CN101439447A - Solder - Google Patents
Solder Download PDFInfo
- Publication number
- CN101439447A CN101439447A CNA2008102469210A CN200810246921A CN101439447A CN 101439447 A CN101439447 A CN 101439447A CN A2008102469210 A CNA2008102469210 A CN A2008102469210A CN 200810246921 A CN200810246921 A CN 200810246921A CN 101439447 A CN101439447 A CN 101439447A
- Authority
- CN
- China
- Prior art keywords
- alloy
- solder
- good
- adopt
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The invention relates to a brazing alloy, pertaining to the technical field of welding. The brazing alloy comprises the following components by the weight percentage: 40-80% of Ti, 10-35% of Cu, 5-20% of Ni and 5-15% of Cr. The brazing alloy of the invention can be coated at the joint of braze welding of Ti3Al-base alloy and GH536 alloy; braze welding is carried out under vacuum condition; after the braze welding, the brazing alloy is used for filling the clearance at the joint of braze welding so as to mould the brazing seam excellently and control the quality of the braze welding to be excellent and steady. The interface connecting parent material and the brazing alloy is tightly integrated that no defect, such as pore and crack, exists; therefore, the interface is excellently organized.
Description
Technical field
The invention belongs to welding technology field, particularly a kind of solder.
Background technology
Along with the continuous development of aero-engine, for satisfying the requirement of high-performance enginer, many engine components have adopted new material, Ti
3Al base alloy is exactly one of them.Ti
3Al base alloy at high temperature (800~850 ℃) has the good temperature resistance energy, and density is lower, compares with nickel base superalloy and can reduce engine weight 40%, is therefore used on new work engine.Present Ti
3Al base alloy is the honeycomb seal structure in one of engine application, promptly adopts the soldering interconnection technique with Ti
3Al base alloy and GH536 honeycomb link together.At present both at home and abroad to Ti
3The soldering research of Al base alloy is also not too general, for Ti
3Al base alloy is connected with the soldering of high temperature alloy and does not appear in the newspapers.
Adopt solders such as existing Ni-based, money base or titanium base, to Ti
3The wetability and the joint filling of Al base alloy and GH536 alloy-junction are all not ideal enough, and the intensity of soldered fitting is lower, can not satisfy instructions for use.The nickel-based solder fusing point is higher, causes Ti easily
3The Al based alloy grain is grown up, and nickel-based solder is to Ti
3The wetability of Al base alloy is poor, and strength of joint is low; Silver-base solder has appropriate melting point, and brazed seam has good plasticity, but mechanical property, resistance to elevated temperatures and oxidation resistent susceptibility are relatively poor; Titanium based solder strength of joint height, corrosion resistance and good heat resistance, but poor to the wetability of GH536 alloy.In order to realize Ti
3Al base alloy is connected with the GH536 alloy, needs a kind of new solder of development.
Summary of the invention
At above technical problem, the invention provides a kind of solder, by adjusting the composition of solder, guaranteeing Ti
3On the wetability good basis of Al base alloy, improve wetability, and soldered fitting intensity satisfies instructions for use to the GH536 alloy.
The present invention is that solder is a titanium based powders solder, and this solder composition is Ti40~80% by weight percentage, Cu10~35%, Ni5~20%, Cr5~15%; Granularity is-150~-300 orders.
Titanium based powders solder of the present invention adopts powder by atomization technology, at first purity is mixed according to the above ratio greater than each feed metal of 99.995%, under inert atmosphere conditions, be smelted into alloy pig, on high pressure gas-water atomization equipment, prepare powder then, powder preparation adopts condition of high voltage and inert gas conditions, alloy liquid droplet after the atomizing is gone into the cooling water environment, obtain the mixture of alloy powder and water, mixture to alloy powder and water carries out suction filtration, vacuum drying and screening then, obtains titanium based powders solder.
Adopt titanium based powders solder of the present invention, be coated in Ti
3The soldered fitting place of Al base alloy and GH536 alloy carries out soldering under vacuum condition, solder is filled gap, soldered fitting place after the soldering, and the brazed seam moulding is good, and brazing quality is good and stable; The interface combination that mother metal is connected with solder is tight, defectives such as pore-free, crackle, and Interface Microstructure is good.By carry out hot strength and shear strength test under the condition of room temperature to 600 ℃, hot strength (σ b) can reach 397MPa, and shear strength (T) can reach 275MPa.Titanium based powders solder preparation method of the present invention is simple, has a good application prospect.
Description of drawings
Fig. 1 is the wettability test figure as a result of the solder in the embodiment of the invention, and the row's of going up test piece material is the GH536 alloy among the figure, and following row's test piece material is Ti
3The Al alloy; Left side test piece is embodiment 1 solder, and middle test piece is embodiment 2 solders, and the right test piece is embodiment 3 solders.
Fig. 2 is a soldered fitting microstructure aspect graph in the embodiment of the invention 1.
The specific embodiment
Embodiment 1
Adopt powder by atomization technology, at first metal Ti, Cu, Ni and Cr are mixed, the composition of mixed material is Ti45%, Cu30%, Ni15%, Cr10%; Mixed material is smelted into alloy pig under vacuum-applying argon gas condition, on high pressure gas-water atomization equipment, prepare powder then, adopt the atomizing of high pressure argon gas, alloy liquid droplet after the atomizing is gone into the cooling water environment, obtain the mixture of alloy powder and water, mixture to alloy powder and water carries out suction filtration, vacuum drying and screening then, obtains titanium based powders solder; Granularity is-150~-300 orders.
This solder is carried out the wetability test, and test result as shown in Figure 1.
Adopt this solder to be coated in Ti
3The soldered fitting place of Al base alloy and GH536 alloy carries out soldering under vacuum condition, solder is filled gap, soldered fitting place after the soldering, and the brazed seam moulding is good, and brazing quality is good and stable; The interface combination that mother metal is connected with solder is tight, defectives such as pore-free, crackle, and Interface Microstructure is good.Soldered fitting microstructure form as shown in Figure 2.
Adopt sample to carry out the vacuum brazing test, by carrying out the test of hot strength (σ b) and shear strength (T) at ambient temperature, hot strength is respectively 400MPa, 402MPa and 407MPa during room temperature, and average tensile strength is 403MPa; Shear strength is respectively 252MPa, 174MPa and 235MPa, and average shear intensity is 220MPa.
Embodiment 2
Adopt powder by atomization technology, at first metal Ti, Cu, Ni and Cr are mixed, the composition of mixed material is Ti55%, Cu20%, Ni10%, Cr15%; Mixed material is smelted into alloy pig under vacuum-applying argon gas condition, on high pressure gas-water atomization equipment, prepare powder then, adopt the atomizing of high pressure argon gas, alloy liquid droplet after the atomizing is gone into the cooling water environment, obtain the mixture of alloy powder and water, mixture to alloy powder and water carries out suction filtration, vacuum drying and screening then, obtains titanium based powders solder; Granularity is-150~-300 orders.
Adopt this solder to be coated in Ti
3The soldered fitting place of Al base alloy and GH536 alloy carries out soldering under vacuum condition, solder is filled gap, soldered fitting place after the soldering, and the brazed seam moulding is good, and brazing quality is good and stable; The interface combination that mother metal is connected with solder is tight, defectives such as pore-free, crackle, and Interface Microstructure is good.
Adopt sample to carry out the vacuum brazing test, by carry out the test of hot strength (σ b) and shear strength (τ) under 400 ℃ of conditions, hot strength is 405MPa, 350MPa and 351MPa in the time of 400 ℃, and average tensile strength is respectively 369MPa; Shear strength is respectively 183MPa, 194MPa and 197MPa, and average shear intensity is 191MPa.
Embodiment 3
Adopt powder by atomization technology, at first metal Ti, Cu, Ni and Cr are mixed, the composition of mixed material is Ti70%, Cu15%, Ni7%, Cr8%; Mixed material is smelted into alloy pig under vacuum-applying argon gas condition, on high pressure gas-water atomization equipment, prepare powder then, adopt the atomizing of high pressure argon gas, alloy liquid droplet after the atomizing is gone into the cooling water environment, obtain the mixture of alloy powder and water, mixture to alloy powder and water carries out suction filtration, vacuum drying and screening then, obtains titanium based powders solder; Granularity is-150~-300 orders.
Adopt this solder to be coated in the soldered fitting place of Ti3Al base alloy and GH536 alloy, carry out soldering under vacuum condition, solder is filled gap, soldered fitting place after the soldering, and the brazed seam moulding is good, and brazing quality is good and stable; The interface combination that mother metal is connected with solder is tight, defectives such as pore-free, crackle, and Interface Microstructure is good.
Adopt sample to carry out the vacuum brazing test, by carry out the test of hot strength (σ b) and shear strength (T) under 600 ℃ of conditions, hot strength is respectively 370MPa, 385MPa and 430MPa in the time of 600 ℃, and average tensile strength is 397MPa; Shear strength is respectively 275MPa, 270MPa and 280MPa, and average shear intensity is 275MPa.
Embodiment 4
Adopt powder by atomization technology, at first metal Ti, Cu, Ni and Cr are mixed, the composition of mixed material is Ti80%, Cu10%, Ni5%, Cr5%; Mixed material is smelted into alloy pig under vacuum-applying argon gas condition, on high pressure gas-water atomization equipment, prepare powder then, adopt the atomizing of high pressure argon gas, alloy liquid droplet after the atomizing is gone into the cooling water environment, obtain the mixture of alloy powder and water, mixture to alloy powder and water carries out suction filtration, vacuum drying and screening then, obtains titanium based powders solder; Granularity is-150~-300 orders.
Adopt this solder to be coated in Ti
3The soldered fitting place of Al base alloy and GH536 alloy carries out soldering under vacuum condition, solder is filled gap, soldered fitting place after the soldering, and the brazed seam moulding is good, and brazing quality is good and stable; The interface combination that mother metal is connected with solder is tight, defectives such as pore-free, crackle, and Interface Microstructure is good.
Embodiment 5
Adopt powder by atomization technology, at first metal Ti, Cu, Ni and Cr are mixed, the composition of mixed material is Ti40%, Cu35%, Ni20%, Cr5%; Mixed material is smelted into alloy pig under vacuum-applying argon gas condition, on high pressure gas-water atomization equipment, prepare powder then, adopt the atomizing of high pressure argon gas, alloy liquid droplet after the atomizing is gone into the cooling water environment, obtain the mixture of alloy powder and water, mixture to alloy powder and water carries out suction filtration, vacuum drying and screening then, obtains titanium based powders solder; Granularity is-150~-300 orders.
Adopt this solder to be coated in Ti
3The soldered fitting place of Al base alloy and GH536 alloy carries out soldering under vacuum condition, solder is filled gap, soldered fitting place after the soldering, and the brazed seam moulding is good, and brazing quality is good and stable; The interface combination that mother metal is connected with solder is tight, defectives such as pore-free, crackle, and Interface Microstructure is good.
Claims (2)
1, a kind of solder is characterized in that: the composition of this solder is Ti40~80%, Cu10~35%, Ni5~20%, Cr5~15% by weight percentage.
2, a kind of solder according to claim 1 is characterized in that this solder is Powdered solder, and its granularity is-150~-300 orders.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2008102469210A CN101439447A (en) | 2008-12-30 | 2008-12-30 | Solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2008102469210A CN101439447A (en) | 2008-12-30 | 2008-12-30 | Solder |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101439447A true CN101439447A (en) | 2009-05-27 |
Family
ID=40724130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2008102469210A Pending CN101439447A (en) | 2008-12-30 | 2008-12-30 | Solder |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101439447A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102909491A (en) * | 2012-10-24 | 2013-02-06 | 中国航空工业集团公司北京航空材料研究院 | Titanium-zirconium-iron-based brazing filler metal for Ti3Al and nickel-based high-temperature alloy braze welding |
CN105312794A (en) * | 2015-10-30 | 2016-02-10 | 沈阳黎明航空发动机(集团)有限责任公司 | Honeycomb structure |
CN109369208A (en) * | 2018-10-31 | 2019-02-22 | 广东工业大学 | A kind of silicon carbide connection solder and its preparation method and application |
CN110625128A (en) * | 2019-11-05 | 2019-12-31 | 西北有色金属研究院 | Preparation method of titanium-copper-nickel-chromium alloy brazing filler metal powder |
-
2008
- 2008-12-30 CN CNA2008102469210A patent/CN101439447A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102909491A (en) * | 2012-10-24 | 2013-02-06 | 中国航空工业集团公司北京航空材料研究院 | Titanium-zirconium-iron-based brazing filler metal for Ti3Al and nickel-based high-temperature alloy braze welding |
CN105312794A (en) * | 2015-10-30 | 2016-02-10 | 沈阳黎明航空发动机(集团)有限责任公司 | Honeycomb structure |
CN109369208A (en) * | 2018-10-31 | 2019-02-22 | 广东工业大学 | A kind of silicon carbide connection solder and its preparation method and application |
CN109369208B (en) * | 2018-10-31 | 2021-07-09 | 广东工业大学 | Brazing filler metal for silicon carbide connection and preparation method and application thereof |
CN110625128A (en) * | 2019-11-05 | 2019-12-31 | 西北有色金属研究院 | Preparation method of titanium-copper-nickel-chromium alloy brazing filler metal powder |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107999991B (en) | High-entropy flux-cored wire for titanium-steel MIG welding and preparation method thereof | |
CN108161278B (en) | High-entropy flux-cored wire for aluminum-steel MIG welding and preparation method thereof | |
CN108161277B (en) | High-entropy flux-cored wire for aluminum-steel submerged arc welding and preparation method thereof | |
CN101284339B (en) | Welding wire and method for welding the aluminum and aluminum alloy and steel | |
CN103567666B (en) | Be applicable to titanium alloy soldering and Ti 2the strip brazing material of AlNb alloy brazed and preparation and method for welding | |
CN108941976B (en) | Welding wire for TA1-Q345 middle layer welding and preparation and welding method | |
CN110394522B (en) | Deformed nickel-based alloy and cast Ni3Brazing process of Al-based alloy | |
CN106141494B (en) | Solder and preparation method and soldering processes for soldering Mo Re alloys foil | |
CN110605498B (en) | TiNiNbZr high-temperature brazing filler metal for TiAl alloy, preparation method and brazing method thereof | |
CN113732563B (en) | Transition layer welding wire for preparing titanium-steel gradient composite material CMT and preparation method | |
CN101439447A (en) | Solder | |
CN111673311B (en) | Welding wire for TA1-Q235B middle layer welding and preparation method | |
CN108161276B (en) | High-entropy flux-cored wire for magnesium-steel MIG welding and preparation method thereof | |
CN101716705A (en) | Multi-alloy cadmium-free phosphor-free copper-based solder | |
CN102922172A (en) | Titanium-zirconium-ferrum based solder for TiAl or Ti3Al alloy soldering | |
CN113953712B (en) | Material for butt welding of TA1-Q235 composite plates and welding method | |
CN110193683B (en) | Brazing filler metal for TiAl-Ni dissimilar material connection | |
CN102909491A (en) | Titanium-zirconium-iron-based brazing filler metal for Ti3Al and nickel-based high-temperature alloy braze welding | |
CN114986023A (en) | Process for prefabricating low-melting-point brazing filler metal, low-melting-point brazing filler metal and preparation method thereof | |
CN108500510A (en) | A kind of titanium-base alloy cored solder containing chromium | |
CN114378477B (en) | Mixed powder solder and preparation method thereof, welding interlayer and welding method | |
CN106735766A (en) | A kind of TIG weld method that titanium matrix composite is overlapped with nickel-base alloy addition Cu intermediate layers | |
CN113427167B (en) | Welding wire for TA1-Cu-Q235 steel side transition layer and preparation method thereof | |
CN109773370A (en) | Nano particle doped titanium-base solder and preparation method thereof | |
CN103567662B (en) | A kind of iron-based solder obtaining high tenacity soldered fitting |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Open date: 20090527 |