BE618264A - - Google Patents
Info
- Publication number
- BE618264A BE618264A BE618264DA BE618264A BE 618264 A BE618264 A BE 618264A BE 618264D A BE618264D A BE 618264DA BE 618264 A BE618264 A BE 618264A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B25/00—Phosphorus; Compounds thereof
- C01B25/06—Hydrogen phosphides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B25/00—Phosphorus; Compounds thereof
- C01B25/08—Other phosphides
- C01B25/088—Other phosphides containing plural metal
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G31/00—Compounds of vanadium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/007—Preparing arsenides or antimonides, especially of the III-VI-compound type, e.g. aluminium or gallium arsenide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02543—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02549—Antimonides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/049—Equivalence and options
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/056—Gallium arsenide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/065—Gp III-V generic compounds-processing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/067—Graded energy gap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/072—Heterojunctions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/11—Metal-organic CVD, ruehrwein type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/119—Phosphides of gallium or indium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/12—Photocathodes-Cs coated and solar cell
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/142—Semiconductor-metal-semiconductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/15—Silicon on sapphire SOS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S252/00—Compositions
- Y10S252/95—Doping agent source material
- Y10S252/951—Doping agent source material for vapor transport
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/925—Fluid growth doping control, e.g. delta doping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/933—Germanium or silicon or Ge-Si on III-V
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/936—Graded energy gap
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Photovoltaic Devices (AREA)
- Catalysts (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US821101A US3363984A (en) | 1959-06-18 | 1959-06-18 | Preparation of iii-v compounds |
US113108A US3312570A (en) | 1961-05-29 | 1961-05-29 | Production of epitaxial films of semiconductor compound material |
US129919A US3364084A (en) | 1959-06-18 | 1961-05-29 | Production of epitaxial films |
US128237A US3322575A (en) | 1959-06-18 | 1961-07-31 | Graded energy gap photoelectromagnetic cell |
US434116A US3224913A (en) | 1959-06-18 | 1965-02-19 | Altering proportions in vapor deposition process to form a mixed crystal graded energy gap |
Publications (1)
Publication Number | Publication Date |
---|---|
BE618264A true BE618264A (xx) |
Family
ID=27537343
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE620887D BE620887A (xx) | 1959-06-18 | ||
BE618264D BE618264A (xx) | 1959-06-18 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE620887D BE620887A (xx) | 1959-06-18 |
Country Status (5)
Country | Link |
---|---|
US (3) | US3364084A (xx) |
BE (2) | BE618264A (xx) |
DE (3) | DE1132098B (xx) |
GB (3) | GB944872A (xx) |
NL (4) | NL129707C (xx) |
Families Citing this family (79)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3496024A (en) * | 1961-10-09 | 1970-02-17 | Monsanto Co | Photovoltaic cell with a graded energy gap |
US3306713A (en) * | 1962-09-18 | 1967-02-28 | Merck & Co Inc | Semiconductor process and products produced thereby |
DE1467360B2 (de) * | 1962-12-01 | 1971-08-12 | Siemens AG, 1000 Berlin u 8000 München | Verfahren zum herstellen einkristalliner schichten aus indiumantimonid |
US3310425A (en) * | 1963-06-28 | 1967-03-21 | Rca Corp | Method of depositing epitaxial layers of gallium arsenide |
US3392066A (en) * | 1963-12-23 | 1968-07-09 | Ibm | Method of vapor growing a homogeneous monocrystal |
US3363155A (en) * | 1964-08-19 | 1968-01-09 | Philips Corp | Opto-electronic transistor with a base-collector junction spaced from the material heterojunction |
US3394390A (en) * | 1965-03-31 | 1968-07-23 | Texas Instruments Inc | Method for making compond semiconductor materials |
DE1544265A1 (de) * | 1965-07-05 | 1970-07-09 | Siemens Ag | Verfahren zum Herstellen von epitaktischen Aufwachsschichten aus binaeren,halbleitenden Verbindungen |
US3492175A (en) * | 1965-12-17 | 1970-01-27 | Texas Instruments Inc | Method of doping semiconductor material |
US3421952A (en) * | 1966-02-02 | 1969-01-14 | Texas Instruments Inc | Method of making high resistivity group iii-v compounds and alloys doped with iron from an iron-arsenide source |
US3493811A (en) * | 1966-06-22 | 1970-02-03 | Hewlett Packard Co | Epitaxial semiconductor material on dissimilar substrate and method for producing the same |
US3433684A (en) * | 1966-09-13 | 1969-03-18 | North American Rockwell | Multilayer semiconductor heteroepitaxial structure |
US3496029A (en) * | 1966-10-12 | 1970-02-17 | Ion Physics Corp | Process of doping semiconductor with analyzing magnet |
NL6615059A (xx) * | 1966-10-25 | 1968-04-26 | ||
US3441453A (en) * | 1966-12-21 | 1969-04-29 | Texas Instruments Inc | Method for making graded composition mixed compound semiconductor materials |
US4404265A (en) * | 1969-10-01 | 1983-09-13 | Rockwell International Corporation | Epitaxial composite and method of making |
US4007074A (en) * | 1970-01-09 | 1977-02-08 | Hitachi, Ltd. | Method of making an epitaxial growth layer of GaAs1-x Px compound semiconductor |
US3696262A (en) * | 1970-01-19 | 1972-10-03 | Varian Associates | Multilayered iii-v photocathode having a transition layer and a high quality active layer |
US3836399A (en) * | 1970-02-16 | 1974-09-17 | Texas Instruments Inc | PHOTOVOLTAIC DIODE WITH FIRST IMPURITY OF Cu AND SECOND OF Cd, Zn, OR Hg |
US3922475A (en) * | 1970-06-22 | 1975-11-25 | Rockwell International Corp | Process for producing nitride films |
FR2092896A1 (en) * | 1970-06-29 | 1972-01-28 | North American Rockwell | Epitaxial film growth - of semiconducting material, by decomposition of organo metallic cpds |
US3765960A (en) * | 1970-11-02 | 1973-10-16 | Ibm | Method for minimizing autodoping in epitaxial deposition |
US3836408A (en) * | 1970-12-21 | 1974-09-17 | Hitachi Ltd | Production of epitaxial films of semiconductor compound material |
BE791077A (fr) * | 1971-11-09 | 1973-03-01 | Matsushita Electric Ind Co Ltd | Element transducteur photoelectrique |
US3862859A (en) * | 1972-01-10 | 1975-01-28 | Rca Corp | Method of making a semiconductor device |
US4284467A (en) * | 1972-02-14 | 1981-08-18 | Hewlett-Packard Company | Method for making semiconductor material |
US3890170A (en) * | 1972-02-29 | 1975-06-17 | Motorola Inc | Method of making a multicolor light display by graded mesaing |
US3928073A (en) * | 1972-04-19 | 1975-12-23 | Telecommunications Sa | Solar cells |
US3733499A (en) * | 1972-04-20 | 1973-05-15 | Westinghouse Electric Corp | Pyroelectric detector |
US3975218A (en) * | 1972-04-28 | 1976-08-17 | Semimetals, Inc. | Process for production of III-V compound epitaxial crystals |
US3790829A (en) * | 1972-07-13 | 1974-02-05 | G Roth | Thermoelectromagnetic energy conversion system |
US3932883A (en) * | 1972-08-08 | 1976-01-13 | The British Secretary of State for Defense | Photocathodes |
US3981755A (en) * | 1972-11-24 | 1976-09-21 | U.S. Philips Corporation | Photocathode manufacture |
US3914136A (en) * | 1972-11-27 | 1975-10-21 | Rca Corp | Method of making a transmission photocathode device |
FR2217068B1 (xx) * | 1973-02-13 | 1978-10-20 | Labo Electronique Physique | |
FR2225207B1 (xx) * | 1973-04-16 | 1978-04-21 | Ibm | |
US4053918A (en) * | 1974-08-05 | 1977-10-11 | Nasa | High voltage, high current Schottky barrier solar cell |
US3982265A (en) * | 1975-09-19 | 1976-09-21 | Bell Telephone Laboratories, Incorporated | Devices containing aluminum-V semiconductor and method for making |
US4032951A (en) * | 1976-04-13 | 1977-06-28 | Bell Telephone Laboratories, Incorporated | Growth of iii-v layers containing arsenic, antimony and phosphorus, and device uses |
NL7605234A (nl) * | 1976-05-17 | 1977-11-21 | Philips Nv | Werkwijze voor het vervaardigen van een halfge- leiderinrichting en halfgeleiderinrichting ver- vaardigd met behulp van de werkwijze. |
US4214926A (en) * | 1976-07-02 | 1980-07-29 | Tdk Electronics Co., Ltd. | Method of doping IIb or VIb group elements into a boron phosphide semiconductor |
US4206002A (en) * | 1976-10-19 | 1980-06-03 | University Of Pittsburgh | Graded band gap multi-junction solar energy cell |
US4147571A (en) * | 1977-07-11 | 1979-04-03 | Hewlett-Packard Company | Method for vapor epitaxial deposition of III/V materials utilizing organometallic compounds and a halogen or halide in a hot wall system |
FR2419585A1 (fr) * | 1978-03-07 | 1979-10-05 | Thomson Csf | Procede d'obtention en phase gazeuse d'une couche epitaxiale de phosphure d'indium, et appareil d'application de ce procede |
FI57975C (fi) * | 1979-02-28 | 1980-11-10 | Lohja Ab Oy | Foerfarande och anordning vid uppbyggande av tunna foereningshinnor |
JPS5696834A (en) * | 1979-12-28 | 1981-08-05 | Mitsubishi Monsanto Chem Co | Compound semiconductor epitaxial wafer and manufacture thereof |
US4422888A (en) * | 1981-02-27 | 1983-12-27 | Xerox Corporation | Method for successfully depositing doped II-VI epitaxial layers by organometallic chemical vapor deposition |
US4757358A (en) * | 1982-03-12 | 1988-07-12 | International Business Machines Corporation | MESFET semiconductor device fabrication with same metal contacting source, drain and gate regions |
IT1161486B (it) * | 1983-06-30 | 1987-03-18 | Cselt Centro Studi Lab Telecom | Metodo per la produzione di materiali con trasparenza ottica nell'infrarosso |
US4697202A (en) * | 1984-02-02 | 1987-09-29 | Sri International | Integrated circuit having dislocation free substrate |
US4588451A (en) * | 1984-04-27 | 1986-05-13 | Advanced Energy Fund Limited Partnership | Metal organic chemical vapor deposition of 111-v compounds on silicon |
US4558337A (en) * | 1984-05-30 | 1985-12-10 | Texas Instruments Inc. | Multiple high electron mobility transistor structures without inverted heterojunctions |
US4596208A (en) * | 1984-11-05 | 1986-06-24 | Spire Corporation | CVD reaction chamber |
JPS6291494A (ja) * | 1985-10-16 | 1987-04-25 | Res Dev Corp Of Japan | 化合物半導体単結晶成長方法及び装置 |
DE3604799A1 (de) * | 1986-02-15 | 1987-08-20 | Licentia Gmbh | Verfahren zum herstellen von halbleiter-heterouebergaengen |
US4886683A (en) * | 1986-06-20 | 1989-12-12 | Raytheon Company | Low temperature metalorganic chemical vapor depostion growth of group II-VI semiconductor materials |
US4814203A (en) * | 1986-09-29 | 1989-03-21 | Ethyl Corporation | Vapor deposition of arsenic |
US4801557A (en) * | 1987-06-23 | 1989-01-31 | Northwestern University | Vapor-phase epitaxy of indium phosphide and other compounds using flow-rate modulation |
US4792467A (en) * | 1987-08-17 | 1988-12-20 | Morton Thiokol, Inc. | Method for vapor phase deposition of gallium nitride film |
GB8821116D0 (en) * | 1988-09-08 | 1989-11-08 | Barr & Stroud Ltd | Infra-red transmitting optical components and optical coatings therefor |
DE3906345A1 (de) * | 1989-02-28 | 1990-08-30 | Eckhard Dr Kaufmann | Thermoelektrisches wandlerelement |
US5274149A (en) * | 1991-07-11 | 1993-12-28 | American Cyanamid Company | Process for making alkyl arsine compounds |
JPH06232099A (ja) | 1992-09-10 | 1994-08-19 | Mitsubishi Electric Corp | 半導体装置の製造方法,半導体装置の製造装置,半導体レーザの製造方法,量子細線構造の製造方法,及び結晶成長方法 |
US5389396A (en) * | 1993-08-11 | 1995-02-14 | Northwestern University | InGaAsP/GaAs diode laser |
US5384151A (en) * | 1993-08-11 | 1995-01-24 | Northwestern University | InGaAsP/GaAs diode laser |
US5421910A (en) * | 1994-02-10 | 1995-06-06 | Northwestern University | Intermetallic compound semiconductor thin film |
US5410178A (en) * | 1994-08-22 | 1995-04-25 | Northwestern University | Semiconductor films |
US6996150B1 (en) * | 1994-09-14 | 2006-02-07 | Rohm Co., Ltd. | Semiconductor light emitting device and manufacturing method therefor |
US5668395A (en) * | 1994-11-22 | 1997-09-16 | Northwestern University | Composition for InSB and GaAs thin film on silicon substrate for use in photodetectors |
US5650635A (en) * | 1995-07-14 | 1997-07-22 | Northwestern University | Multiple stacked Sb-based heterostructures |
US6025611A (en) * | 1996-09-20 | 2000-02-15 | The Board Of Regents Of The University Of Nebraska | Boron-carbide and boron rich rhobohedral based transistors and tunnel diodes |
US5888886A (en) * | 1997-06-30 | 1999-03-30 | Sdl, Inc. | Method of doping gan layers p-type for device fabrication |
DE102004048454B4 (de) * | 2004-10-05 | 2008-02-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung von Gruppe-III-Nitrid-Volumenkristallen oder-Kristallschichten aus Metallschmelzen |
US10665745B2 (en) | 2012-12-13 | 2020-05-26 | Tae Technologies, Inc. | Magnetically polarized photonic device |
MD4510C1 (ro) * | 2016-06-23 | 2018-03-31 | Государственный Университет Молд0 | Procedeu de creştere a structurii n+-p-p+ InP pentru celule solare |
MD4554C1 (ro) * | 2017-10-18 | 2018-09-30 | Государственный Университет Молд0 | Procedeu de majorare a eficienţei celulelor fotovoltaice pe baza p+InP-p-InP-n+CdS |
DE102019008931B4 (de) * | 2019-12-20 | 2024-04-11 | Azur Space Solar Power Gmbh | Gasphasenepitaxieverfahren |
DE102019008929A1 (de) * | 2019-12-20 | 2021-06-24 | Azur Space Solar Power Gmbh | Gasphasenepitaxieverfahren |
DE102019008927B4 (de) * | 2019-12-20 | 2024-04-11 | Azur Space Solar Power Gmbh | Gasphasenepitaxieverfahren |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL99536C (xx) * | 1951-03-07 | 1900-01-01 | ||
DE970420C (de) * | 1951-03-10 | 1958-09-18 | Siemens Ag | Elektrisches Halbleitergeraet |
US2763581A (en) * | 1952-11-25 | 1956-09-18 | Raytheon Mfg Co | Process of making p-n junction crystals |
US2858275A (en) * | 1954-12-23 | 1958-10-28 | Siemens Ag | Mixed-crystal semiconductor devices |
DE1029941B (de) * | 1955-07-13 | 1958-05-14 | Siemens Ag | Verfahren zur Herstellung von einkristallinen Halbleiterschichten |
US2929859A (en) * | 1957-03-12 | 1960-03-22 | Rca Corp | Semiconductor devices |
US3211970A (en) * | 1957-05-06 | 1965-10-12 | Rca Corp | Semiconductor devices |
US2961475A (en) * | 1957-05-29 | 1960-11-22 | Rca Corp | Solid-state charge carrier valve |
US3111611A (en) * | 1957-09-24 | 1963-11-19 | Ibm | Graded energy gap semiconductor devices |
FR1184921A (fr) * | 1957-10-21 | 1959-07-28 | Perfectionnements aux procédés de fabrication par alliage de redresseurs ou de transistrons à jonctions | |
NL236715A (xx) * | 1958-03-03 | |||
FR1193194A (fr) * | 1958-03-12 | 1959-10-30 | Perfectionnements aux procédés de fabrication par diffusion des transistors et des redresseurs à jonctions | |
US3030189A (en) * | 1958-05-19 | 1962-04-17 | Siemens Ag | Methods of producing substances of highest purity, particularly electric semiconductors |
US3132057A (en) * | 1959-01-29 | 1964-05-05 | Raytheon Co | Graded energy gap semiconductive device |
NL239785A (xx) * | 1959-06-02 | |||
US3312570A (en) * | 1961-05-29 | 1967-04-04 | Monsanto Co | Production of epitaxial films of semiconductor compound material |
NL252533A (xx) * | 1959-06-30 | 1900-01-01 | ||
US3186873A (en) * | 1959-09-21 | 1965-06-01 | Bendix Corp | Energy converter |
NL121550C (xx) * | 1959-12-11 | |||
US3168422A (en) * | 1960-05-09 | 1965-02-02 | Merck & Co Inc | Process of flushing unwanted residue from a vapor deposition system in which silicon is being deposited |
US3131098A (en) * | 1960-10-26 | 1964-04-28 | Merck & Co Inc | Epitaxial deposition on a substrate placed in a socket of the carrier member |
-
0
- BE BE620887D patent/BE620887A/xx unknown
- NL NL252729D patent/NL252729A/xx unknown
- NL NL281602D patent/NL281602A/xx unknown
- BE BE618264D patent/BE618264A/xx unknown
- NL NL279070D patent/NL279070A/xx unknown
- NL NL129707D patent/NL129707C/xx active
-
1960
- 1960-06-15 DE DEM45650A patent/DE1132098B/de active Pending
- 1960-06-17 GB GB21334/60A patent/GB944872A/en not_active Expired
-
1961
- 1961-05-29 US US129919A patent/US3364084A/en not_active Expired - Lifetime
- 1961-07-31 US US128237A patent/US3322575A/en not_active Expired - Lifetime
-
1962
- 1962-05-29 DE DE19621444508 patent/DE1444508A1/de active Pending
- 1962-05-29 GB GB20586/62A patent/GB1011979A/en not_active Expired
- 1962-07-30 DE DE19621444511 patent/DE1444511A1/de active Pending
- 1962-07-31 GB GB29333/62A patent/GB1015708A/en not_active Expired
-
1965
- 1965-02-19 US US434116A patent/US3224913A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE1444508A1 (de) | 1970-02-19 |
BE620887A (xx) | |
GB944872A (en) | 1963-12-18 |
US3364084A (en) | 1968-01-16 |
US3322575A (en) | 1967-05-30 |
GB1011979A (en) | 1965-12-01 |
NL279070A (xx) | |
NL281602A (xx) | |
NL252729A (xx) | |
GB1015708A (en) | 1966-01-05 |
NL129707C (xx) | |
DE1132098B (de) | 1962-06-28 |
DE1444511A1 (de) | 1970-12-17 |
US3224913A (en) | 1965-12-21 |