improved, the loss during the transformation from light energy to heat energy is reduced greatly, the heat radiation performance is improved greatly, the LED lamp manufactured by the ceramic-layer-plated base has good safety performance, is non-conductive, and is difficult to be mashed, and the service life is also prolonged greatly.
Description
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources; Because its power saving, life-span are long; Various lighting devices have been widely used at present; If traditional LED bulb lamp all adopts metal material as the LED base plate for packaging, because the whiteness of metal substrate own is lower, therefore the not treated encapsulation base plate of directly making the LED lamp; Its reflector efficiency is not high; Particularly in great power LED was used, because its caloric value is bigger, life of product was lower; Therefore the light-emitting area on the existing metal substrate all can be handled earlier; As improving its whiteness as reflector layer or the white reflector layer of pressing one deck at its surface brush one deck white paint; But this way; At first its technology is complicated; Production cost is higher, simultaneously, because after having increased one deck reflector layer; Traditional its heat dispersion of led light source module encapsulation construction reduces greatly, can't solve the heat dissipation problem of high-power LED light source module more.
Summary of the invention
The technical problem that the present invention will solve is to provide a kind of and can either saves production cost, can keep single glass of module of led light source of heat dispersion plating ceramic layer base preferably again.
The technical scheme that the present invention adopts is: single glass of module of a kind of led light source is with plating ceramic layer base; Said base comprises substrate and is arranged on the reflector on the substrate; It is characterized in that: the light-emitting area that is used to install LED on the said reflector is coated with a ceramic layer, the whiteness of said ceramic layer >=70.
Said substrate and reflector are to adopt one-body molded processing, and perhaps reflector is bonded and fixed on the substrate.
The whiteness of said ceramic layer is more preferred from >=and 85.
The whiteness of said ceramic layer is more preferred from >=and 88.
Also be provided with the sulculus that is used to install wiring board on the said substrate.
Said sulculus is located at the outside of reflector, and extends into the reflector sidewall.
Said sulculus is located at the bottom of reflector, and the below of this sulculus is provided with a through hole and extends base.
Compared with prior art; The present invention has following advantage: because said substrate and reflector are that metal material is one-body molded processes in employing; Or after being bonded and fixed at reflector on the substrate; Plating high whiteness ceramic layer again handles; The reflector layer production process that can reduce traditional LED to adopt metab and need to increase had both been simplified production technology, can save production cost greatly; Help large batch of suitability for industrialized production, can adopt prefabricated mode Direct Production base simultaneously; The inventor finds through long-term a large amount of experiment in addition, the whiteness of its base reflective surface is increased to >=70, can promote well and get optical efficiency, and heat dispersion is excellent; Its whiteness is >=88 best results if lifting is better for >=85 effects if promote; Because after being coated with high whiteness ceramic layer on the reflector of base; The getting optical efficiency and will promote greatly of led chip; Therefore can significantly reduce luminous energy is converted into heat energy loss; Therefore its heat dispersion also will improve greatly; Good with its its security performance of LED lamp of processing; Non-conductive, also improve greatly non-friable useful life.
Description of drawings
The present invention is further illustrated to combine embodiment with reference to the accompanying drawings.
Fig. 1 is the overall structure sketch map of single glass of module of led light source of the present invention with plating ceramic layer base.
Fig. 2 is the A-A generalized section of Fig. 1.
Embodiment
Come the present invention is carried out detailed explanation below in conjunction with specific embodiment.
As depicted in figs. 1 and 2; Single glass of module of a kind of led light source is with plating ceramic layer base; Said base comprises substrate 1 and is arranged on the reflector 2 on the substrate 1; The light-emitting area that is used to install led chip on the said reflector 2 is coated with a ceramic layer 21; Said substrate 1 and reflector 2 are to plate ceramic layer 21 after can adopting that metal material is one-body molded and processing, or reflector 2 is bonded and fixed on the substrate 1.The whiteness of said ceramic layer >=70; Be more preferred from >=85; The best is >=88.
Also be provided with the sulculus 3 that is used to install wiring board that extends into reflector sidewall 22 on the said substrate 1.
Therefore traditional general whiteness of LED metab needs light-emitting area thereon to increase the reflector layer production process in actual production all less than 70, but do like this heat dispersion of LED base is reduced greatly, and increase production process, has also increased production cost.The present invention is employed in the ceramic layer that plates high whiteness on the light-emitting area of reflector; Can be according to the prefabricated size that processes needs of production needs; Both met the requirement of whiteness >=70; Improve heat dispersion; Both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production; Simultaneously can adopt prefabricated mode Direct Production base, production efficiency will improve greatly.
In addition, the sulculus 3 in the foregoing description also can be located at the bottom of reflector 2, and below this sulculus 3, is provided with the both positive and negative polarity usefulness that a through hole extends base confession lead line plate, can reach the object of the invention equally.
Claims (7)
1. single glass of module of a led light source is with plating ceramic layer base, and said base comprises substrate and is arranged on the reflector on the substrate, it is characterized in that: the light-emitting area that is used to install LED on the said reflector is coated with a ceramic layer, the whiteness of said ceramic layer >=70.
2. single glass of module of led light source according to claim 1 is characterized in that with plating ceramic layer base: said substrate and reflector are to adopt one-body molded processing, or reflector is bonded and fixed on the substrate.
3. single glass of module of led light source according to claim 1 is characterized in that with plating ceramic layer base: the whiteness of said ceramic layer is more preferred from >=and 85.
4. single glass of module of led light source according to claim 1 is characterized in that with plating ceramic layer base: the whiteness of said ceramic layer is more preferred from >=and 88.
5. single glass of module of led light source according to claim 1 is characterized in that: also be provided with the sulculus that is used to install wiring board on the said substrate with plating ceramic layer base.
6. single glass of module of led light source according to claim 5 is with plating ceramic layer base, and it is characterized in that: said sulculus is located at the outside of reflector, and extends into the reflector sidewall.
7. single glass of module of led light source according to claim 5 is with plating ceramic layer base, and it is characterized in that: said sulculus is located at the bottom of reflector, and the below of this sulculus is provided with a through hole and extends base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110266636A CN102306695A (en) | 2011-09-09 | 2011-09-09 | Ceramic-layer-plated base for LED (light emitting diode) light source single-cup module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110266636A CN102306695A (en) | 2011-09-09 | 2011-09-09 | Ceramic-layer-plated base for LED (light emitting diode) light source single-cup module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102306695A true CN102306695A (en) | 2012-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110266636A Pending CN102306695A (en) | 2011-09-09 | 2011-09-09 | Ceramic-layer-plated base for LED (light emitting diode) light source single-cup module |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101027781A (en) * | 2004-08-03 | 2007-08-29 | 德山株式会社 | Package for storing light emitting element and method for producing package for storing light emitting element |
| CN101828275A (en) * | 2007-10-19 | 2010-09-08 | 日本钨合金株式会社 | LED package substrate and LED package using the same |
| JP2011035110A (en) * | 2009-07-31 | 2011-02-17 | Kaneka Corp | Resin composition for semiconductor package |
| CN102005445A (en) * | 2010-09-30 | 2011-04-06 | 福建中科万邦光电股份有限公司 | Encapsulation structure of light emitting diode (LED) light source module |
| CN102544252A (en) * | 2011-07-05 | 2012-07-04 | 曹永革 | Method for efficiently packaging light-emitting diode (LED) chips by using substrate high diffuse reflection optical design |
-
2011
- 2011-09-09 CN CN201110266636A patent/CN102306695A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101027781A (en) * | 2004-08-03 | 2007-08-29 | 德山株式会社 | Package for storing light emitting element and method for producing package for storing light emitting element |
| CN101828275A (en) * | 2007-10-19 | 2010-09-08 | 日本钨合金株式会社 | LED package substrate and LED package using the same |
| JP2011035110A (en) * | 2009-07-31 | 2011-02-17 | Kaneka Corp | Resin composition for semiconductor package |
| CN102005445A (en) * | 2010-09-30 | 2011-04-06 | 福建中科万邦光电股份有限公司 | Encapsulation structure of light emitting diode (LED) light source module |
| CN102544252A (en) * | 2011-07-05 | 2012-07-04 | 曹永革 | Method for efficiently packaging light-emitting diode (LED) chips by using substrate high diffuse reflection optical design |
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Application publication date: 20120104 |