AT238283B - Process for the production of printed circuits - Google Patents

Process for the production of printed circuits

Info

Publication number
AT238283B
AT238283B AT4360A AT4360A AT238283B AT 238283 B AT238283 B AT 238283B AT 4360 A AT4360 A AT 4360A AT 4360 A AT4360 A AT 4360A AT 238283 B AT238283 B AT 238283B
Authority
AT
Austria
Prior art keywords
production
printed circuits
printed
circuits
Prior art date
Application number
AT4360A
Other languages
German (de)
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of AT238283B publication Critical patent/AT238283B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemically Coating (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
AT4360A 1959-01-08 1960-01-05 Process for the production of printed circuits AT238283B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78570359A 1959-01-08 1959-01-08

Publications (1)

Publication Number Publication Date
AT238283B true AT238283B (en) 1965-02-10

Family

ID=25136361

Family Applications (1)

Application Number Title Priority Date Filing Date
AT4360A AT238283B (en) 1959-01-08 1960-01-05 Process for the production of printed circuits

Country Status (8)

Country Link
AT (1) AT238283B (en)
BE (1) BE586392A (en)
CH (1) CH381293A (en)
DE (1) DE1176731B (en)
DK (1) DK98445C (en)
ES (1) ES254803A1 (en)
FR (1) FR1237098A (en)
GB (1) GB938365A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH504830A (en) * 1966-06-28 1971-03-15 Photocircuits Corp Method of making a printed circuit board from insulating material
DE2131205C3 (en) * 1971-06-23 1981-07-30 International Electronic Research Corp., Burbank, Calif. Process for the production of a printed circuit with a metal core
FR2397469A1 (en) * 1977-02-22 1979-02-09 Panoduz Anstalt PROCEDURE FOR DEPOSING A LAYER OF CONDUCTIVE METAL ON AN INSULATING SUPPORT
GB2038101B (en) * 1978-12-19 1983-02-09 Standard Telephones Cables Ltd Printed circuits
DE3733002A1 (en) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Electroconductive pattern metallised additively
WO1988002592A1 (en) * 1986-09-30 1988-04-07 Wilde Membran Impulstechnik Gmbh Electrically conductive structure with applied metallization
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
TW218430B (en) * 1992-01-30 1994-01-01 Motorola Inc
DE10241137B4 (en) * 2002-09-03 2008-05-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process for the metallization of plastics
GB201212407D0 (en) * 2012-07-12 2012-08-22 Intrinsiq Materials Ltd Composition for forming a seed layer
WO2020075152A2 (en) * 2018-10-11 2020-04-16 Shell Oil Company A composition and uses thereof

Also Published As

Publication number Publication date
BE586392A (en) 1960-07-08
ES254803A1 (en) 1960-05-01
DK98445C (en) 1964-04-13
CH381293A (en) 1964-08-31
FR1237098A (en) 1960-07-22
DE1176731B (en) 1964-08-27
GB938365A (en) 1963-10-02

Similar Documents

Publication Publication Date Title
CH426745A (en) Process for the production of thin, monocrystalline semiconducting layers
CH399181A (en) Process for the production of printing forms
CH420923A (en) Process for coating objects
CH414865A (en) Process for the production of several semiconductor components at the same time
CH395342A (en) Method of handling transistors
AT238283B (en) Process for the production of printed circuits
AT240947B (en) Process for producing line patterns for applied circuits
CH426742A (en) Process for the production of single crystal silicon
CH402290A (en) Process for making molds and cores
CH388509A (en) Process for the desulfurization of hydrocarbons
CH459317A (en) Process for the manufacture of polyolefin sheets for printed circuits
AT253031B (en) Process for the production of printed circuits
CH402830A (en) Process for the production of N-glycosides
AT241818B (en) Process for stabilizing polyurethanes
CH387176A (en) Method for manufacturing semiconductor components
CH413110A (en) Process for the production of sintered semiconductor bodies
AT258557B (en) Process for the production of chipboard
AT219259B (en) Process for the production of shuttering panels
CH360481A (en) Process for the production of cell structure components
CH399983A (en) Method for producing flat ceramic bodies
CH389501A (en) Process for the protection of photosensitive articles
CH383115A (en) Process for etching magnesium
CH369830A (en) Process for the production of rod-shaped semiconductor bodies
CH413675A (en) Process for the production of coatings from polyamides
CH396216A (en) Process for the production of layers from semiconducting AiiiBv compounds