CN101754658B - Radiating device - Google Patents
Radiating device Download PDFInfo
- Publication number
- CN101754658B CN101754658B CN2008103061834A CN200810306183A CN101754658B CN 101754658 B CN101754658 B CN 101754658B CN 2008103061834 A CN2008103061834 A CN 2008103061834A CN 200810306183 A CN200810306183 A CN 200810306183A CN 101754658 B CN101754658 B CN 101754658B
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting cylinder
- abstractor
- radiator
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a radiating device for the radiation of an electronic element, which comprises a base, a post radiator and at least one hot pipe, wherein the radiator comprises a heat conducting barrel and a plurality of fins arranged in the heat conducting barrel; the lower surface of the base contacts to the electronic element in a heat conducting way; at least one hot pipe is in a flat shape, and is wound at the outer surface of the hot pipe in a special shape, so a plurality of coils wound at the outer surface of the heat conducting barrel at interval is formed; and the upper surface of the base is connected with the hot pipe in the heat conducting way. The hot pipe of the radiating device is wound to one of the heat conducting barrel from the other along the circumference of the hot pipe, so the hot contact area of the hot pipe and the heat conducting barrel is increased. Heat on the base can be evenly conducted to the heat conducting barrel and the fins by the hot pipe, so the radiating efficiency of the radiating device is high.
Description
Technical field
The present invention relates to a kind of heat abstractor, refer to especially a kind of heat abstractor to electronic element radiating.
Background technology
The electronic devices and components that are installed on circuit board can produce a large amount of heats when operation, if these heats can not be left effectively, will directly cause temperature sharply to rise, and badly influence service behaviour and the life-span of electronic devices and components.For this reason, a heat abstractor being installed usually on electronic devices and components dispels the heat.
Tower heat abstractor is a kind of traditional heat abstractor, and it comprises that generally a heat-conducting plate, a fins group and heat conduction with the electronic component contact are connected some heat pipes of heat-conducting plate and fins group.Yet, when using this heat abstractor, at first heat pipe will be passed to from the heat that electronic component absorbs its fins group part of vicinity on every side, then heat from the close-by examples to those far off diffusion on fins group, so heat distributes in fins group and is inhomogeneous, so the radiating efficiency of this heat abstractor is lower.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor of good heat dispersion performance.
A kind of heat abstractor, be used for electronic component is dispelled the heat, it comprises a pedestal, a pole-shaped radiator and at least one heat pipe, this radiator comprises a heat-conducting cylinder and is arranged on the interior some fins of heat-conducting cylinder, the lower surface of this pedestal contacts with electronic component heat conduction, and described at least one heat pipe is flat, and is coiled in the shape of a spiral the outer surface of heat-conducting cylinder, thereby form and be coiled in heat-conducting cylinder outer surface, some circles separately, the upper surface of described pedestal is connected with heat pipe for thermal conductivity.
Compared with prior art, the heat pipe of heat abstractor of the present invention circumferentially is wound into the other end by heat-conducting cylinder one end along heat-conducting cylinder, increased the thermocontact area of heat pipe and heat-conducting cylinder, heat pipe can evenly conduct to heat-conducting cylinder and fin with the heat on pedestal, and the radiating efficiency of heat abstractor is higher.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of one embodiment of the invention heat abstractor.
Fig. 2 is the three-dimensional exploded view of heat abstractor in Fig. 1.
Embodiment
As shown in Figure 1, the heat abstractor of one embodiment of the invention is in order to distribute the heat that produces with the electronic component (not shown) of its combination.This heat abstractor comprises that a hollow cylindrical radiator 20, some spiral surroundings are at the heat pipe 30 of radiator 20 outer surfaces, with a pedestal 10 of heat pipe 30 combinations and be arranged at a fan 40 of these radiator 20 1 ends.
Please be simultaneously with reference to Fig. 2, described pedestal 10 is one-body molded by the good metal material of the heat conductivilitys such as copper, aluminium, it has the plane 14 that a curved surface 12 and that is positioned at the top is positioned at the bottom, this curved surface 12 directly contact with heat pipe 30 and with radiator 20 separately, the curvature of the curvature of the curvature of this curved surface 12 and the heat pipe that is in contact with it 30 and heat-conducting cylinder 22 outer surfaces is consistent, and 14, the plane of this pedestal 10 directly contacts with electronic component.
Described radiator 20 is by the good metal material one extrusion modling of the heat conductivilitys such as copper, aluminium.This radiator 20 comprises a hollow cylindrical heat-conducting cylinder 22 and along heat-conducting cylinder 22 inwalls some fins 24 separately of Axis Extension wherein.Described fin 24 is tabular, it is arranged on heat-conducting cylinder 22 inwalls equably, and the direction to heat-conducting cylinder 22 axis extensions progressively reduces its thickness from heat-conducting cylinder 22 inwalls, thereby the cross section that makes each fin 24 is needle-like, simultaneously from heat-conducting cylinder 22 inwalls to heat-conducting cylinder 22 axis, 24 of adjacent fins form some gas channels 240 that width progressively reduces, and flow by the heat on fin 24 is taken away in order to air feed.Thereby the area of dissipation of radiator 20 axis line inside line peripheral part is little, its gas channel 240 comparatively denses, and radially the area of dissipation near heat-conducting cylinder 22 inwalls is large, its gas channel 240 is more loose.Each fin 24 extends axially and runs through the inwall of whole heat-conducting cylinder 22 along heat-conducting cylinder 22.Each fin 24 is identical along the length that heat-conducting cylinder 22 radially extends, and all fins 24 do not contact along the end that heat-conducting cylinder 22 radially extends, thereby the central authorities at radiator 20 form a cylindrical cavity 200, this cavity 200 is communicated with the gas channel 240 of 24 of fins, and extends axially opening to its two ends along radiator 20.In the present embodiment, fin 24 is integrated extrusion modling with heat-conducting cylinder 22, makes the manufacturing cost of radiator 20 lower.Understandably, some fins 24 of heat abstractor of the present invention can separate with heat-conducting cylinder 22 to be made, again fin 24 is fitted on heat-conducting cylinder 22 inwalls in modes such as bonding or welding, for example, can be converted into the described some fins 24 of wavy formation than the foil Curved Continuous with one, then it is fitted on heat-conducting cylinder 22 inwalls.In addition, heat-conducting cylinder 22 outer surfaces of radiator 20 also can form lug boss or fin 24, with increasing heat radiation area.
Described each heat pipe 30 is flat, and bends on the outer surface that helical form is coiled in heat-conducting cylinder 22, thereby described heat pipe 30 forms and is coiled in heat-conducting cylinder 22 outer surfaces, some circles separately.Heat pipe 30 is squeezed into flat, heat-conducting medium can be coated in equably on heat-conducting cylinder 22 and outer surface that heat pipe 30 combines, prevent that heat-conducting medium is extruded in the process that heat pipe 30 is arranged on heat-conducting cylinder 22, solder bond is together securely to make heat pipe 30 and radiator 20.The curvature of each heat pipe 30 bending is consistent with heat-conducting cylinder 22 outer surface curvatures, and heat pipe 30 is fully contacted with the outer surface of heat-conducting cylinder 22.In the present embodiment, the number of heat pipe 30 is three, and overlap the to each other around the home on heat-conducting cylinder 22 outer surfaces, it is other heat pipe equally-spaced in the middle of two adjacent circles of each heat pipe 30 are sandwiched in, the amplitude that adopts this canoe that each heat pipe 30 is bent is smaller, distance between each heat pipe 30 adjacent turn is larger, can prevent that its inner capillary structure (not shown) is destroyed because of overflexing.Heat pipe 30 coiling heat-conducting cylinders 22 and the axial whole outer surface that covers heat-conducting cylinder 22, be the two ends of two ends arrival heat-conducting cylinders 22 of heat pipe 30, increased the contact area of 22 of heat pipe 30 and heat-conducting cylinders, the heat that pedestal 10 absorbs can be passed to along each circumferential position of heat-conducting cylinder 22 quickly and evenly by heat pipe 30, again by heat-conducting cylinder 22 with the heat Transmit evenly to its inner fin 24, then fin 24 with dissipation of heat in air, radially temperature is high in the outer part for this heat abstractor, and inboard temperature is low.
Described fan 40 side direction are installed on an open end of radiator 20 heat-conducting cylinders 22.The heat of radiator 20 distributes identical with the throughput distribution of fan 40, the core of this fan 40, i.e. low blast district, cavity 200 in the face of radiator 20, the flabellum part of fan 40, it is high blast district, the large fin 24 of area of dissipation in the face of radiator 20, make radiator 20 radial outside temperature eminence air quantity large, radially inner side temperature lower air quantity is little, so arranges, when fan 40 is opened, accelerated the heat exchange of fin 24 with the air of radiator 20, the auxiliary heat dissipation effect of fan 40 is given full play to.
When using this heat abstractor, electronic component is sent out heat thermogenetic and is absorbed via said base 10 and then passes to heat pipe 30, the fin 24 that heat pipe 30 transfers heat to heat-conducting cylinder 22 and interior large surface area thereof again distributes, and the air-flow that fan 40 produces can accelerate distributing of heat on radiator 20.
Compared with prior art, on the whole outer surface of the heat pipe 30 of heat abstractor of the present invention along heat-conducting cylinder 22 axial rings around heat-conducting cylinder 22, larger with the contact area of heat-conducting cylinder 22, heat on pedestal 10 evenly can be conducted to heat-conducting cylinder 22 and fin 24, the quick conductive performance of having given full play to heat pipe 30 is strengthened the capacity of heat transmission of pedestal 10, makes heat abstractor each position all can Quick uniform conduction heat.Simultaneously, fan 40 sides are contained on radiator 20, take full advantage of the auxiliary heat dissipation function of fan 40, the radiating efficiency of heat abstractor is higher.
Understandably, the cross section outline of heat abstractor heat-conducting cylinder 22 of the present invention can be ellipse, circle, fan-shaped or polygon, this moment heat pipe 30 the also alteration of form of corresponding radiator 20 cross section outlines of shape; The bearing of trend of the fin 24 of radiator 20 inner surfaces and shape can change along with radiator 20 global shapes and demand.
Claims (8)
1. heat abstractor, be used for electronic component is dispelled the heat, it comprises a pedestal, one pole-shaped radiator, one fan and at least one heat pipe, this radiator comprises a heat-conducting cylinder and is arranged on the interior some fins of heat-conducting cylinder, the lower surface of this pedestal contacts with electronic component heat conduction, it is characterized in that: described at least one heat pipe is flat, and be coiled in the shape of a spiral the outer surface of heat-conducting cylinder, be coiled in the heat-conducting cylinder outer surface thereby form, some circles separately, the upper surface of described pedestal is connected with heat pipe for thermal conductivity, described some fins extend to the heat-conducting cylinder axis from the heat-conducting cylinder inwall, the end that all fins extend encloses and forms a cylindrical cavity, this cylindrical cavity is positioned at heat-conducting cylinder central authorities, this cavity extends axially the opening that connects the heat-conducting cylinder two ends along heat-conducting cylinder, thereby keep outward being communicated with radiator, described fan side is to the opening part of an end that is installed on heat-conducting cylinder, the core of this fan is in the face of the cavity of heat-conducting cylinder central authorities, the flabellum of this fan is partly in the face of the fin in heat-conducting cylinder.
2. heat abstractor as claimed in claim 1 is characterized in that: described heat pipe is along the axial coiling of heat-conducting cylinder and run through the whole outer surface of heat-conducting cylinder.
3. heat abstractor as claimed in claim 1 is characterized in that: the number of described heat pipe is two or more, and overlaps the to each other around the home on the heat-conducting cylinder outer surface other heat pipe equally-spaced in the middle of two circles that each heat pipe is adjacent are sandwiched in.
4. heat abstractor as claimed in claim 1, it is characterized in that: described some fins separate with heat-conducting cylinder to be made, and these some fins fit on the heat-conducting cylinder inwall in modes such as bonding or welding.
5. heat abstractor as claimed in claim 4 is characterized in that: described some fins are converted into by a foil Curved Continuous and wavyly form and fit on the heat-conducting cylinder inwall.
6. heat abstractor as claimed in claim 1 is characterized in that: described radiator is by the extrusion modling of metal one, and the cross section outline of described heat-conducting cylinder is circular.
7. heat abstractor as claimed in claim 6, it is characterized in that: described fin is tabular, it equates with the height of heat-conducting cylinder along the axially extended length of heat-conducting cylinder, it reduces gradually from the thickness that the heat-conducting cylinder inwall radially extends towards the axis, thereby form some gas channels between fin, this gas channel is communicated with described cavity.
8. heat abstractor as claimed in claim 1, it is characterized in that: the cross section outline of described heat-conducting cylinder is polygon, ellipse or fan-shaped.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103061834A CN101754658B (en) | 2008-12-11 | 2008-12-11 | Radiating device |
| US12/463,348 US20100147496A1 (en) | 2008-12-11 | 2009-05-08 | Heat dissipation device with heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103061834A CN101754658B (en) | 2008-12-11 | 2008-12-11 | Radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101754658A CN101754658A (en) | 2010-06-23 |
| CN101754658B true CN101754658B (en) | 2013-06-05 |
Family
ID=42239142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008103061834A Expired - Fee Related CN101754658B (en) | 2008-12-11 | 2008-12-11 | Radiating device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100147496A1 (en) |
| CN (1) | CN101754658B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102037682B1 (en) * | 2012-10-31 | 2019-10-29 | 웅진코웨이 주식회사 | Cooling device and cold water storage of water treatment apparatus |
| CN104613443B (en) * | 2015-02-03 | 2018-01-30 | 东莞市闻誉实业有限公司 | Radiator with guide vane |
| KR20160117937A (en) * | 2015-04-01 | 2016-10-11 | 삼성전자주식회사 | Refrigerator and heat exchanger applying the same |
| US9939859B2 (en) | 2016-03-17 | 2018-04-10 | Google Llc | Electronic device with a cooling structure |
| CN206274224U (en) * | 2016-12-20 | 2017-06-23 | 刘龙芳 | A kind of spiral line type radiator |
| CN107062730A (en) * | 2017-01-13 | 2017-08-18 | 北京热刺激光技术有限责任公司 | Air-cooled water cooling machine |
| EP3595105B1 (en) | 2018-07-13 | 2024-01-24 | ABB Schweiz AG | A heat sink for a high voltage switchgear |
| CN113441700A (en) * | 2021-07-30 | 2021-09-28 | 上海睿昇半导体科技有限公司 | Cooling water jacket and processing method thereof |
| CN114673972B (en) * | 2022-05-31 | 2022-08-30 | 徐连城 | Heat abstractor and fishing lamp |
| KR102595307B1 (en) * | 2023-04-03 | 2023-10-30 | 주식회사 삼정이엔씨 | Heat exchanger for hydrogen liquefied |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1503356A (en) * | 2002-11-26 | 2004-06-09 | 诺亚公司 | Central type flow guiding heat radiation device |
| US7129731B2 (en) * | 2003-09-02 | 2006-10-31 | Thermal Corp. | Heat pipe with chilled liquid condenser system for burn-in testing |
| CN1933710A (en) * | 2005-09-14 | 2007-03-21 | 富准精密工业(深圳)有限公司 | Heat tube radiating device |
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| US3100969A (en) * | 1960-08-03 | 1963-08-20 | Thore M Elfving | Thermoelectric refrigeration |
| US5067330A (en) * | 1990-02-09 | 1991-11-26 | Columbia Gas System Service Corporation | Heat transfer apparatus for heat pumps |
| US5572885A (en) * | 1995-06-06 | 1996-11-12 | Erickson; Donald C. | Shrouded coiled crested tube diabatic mass exchanger |
| US7147045B2 (en) * | 1998-06-08 | 2006-12-12 | Thermotek, Inc. | Toroidal low-profile extrusion cooling system and method thereof |
| US6233146B1 (en) * | 1999-07-28 | 2001-05-15 | Dell Usa, L.P. | Rotatable portable computer remote heat exchanger with heat pipe |
| US6315033B1 (en) * | 2000-05-22 | 2001-11-13 | Jia Hao Li | Heat dissipating conduit |
| US6640883B2 (en) * | 2002-02-14 | 2003-11-04 | Glacialtech Inc. | Computer heat sink |
| NZ523962A (en) * | 2003-01-31 | 2004-10-29 | Energy Saving Concepts Ltd | Heat exchanger with multiple turbulent flow paths |
| TW575154U (en) * | 2003-04-23 | 2004-02-01 | Hon Hai Prec Ind Co Ltd | Radiator having heat pipe |
| US7322404B2 (en) * | 2004-02-18 | 2008-01-29 | Renewability Energy Inc. | Helical coil-on-tube heat exchanger |
| TWM259940U (en) * | 2004-05-31 | 2005-03-21 | Glacialtech Inc | Heat dissipating device |
| CN2727964Y (en) * | 2004-09-17 | 2005-09-21 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN2777753Y (en) * | 2005-01-19 | 2006-05-03 | 富准精密工业(深圳)有限公司 | Radiator |
| TWM278213U (en) * | 2005-02-24 | 2005-10-11 | Comptake Technology Co Ltd | Heat dissipation device |
| CN101203117B (en) * | 2006-12-13 | 2010-08-25 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101610658B (en) * | 2008-06-20 | 2012-07-18 | 富准精密工业(深圳)有限公司 | Heat dissipation device |
-
2008
- 2008-12-11 CN CN2008103061834A patent/CN101754658B/en not_active Expired - Fee Related
-
2009
- 2009-05-08 US US12/463,348 patent/US20100147496A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1503356A (en) * | 2002-11-26 | 2004-06-09 | 诺亚公司 | Central type flow guiding heat radiation device |
| US7129731B2 (en) * | 2003-09-02 | 2006-10-31 | Thermal Corp. | Heat pipe with chilled liquid condenser system for burn-in testing |
| CN1933710A (en) * | 2005-09-14 | 2007-03-21 | 富准精密工业(深圳)有限公司 | Heat tube radiating device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100147496A1 (en) | 2010-06-17 |
| CN101754658A (en) | 2010-06-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20131211 |